ULTRASONIC DEVICE
20220163486 · 2022-05-26
Assignee
Inventors
Cpc classification
G10K11/004
PHYSICS
International classification
Abstract
An ultrasonic device, the device comprising at least one flexible ultrasonic transducer; and a clamp configured to mount the at least one transducer to a test object. Optionally, the clamp may comprise one or more bands and wherein the one or more bands can optionally be metal or at least part of the one or more bands may be formed of a conformable material such that the one or more bands comprises a conformable band or band portion.
Claims
1. An ultrasonic device, the device comprising: at least one flexible ultrasonic transducer; and a clamp configured to mount the at least one flexible ultrasonic transducer to a test object.
2. The device of claim 1 in which the clamp comprises one or more bands.
3. The device of claim 2, wherein at least part or all of the one or more bands is metal.
4. The device of claim 2, wherein at least part of the one or more bands is formed of a conformable material such that the one or more bands comprise a conformable band or band portion.
5. The device according to claim 4, wherein the conformable material is an elastomeric material that is stable at temperatures from −100° C. to 300° C. or higher.
6. The device according to claim 4, wherein the at least one flexible ultrasonic transducer is inserted, insertable or at least partially or fully embedded or moulded into the conformable band or band portion.
7. The device according to claim 2, wherein the at least one band is configured with a securer for locking the band to and/or selectively releasing the band from the test object and/or adjusting the tension in the band.
8. The device according to claim 1, further comprising an urging mechanism, configured to urge the at least one flexible ultrasonic transducer towards and/or onto the test object, in use.
9. The device according to claim 8, wherein the urging mechanism is configured such that position of, or the force applied by the urging mechanism on, the at least one flexible ultrasonic transducer is selectively variable or adjustable by operation of the urging mechanism.
10. The device according to claim 8, wherein the urging mechanism comprises a screw or a rotational assembly.
11. The device according to claim 10, wherein the screw or the rotational assembly is coupled to the at least one flexible ultrasonic transducer via a coupling, the coupling being configured to accommodate the rotational motion of the screw without transferring rotational motion to the at least one flexible ultrasonic transducer.
12. The device according to claim 8, comprising a conformable buffer between the coupling and/or urging mechanism and the at least one flexible ultrasonic transducer.
13. The device according to claim 12, wherein the conformable buffer is configured to withstand temperatures of 150° C., 250° C., 300° C. or higher.
14. The device of claim 1, wherein the ultrasonic device is configured to operate at temperatures between 100° C. and 500° C.
15. The device of claim 1, further comprising one or more temperature sensors integrated into the ultrasonic device.
16. The device of claim 1, wherein the at least one flexible ultrasonic transducer is arranged in a transducer array.
17. The device according to claim 1, wherein the at least one flexible ultrasonic transducer of the transducer array comprises a layer of polycrystalline, inorganic piezoelectric material on a metallic foil substrate.
18. The device of claim 17, in which each flexible ultrasonic transducer of the transducer array comprises one or more discrete electrodes provided directly on the layer of polycrystalline, inorganic piezoelectric material and the metallic foil substrate is operable as a counter electrode.
19. The device according to claim 17, in which the layer of piezoelectric material has a thickness in the range of 2 to 20 μm; and/or the layer of polycrystalline, inorganic piezoelectric material is thinner than the metallic foil substrate.
20. The device according to claim 2, comprising a plurality of flexible ultrasonic transducers distributed along the one or more bands.
21. The device according to claim 20, wherein the at least one flexible ultrasonic transducer is provided on and/or feedable from a reel or spool.
22. The device according to claim 20, wherein a plurality of the at least one flexible ultrasonic transducers have different intra-transducer spacings therebetween.
23. A method of manufacturing, repairing or assembling the ultrasonic device of claim 1, the method comprising: providing at least one flexible ultrasonic transducer and a clamp; and mounting the at least one transducer to the clamp.
24. A method comprising: mounting the ultrasonic device of claim 1 to a test object using the clamp; bringing the at least one transducer or transducer array into contact and/or onto a surface of the test object; and providing a test signal to the transducer array and/or receiving the output signal from the ultrasonic transducer array.
