Manufacturable metal-graphene interface for highly efficient and durable condensers

Abstract

The present disclosure relates to efficient condensing operations and apparatuses. Methods of fabricating condensers and specifically condenser surfaces are also disclosed. A condensing apparatus can include a condenser surface having a substrate and one or more layers of graphene. The substrate can be formed of nickel and a nickel-graphene surface composite layer can be formed. The substrate-graphene composite can be highly durable, hydrophobic, and resistant to fouling. Dropwise condensation can be induced.

Claims

1. A condensing apparatus comprising: a condenser having a coolant side and a condensing side; a substrate on the coolant side or the condensing side or both, the substrate comprising brass, copper, a copper alloy, nickel, a nickel alloy, or a combination thereof at a surface; a continuous electroplated layer of pure nickel or nickel alloy having a thickness of from about 1 micrometer to about 100 micrometers on the surface of the substrate; one or more layers of graphene on a surface of the continuous electroplated layer of pure nickel or nickel alloy; and a nickel graphene composite interface comprising π-orbitals of the graphene hybridized with d-electrons of nickel of the pure nickel or nickel alloy.

2. The apparatus of claim 1, wherein three or more layers of graphene are on the surface of the substrate.

3. The apparatus of claim 1, wherein the one or more layers of graphene are on the condensing side of the condenser providing hydrophobicity.

4. The apparatus of claim 1, wherein a thermal expansion mismatch between the substrate and the graphene is less than 18×10.sup.−6 k.sup.−1.

5. The apparatus of claim 1, wherein the electroplated layer comprises pure nickel.

6. The condensing apparatus of claim 1, wherein the one or more layers of graphene have a grain size greater than about 3 micrometers.

7. A condensing apparatus fabrication method comprising: electroplating a continuous layer of pure nickel or nickel alloy on a surface of a condensing element, the surface comprising brass, copper, a copper alloy, nickel, a nickel alloy, or a combination thereof, the continuous electroplated layer having a thickness of from about 1 micrometer to about 100 micrometers; and forming one or more layers of graphene on a surface of the electroplated layer, wherein upon the formation of the one or more layers of graphene, π-orbitals of the graphene are hybridized with d-electrons of the nickel of the pure nickel or the nickel alloy thus forming a nickel-graphene composite interface.

8. The method of claim 7, wherein the one or more layers of graphene is formed according to a process comprising chemical vapor deposition (CVD), thin film physical vapor deposition (PVD), or deposition of hydrogenated amorphous carbon.

9. The method of claim 7, wherein three or more layers of graphene are formed.

10. The method of claim 7, wherein the electroplated layer is formed on a coolant side, a condensing side, or both sides of the condensing element.

11. The method of claim 7, wherein the one or more layers of graphene is formed according to a process comprising chemical vapor deposition (CVD).

12. The method of claim 7, wherein the condensing element comprises a tube.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) A full and enabling disclosure of the present invention, including the best mode thereof to one skilled in the art, is set forth more particularly in the remainder of the specification, which includes reference to the accompanying figures, in which:

(2) FIG. 1 shows a nickel-graphene interface according to an embodiment of the present invention.

(3) FIG. 2 shows a scanning electron microscope image of graphene layers on a nickel substrate.

(4) FIG. 3 shows dropwise condensation occurring on a tube with a nickel-graphene surface.

(5) FIG. 4(a) shows a Raman spectroscopy graph for multiple layers of graphene on a nickel tube; FIG. 4(b) shows heat transfer coefficients (HTCs) of a pure nickel tube and a nickel tube having graphene layers according to an embodiment; and FIG. 4(c) shows HTCs after a period of 33 days.

(6) FIG. 5(a) shows an X-ray photoelectron spectroscopy (XPS) graph of the peak intensity of a copper-graphene interface after a two hour test, and FIGS. 5(b), 5(c), and 5(d) show the peak intensity of nickel-graphene interfaces after a one-month test.

(7) FIGS. 6(a), 6(b), and 6(c) show efficient dropwise condensation (DWC) and heat transfer coefficients of nickel-graphene surfaces.

(8) FIG. 7(a) shows the corrosion rate of copper-graphene interfaces and FIG. 7(b) shows the corrosion rate of nickel-graphene interfaces.

(9) FIG. 8 shows a heat exchanger wall having substrate-graphene interfaces on both a coolant side and a condenser side.

(10) Repeat use of reference characters in the present specification and drawings is intended to represent the same or analogous features or elements of the present invention.

DETAILED DESCRIPTION

(11) Reference now will be made to the embodiments of the invention, one or more examples of which are set forth below. Each example is provided by way of an explanation of the invention, not as a limitation of the invention. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the invention without departing from the scope or spirit of the invention. For instance, features illustrated or described as one embodiment can be used on another embodiment to yield still a further embodiment. Thus, it is intended that the present invention cover such modifications and variations as come within the scope of the appended claims and their equivalents. It is to be understood by one of ordinary skill in the art that the present discussion is a description of exemplary embodiments only, and is not intended as limiting the broader aspects of the present invention, which broader aspects are embodied exemplary constructions.

