Method for Preparing TEM Sample

Abstract

The present application discloses a method for preparing a TEM sample, comprising: step 1, forming a first protective layer to non-full fill a deep trench; step 2, performing a first time of front and rear side cutting using a FIB, so as to form the TEM sample having a first thickness, and a via in the deep trench is exposed from the front side and the rear side of the TEM sample; step 3, forming a second material layer, which fully fills the exposed via from the front side and the rear side of the TEM sample; and step 4, performing a second time of front and rear side cutting of a target area on the chip sample using the FIB, so as to reduce the thickness of the TEM sample to a target thickness.

Claims

1. A method for preparing a transmission electron microscope (TEM) sample, comprising the following steps: step 1, providing a chip sample having a deep trench, and forming a first protective layer, the first protective layer filling the deep trench from a top of the chip sample, and the first protective layer further extending to a top surface of the chip sample outside the deep trench, wherein a first value is a maximum aspect ratio of a trench fully filled with the first protective layer, an aspect ratio of the deep trench is greater than the first value, the first protective layer does not fully fill the deep trench, and a via produced by non-full filling is formed in the deep trench; step 2, performing, using a focused ion beam (FIB), a first time of front and rear side cutting of a target area on the chip sample for forming the TEM sample, so as to form the TEM sample having a first thickness, the first thickness being greater than a target thickness, wherein a front side and a rear side of the TEM sample both intersect with an extension direction of the deep trench, and the via in the deep trench is exposed from the front side and the rear side of the TEM sample; step 3, forming a second material layer, the second material layer fully filling the exposed via from the front side and the rear side of the TEM sample; and step 4, performing a second time of front and rear side cutting of the target area on the chip sample using the FIB, so as to reduce a thickness of the TEM sample to the target thickness.

2. The method for preparing the TEM sample according to claim 1, wherein the chip sample comprises a semiconductor substrate and a semiconductor device layer formed on a front side of the semiconductor substrate, and the deep trench is located on the semiconductor device layer.

3. The method for preparing the TEM sample according to claim 2, wherein the chip sample comprises a plurality of deep trenches, and all of the deep trenches are arranged in parallel.

4. The method for preparing the TEM sample according to claim 3, wherein, in the semiconductor device layer, a structure having the deep trench comprises: deep trench isolation; an arrangement structure of polysilicon wires; an arrangement structure of fins; and an arrangement structure of metal wires.

5. The method for preparing the TEM sample according to claim 1, wherein, in step 1, the first protective layer is formed by means of an electron beam assisted deposition process or a colloid coating process.

6. The method for preparing the TEM sample according to claim 1, wherein, in step 2, the front side and the rear side of the TEM sample both perpendicularly intersect with the extension direction of the deep trench.

7. The method for preparing the TEM sample according to claim 1, wherein, in step 2, a cutting direction of the first time of front and rear side cutting is a direction from the top surface to a bottom surface of the chip sample.

8. The method for preparing the TEM sample according to claim 1, wherein the first thickness is 100-300 nm.

9. The method for preparing the TEM sample according to claim 8, wherein the target thickness is 30-80 nm.

10. The method for preparing the TEM sample according to claim 1, wherein, in step 3, the second material layer is formed by means of an electron beam assisted deposition process.

11. The method for preparing the TEM sample according to claim 2, wherein the semiconductor substrate comprises a silicon substrate.

12. The method for preparing the TEM sample according to claim 1, wherein a material of the first protective layer comprises a metal material.

13. The method for preparing the TEM sample according to claim 1, wherein a material of the second material layer comprises a metal material.

14. The method for preparing the TEM sample according to claim 1, wherein, in step 1, a thickness of the chip sample is greater than 500 nm.

15. The method for preparing the TEM sample according to claim 14, wherein the chip sample is obtained by cutting and thinning a wafer composed of a semiconductor substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The present application is described in detail below with reference to the drawings and specific implementations

[0047] FIG. 1A is a top view of a chip sample provided in an existing method for preparing a TEM sample.

[0048] FIG. 1B is a sectional view corresponding to FIG. 1A.

[0049] FIG. 2A is a top view of the chip sample provided after filling with a protective layer in the existing method for preparing a TEM sample.

