Method for preparing avalanche photodiode

Abstract

A method for preparing an avalanche photodiode includes preparing a mesa on a wafer, growing a sacrificial layer on an upper surface of the wafer and a side surface of the mesa, removing the sacrificial layer in an ohmic contact electrode region of the wafer, preparing an ohmic contact electrode in the ohmic contact electrode region of the wafer, removing the sacrificial layer in a non-mesa region of the wafer, growing a passivation layer on the upper surface of the wafer and the side surface of the mesa, removing the passivation layer on the upper surface of the mesa of the wafer and the passivation layer in the non-mesa region of the wafer corresponding to the ohmic contact electrode region, and removing the sacrificial layer on the upper surface of the mesa of the wafer.

Claims

1. A method for preparing an avalanche photodiode, comprising: preparing a mesa on a wafer; growing a sacrificial layer on an upper surface of the wafer and on a side surface of the mesa; removing the sacrificial layer on an ohmic contact electrode region of the wafer; preparing an ohmic contact electrode on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed; removing the sacrificial layer on the side surface of the mesa and on a non-mesa region of the wafer on which the ohmic contact electrode is prepared, the non-mesa region being a region of the wafer outside of the mesa; growing a passivation layer on the upper surface of the wafer and the side surface of the mesa from which the sacrificial layer in the non-mesa region and on the side surface of the mesa has been removed; removing the passivation layer on the upper surface of the mesa of the wafer on which the passivation layer is grown, and removing the passivation layer in the non-mesa region of the wafer corresponding to the ohmic contact electrode region; and removing the sacrificial layer on the upper surface of the mesa of the wafer, and wherein the step of preparing the ohmic contact electrode on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed comprises: vapor-depositing a metal layer on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed; and preparing the ohmic contact electrode by annealing the wafer on which the metal layer is vapor-deposited in a nitrogen atmosphere.

2. The method of claim 1, wherein the wafer comprises, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer; or wherein the wafer comprises, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer; or wherein the wafer comprises, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, and a silicon carbide N layer.

3. The method of claim 2, wherein the step of preparing the mesa on the wafer comprises: etching the non-mesa region of the wafer via photolithography and etching process, down to an upper surface of the silicon carbide P.sup.+ layer.

4. The method of claim 2, wherein the substrate is a silicon carbide substrate.

5. The method of claim 1, wherein the mesa is tilted with a preset angle.

6. The method of claim 1, wherein the sacrificial layer is one of, or a multiple combination of, a silicon oxide layer, an aluminum oxide layer, a chromium oxide layer, an yttrium oxide layer, or a silicon nitride layer.

7. The method of claim 1, wherein the passivation layer is one of, or a multiple combination of, a silicon oxide layer, an aluminum oxide layer, a chromium oxide layer, an yttrium oxide layer, or a silicon nitride layer.

8. The method of claim 1, wherein a thickness of the sacrificial layer is from 10 nm to 300 nm, and wherein a thickness of the passivation layer is from 50 nm to 500 nm.

9. The method of claim 1, wherein a material of the ohmic contact electrode is one of, or a multiple combination of, nickel, titanium, aluminum, or gold.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Drawings for describing embodiments herein or related art are introduced below briefly for clearer illustration of a technical solution herein. Note that the drawings described below refer merely to some embodiments herein. A person having ordinary skill in the art may acquire other drawings according to the drawings herein without creative effort.

(2) FIG. 1 is a flow chart of a method for preparing an avalanche photodiode according to an embodiment herein; and

(3) FIG. 2 is a sectional view of a structure of a method for preparing an avalanche photodiode according to an embodiment herein.

(4) Corresponding numerals and symbols in the different figures generally refer to corresponding parts unless otherwise indicated. The figures are drawn to clearly illustrate the relevant aspects of the various embodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(5) The making and using of the embodiments of this disclosure are discussed in detail below. It should be appreciated, however, that the concepts disclosed herein can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative, and do not limit the scope of the claims.

(6) In description as follows, for purpose of illustration rather than limiting, specifics such as a specific system structure, technology, etc., are proposed for a thorough understanding of embodiments herein. However, a skilled person in the art shall know that the subject disclosure may also be implemented in other embodiments without these specifics. In other cases, elaboration of a well-known system, apparatus, circuit, method, etc., is omitted, to prevent an unnecessary detail from obscuring description of the subject disclosure.

(7) A technical solution herein is illustrated below with reference to specific embodiments.

(8) Referring to FIG. 1, a method for preparing an avalanche photodiode comprises options as follows.

