OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME

Abstract

An optoelectronic component includes at least one optoelectronic semiconductor chip and an electronic first storage medium. The first storage medium electrically stores first component information. The component can be uniquely identified via the first component information. The optoelectronic component also includes a second storage medium which can be read out wirelessly at least in an unmounted state of the component. The second storage medium stores second component information that is representative of the first component information.

Claims

1. An optoelectronic component comprising at least one optoelectronic semiconductor chip and an electronic first storage medium, wherein the first storage medium electronically stores first component information by means of which the component can be uniquely identified, the optoelectronic component comprises a second storage medium which can be read out wirelessly at least in an unmounted state of the component, in the second storage medium a second component information is stored which is representative of the first component information.

2. The optoelectronic component according to claim 1, wherein the first storage medium is implemented by an IC-chip of the component, the semiconductor chip is electrically controllable via the IC-chip.

3. The optoelectronic component according to claim 1, wherein the second storage medium is a portion of the component which is freely visible in the unmounted state of the component, and the second component information is contained in an optoelectronically readable character string in the freely visible portion, and/or the second storage medium is implemented by an RFID transponder.

4. The optoelectronic component according to claim 2, wherein the component comprises a plurality of optoelectronic semiconductor chips which are electrically controllable via the IC-chip and/or the semiconductor chip is a pixelated semiconductor chip with a plurality of individual pixels and the individual pixels are electrically controllable via the IC-chip.

5. The optoelectronic component according to claim 1, further comprising a carrier, a radiation-impermeable housing with a recess on the carrier, wherein the optoelectronic semiconductor chip is arranged on the carrier in the region of the recess.

6. A system comprising a plurality of optoelectronic components according to claim 1, a third storage medium, wherein the optoelectronic components are arranged at different positions in the system, so that each component is biuniquely assigned to a position with the assigned second component information, position information is stored in the third storage medium which is representative of which second component information is assigned to which position.

7. The system according to claim 6, wherein the system comprises a control unit, the control unit and the optoelectronic components are coupled to one another in terms of signals, the control unit is configured to control the individual components.

8. The system according to claim 7, wherein the third storage medium is implemented by the control unit of the system.

9. The system according to claim 6, wherein the system is or comprises an optoelectronic module, wherein the module comprises a module carrier, the optoelectronic components are arranged on different positions of the module carrier.

10. The system according to claim 9, wherein the third storage medium is wirelessly readable and is applied to the module carrier or introduced into the module carrier.

11. The system according to claim 9, wherein the module is a display backlight or a headlight or a tail light or a brake light or a display or an interior light.

12. A vehicle comprising a system according to claim 6.

13. Method A method for producing an optoelectronic component according to claim 1, comprising the steps: A1) providing a base component with an electronic first storage medium, B1) storing a first component information in the first storage medium, wherein the base component is uniquely identifiable via the first component information and wherein the first component information is electronically readable, C1) assigning a second storage medium with second component information to the base component, wherein the second component information is representative of the first component information, and wherein the second storage medium can be read out wirelessly at least in an unmounted state of the finished component.

14. A method for producing a system comprising the steps of: A2) providing a plurality of optoelectronic components each with component information stored in the component, wherein each component is uniquely identifiable via the associated component information, B2) assembly of the components at different positions such that a position is biuniquely assigned to each component with the associated component information, C2) recording the component information of the components and storing position information, which is representative of which component information is assigned to which position, in a third storage medium.

15. The method according to claim 14, wherein the position information is stored in a control unit and the control unit is configured to control the individual components.

16. The method according to claim 14, wherein the system is a module or comprises a module, the module comprises a module carrier, the optoelectronic components are arranged on different positions of the module carrier in step B), the third storage medium can be read out wirelessly.

17. The method according to one of claim 14, wherein the optoelectronic components are optoelectronic components according claim 1.

18. The method according to claim 17, wherein in step C2) the second component information is acquired in each case.

19. The method for controlling a system according to claim 6, comprising the steps: providing control information that is representative of the position of the system at which an optoelectronic component placed there is to be controlled, determining the second component information associated with the component to be controlled as a function of the position information stored in the third storage medium, controlling the optoelectronic component to which the previously determined second component information is assigned.

Description

[0072] Showing in:

[0073] FIGS. 1A to 2B exemplary embodiments of an optoelectronic component in cross-sectional view and top view,

[0074] FIGS. 3 to 7 various exemplary embodiments of the system,

[0075] FIGS. 8A to 8C positions in an exemplary embodiment of the method for producing a system

[0076] FIGS. 9A to 10C positions in exemplary embodiments of the method for producing an optoelectronic component.

[0077] In FIGS. 1A and 1B, a first exemplary embodiment of the optoelectronic component 1 is shown in cross-sectional view (FIG. 1A) and in plan view (FIG. 1B). In the present case, the optoelectronic component 1 is an LED. The optoelectronic component 1 comprises a plurality of optoelectronic semiconductor chips 10 which are applied to a common carrier 12. The carrier 12 is, for example, a ceramic carrier or a leadframe. In operation, the optoelectronic semiconductor chips 10 emit, for example, visible light of different spectral ranges, such as red light, blue light, and green light.