25. Computer readable code that, when processed by an automated manufacturing system controller, causes the automated manufacturing system to produce at least part of the ultrasonic device of claim 1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0051] These and other aspects of the present disclosure will now be described, by way of example only, with reference to the accompanying Figures, in which:
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DETAILED DESCRIPTION OF THE DRAWINGS
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[0070] The device 5 comprises a device body 15, a clamp 20 and one or more ultrasonic transducers (in this example a plurality of the ultrasonic transducers are provided in an ultrasonic transducer array 25, which can be seen particularly in
[0071] As shown in
[0072] An array of electrodes 40 is provided on a surface of the piezoelectric layer 35 that is on an opposite side of the piezoelectric layer 35 to the substrate 30, such that the piezoelectric layer 35 is between the electrodes 40 and the substrate 30. Each electrode 40 is electrically connected to a corresponding electrical contact 45 by a respective conductive track 50. Each electrode and the associated portion of the piezoelectric layer 35 and substrate 30 can be considered to form a transducer of the transducer array 25. Each electrode 40 is individually addressable to drive the electrode 40 and to read out signals collected by the electrode 40. Electrically resistive dielectric material, such as photoresist e.g. SU-8, can optionally be provided between the piezoelectric layer 35 and both the conductive tracks 50 and contacts 45 and also between discrete electrodes 40, contacts 45 and conductive tracks 50 to mitigate against cross-talk.
[0073] For example, a control device (not shown) can be connected to the electrical contacts 45 to provide alternating drive signals to the electrodes 40 via the respective conductive tracks 50 in order to create a potential difference across the corresponding portions of the piezoelectric layer 35 that correspond to the driven electrode 40, so as to cause the corresponding portion of the piezoelectric layer 35 to oscillate with a frequency corresponding to that of the drive signal to thereby produce an ultrasonic wave having a corresponding frequency. Reflections of the emitted ultrasonic waves can also be received by the ultrasonic transducer array 25, causing at least portions of the piezoelectric layer 35 to oscillate, which thereby generates an electrical signal having a frequency dependent on that of the received ultrasonic wave. This can be received by the control device via the electrodes 40, conductive tracks 50 and contacts 45.
[0074] Examples of flexible ultrasonic transducers and ultrasonic transducer arrays that could be used (or at least features thereof) in the present examples are described in GB1803444.7, GB 1803257.3, GB2555835, WO2018/087560, PCT/GB2019/050567 and/or PCT/GB2019/050549, all in the name of the present applicant, and the contents of each of which are incorporated by reference as if disclosed in full herein.
[0075] The device body 15 in this example comprises a hollow metal enclosure that houses the ultrasonic transducer array 25 and any associated wiring and electronics. The device body 15 comprises an electrical connector 55 for connecting the contacts 45 of the ultrasonic transducer array 25 to the control device. The electrical connector 55 could be a microcoax connector, for example, but is not limited to this. The device body 15 comprises a plurality of feet 60, designed to engage with the test object 10 in order to securely mount the device 5 onto the test object 10.
[0076] The device body 15 is mounted onto the clamp 10, e.g. by passing part of the clamp 20 through channels in the device body, by physical connection, and/or the like. In this example, the clamp 20 comprises a plurality of bands 65. In this case the bands 65 are metal bands for strength and security, but are not limited to this. The bands 65 are configured to extend around at least part of the test object, in use, and to be selectively opened and closed. For example, the bands 65 may be configured to pass through channels in the device body 15 and to be secured by a screw, ratchet or other one-way mechanism, a lock lever, interference or press fit, a clip and/or the like.
[0077] As can be seen particularly in
[0078] In the example of
[0079] A distal end 90 of the screw 80 engages with a coupling 95 that is provided between the screw 80 and the transducer array 25. The coupling 95 accommodates the rotational motion of the screw 80 without passing on rotational motion to the transducer array 25. Examples of suitable couplings 95 include a socket joint, bearing mechanism or the like.