(9) At S101, prepare a mesa on a wafer.

(10) In the embodiment of the disclosure, the wafer may be a silicon carbide wafer, a gallium nitride wafer or other wafer that can be used for preparing an avalanche photodiode. Preferably, the wafer is a silicon carbide wafer. Silicon carbide may be preferred for preparing an ultraviolet photo detector due to a property thereof such as a wide band gap, good thermal conductivity, a high saturation drift speed of electrons, a stable chemical property, and a low density of defects, etc. Concretely, the material of the wafer may be 4H—SiC.

(11) In one embodiment, the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer. Or the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer. Or the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, and a silicon carbide N layer.

(12) In the embodiment of the disclosure, the silicon carbide P.sup.+ layer may be a heavy-doped silicon carbide P-type layer. The silicon carbide N.sup.− layer may be a light-doped silicon carbide N-type layer. The silicon carbide N.sup.+ layer may be a heavy-doped silicon carbide N-type layer. In one embodiment, the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer. Therein, a doping concentration of the silicon carbide P.sup.+ layer may be 1×10.sup.18 cm.sup.−3 to 1×10.sup.20 cm.sup.−3, and a doping concentration of the silicon carbide N layer may be 1×10.sup.17 cm.sup.−3 to 5×10.sup.18 cm.sup.−3, and a doping concentration of the silicon carbide N.sup.− layer may be 1×10.sup.15 cm.sup.−3 to 1×10.sup.17 cm.sup.−3, and a doping concentration of the silicon carbide N.sup.+ layer may be 1×10.sup.18 cm.sup.−3 to 1×10.sup.20 cm.sup.−3. In other embodiment, the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, a silicon carbide N.sup.− layer, and a silicon carbide N.sup.+ layer, forming a PIN structure. Therein, the doping concentration of the silicon carbide P.sup.+ layer may be 1×10.sup.18 cm.sup.−3 to 1×10.sup.20 cm.sup.−3, and the doping concentration of the silicon carbide N.sup.− layer may be 1×10.sup.15 cm.sup.−3 to 1×10.sup.17 cm.sup.−3, and the doping concentration of the silicon carbide N.sup.+ layer may be 1×10.sup.18 cm.sup.−3 to 1×10.sup.20 cm.sup.−3. In other embodiment, the wafer may comprise, from bottom to top, a substrate, a silicon carbide P.sup.+ layer, and a silicon carbide N layer, forming a PN structure. Therein, the doping concentration of the silicon carbide P.sup.+ layer may be 1×10.sup.18 cm.sup.−3 to 1×10.sup.20 cm.sup.−3, and the doping concentration of the silicon carbide N layer may be 5×10.sup.17 cm.sup.−3 to 1×10.sup.20 cm.sup.−3.

(13) In one embodiment, S101 may be implemented as follows: etching the non-mesa region of the wafer via photolithography and an etching process, down to an upper surface of the silicon carbide P.sup.+ layer.

(14) In the embodiment of the disclosure, the wafer may include a mesa region and a non-mesa area. The mesa region may be where the prepared mesa is located. The non-mesa region may be an area of the wafer outside the mesa region. As shown in FIG. 2, the mesa may be prepared on the wafer as follows. The mesa region of the wafer may be covered with a photoresist via photolithography. Then the silicon carbide N.sup.+ layer 205, the silicon carbide N.sup.− layer 204, and the silicon carbide N layer 203 of the wafer may be etched one by one via the etching process. At last, the photoresist may be removed, and the mesa may be prepared on the wafer.

(15) In the embodiment of the disclosure, the mesa may be vertical, or tilted with a preset angle. Preferably, based on a mesa tilted with a preset angle, early breakdown of the device may be prevented effectively. To prepare a mesa tilted with a preset angle, the mesa region of the wafer may be covered with a photoresist layer tilted at a preset angle based on photolithography and a photoresist Reflow process. Then, etching may be performed via an etching process.

(16) In one embodiment, the substrate may be a silicon carbide substrate.

(17) In the embodiment of the disclosure, the substrate may be a silicon carbide substrate. A silicon carbide epitaxial layer may be grown on the silicon carbide substrate via homogeneous epitaxy. This may reduce a lattice mismatch and render a high-quality wafer.

(18) At S102, grow a sacrificial layer on an upper surface of the wafer and on a side surface of the mesa.