[0078] Furthermore, the optoelectronic component 1 comprises an IC-chip 11, for example an ASIC. The IC-chip 11 is arranged next to the semiconductor chips 10 on the carrier 12. Alternatively, it would also be conceivable that the IC-chip itself forms the carrier 12 on which the semiconductor chips 10 are arranged. Via the IC-chip 11, the three semiconductor chips 10 are individually and independently controlled during operation. The IC-chip 11 includes an electronic first storage medium 1A. The first storage medium 1A stores first component information by which the component 1 can be uniquely identified. The first component information is, for example, a serial number or an address of the component. The first component information can be read out electronically from the first storage medium 1A, preferably by electrically connecting a reader.

[0079] The optoelectronic component 1 further comprises a radiation-impermeable housing 13, for example a white plastic housing 13. A character string in the form of a QR code is printed on or embossed in a portion of the housing 13. In the present embodiment, the section with the character string forms a second storage medium 1B. The QR code includes a second component information. The second component information is representative of the first component information. In particular, the second component information corresponds to the first component information.

[0080] As can be seen in FIG. 1, the semiconductor chips 10 are arranged in a recess 14 of the housing 13 on the carrier 12 so that the radiation emitted from each of the semiconductor chips 10 in operation can exit the component 1. The IC-chip 11 is covered by the housing 13.

[0081] In FIG. 2, a second exemplary embodiment of the optoelectronic component 1 is again shown in cross-sectional view (FIG. 2A) and plan view (FIG. 2B). Unlike the exemplary embodiment of FIG. 1, the component 1 here comprises only a single semiconductor chip 10 arranged in the recess 14 of the housing 13. The semiconductor chip 10 in the present case is a pixelated semiconductor chip with a plurality of pixels. In operation, the pixels can be controlled individually and independently of one another via the IC-chip 11.

[0082] FIG. 3 shows a first exemplary embodiment of the system. The system comprises a plurality of optoelectronic components 1, each of which may be adapted as shown in FIG. 1 or FIG. 2. Further, the system comprises a control unit 20 comprising a third storage medium 2. The components 1 are signal-technically coupled with the control unit 20. This is achieved in the present case by means of a bus via which the components 1 are connected in parallel with the control unit 20. Thus, during operation of the system, the components 1 are supplied equally (in parallel) with a control signal output by the control unit 2.

[0083] FIG. 3 shows that the components 1 are arranged at different positions. This is a component chain in which the components are arranged at different positions in the chain. Each optoelectronic component 1 of the chain with the associated second component information is therefore biuniquely assigned a position in the chain. In the third storage medium 2, position information is stored which is representative of which second component information is assigned to which position in the chain. Thus, at least indirectly, the first component information or the address of each component is associated with the position assigned to the component.

[0084] During operation of the system, drive information can be provided that is representative of the position at which an optoelectronic component placed there is to be controlled. For example, the penultimate component of the chain is to be driven. Depending on the position information stored in the third storage medium 2, it can be determined which second component information the component to be controlled has. By transmitting a corresponding control signal with the appropriate second component information/first component information/address, the penultimate component 1 of the chain can be selectively controlled.

[0085] In FIG. 4, a vehicle is shown with a system. The system corresponds, for example, to the system shown in FIG. 3. The chain of components 1 is installed in a door frame of the vehicle. During operation of the system, individual regions of the door frame can then be selectively controlled/illuminated.

[0086] FIG. 5 shows another exemplary embodiment of the system. In the present case, the system is a module 100. The module 100 is, for example, a tail light for a motor vehicle. The module comprises a module carrier 101. A plurality of optoelectronic components 1, for example as described in connection with FIG. 1 or 2, are mounted in a specified pattern on the module carrier 101. The components 1 are in turn connected in parallel with a signal line/bus leading to a control unit (the control unit is not shown). On the module carrier 101, which is for example a printed circuit board, the third storage medium 2 is implemented by a printed or embossed QR code in which the position information of the module 100 is stored. When the module 100 is installed, for example in a vehicle, the third storage medium 2 can be read, for example with the aid of a scanner, and the position information can be uploaded to a control unit. In this way, selective control of the individual components 1 of the module 100 is made possible via the control unit.

[0087] FIG. 6 shows a further exemplary embodiment of the system, which is installed in a vehicle, for example. Here, the system comprises two modules 100, as described, for example, in connection with FIG. 5. Furthermore, the system comprises a control unit 20, via which the modules 100 can be controlled. The position information of the individual modules 100 is stored in a respective QR code of the modules 100. When the modules 100 are installed, a reader can be used to read the QR code in each case, and the extracted position information can be uploaded to the control unit 2 or to the third storage medium 20 of the control unit 2. Thus, the position information is stored in both the QR codes and the control unit 2. If one of the modules 100 is defective, it can be easily replaced, and the respective position information of the new module 100 can be quickly and easily uploaded to the control unit 2 using a reader, overwriting the old position information.

