EMC FILTER FOR ELECTROMAGNETIC REGULATION OF CONVERTER AND MANUFACTURING METHOD THEREOF
20220166310 · 2022-05-26
Assignee
Inventors
- Tae Ho Bang (Seoul, KR)
- Ji Hoon PARK (Suwon-si, KR)
- Hyun Woo Shim (Suwon-si, KR)
- Du Ho Kim (Yongin-si, KR)
- Soo Min Jeon (Yongin-si, KR)
- Deok Kwan Choi (Yongin-si, KR)
- Won Gon KIM (Yongin-si, KR)
- Min Heo (Seongnam-si, KR)
- Kang Min KIM (Seoul, KR)
- A Ra Lee (Seongnam-si, KR)
Cpc classification
B60L53/20
PERFORMING OPERATIONS; TRANSPORTING
H01F21/06
ELECTRICITY
H02M1/44
ELECTRICITY
H01F2017/065
ELECTRICITY
International classification
H02M1/44
ELECTRICITY
B60L53/20
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Provided is an electro-magnetic compatibility (EMC) filter including a lower bobbin having a U-shaped cross-sectional shape, a lower core including a magnetic material having a U-shaped cross-sectional shape and disposed on the lower bobbin, a bus bar disposed on the lower core, an upper bobbin having a hollow inside, having a hexahedral shape with one side open, and configured to cover an upper portion of the lower bobbin, and an upper core including a magnetic material having a plate-like shape, disposed in an internal space of the upper bobbin, and disposed on the lower core (U core) to cover the bus bar with a gap maintained by the bus bar between the upper and lower cores when the lower bobbin and the upper bobbin are coupled to each other.
Claims
1. An electro-magnetic compatibility (EMC) filter includes: a lower bobbin having a U-shaped cross-sectional shape; a lower core including a magnetic material having a U-shaped cross-sectional shape and disposed on the lower bobbin; a bus bar disposed on the lower core; an upper bobbin having a hollow inside, having a hexahedral shape with one side open, and configured to cover an upper portion of the lower bobbin; and an upper core including a magnetic material having a plate-like shape, disposed in an internal space of the upper bobbin, and disposed on the lower core to cover the bus bar with a gap maintained by the bus bar between the upper and lower cores when the lower bobbin and the upper bobbin are coupled to each other.
2. The EMC filter of claim 1, wherein the bus bar is configured to extend to bypass the gap so as not to overlap the gap.
3. The EMC filter of claim 1, wherein the bus bar includes: a first bus bar configured to extend below a height level of the gap so as not to overlap the gap; and second and third bus bars configured to extend from respective upper end surfaces of two ends of the first bus bar in opposite directions.
4. The EMC filter of claim 3, wherein a height of the lower core is a thickness of the second bus bar or the third bus bar.
5. The EMC filter of claim 3, wherein a height of the lower core is designed by a following equation:
(the height of the lower core=2×a thickness of the first bus bar−the gap).
6. The EMC filter of claim 1, further comprising: a heat dissipation material applied to a portion of the bus bar and a portion of the lower core not covered by the bus bar and exposed upwardly.
7. The EMC filter of claim 1, wherein the bus bar includes: a first bus bar extending below a height level of the gap so as not to overlap the gap; and second and third bus bars extending from respective upper end surfaces of two ends of the first bus bar in opposite directions, wherein the EMC filter further includes a heat dissipation material applied to a portion of the lower core not covered by the bus bar and exposed upwardly and a portion of the first bus bar.
8. A method of manufacturing an electro-magnetic compatibility (EMC) filter, the method comprising: attaching a lower core having a U-shaped cross-sectional shape to a lower bobbin having a U-shaped cross-sectional shape; attaching a bus bar to the lower core; applying a heat dissipation material to a portion of the bus bar and a portion of the lower core exposed upwardly and not covered by the bus bar; attaching an upper core to a lower surface of an internal space of the upper bobbin; and coupling the lower bobbin and the upper bobbin such that the lower core and the upper core encase the bus bar with a gap between the lower core and the upper core maintained by the bus bar.
9. The method of claim 8, wherein the bus bar includes: a first bus bar configured to extend below a height level of the gap so as not to overlap the gap; and second and third bus bars configured to extend from respective upper end surfaces of two ends of the first bus bar in opposite directions, wherein, in the applying a heat dissipation material, the portion of the bus bar is a surface of the first bus bar.
