OPTICAL DIFFRACTION COMPONENT
20220171292 · 2022-06-02
Inventors
Cpc classification
G02B5/1861
PHYSICS
G03F7/70191
PHYSICS
G03F7/70175
PHYSICS
H05G2/008
ELECTRICITY
G02B5/09
PHYSICS
G03F7/70575
PHYSICS
International classification
Abstract
An optical diffraction component has a periodic grating structure profile. The diffraction structure levels are arranged so that a wavelength range around two different target wavelengths diffracted by the grating structure profile has radiation components with three different phases that interfere destructively with one another. Diffraction structure levels predefine a topography of a grating period of the grating structure profile that is repeated regularly along a period running direction. These include a neutral diffraction structure level, a positive diffraction structure level raised relative thereto, and a negative diffraction structure level lowered relative thereto. The neutral diffraction structure level has an extent along the period running direction which is less than 50% of the extent of the grating period. A difference between the two target wavelengths is less than 50%. The result is an optical diffraction component whose possibilities for use can be extended, for example, to stray light suppression.
Claims
1. An optical diffraction component, comprising: a periodic grating structure profile comprising diffraction structures, wherein: each diffraction structure has a first diffraction structure level, a second diffraction structure level or a third diffraction structure level; the first diffraction structure level is equal to a reference plane; the second diffraction structure level is above the reference plane; the third diffraction structure level is below the reference plane; the first, second and third diffraction structure levels define a topography of a grating period of the grating structure profile; the grating period repeats regularly along a period running direction; along the period running direction, the first diffraction structure level extends less than 50% of the grating period; the diffraction structures are configured so that, during use of the optical diffraction component, a wavelength range around two different target wavelengths diffracted by the periodic grating structure profile comprises radiation components with three different phases that interfere destructively with one another; and a difference between the two different target wavelengths is less than 50%.
2. The optical diffraction component of claim 1, wherein the second and third diffraction structure levels extend an equal distance along the period running direction.
3. The optical diffraction component of claim 1, wherein a height of the second diffraction structure level above the reference plane is equal to a depth of the third diffraction structure level below the reference plane.
4. The optical diffraction component of claim 1, wherein the two target wavelengths differ by at least 1%.
5. The optical diffraction component of claim 1, wherein the two target wavelengths differ by at least 10%.
6. The optical diffraction component of claim 1, wherein the grating period extends between 0.5 mm and 5 mm along the period running direction.
7. The optical diffraction component of claim 1, wherein the diffraction structure levels have a mirror-symmetrical arrangement.
8. The optical diffraction component of claim 1, wherein the second and third diffraction structure levels extend an equal distance along the period running direction, and a height of the second diffraction structure level above the reference plane is equal to a depth of the third diffraction structure level below the reference plane.
9. The optical diffraction component of claim 8, wherein the two target wavelengths differ by at least 1%.
10. The optical diffraction component of claim 9, wherein the grating period extends between 0.5 mm and 5 mm along the period running direction.
11. The optical diffraction component of claim 10, wherein the diffraction structure levels have a mirror-symmetrical arrangement.
12. The optical diffraction component of claim 1, wherein the second and third diffraction structure levels extend an equal distance along the period running direction, and the two target wavelengths differ by at least 1%.
13. The optical diffraction component of claim 1, wherein the second and third diffraction structure levels s extend an equal distance along the period running direction, and the grating period extends between 0.5 mm and 5 mm along the period running direction.
14. The optical diffraction component of claim 1, wherein the second and third diffraction structure levels extend an equal distance along the period running direction, and the diffraction structures have a mirror-symmetrical arrangement.
15. A collector mirror, comprising: an optical component according to claim 1, wherein the collector mirror is an EUV collector mirror.
16. The collector mirror of claim 15, wherein: the collector mirror is configured to guide EUV radiation toward a focal region; and the optical diffraction component is configured to guide radiation at at least one of two different target wavelengths away from the focal region.
17. An illumination system, comprising: an EUV collector comprising an optical component according to claim 1; and an illumination optical unit, wherein the EUV collector is configured to provide EUV radiation to the illumination optical unit, and the illumination optical unit is configured to illuminate an object with the EUV radiation.
