PORT PROCESSING METHOD
20220173564 · 2022-06-02
Assignee
Inventors
Cpc classification
H01R43/00
ELECTRICITY
International classification
H01R43/00
ELECTRICITY
Abstract
A port processing method, used to enhance an electrostatic discharge protection capability and an overstress protection capability. The method comprises: step S1, providing a cable having a plurality of terminal contact cores leading out of the cable, the plurality of terminal contact cores comprising contact cores disposed at two sides of the cable, and signal cores disposed within the cable; and S2, changing the signal layout of the contact cores and the signal cores, so as to enhance the electrostatic discharge protection capability and the overstress protection capability. The method for changing the signal layout comprises: using the contact cores as a signal ground, and disposing a contact spring plate at a middle portion of each of the contact cores and each of the signal cores; and extending lengths of the contact cores outward.
Claims
1. A port processing method for enhancing an electrostatic discharge protection capability and an overstress protection capability, comprising the steps of: S1, providing a cable having a plurality of terminal contact cores leading out of the cable, the plurality of terminal contact cores comprise contact cores disposed at two sides of the cable, and signal cores disposed within the cable; and S2, changing the signal layout of the contact cores and the signal cores, so as to enhance the electrostatic discharge protection capability and the overstress protection capability.
2. The port processing method of claim 1, wherein in S1, at least three contact cores are disposed.
3. The port processing method of claim 1, wherein in S2, the method for changing the signal layout of the terminal contact cores comprises, using the contact cores as a signal ground, and disposing a contact elastic piece in a central portion of each of the contact cores and of each of the signal cores respectively, to enhance the electrostatic discharge protection capability and the overstress protection capability.
4. The port processing method of claim 3, wherein the height of the contact elastic piece disposed on the contact cores is greater than that of the contact elastic piece disposed on the signal cores, and is at least greater than a preset height.
5. The port processing method of claim 1, wherein in S2, the method for changing the signal layout of the signal cores comprises, extending the length of each of the contact cores outwards, so that the length of each of the contact cores is greater than that of each of the signal cores, to enhance the electrostatic discharge protection capability and the overstress protection capability.
6. The port processing method of claim 1, wherein in S2, the method for changing the signal layout of the terminal contact cores comprises, adjusting a signal spacing between each of the contact cores and each of the signal cores adjacent thereto, to enhance the electrostatic discharge protection capability and the overstress protection capability.
7. The port processing method of claim 6, wherein the signal spacing between each of the contact cores and each of the signal cores adjacent thereto is at least greater than a preset width.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings, together with the specification, illustrate exemplary embodiments of the present disclosure, and, together with the description, serve to explain the principles of the present invention.
[0018]
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
DETAILED DESCRIPTION
[0028] The technical solution set forth in the embodiments of the present invention will now be described clearly and fully hereinafter with reference to the accompanying drawings of the embodiments of the present invention. Obviously, such embodiments provided in the present invention are only part of the embodiments instead of all embodiments. It should be understood that all the other embodiments obtained from the embodiments set forth in the present invention by one skilled in the art without any creative work fall within the scope of the present invention.
[0029] Notably, the embodiments set forth in the present invention and features of the embodiments may be combined in any suitable manner.
[0030] The present invention will be described hereinafter with reference to the accompanying drawings and particular embodiments, but the invention is not limited thereto.
[0031] In the prior art, when it comes to the cause for EOS/ESD, three elements are key drivers for EOS/ESD damage, namely, interference sources, propagation paths, and damaged devices; as the cause of EOS/ESD damage is known, the proposed ways to avoid EOS/ESD damage is to: cut off the EOS/ESD interference source, cut off the propagation path, and isolate the damages devices.
[0032] Thus, given that the foregoing problems exist in the prior art, the present invention provides a port processing method for enhancing the electrostatic discharge protection capability and the overstress protection capability, as shown in
[0033] S1, providing a cable having a plurality of terminal contact cores leading out of the cable, the plurality of terminal contact cores comprise contact cores disposed at two sides of the cable, and signal cores disposed within the cable; and
[0034] S2, changing the signal layout of the contact cores and the signal cores, so as to enhance the electrostatic discharge protection capability and the overstress protection capability.
[0035] The technical solution of the port processing method is adopted to enhance the electrostatic discharge protection capability and the overstress protection capability, as shown in
[0036] Furthermore, in this technical solution, the previous ESD/EOS protection devices are discarded; instead, the propagation path is considered as a way to avoid the ESD/EOS damage, that is to say, the propagation path is cut off, and the connection of the ground GND is prioritized when two devices are in contact; in addition, GND of PCB board is cut, so that energy of charge reaching the chip end is the lowest, and desired protection is achieved. In particular, when two devices or electronic products or cables and devices or charged objects touch the electronic products, the GND is grounded on a priority basis, so that the potential difference is reduced, allowing both devices to have the same reference potential plane when the signals are superimposed, thus, the EOS problem of overvoltage and overcurrent will not occur when the signals are in contact.
[0037] In a preferred embodiment, in S2, the method for changing the signal layout of the terminal contact cores comprises, using the contact cores as a signal ground, and disposing a contact elastic piece in a central portion of each of the contact cores and of each of the signal cores respectively, to enhance the electrostatic discharge protection capability and the overstress protection capability.
[0038] In particular, as shown in
[0039] In the above-mentioned technical solution, the height of the contact elastic piece disposed on the contact cores is greater than that of the contact elastic piece disposed on the signal cores, and is at least greater than a preset height, wherein the preset height is 10 mil.
[0040] In particular, as shown in
[0041] Of note, the preset height defined in the solution is 10 mil, however, other heights are also contemplated. Details will not be repeated herein.
[0042] In a preferred embodiment, in S2, a method for changing the signal layout of the signal cores comprises, extending the length of each of the contact cores outwards, so that the length of each of the contact cores is greater than that of each of the signal cores to enhance the electrostatic discharge protection capability and the overstress protection capability.
[0043] In particular, as shown in
[0044] Furthermore, as shown in
[0045] Furthermore, as shown in
cot à(m+b)+((m+b)−(m+b)/cos à)/sin à
[0046] Furthermore, the signal layout of the contact cores and the signal cores is changed to enhance the electrostatic discharge protection capability and the overstress protection capability, the operation is simple, and the cost is low.
[0047] In a preferred embodiment, in S2, a method for changing the signal layout of the terminal contact cores comprises, adjusting a signal spacing between each of the contact cores and each of the signal cores adjacent thereto, to enhance the electrostatic discharge protection capability and the overstress protection capability.
[0048] In the above-mentioned technical solution, the signal spacing between each of the contact cores and each of the signal cores adjacent thereto is at least greater than a preset width, wherein the preset width is 10 mil.
[0049] In particular, as shown in
[0050] Of note, the preset width defined in this solution is at least greater than 10 mil, however, the increase in the signal spacing is not defined. Details in this regard will not be repeated.
[0051] The above descriptions are only the preferred embodiments of the invention, not thus limiting the embodiments and scope of the invention. Those skilled in the art should be able to realize that the schemes obtained from the content of specification and drawings of the invention are within the scope of the invention.