10. The method of claim 8, wherein the attaching a bus bar to the lower core includes attaching the bus bar, extending to bypass the gap so as not to overlap the gap, to the lower core.
11. The method of claim 8, wherein the gap is constantly maintained even with external vibration and impact as the gap is maintained by the bus bar having a metal material.
12. The method of claim 8, wherein the bus bar includes: a first bus bar configured to extend below a height level of the gap so as not to overlap the gap; and second and third bus bars configured to extend from respective upper end surfaces of two ends of the first bus bar in opposite directions, wherein the method further comprising: manufacturing the lower core, wherein, in the manufacturing the lower core, a height of the lower core is a thickness of the second bus bar or the third bus bar, or is manufactured by a following equation:
the height of the lower core=2×a thickness of the first bus bar−the gap.
13. An electro-magnetic compatibility (EMC) filter comprising: a lower bobbin having a U-shaped cross-sectional shape; a lower core having a magnetic material, having a U-shaped cross-sectional shape, and disposed on the lower bobbin; a bus bar disposed on the lower core; an upper bobbin having a plate-like shape and configured to cover an upper portion of the lower bobbin; and an upper core having a magnetic material, having a plate-like shape, disposed on a lower surface of the upper bobbin, and disposed on the lower core with a gap maintained by the bus bar when the lower bobbin and the upper bobbin are coupled to each other.
14. The EMC filter of claim 13, wherein the bus bar is configured to extend to bypass the gap so as not to overlap the gap.
15. The EMC filter of claim 13, wherein a heat dissipation material is applied to a portion of the bus bar and a portion of the lower core not covered by the bus bar and exposed upwardly.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
[0026]
DETAILED DESCRIPTION OF EMBODIMENTS
[0027] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0028] The advantages, features and aspects of the present disclosure will become apparent from the following description of the embodiments with reference to the accompanying drawings, which is set forth hereinafter. The present disclosure may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. In this disclosure, when an element is described as being connected to another element, the element may be directly connected to the other element, or a third element may be interposed therebetween. Also, in the drawings, a shape or a size of each element is exaggerated for convenience of a description and clarity, and elements irrelevant to a description are omitted. Like reference numerals refer to like elements throughout. The terms of a singular form may include plural forms unless referred to the contrary. The meaning of ‘comprise’, ‘include’, or ‘have’ specifies a property, a region, a fixed number, a step, a process, an element and/or a component but does not exclude other properties, regions, fixed numbers, steps, processes, elements and/or components.
[0029]
[0030] Referring to
[0031] As shown in
[0032]
[0033] Referring to
[0034] The bobbins 110 and 130 are configured to include a lower bobbin 110 and an upper bobbin 130 covering an upper portion of the lower bobbin 110.
[0035] As shown in
[0036] The upper bobbin 130 has one side open and is formed in a hexahedral shape with an empty inside, may be formed of the same material as that of the lower bobbin 110, and may be molded to have a hexahedral shape with one side open and an inside empty by an injection molding method.
[0037] The lower core 120 (or a U core) is disposed on the lower bobbin 110. Here, the lower core 120 is also formed to have a U-shaped cross-sectional structure so as to be disposed on the lower bobbin 110 having a U-shaped cross-sectional structure.
[0038] The lower core 120 (or a U core) is formed of a magnetic material, and the magnetic material may be, for example, a ferrite-based material.
[0039] In an internal space of the upper bobbin 130, the upper core 140, (or an I core in
[0040] As shown in
[0041] The upper core 140 (I core) may also be formed of a magnetic material like the lower core 120 (U core).
[0042] When the lower bobbin 110 and the upper bobbin 130 are coupled to each other, a preset gap (G in
[0043] The bus bar 150 is disposed on the lower core 120 (U core). Unlike the related art in which a bobbin is manufactured in a special shape to design the gap, in the present disclosure, the gap (in
[0044] Since the gap (G in
[0045] The bus bar 150 disposed on the lower core 120 (U core) includes first to third bus bars 152, 154, and 156 being integrally formed.