[0050] FIG. 2B is a sectional view corresponding to FIG. 2A.

[0051] FIG. 3A is a top view of the chip sample provided after front and rear side cutting of the TEM sample in the existing method for preparing a TEM sample.

[0052] FIG. 3B is a sectional view corresponding to FIG. 3A.

[0053] FIG. 4 is a picture of the TEM sample prepared by the existing method for preparing a TEM sample.

[0054] FIG. 5 is a flowchart of a method for preparing a TEM sample according to an embodiment of the present application.

[0055] FIG. 6A is a top view of a chip sample provided in step 1 of the method for preparing a TEM sample according to an embodiment of the present application.

[0056] FIG. 6B is a sectional view corresponding to FIG. 6A.

[0057] FIG. 7A is a top view of the chip sample provided after filling the top with a first protective layer in step 1 of the method for preparing a TEM sample according to an embodiment of the present application.

[0058] FIG. 7B is a sectional view corresponding to FIG. 7A.

[0059] FIG. 8A is a top view of the chip sample provided after the first time of front and rear side cutting in step 2 of the method for preparing a TEM sample according to an embodiment of the present application.

[0060] FIG. 8B is a sectional view corresponding to FIG. 8A.

[0061] FIG. 9A is a top view of the chip sample provided after side filling with a first material in step 3 of the method for preparing a TEM sample according to an embodiment of the present application.

[0062] FIG. 9B is a sectional view corresponding to FIG. 9A.

[0063] FIG. 10A is a top view of the chip sample provided after the second time of front and rear side cutting in step 4 of the method for preparing a TEM sample according to an embodiment of the present application.

[0064] FIG. 10B is a sectional view corresponding to FIG. 10A.

DETAILED DESCRIPTION OF THE DISCLOSURE

[0065] FIG. 5 is a flowchart of a method for preparing a TEM sample according to an embodiment of the present application. The method for preparing a TEM sample according to an embodiment of the present application includes the following steps.

[0066] Step 1. Referring to FIG. 6A, a chip sample 201 having a deep trench 202 is provided.

[0067] In this embodiment of the present application, the chip sample 201 includes a semiconductor substrate and a semiconductor device layer formed on a front side of the semiconductor substrate. The deep trench 202 is located on the semiconductor device layer.

[0068] The semiconductor substrate includes a silicon substrate.

[0069] The thickness of the chip sample 201 is greater than 500 nm. The chip sample 201 is obtained by cutting and thinning a wafer composed of the semiconductor substrate.

[0070] The chip sample 201 includes a plurality of the deep trenches 202, and all the deep trenches 202 are arranged in parallel.

[0071] In some embodiments, a structure having the deep trench 202 is deep trench isolation.

[0072] In some embodiments, the structure having the deep trench 202 is an arrangement structure of polysilicon wires. The deep trench 202 is formed between the polysilicon wires.

[0073] In some embodiments, the structure having the deep trench 202 is an arrangement structure of fins. The deep trench 202 is formed between the fins.

[0074] In some embodiments, the structure having the deep trench 202 is an arrangement structure of metal wires. The deep trench 202 is formed between the metal wires.

[0075] In FIG. 6A, the length direction of the deep trench 202 is a y direction, the width direction of the deep trench 202 is an x direction, and the deep trenches 202 are arranged at intervals along the x direction. The dashed line box 203 represents a target area for forming the TEM sample, that is, an area to be analyzed is located in the dashed line box 203.

[0076] FIG. 6B is a sectional view corresponding to FIG. 6A, wherein a section is an xz plane.

[0077] Referring to FIG. 7A, a first protective layer 204 is formed. Referring to FIG. 7B, the first protective layer 204 fills the deep trench 202 from the top of the chip sample 201, and the first protective layer 204 further extends to the top surface of the chip sample 201 outside the deep trench 202.

[0078] A first value is a maximum aspect ratio of a trench fully filled with the first protective layer 204, and the aspect ratio of the deep trench 202 is greater than the first value. The first protective layer 204 does not fully fill the deep trench 202, and a via 205 produced by non-full filling is formed in the deep trench 202.