(12) The present disclosure relates to efficient and robust condensing operations, apparatuses, and fabrication methods thereof. Condensers play an important role in many industries including petrochemicals, automotive, heating ventilation and air conditioning (HVAC), power generation, and water purification and desalination. Unfortunately, designing efficient condensers that can withstand varying environments is a difficult challenge. Problems and inefficiencies associated with the surface of condensers include biofouling (e.g., biofilms and bacteria on the condenser surface), oxidation of the condenser surface, and the films of water themselves acting as insulators. Also, when steam or water condenses, dissolved non-condensable gasses such as oxygen can oxidize and otherwise degrade the condenser surface. The methods and apparatuses discussed herein seek to mitigate or eliminate these problems of the prior art.

(13) Methods of fabricating condensers, and specifically condenser surfaces, are also disclosed. FIG. 1 shows a condenser surface 100 according to an embodiment of the present invention. The condenser surface includes of a substrate 101 and one or more layers of graphene 102. One, two, three, or more layers of graphene 102 can be formed on the substrate. The graphene can be formed as a layer on the substrate, but may preferably be formed in a manner that results in the creation of a substrate-graphene composite in which the graphene is integrated with the substrate material. That is, the molecular structure of the graphene can interact and even embed itself within the molecular structure or crystal lattice of substrate. Specifically, π-orbitals of the graphene can hybridize with the d-electrons of the substrate. The unique nature of the nickel-graphene composite allows for especially strong bonding. For example, the separation between the graphene and the substrate can be from about 0.05 nm to about 0.5 nm, preferably from about 0.1 nm to about 0.3 nm, and even more preferably from about 0.15 nm to about 0.25 nm. In a specific example, the separation between the respective materials in nickel-graphene composites is approximately 0.21 nm.

(14) The substrate 101 can be formed of any material that is conventionally known in the art including stainless steel, copper, brass, nickel, aluminum, titanium, as well as mixtures and alloys thereof. In some embodiments, the thermal mismatch between the graphene layers and the substrate can be less than 25×10.sup.−6 k.sup.−1, such as less than 20×10.sup.−6 k.sup.−1, such as less than 18×10.sup.−6K.sup.−1, such as less than 15×10.sup.−6 k.sup.−1. The thermal mismatch can also range from about 25×10.sup.−6 k.sup.−1 to about 8×10.sup.−6 k.sup.−1, such as from about 19×10.sup.−6 k.sup.−1 to about 11×10.sup.−6 k.sup.−1, such as from about 16×10.sup.−6 k.sup.−1 to about 12×10.sup.−6 k.sup.−1.

(15) In a specific embodiment, the substrate 101 can be a nickel or nickel alloy. Nickel and nickel alloys have been found to work particularly well with graphene, and it is believed that the graphene embeds itself within or binds tightly with the crystal lattice of the nickel substrate. The condenser can also be formed of a base material (such as stainless steel, copper, brass, aluminum, titanium, as well as mixtures and alloys thereof) that acts as the structural support of the condenser with a thin layer of nickel or nickel-alloy present on the surface of the base material. The thin layer of nickel or nickel-alloy on the surface of the base material can be applied using, for example, electroplating techniques. The nickel or nickel-alloy coating can therefore have a thickness of from about 1 to about 100 micrometers, such as from about 20 to about 80 micrometers, such as from about 40 to about 60 micrometers.

(16) FIG. 2 shows a scanning electron microscope image of graphene layers on a nickel substrate. The image shows a relatively uniform and defect free graphene structure. The graphene grain sizes should optimally be large and defect-free and can have an average diameter or width of greater than about 3 micrometers, such as greater than about 5 micrometers, such as greater than about 10 micrometers, such as greater than about 20 micrometers. Furthermore, the graphene grain sizes (or diameter, or width) can range from about 1 micrometer to about 50 micrometers, such as from about 3 micrometers to about 30 micrometers, such as from about 10 micrometers to about 20 micrometers.

(17) FIG. 3 shows a tube condenser having a nickel-graphene composite surface in accordance with an embodiment of the present disclosure. The tube condenser of FIG. 3 has coolant running within the tube and steam condensing on the surface of the tube. Dropwise condensation is achieved on the surface of the tube. The dropwise condensation wipes away water films from the surface of the tube and keeps water films from forming an insulating layer that would reduce the heat transfer of the condenser. The dropwise condensation is achievable due to the hydrophobic nature of the nickel-graphene composite surface. The hydrophobic surface may be attributable to weak van der Waals forces between the graphene layers and the out-of-plane water droplets. This may result in reduced drag forces between the substrate-graphene surface and the water droplets and further promote dropwise condensation.

(18) The substrate-graphene surface can be applied to any conventional condenser material which acts as a structural base and provides structural integrity. For example, the base of the condenser can be made of conventional materials that are known in the art such as stainless steel, carbon steel, titanium, aluminum, copper, nickel, brass, and mixtures and alloys therefore. The base can form the structural support for condenser tubing and fins that promote heat transfer. The substrate can then be applied to the condenser base followed by the layers of graphene. Alternatively, the condenser base can serve directly as the substrate.

