METHOD FOR PRODUCING A COMPONENT, AND OPTOELECTRONIC COMPONENT

Abstract

A method for manufacturing a component is disclosed. In an embodiment a method for producing a component includes providing a connection carrier and forming a housing body on at least a part of the connection carrier by a 3D printing method, wherein forming the housing body includes applying at least one layer of a liquid potting compound, selectively curing the at least one layer of the liquid potting compound and removing residues of the liquid potting compound.

Claims

1.-15. (canceled)

16. A method for producing a component, the method comprising: providing a connection carrier; and forming a housing body on at least a part of the connection carrier by a 3D printing method, wherein forming the housing body comprises: applying at least one layer of a liquid potting compound; selectively curing the at least one layer of the liquid potting compound; and removing residues of the liquid potting compound.

17. The method of claim 16, further comprising applying at least one optoelectronic semiconductor chip on the connection carrier before forming the housing body.

18. The method of claim 16, further comprising introducing at least one cavity and/or an undercut into the housing body.

19. The method of claim 18, wherein the cavity and/or the undercut are formed at unexposed positions.

20. The method of claim 16, wherein curing of the liquid potting compound is carried out by selective exposure with an electromagnetic radiation source.

21. The method of claim 16, wherein curing of the liquid potting compound is carried out by a laser.

22. The method of claim 16, wherein curing of the liquid potting compound is carried out by using a digital mirror device.

23. The method of claim 16, further comprising applying at least two semiconductor chips on the connection carrier before forming the housing body, wherein the connection carrier remains free of the housing body in a free region between two adjacent semiconductor chips.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Further advantageous embodiments and developments of the method for producing a component and of the optoelectronic component may be found from the exemplary embodiments described below in connection with the figures, in which:

[0061] FIG. 1 shows a schematic sectional representation of a method for producing a component according to one exemplary embodiment;

[0062] FIG. 2 shows a schematic sectional representation of a method for producing a component according to one exemplary embodiment;

[0063] FIG. 3 shows a schematic sectional representation of an optoelectronic component according to one exemplary embodiment; and

[0064] FIG. 4 shows a plan view of a multiplicity of optoelectronic components according to one exemplary embodiment.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0065] Elements which are the same or similar, or which have the same effect, are provided with the same references in the figures. The figures and the size proportions of the elements represented in the figures with respect to one another are not to be regarded as true to scale. Rather, individual elements, in particular layer thicknesses, may be represented exaggeratedly large for better representability and/or for better understanding.

[0066] In the method for producing a component according to the exemplary embodiment of FIG. 1, a connection carrier 2 is provided in a first step. The connection carrier 2 is arranged on a platform it The platform 11 and the connection carrier 2 are located in a container 10.

[0067] A liquid potting compound 12 is introduced into the container 10. The liquid potting compound 12 comprises for example an epoxide, an acrylate, a vinyl ester resin, titanium dioxide, a silicone and/or a co-initiator.

[0068] The connection carrier 2 on the platform 11 is initially located at the surface of the liquid potting compound 12. The connection carrier 2 is arranged on the platform 11, and there is a layer 21 of the liquid potting compound 12 on the connection carrier 2.

[0069] The layer 21 of the liquid potting compound 12 is cured by means of a laser 13. The electromagnetic radiation of the laser 13 is radiated onto an optical unit 14, for example a mirror, which is then directed in a controlled way onto a particular position of the layer 21 by means of a galvanometer 15. Particular regions of the layer 21 may therefore be cured in a controlled way.

[0070] The curing is carried out layerwise. Once the layer 21 has been cured as desired, the platform 11 is moved further into the liquid potting compound 12 and the further layer 21 is cured in a controlled way by means of the laser 13. This is carried out until a multiplicity of layers 21 have been cured. In the exemplary embodiment of FIG. 1, for example, 20 layers 21 each with a thickness of 10 micrometers are cured layerwise. The cured layers 21 establish covalent bonds with one another and form the housing body 4.

[0071] At the positions which are not exposed by the laser 13, the liquid potting compound 12 is not cured and a cavity 19 and/or an undercut is formed. The liquid potting compound 12 which is not cured is removed. The method according to FIG. 1 has a very good resolution since the individual layers 21 can be irradiated with the aid of the laser 13, and therefore cured, in a controlled way.

[0072] Optionally, at least one semiconductor chip 3 may be applied on the connection carrier 2. The semiconductor chip 3 is applied on the connection carrier 2 before the housing body 4 is formed.