18. An optical system, comprising: an EUV collector comprising an optical component according to claim 1; an illumination optical unit; and a projection optical unit, wherein the EUV collector is configured to provide EUV radiation to the illumination optical unit, the illumination optical unit is configured to illuminate an object field with the EUV radiation, and the projection optical unit is configured to image the object field into an image field.
19. An apparatus comprising: an EUV light source; an EUV collector comprising an optical component according to claim 1; an illumination optical unit; and a projection optical unit, wherein the EUV light source is configured to provide EUV radiation to the EUV collector, the EUV collector is configured to provide the EUV radiation to the illumination optical unit, the illumination optical unit is configured to illuminate an object field with the EUV radiation, and the projection optical unit is configured to image the object field into an image field.
20. A method of using an apparatus comprising an EUV collector, an illumination optical unit and a projection optical unit, the method comprising: using the EUV collector to provide EUV illumination to the illumination optical unit; using the illumination optical unit to illuminate a reticle in an object field with the EUV radiation; and using the projection optical unit to image the reticle into a light-sensitive material in an image field, wherein the EUV collector comprises an optical component according to claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Exemplary embodiments of the disclosure are explained in greater detail below with reference to the drawing, in which:
[0032]
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0043] A projection exposure apparatus 1 for microlithography includes a light source 2 for illumination light or imaging light 3, which will be explained in yet more detail below. The light source 2 is an EUV light source, which produces light in a wavelength range of, for example, between 5 nm and 30 nm, such as between 5 nm and 15 nm. The illumination light or imaging light 3 is also referred to as EUV used light below.
[0044] For example, the light source 2 can be a light source with a wavelength of 13.5 nm or a light source with a wavelength of 6.9 nm. Other EUV wavelengths are also possible. A beam path of the illumination light 3 is illustrated very schematically in
[0045] An illumination optical unit 6 is used to guide the illumination light 3 from the light source 2 to an object field 4 in an object plane 5. The illumination optical unit includes a field facet mirror FF illustrated highly schematically in
[0046] Pupil facets (not illustrated in any more detail) of the pupil facet mirror PF are part of a transfer optical unit, which transfer, and for example image, field facets (likewise not illustrated) of the field facet mirror FF into the object field 4 in a manner being superimposed on one another. An embodiment known from the prior art can be used for the field facet mirror FF on the one hand and the pupil facet mirror PF on the other hand.
[0047] By way of example, such an illumination optical unit is known from DE 10 2009 045 096 A1.
[0048] Using a projection optical unit or imaging optical unit 7, the object field 4 is imaged into an image field 8 in an image plane 9 with a predefined reduction scale. Projection optical units which can be used for this purpose are known from e.g. DE 10 2012 202 675 A1.
[0049] In order to facilitate the description of the projection exposure apparatus 1 and the various embodiments of the projection optical unit 7, a Cartesian xyz-coordinate system is indicated in the drawing, from which system the respective positional relationship of the components illustrated in the figures is evident. In
[0050] The object field 4 and the image field 8 are rectangular. Alternatively, it is also possible for the object field 4 and the image field 8 to have a bent or curved embodiment, that is to say, for example, a partial ring shape. The object field 4 and the image field 8 have an x/y-aspect ratio of greater than 1. Therefore, the object field 4 has a longer object field dimension in the x-direction and a shorter object field dimension in the y-direction. These object field dimensions extend along the field coordinates x and y.
[0051] One of the exemplary embodiments known from the prior art can be used for the projection optical unit 7. What is imaged in this case is a portion of a reflection mask 10, also referred to as reticle, coinciding with the object field 4. The reticle 10 is carried by a reticle holder 10a. The reticle holder 10a is displaced by a reticle displacement drive 10b.
[0052] The imaging by way of the projection optical unit 7 is implemented on the surface of a substrate 11 in the form of a wafer, which is carried by a substrate holder 12. The substrate holder 12 is displaced by a wafer or substrate displacement drive 12a.
[0053]
[0054] The projection exposure apparatus 1 is of the scanner type. Both the reticle 10 and the substrate 11 are scanned in the y-direction during the operation of the projection exposure apparatus 1. A stepper type of the projection exposure apparatus 1, in which a stepwise displacement of the reticle 10 and of the substrate 11 in the y-direction is effected between individual exposures of the substrate 11, is also possible. These displacements are effected synchronously with one another by an appropriate actuation of the displacement drives 10b and 12a.