(19) FIG. 8 shows a heat exchanger wall 800 having substrate-graphene interfaces on both a coolant side 801 and a condenser side 802. The heater exchanger wall 800 can have a base material 803 that serves as a structural support. A substrate layer 804 can be formed on one or both sides of the heat exchanger wall 800. One or more layers of graphene 805 can be applied to the substrates 804, or a suitable base material 803 can directly serve as the substrate.

(20) Graphene can be applied to the substrate in various ways. For example, graphene can be applied to the substrate using chemical vapor deposition (CVD), atmospheric pressure CVD, thin film physical vapor deposition (PVD) such as direct current magnetron sputtering, and deposition of hydrogenated amorphous carbon. The graphene layer can have a thickness greater than about about 5 nm, such as greater than about 10 nm, such as greater than about 20 nm, such as greater than about 30 nm. The graphene layer's thickness can also range from about 2 nm to about 100 nm, such as from about 5 nm to about 50 nm, such as from about 10 nm to about 30 nm.

(21) Graphene composite interfaces of the present disclosure can reduce biofouling by reducing bacterial adhesion by 50% or more. Calcium sulfate and other scale deposition rates can also be reduced. Furthermore, low surface energy graphene interfaces can be easily cleaned to remove scale and biofouling agents as their contact adhesion force is lessened by the graphene composite surface.

(22) The present invention may be better understood with reference to the following examples.

Example 1

(23) Nickel-graphene composite surfaces were produced. FIG. 4(a) shows a Raman spectroscopy graph for one, two, and three layers of graphene on a nickel substrate. FIG. 4(b) shows heat transfer coefficients (HTCs) of a pure nickel tube and a nickel tube having graphene layers. It can be seen that the nickel-graphene surface is able to produce approximately 150% greater heat transfer than the nickel tube without graphene. FIG. 4(c) shows HTCs after a period of 33 days. It shows that the nickel-graphene composite surface maintained superior heat transfer over the nickel only surface.

Example 2

(24) Both copper-graphene-monolayer and nickel-graphene-multilayer interfaces were prepared for steam condensation testing. Both surfaces were examined by X-ray photoelectron spectroscopy (XPS) before and after condensation experiments. As illustrated by FIG. 5(a), copper-graphene was oxidized after one two-hour test and quickly lost its graphene enhancement. In contrast, after a month-long test in air, the nickel-graphene composite did not show much oxidation, as seen in FIGS. 5(b), 5(c), and 5(d). The slight degradation in HTCs is likely due to the accumulation of hydroxyl groups (FIG. 5(b)), which increased with test time (FIG. 5(c)). This study shows that nickel-graphene interfaces exhibit superior anticorrosion properties in harsh steam environments. The superior durability of the nickel-graphene interface could be due to the similarities in thermal expansion between nickel and graphene. The thermal expansion mismatch between the graphene monolayer and the copper substrate is on the order of 19.2×10.sup.−6K.sup.−1, causing the graphene to separate from the copper substrate. However, the nickel-graphene interface has a smaller thermal expansion mismatch, on the order of 14×10.sup.−6K.sup.−1. Considering the additional lubrication effect between graphene layers, the nickel-graphene interface showed far better thermal expansion mismatch and durability.

(25) FIGS. 6(a), 6(b), and 6(c) show efficient dropwise condensation (DWC) and heat transfer coefficients of nickel-graphene surfaces. As illustrated in FIG. 6(a), nickel-graphene interfaces can enable up to six-times greater heat flux compared to other condenser surfaces. FIG. 6(b) shows equally important that, even with a high percentage of air, an approximately 180% enhancement is still achieved by a nickel-graphene interface relative to the state-of-practice film-wise condensation. Heat transfer coefficients generally decrease with lower working pressure, but the nickel-graphene interfaces still showed significant enhancement of approximately 200% at 0.4 atmospheres of pressure and at a subcooled temperature of 10° C. FIG. 6(c) shows heat transfer coefficients with different steam pressures. FIG. 6(c) demonstrates that higher steam pressures produce greater heat transfer coefficients. However, all of the heat transfer coefficients demonstrated are greater than the filmwise heat transfer coefficients, as shown in the shaded lower portion.

Example 3

(26) Corrosion studies were performed using Tafel analysis. FIG. 7(a) shows the corrosion rates of copper-graphene interfaces and FIG. 7(b) shows the corrosion rates of nickel-graphene interfaces. As illustrated in FIG. 7(a), copper-graphene initially shows a low corrosion rate. However, once corrosion starts to occur locally, the corrosion rate begins to accelerate rapidly and globally. In contrast and as illustrated in FIG. 7(b), the nickel-graphene interface is extremely stable and showed an approximately 450× lower corrosion rate even after a fourth test.

(27) These and other modifications and variations to the present invention may be practiced by those of ordinary skill in the art, without departing from the spirit and scope of the present invention, which is more particularly set forth in the appended claims. In addition, it should be understood the aspects of the various embodiments may be interchanged both in whole or in part. Furthermore, those of ordinary skill in the art will appreciate that the foregoing description is by way of example only, and is not intended to limit the invention so further described in the appended claims.