[0073] The method of the exemplary embodiment of FIG. 2 for producing a component comprises a container 10, in which a Z stage 20 and a platform 11 are arranged. The connection carrier 2 is arranged on the platform 11. The container 10 comprises a liquid potting compound 12.

[0074] According to this exemplary embodiment as well, the connection carrier 2 is initially located on the platform 11, close to the surface of the liquid potting compound 12. A layer 21 of the liquid potting compound 12 is arranged on the connection carrier 2. The layer 21 of the liquid potting compound 12 is selectively cured by exposure using an electromagnetic radiation source. After the layer 21 has been selectively cured, the platform 11, or the Z stage 20, is moved a little further into the liquid potting compound 12. The further layer 21 is located on the already cured potting compound and is in turn cured by the selective exposure using an electromagnetic radiation source.

[0075] The curing of the liquid potting compound 12 is carried out by using a digital mirror device 18. In this case, the electromagnetic rays of a light source 16 are deviated onto a multiplicity of mirrors 22, and then impinge on the liquid potting compound 12 via a lens 17. According to the exemplary embodiment of FIG. 2, for example, 20 layers 21 each with a thickness of 10 micrometers are successively cured layerwise. The individual layers 21 then bond to form a housing body 4. The positions which are unexposed form the cavity 19 and/or the undercut of the housing body 4.

[0076] The methods of FIGS. 1 and 2 show the production of components according to the top-down method. The components according to embodiments of the invention may similarly also be produced according to the bottom-up method and the CLIP (not shown here).

[0077] The exemplary embodiment of FIG. 3 shows an optoelectronic component 1. The optoelectronic component 1 comprises a connection carrier 2, a semiconductor chip 3 and a housing body 4. The housing body 4 encloses the connection carrier 2 and the semiconductor chip 3 in some positions. Furthermore, the housing body 4 comprises at least one cavity 19. In the exemplary embodiment of FIG. 3, the cavity 19 is configured as a closed hollow space and has a cuboid structure. Alternatively, the cavity 19 may also have the shape of a sphere, a cube, a cone, a conic frustum, a cylinder, a pyramid, a pyramidal frustum or a polyhedron (not shown here). The cavity is, in particular, free of material of the housing body and bounded by the housing body on all sides.

[0078] The semiconductor chip 3 is optionally fastened on the connection carrier 2 by means of an adhesive layer 5. Preferably, the semiconductor chip 3 is enclosed laterally by the housing body 4. The housing body 4 is for example connected to the semiconductor chip 3, at least arranged as tightly as possible on the semiconductor chip 3, in order to reduce or prevent moisture between the semiconductor chip 3 and the housing body 4.

[0079] FIG. 3 additionally shows that the side of the housing body 4 which faces away from the connection carrier 2 ends flush with the semiconductor chip 3. The radiation exit face 23 of the semiconductor chip 3 is therefore free of the housing body 4. Optionally, it is possible for the housing body 4 to protrude by at most 20 μm beyond the semiconductor chip 3. A thickness D of the housing body 4 is 200 μm. In this case, 20 layers 21 each with a thickness of 10 μm were applied. In the finished optoelectronic component 1, the housing body 4 merely comprises one continuous layer 21, since the 20 layers 21 establish covalent bonds with one another. The material of the housing body 4 is a polymerized epoxide.

[0080] The exemplary embodiment of FIG. 4 shows a plan view of a multiplicity of optoelectronic components 1. Each optoelectronic component 1 comprises a connection carrier 2, a semiconductor chip 3 and a housing body 4, which encloses the connection carrier 2 and the semiconductor chip 3 in some positions. A free region 6 of the connection carrier 2, which is located between the semiconductor chips 3, is in this case free of the housing body 4. This has the advantage that the singulation of the multiplicity of semiconductor chips 3 is simplified, since only the connection carrier 2 needs to be sawed through. No cracks are therefore formed in the housing body 4.

[0081] The features and exemplary embodiments described in connection with the figures may be combined with one another according to further exemplary embodiments, even if not all combinations are explicitly described. Furthermore, the exemplary embodiments described in connection with the figures may alternatively or additionally comprise further features according to the description in the general part.

[0082] The description with the aid of the exemplary embodiments does not restrict the invention to this description. Rather, the invention comprises any new feature and any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination is not itself explicitly specified in the patent claims or the exemplary embodiments.