[0079] In some embodiments, the first protective layer 204 is formed by means of an electron beam assisted deposition process. In this case, the first protective layer 204 can be directly formed in a FIB system. In other embodiments, the first protective layer 204 is formed by means of a colloidal coating process.

[0080] The material of the first protective layer 204 includes a metal material.

[0081] Step 2. Referring to FIG. 8A, the first time of front and rear side cutting of a target area on the chip sample 201 for forming a TEM sample is performed using a FIB, so as to form the TEM sample 206a having a first thickness, the first thickness being greater than a target thickness, wherein a front side 2061a and a rear side 2062a of the TEM sample 206a both intersect with an extension direction of the deep trench 202, and referring to FIG. 8A, the via 205 in the deep trench 202 is exposed from the front side 2061a and the rear side 2062a of the TEM sample 206a.

[0082] In FIG. 8A, the blank area on both sides of the TEM sample 206a is an area to be removed by the first time of front and rear side cutting.

[0083] In some example embodiments, the front side and the rear side of the TEM sample both perpendicularly intersect with the extension direction of the deep trench 202.

[0084] In some embodiments, a cutting direction of the first time of front and rear side cutting is a direction from the top surface to the bottom surface of the chip sample 201.

[0085] The first thickness is 100-300 nm.

[0086] The target thickness is 30-80 nm.

[0087] Step 3. Referring to FIG. 9A, a second material layer 301 is formed. Referring to FIG. 9B, the second material layer 301 fully fills the exposed via 205 from the front side 2061a and the rear side 2062a of the TEM sample.

[0088] In some embodiments, the second material layer 301 is formed by means of an electron beam assisted deposition process. In this case, the second material layer 301 can be directly formed in the FIB system, and the second material layer 301 is formed by means of a low energy side filling process.

[0089] The material of the second material layer 301 includes a metal material.

[0090] Step 4. Referring to FIG. 10A, the second time of front and rear side cutting of the target area on the chip sample 201 is performed using the FIB, so as to reduce the thickness of the TEM sample 206 to the target thickness. The TEM sample reaching the target thickness is separately marked with mark 206, and the front side of the TEM sample 206 is marked with mark 2061 and the rear side is marked with mark 2062.

[0091] In the process of the second time of front and rear side cutting, since both the front side 2061 and rear side 2062 of the TEM sample 206 have no vias, ion beam scratches can be reduced or eliminated. FIG. 10B shows that no ion beam scratch is produced.

[0092] In the present application, for the chip sample 201 having the deep trench 202, after the top of the chip sample 201 is filled with the first protective layer 204, the front and rear side cutting of the TEM sample is divided. Before the TEM sample is thinned to the target thickness, the via 205 formed after filling the deep trench 202 with the first protective layer 204 is exposed from the front side 2061a and the rear side 2062a of the TEM sample 206a. A step of side filling for the TEM sample 206a is added, and the via 205 in the deep trench 202 of the TEM sample 206a is fully filled by means of the side filling. Then front and rear side cutting of the TEM sample continues, i.e., the second time of front and rear side cutting. Before the second time of front and rear side cutting, the deep trench 202 in the TEM sample area is fully filled with the first protective layer 204 and the second material layer 301, and thus no ion beam scratch is produced during the second time of front and rear side cutting. Therefore, the embodiment of the present application can reduce or eliminate ion beam scratches produced during a sample preparation process for the chip sample 201 having the deep trench 202, thereby eliminating damages caused by the ion beam scratches in the TEM sample 206 and improving the quality of the TEM sample 206 and the success rate of sample preparation.

[0093] In addition, the second material layer 301 of the embodiment of the present application can be realized by means of the electron beam assisted deposition process, while the first time of front and rear side cutting and the second time of front and rear side cutting are both performed by using the FIB. Both electron beam assisted deposition and FIB cutting can be realized in the same FIB system, so the present application is also characterized by simple operation and low process cost.

[0094] The present application is described in detail above via specific embodiments, which, however, do not intended to limit the present application. Without departing from the principle of the present application, those skilled in the art can also make many other changes and improvements, which shall also be considered as the scope of protection the present application.