[0080] The coupling 95 is also provided with a conformable buffer 100 that sits between the rest of the coupling 95 and the ultrasonic transducer 25. The buffer 100 is resiliently deformable. The conformable buffer 100 can assist the flexible ultrasonic transducer array 25 in conforming to a curved surface of the test object whilst evenly distributing force over the transducer array 25, thereby mitigating against damage to the transducer array 25. The conformable buffer 100 also provides a degree of compensation for expansion/contraction of the test object with heating. However, the conformable buffer 100 is preferably configured to withstand the elevated temperatures, which may limit material selection, ruling out conventional engineering polymers and elastomers. As such, high temperature materials such as graphite, fibre reinforced materials or certain minerals such as vermiculite may be used for the buffer 100 to provide the desired temperature and accommodating properties.
[0081] In this way, in use, the screw 80 of the urging mechanism 75 may be operated in order to apply and vary an axial force of the transducer array 25 acting to urge the active surface 70 of the transducer array 25 onto the corresponding surface of the test object 10. The urging mechanism 75 is therefore operable to achieve the desired acoustic coupling between the transducer array 25 and the test object 10, preferably without the use of a couplant such as gel that may be disadvantageous or unsuitable for high temperature or long term use.
[0082] Another example of an ultrasonic device 205 is shown in
[0083] The device 205 comprises a clamp 220 and one or more ultrasonic transducers (in this example a plurality of the ultrasonic transducers are provided in a plurality of ultrasonic transducer arrays 225, which can be seen particularly in
[0084] Like the clamp 20 in the device 5 of
[0085] Specifically, the band 265 comprises a conformable material sub-band 305 formed from the conformable material and provided around a securing band 310. The band 265 can be used to fasten the device 205 around the test object 10 and provide sufficient force for couplant free operation. The band 265 can be secured and tightened with a closure mechanism 315. For example, the closure mechanism could comprise a ratchet mechanism, screw/bolt closure or worm gear arrangement, and/or the like. The securing band 310 is preferably formed from a suitably durable material such as metal, e.g. stainless steel.
[0086] The conformable material (e.g. the flexible elastomer) forming the conformable sub band 305 holds the ultrasonic transducers or transducer arrays 225. The ultrasonic transducers or transducer arrays 225 can optionally be moulded into the conformable material or may be removable inserts. The conformable material is electrically insulating and a layer of the conformable material extends between the metal securing band 310 and the ultrasonic transducers or transducer arrays 225 and/or any electronics required to operate them. This arrangement may protect the ultrasonic transducers or transducer arrays 225 by distributing force evenly. This backing of conformable material also provides a degree of compensation for expansion/contraction of the test object with heating. The ultrasonic transducers or transducer arrays 225 could optionally have integrated wiring that could be moulded through the conformable material or channelled between the conformable sub-band 305 and the metal securing band 310. Alternatively, the ultrasonic transducers or transducer arrays 225 could be fitted with a surface mount connector such as a microcoax allowing them to be hooked up with a separate wire for improved modularity.
[0087] As shown particularly in
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[0090] Although specific examples are described above in relation to the Figures, it will be appreciated that variations on the above examples are possible. As such, the scope of protection is defined by the claims and not by the above specific examples.
[0091] For example, although examples of piezoelectric materials being ZnO or AlN are given above, it will be appreciated that other piezoelectric materials could be used instead. Furthermore, although transition metal doped piezoelectric materials are described, it will be appreciated that non-doped piezoelectric materials could be used. In addition, although various thicknesses, dimensions, numbers and geometric arrangements of electrodes, conductive tracks and contacts are given above, it will be appreciated that other thicknesses, dimensions, numbers and geometric arrangements of electrodes, conductive tracks and contacts could be used. Indeed, although the electrodes are all shown as the same size and shape, it will be appreciated that at least some or all of the electrodes may be of different sizes and/or shapes.
[0092] Furthermore, whilst clamps in the form of bands are used, it will be appreciated that other clamping mechanisms such as gripping members, interference or press fit mechanisms and/or the like could be used. In addition, whilst various examples of suitable conformable materials have been given, it will be appreciated that other suitable conformable materials could be used.