[0055]
[0056] The light source 2 is an LPP (laser produced plasma) source. For the purposes of producing plasma, tin droplets 15 are generated as a continuous droplet sequence by a tin droplet generator 16. A trajectory of the tin droplets 15 extends transversely to a principal ray direction 17 of the EUV used light 3. Here, the tin droplets 15 drop freely between the tin droplet generator 16 and a tin capturing device 18, with the droplets passing through a plasma source region 19. The EUV used light 3 is emitted by the plasma source region 19. When the tin droplet 15 arrives in the plasma source region 19, it is impinged upon there by pump light 20 from a pump light source 21. The pump light source 21 can be an infrared laser source in the form of e.g. a CO.sub.2 laser. A different IR laser source is also possible, for example a solid-state laser, for example an Nd:YAG laser. The pump light source 21 can include a light source unit for producing a light prepulse and a light source unit for producing a main light pulse. The light prepulse, on the one hand, and the main light pulse, on the other hand, can have different light wavelengths.
[0057] The pump light 20 is transferred into the plasma source region 19 by way of a mirror 22, which can be a mirror that is tiltable in a controlled fashion, and by way of a focusing lens element 23. A plasma emitting the EUV used light 3 is produced by the pump light impingement from the tin droplet 15 arriving in the plasma source region 19. A beam path of the EUV used light 3 is illustrated in
[0058] The field facet mirror FF is disposed downstream of the intermediate focus 26 in the beam path of the EUV used light 3, in the region of a far field of the EUV used light 3.
[0059] The EUV collector 24 and further components of the light source 2, which may be the tin droplet generator 16, the tin capturing device 18 and the focusing lens element 23, are arranged in a vacuum housing 27. The vacuum housing 27 has a passage opening 28 in the region of the intermediate focus 26. In the region of an entrance of the pump light 20 into the vacuum housing 27, the latter includes a pump light entrance window 29 for the light prepulse and for the main light pulse.
[0060]
[0061]
[0062] Structure depth values d are indicated below with computed accuracy in some instances, where it is regularly sufficient for the structure depth when indicated in micrometers to be rounded to two places following the decimal point.
[0063] The grating structure profile of the optical diffraction component 34 has diffraction structures with exactly three diffraction structure levels, which are designated by N.sub.0, N.sub.1 i and N.sub.2 in
[0064] The diffraction structures of the optical grating 34 are arranged such that a wavelength range around the two target wavelengths λ1, e.g. the light prepulse, and λ2, e.g. the main light pulse, which are diffracted by the grating structure profile has radiation components with three different phases that interfere destructively with one another.
[0065] The diffraction structure levels N.sub.0 to N.sub.2 predefine a topography of a grating period of the grating structure profile that is repeated regularly along the period running direction x.
[0066] The illustrated embodiment according to
[0067] Within the grating period P, the neutral diffraction structure level No has a total extent a.sub.0 along the period running direction x which is less than 50% of the extent of the entire grating period P. A sum of the extents a.sub.1, a.sub.2 of the positive diffraction structure level N.sub.1 and of the negative diffraction structure level N.sub.2 is thus greater than the total extent of the neutral diffraction structure level N.sub.0.
[0068] The optical grating 34 is illustrated with ideally steep sidewalls between the different diffraction structure levels N.sub.i in
[0069] A displacement of the diffraction structure levels N.sub.i that maintains the respective extent a.sub.0, a.sub.1, a.sub.2 of the different diffraction structure levels N.sub.i within the grating period P is also possible. In this regard, for example, unlike in the symmetrical arrangement illustrated in
[0070] Basic properties of the optical diffraction component 34 are tabulated below:
TABLE-US-00001 Optical grating 34 (FIG. 4) a0 49.9543% a1(=a2) 25.0228% d.sub.0 2.59904 μm λ1 10.2 μm λ2 10.6 μm
[0071] In this case, a0 denotes the ratio between the total extent of the neutral diffraction structure levels N.sub.0 in a grating period P and the extent of the grating period P.
[0072] a1(=a2) denote the ratio proportions of the extents of the positive diffraction structure level N.sub.1 and of the negative diffraction structure level N.sub.2 within the grating period P relative to the total extent of the grating period P. The extents a1, a2 of the positive diffraction structure level N1, on the one hand, and of the negative diffraction structure level N2, on the other hand, along the period running direction x are exactly equal.