[0088] FIG. 7 shows another exemplary embodiment of the system. Again, the system comprises a module 100, for example in the form of a tail light. Unlike in FIG. 5, the third storage medium of the module 100 is now not implemented as an optically readable code, but by a control unit 20 biuniquely assigned to the module 100. The control unit 20 is arranged on the module carrier 101. The control unit 20 is, for example, a gateway. The control unit 20 on the module is controlled in operation, for example, by a master control unit.

[0089] FIG. 8 shows an exemplary embodiment of the method for producing the system. For manufacturing, optoelectronic components 1 were first provided in a step A2, each of which is adapted, for example, as the optoelectronic components of FIG. 1 or 2. These components 1 were then arranged at different positions on the module carrier 101 in a step B2. As a result, a position was biuniquely assigned to each component 1 with the associated first and second component information. The next step C2 is now to acquire the second component information of each component 1 and, in dependence thereon, store position information representative of which second component information is associated with which position on the module carrier 101. This position information is stored in the third storage medium 2. In the present case, the third storage medium 2 is again implemented by a control unit 20 on the module carrier 101.

[0090] A reader 3, in this case in the form of a scanner, is used to record the component information. With the reader 3, the QR code of the component 1 is first scanned at the first position of the component chain. The first position is assigned, by way of example, the position identifier 01, which is thus stored in the third storage medium 2. The second component information, which is detected by means of the reader 3, is 00000000031 by way of example (FIG. 8A). Accordingly, position information is stored on the third storage medium 2 that the second component information 00000000031 is assigned to the position identifier 01. Subsequently, the component 1 is scanned at the second position (position identifier 02) of the chain (FIG. 8B). The detected second component information 00000002783 is assigned to the position identifier 02 and this position information is stored on the third storage medium 2. Then the component 1 is scanned at the third position of the chain (position identifier 03) (FIG. 8C). The second component information 00000000083 detected in this process is assigned to the position identifier 03 and this position information is stored on the third storage medium 2. This is preferably continued until all components 1 have been scanned. The position information can be stored directly on the third storage medium, or it can be stored temporarily beforehand.

[0091] Subsequently, via the control unit 20, the component 1 at the third position of the chain can be controlled, for example, by sending out a control signal that carries the address 00000000083. The components 1 can all be connected in parallel with the control unit 20 so that the control signal reaches all components 1 equally. By comparing the address in the control signal with the first component informations stored electronically in each of the components 1, only the component 1 at the third position in the chain responds to the control signal and emits radiation. All other components 1 remain unchanged or switched off.

[0092] FIG. 9 shows a first exemplary embodiment of the method for producing an optoelectronic component. In the first position of FIG. 9A, a base component is provided (step A1 of the method). The base component includes a carrier 12, optoelectronic semiconductor chips 10 arranged thereon, a housing 13, and an IC-chip 11. The IC-chip 11 further includes an electronic first storage medium 1A. On the first storage medium 1A, a first component information is or will be stored in the position of the FIG. 9A (step B1 of the method). Alternatively, however, it is also conceivable that the first storage medium 1A is implemented by a component of the component that is separate from the IC-chip 11.

[0093] In FIG. 9B a second position of the method is shown, in which the first component information is read out from the first storage medium 1A. For this purpose, a reader 3, for example in the form of a computer, is connected to a communication interface of the basic component. The first component information is communicated to the computer and is in this case the digit 00000000083.

[0094] FIG. 9C shows a third position of the method (step C1) in which, depending on the read-out first component information, a second storage medium 1B on which a second component information is stored is assigned to the base component. In this case, a QR code is inscribed in the housing 13 with the aid of a laser, wherein the second component information is included in the QR code. The second component information is representative of the first component information. In addition, other component information, such as brightness values or color locations, may be stored in the QR code. By writing the QR code, the optoelectronic component 1 is completed.

[0095] FIG. 10 shows a second exemplary embodiment of the method for producing an optoelectronic component. Here, the method steps B1 and C1 are carried out in reverse order. First, in FIG. 10A, a base component is provided (step A1). Then, a QR code is written into the housing 13 by means of a laser, wherein the QR code contains second component information (step C1). Thereafter, as shown in FIG. 10C, the QR code is read using a reader 3. Accordingly, first component information is then electronically written to the first storage medium 1A of the base component (step B1). Again, the second component information is representative of the first component information.

[0096] Instead of a QR code, as shown in FIGS. 9 and 10, the second storage medium 1B may be an RFID transponder which is written with the second component information before or after the first storage medium 1A.

[0097] This patent application claims priority to German patent application 10 2019 109 329.5, the disclosure content of which is hereby incorporated by reference.

[0098] The invention is not limited to the exemplary embodiments by the description thereof. Rather, the invention encompasses any new feature as well as any combination of features, which in particular includes any combination of features in the patent claims, even if these features or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.

LIST OF REFERENCE SIGNS

[0099] 1 optoelectronic component [0100] 1A first storage medium [0101] 1B second storage medium [0102] 2 third storage medium [0103] 3 reader [0104] 10 optoelectronic semiconductor chip [0105] 11 IC-chip [0106] 12 carrier [0107] 13 housing [0108] 14 recess [0109] 20 control unit [0110] 100 Module [0111] 101 Module carrier