RADAR MODULE COMPRISING A MICROWAVE CHIP

Abstract

A radar module configured for plant monitoring is provided, including: a microwave chip including a radar signal source configured to generate a radar signal; a coupling element connected to the radar signal source by a signal link; and a resonant cavity into which the coupling element projects, the coupling element being configured to couple the radar signal into the resonant cavity, and the resonant cavity being integrated in the microwave chip.

Claims

1.-15. (canceled)

16. A radar module configured for plant monitoring, comprising: a microwave chip comprising: a radar signal source configured to generate a radar signal; a coupling element connected to the radar signal source by a signal link; and a resonant cavity into which the coupling element projects, wherein the coupling element is configured to couple the radar signal into the resonant cavity, and wherein the resonant cavity is integrated in the microwave chip.

17. The radar module according to claim 16, wherein the resonant cavity is formed of a pot lined with conductive material, which is arranged in the microwave chip in whole or in part.

18. The radar module according to claim 16, wherein the resonant cavity has a metallized bottom and a side metallization formed in the microwave chip.

19. The radar module according to claim 16, wherein the microwave chip has a cavity forming the resonant cavity.

20. The radar module according to claim 16, further comprising a waveguide arranged to guide the coupled radar signal towards an object to be monitored.

21. The radar module according to claim 20, further comprising a lens arranged to focus the radar signal, wherein the microwave chip is integrally overmolded with a piece of the waveguide and the lens as an insert.

22. The radar module according to claim 20, wherein the waveguide is arranged at a top of the microwave chip and a bottom of the metallic pot is arranged at a bottom of the microwave chip so that the waveguide and the metallic pot at least partially surround the microwave chip and form the resonant cavity.

23. The radar module according to claim 16, wherein the coupling element is a coupling pin and/or a patch antenna.

24. The radar module according to claim 16, further comprising an antenna arranged to radiate the coupled radar signal in the direction of an object to be monitored, wherein the microwave chip further comprises a top layer and a bottom layer, wherein the signal link between the coupling element and the radar signal source is arranged on the top layer or inside the microwave chip, and wherein the antenna is located on the bottom layer.

25. The radar module according to claim 16, wherein the radar module is configured to generate a radar signal with a transmission frequency of more than 200 GHz.

26. The radar module according to claim 16, wherein a diameter of the resonant cavity is less than 1.5 mm.

27. The radar module according to claim 16, wherein a diameter of the resonant cavity is smaller than a diameter of the microwave chip.

28. The radar module according to claim 16, the radar module being further configured for level measurement, for point level measurement, or for plant automation.

29. A radar measurement device, comprising a radar module according to claim 16.

30. A method of manufacturing a radar module, comprising the step of: providing a radar signal source, a coupling element, a signal connection between the radar signal source and the coupling element, and a resonant cavity on or in a microwave chip, wherein the coupling element projects into the resonant cavity, and wherein the resonant cavity is integrated in the microwave chip.

Description

SHORT DESCRIPTION OF THE FIGURES

[0037] FIG. 1 shows a radar module according to one embodiment.

[0038] FIG. 2 shows a radar module according to a further embodiment.

[0039] FIG. 3 shows a flow diagram of a method according to one embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

[0040] FIG. 1 shows a small section of a radar module 100 of a radar measuring device 114 according to an embodiment. The radar module is used in the field of process automation, in particular for plant monitoring.

[0041] It has a microwave chip 101 on or in which a radar signal source 104 is formed. A coupling element 102 is provided, for example a coupling pin or an antenna patch, the coupling element and the radar signal source being interconnected by means of a signal link 103. The chip itself forms a resonant cavity 105 surrounded by a metallization 106, 107. In the case of FIG. 1, this metallization is in the form of a metallic pot with a bottom 106 on the underside. The coupling element 102 is arranged to couple the radar signal generated by the radar signal source into the resonant cavity 105 and the waveguide 109. The waveguide 109 then transmits the coupled radar signal to an antenna, which radiates it towards the object to be monitored.

[0042] A direct coupling of the radar signal from the microwave chip into the waveguide 109 takes place. In the case of very high frequencies (greater than 200 GHz), the waveguide 109 has dimensions that are smaller than, or at least similar to, the dimensions of the microwave chip. For example, a circular waveguide 109 has a diameter of less than 1.5 mm in the frequency range above 200 GHz. The dimensions of the microwave chip are in a similar range. The waveguide 109 is fully coupled to or on the microwave chip.

[0043] On the chip surface (top layer) is the coupling element 102, for example in the form of a coupling pin. The waveguide 109 is arranged above this. This means that the chip is located (at least partially or even completely) within the waveguide or the adjoining pot 106, 107.

[0044] The resonant cavity 105 is made of the material of the microwave chip. The side walls of the “pot” so formed are metallized structures. The metallization at the bottom of the pot may be produced by grinding the chip to the appropriate thickness and then conductively bonding it to the bottom 106.

[0045] The coupling element 102 may be located on the top layer, or it may be provided in an inner layer of the microwave chip.

[0046] A lens may be disposed over the entire arrangement or within the waveguide 109 for signal focusing (cf. lens 110 in FIG. 2). The lens may be mounted on the arrangement together with a piece-filled waveguide 109. Also, a small antenna horn 111 may be provided with a circular waveguide 109 (cf. FIG. 2).

[0047] In one embodiment, the chip is overmolded with a piece of waveguide, possibly including an optional lens, as an insert and may be used in a standard package form (QFN, . . . ) as an SMD component. The same applies to a small antenna horn with a corresponding round waveguide connection. The horn diameter is in the range of a few millimeters.

[0048] FIG. 2 shows a further design with the radiation direction rotated by 180°, i.e. through the chip. Here, the antenna 111 with the round waveguide connection 109 or the waveguide is placed on the back of the chip. Reference sign 112 here denotes the upper side of the chip (top layer), on which the bond pads 116 and the rear-side metallization 106 are arranged. Reference sign 113 denotes the back or bottom side of the microwave chip (bottom layer), on which the circular waveguide 109 with the antenna 111 is placed.

[0049] The chip must be placed precisely for this purpose. One advantage of this arrangement is that the remaining contacts 116 of the chip (for the supply, etc.) may be placed on the top layer. The mechanical connections for the antenna are located on the other side of the chip so that they cannot damage the bond connections.

[0050] The carrier 115 may receive the signals via the bond pads 116 and corresponding bond connections. The carrier 115 may be made of various materials. It may be implemented as a small wiring board. The antenna connector 109, 111 may be of various designs. The resonant cavity 105 is integrated into the chip, for example in the form of a cavity or recess 108. Alternatively to a recess, a metallization 107 is incorporated into the chip 101.

[0051] FIG. 3 shows a flowchart of a method according to one embodiment. In step 301, a microwave chip comprising a radar signal source is fabricated. In step 302, a resonant cavity is created in the chip, in particular by providing a cylindrical continuous or interrupted metallization in the chip or, alternatively, on the inner wall of a recess in the chip. In step 303, a coupling element is connected to the radar signal source via a signal connection and projects into the resonant cavity. These steps may also be implemented in a different order.

[0052] Supplementally, it should be noted that “comprising” and “comprising” do not exclude other elements or steps, and the indefinite articles “a” or “one” do not exclude a plurality. It should further be noted that features or steps that have been described with reference to any of the above embodiments may also be used in combination with other features or steps of other embodiments described above. Reference signs in the claims are not to be regarded as limitations.