[0073] d.sub.0 denotes the absolute structure depth of the positive diffraction structure level N.sub.1, on the one hand, and of the negative diffraction structure level N.sub.2, on the other hand.
[0074] λ1, λ2 denote the two target wavelengths to be suppressed.
[0075] The extents a.sub.0, a.sub.1 and a.sub.2 of the diffraction structure levels N.sub.0, N.sub.1, N.sub.2 and also the structure depth do are chosen such that for both target wavelengths λ1 and λ2 upon addition of the three radiation components with different phases that are generated upon reflection at the grating structure profile on account of the diffraction structure levels N.sub.i, in addition in each case destructive interference results. In an arrow diagram indicating real and imaginary parts of the radiation components, the three contributions add up to zero if the wavelength corresponds to one of the two target wavelengths.
[0076] The parameters d.sub.0, a.sub.0, a.sub.1 and a.sub.2 are designed such that the following equation is satisfied for both target wavelengths λ1 and λ2:
a.sub.0+a.sub.1e.sup.+i4πd.sup.
[0077] This equation applies to the case of normal incidence of the radiation on the grating. An adaptation of the parameters for non-normal incidence is obvious to a person skilled in the art. This adaptation can vary across the component.
[0078]
[0079] For comparison,
[0080] The reflectivity 36 exhibits a narrowband suppression at the target wavelength λ2. The reflectivities 37 and 38 exhibit more broadband suppressions firstly at the target wavelength λ2 (reflectivity 37) and secondly at 10.4 μm (reflectivity 38).
[0081]
[0082] In this case,
[0083] In this case,
[0084] In the case of the design according to
[0085] In the case of the optical diffraction component 40 according to
[0086] In the case of the design according to
[0087] Optical diffraction components 41, 42 according to
[0088] In a manner corresponding to the above tabulation concerning the optical diffraction component 34, the basic parameters of the optical diffraction components 39 to 41 are tabulated below:
TABLE-US-00002 Optical Optical Optical grating 39/40 grating 41 grating 42 (FIG. 6/7) (FIG.8) (FIG.9) a0 10.8652% 48.6984% 48.0496% a1 (=a2) 44.5674% 25.6508% 25.9752% d.sub.0 1.42808 μm 2.38013 μm 2.32104 μm
[0089] The optical gratings 39 to 42 according to
[0090]
[0091]
[0092] The two designs, which lead to the optical diffraction components 39, 40 according to
[0093] A reflectivity 44 of the optical diffraction component 41 has a similarly good suppression effect at the two target wavelengths, wherein an additional suppression in the region of 1.07 μm (side minimum 45) takes place in the case of this design of the optical diffraction component 41.
[0094] The optical diffraction component 42 also has a suppression in the region of the two target wavelengths λ1, λ2 which is comparable to that of the optical diffraction component 39, 40 (reflectivity 46), wherein a further side minimum 47 of the suppression is additionally present at a wavelength of approximately 1.02 μm.
[0095] The suppression in the region of the target wavelengths λ1, λ2 has a somewhat broader bandwidth in the case of the optical diffraction components 41, 42 in comparison with the optical diffraction components 39, 40.
[0096] The above-explained structurings of the optical gratings can have the effect that stray light radiation having an infrared wavelength, for example, that is reflected by the EUV collector 24 interferes destructively in a zero order and a stray light intensity is thus suppressed in the zero order. In this case, the optical diffraction components described above are generally used as reflective components.
[0097] A main body of the EUV collector 24 can be manufactured from aluminum. Alternative materials for this main body are copper, alloys including the constituent copper and/or aluminum or alloys, produced by powder metallurgy, of copper and aluminum oxide or silicon.
[0098] In order to produce a microstructured or nanostructured component, the projection exposure apparatus 1 is used as follows: First, the reflection mask 10 or the reticle and the substrate or the wafer 11 are provided. Subsequently, a structure on the reticle 10 is projected onto a light-sensitive layer of the wafer 11 with the aid of the projection exposure apparatus 1. Then, a microstructure or nanostructure on the wafer 11, and hence the microstructured component, is produced by developing the light-sensitive layer.