[0046] The first bus bar 152 is disposed on the lower core 120 (U core), and extends in a straight line under the gap (G in
[0047] The second and third bus bars 154 and 156 extend in a straight line in opposite directions from upper end surfaces of both ends of the first bus bar 152, and when manufacturing of the EMC filter 100 is completed by coupling the lower bobbin 110 and the upper bobbin 130, the lower bobbin 110 and the upper bobbin 130 are designed to extend to the outside of a coupled assembly.
[0048] The second and third bus bars 154 and 156 are respectively connected to an output terminal (not shown in
[0049] The bus bar 150 including the first to third bus bars 152, 154, and 156 may extend to bypasses the gap (G in
[0050] Of course, as shown in
[0051] The bus bar 150 may be formed of a highly conductive metal material. Metal materials are harder than plastic materials. In the present disclosure, as shown in
[0052] Accordingly, the gap (G in
[0053] Meanwhile, a height (H in
[0054] Here, the height H of the lower core 120 (U core) may be a thickness of the second and third bus bars 154 and 156. In this case, the thicknesses of the second and third bus bars 154 and 156 are equal, and the thickness of the first bus bar 152 (B in
[0055] In this embodiment, the height H of the lower core 120 (U core) may be designed by the following equation.
Height of lower core (H in FIGS. 4 and 6)=2×thickness of first bus bar 152 (B in FIGS. 4 and 6)−gap (G in FIGS. 5 and 6) [Equation 1]
[0056]
[0057] First, referring to
[0058] Next, referring to
[0059] Next, referring to
[0060] Next, referring to
[0061] Next, referring to
[0062] According to the coupling process of the lower bobbin 110 and the upper bobbin 130, the lower core 120 and the upper core 140 encase the bus bars 150 with the preset gap (G in
[0063] In this manner, as the bus bars 150 (152, 154, and 156) extend in the structure bypassing the gap (G in
[0064] In addition, since the bus bars 150 (152, 154, and 156) of a hard material such as a metal material maintain (or support) the gap (G in
[0065]
[0066] Referring to
[0067] The lower bobbin 110′ according to another embodiment may be implemented to have the same structure and function as the lower bobbin 110 described above with reference to
[0068] Therefore, the description of the lower bobbin 110′ and the bus bar 150′ according to another embodiment of the present disclosure is replaced with the description of the lower bobbin 110 and the bus bar 150 described above with reference to
[0069] However, the upper bobbin 130′ according to another embodiment is different from the upper bobbin 130 formed of a hexahedral shape with one side open and an empty inside a described above in that the upper bobbin 130′ has a plate-like shape. In this case, the upper core may be disposed on a lower surface of the upper bobbin 130′, rather than on a bottom surface forming an internal space of the upper bobbin 130′, unlike the embodiment described above.
[0070] Except for the shape difference, the upper bobbin 130′ and the upper bobbin 130 described above are implemented to have the same function. Therefore, the description of the upper bobbin 130′ is also replaced with the description of the upper bobbin 130 described above.
[0071] According to the EMC filter of the present invention, a heat dissipation material is applied on a bus bar extending to bypass a gap (gap between an upper core and a lower core) inside the core, thereby minimizing a temperature rise of a bus bar that occurs due to a fringing effect (fringing field) in the gap inside the core.
[0072] In addition, since the EMC filter of the present disclosure is directly installed on a cooling passage in the outer housing of the converter, cooling efficiency of the bus bar is improved.
[0073] In addition, according to the EMC filter of the present disclosure, by maintaining the gap inside the core (the gap between the upper core and the lower core) with a bus bar formed of a hard metal material, the gap inside the core may be maintained even for strong external vibrations and shocks.
[0074] In addition, according to the EMC filter of the present disclosure, as described above, since the bus bar maintains the gap inside the core (the gap between the upper core and the lower core), as in the prior art, the bobbin has a special shape to maintain the gap, the bobbin may be manufactured to have a simple shape, rather than a special shape for maintaining the gap, thereby reducing time and cost required for manufacturing the bobbin.
[0075] A number of exemplary embodiments have been described above. Nevertheless, it will be understood that various modifications may be made. For example, suitable results may be achieved if the described techniques are performed in a different order and/or if components in a described system, architecture, device, or circuit are combined in a different manner and/or replaced or supplemented by other components or their equivalents. Accordingly, other implementations are within the scope of the following claims.