(19) In the embodiment of the disclosure, as shown in FIG. 2, a sacrificial layer 206 may be grown on the upper surface of the wafer and on the side surface of the mesa. The sacrificial layer 206 may be one of, or a multiple combination of, a silicon oxide layer, an aluminum oxide layer, a chromium oxide layer, an yttrium oxide layer, or a silicon nitride layer. A thickness of the sacrificial layer 206 may be 10 nm to 300 nm.

(20) At S103, remove the sacrificial layer on an ohmic contact electrode region of the wafer.

(21) In the embodiment of the disclosure, as shown in FIG. 2, the sacrificial layer 206 on the ohmic contact electrode region of the wafer may be removed. The ohmic contact electrode region may be an area where the ohmic contact electrode of the device is located. S103 may be implemented as follows. The area of the wafer outside the ohmic contact electrode region may be coated with a photoresist via photolithography. The sacrificial layer 206 on the ohmic contact electrode region may be removed via the etching process. The sacrificial layer on the area outside the ohmic contact electrode region may be protected by the photoresist from being removed.

(22) At S104, prepare an ohmic contact electrode on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed.

(23) In one embodiment, S104 may be implemented as follows: vapor-deposit a metal layer on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed. And prepare the ohmic contact electrode by annealing the wafer on which the metal layer is vapor-deposited in a nitrogen atmosphere.

(24) In the embodiment of the disclosure, as shown in FIG. 2, the ohmic contact electrode 207 may be prepared on the ohmic contact electrode region of the wafer. The ohmic contact electrode may include an ohmic contact electrode on the non-mesa region and an ohmic contact electrode on the mesa region. The ohmic contact electrode on the non-mesa region may be a P-type electrode. The ohmic contact electrode on the mesa region may be an N-type electrode. The ohmic contact electrode on the non-mesa region may be a ring electrode surrounding the mesa. The ohmic contact electrode may be prepared as follows. The area of the wafer outside the ohmic contact electrode region may be coated with a photoresist via photolithography. A metal layer may be vapor-deposited onto the upper surface of the wafer via metal evaporation. The photoresist may be removed, then, the metal layer on the upper surface of the photoresist may be removed together. At last, the ohmic contact electrode may be formed by annealing the wafer in a nitrogen atmosphere.

(25) At S105, remove the sacrificial layer in a non-mesa region of the wafer on which the ohmic contact electrode is prepared and on the side surface of the mesa, the non-mesa region being a region of the wafer outside of the mesa.

(26) In the embodiment of the disclosure, as shown in FIG. 2, the sacrificial layer 206 on the non-mesa region of the wafer and the sacrificial layer 206 on the side surface of the mesa may be removed via the etching process. Only the sacrificial layer 206 on the upper surface of the mesa of the wafer may remain. The concrete implementation method is as follows. Firstly, the upper surface of the mesa of the wafer may be coated with a photoresist layer via photolithography. Then, the sacrificial layer 206 may be etched via the etching process.

(27) At S106, grow a passivation layer on the upper surface of the wafer and the side surface of the mesa from which the sacrificial layer in the non-mesa region and on the side surface of the mesa has been removed.

(28) In the embodiment of the disclosure, as shown in FIG. 2, a passivation layer 208 may be grown on the wafer. The passivation layer 208 may be one of, or a multiple combination of, a silicon oxide layer, an aluminum oxide layer, a chromium oxide layer, an yttrium oxide layer, or a silicon nitride layer. A thickness of the passivation layer 208 may be 50 nm to 500 nm.

(29) At S107, remove the passivation layer on the upper surface of the mesa of the wafer on which the passivation layer is grown, and remove the passivation layer in the non-mesa region of the wafer corresponding to the ohmic contact electrode region.

(30) In the embodiment of the disclosure, as shown in FIG. 2, the passivation layer on the upper surface of the mesa and the passivation layer on the non-mesa region corresponding to the ohmic contact electrode region may be removed via photolithography and etching. The passivation layer may be formed on the side surface of the mesa of the wafer and on the area of the non-mesa region outside the ohmic contact electrode region.

(31) At S108, remove the sacrificial layer on the upper surface of the mesa of the wafer.

(32) In the embodiment of the disclosure, as shown in FIG. 2, the sacrificial layer 206 on the upper surface of the mesa of the wafer may be removed via photolithography and etching to form an optical window on the wafer, so as to prepare an avalanche photodiode with an optical window.

(33) With embodiments herein, an avalanche photodiode with an optical window is prepared by: preparing a mesa on a wafer; growing a sacrificial layer on an upper surface of the wafer with the mesa prepared, and on a side surface of the mesa; removing the sacrificial layer on an ohmic contact electrode region of the wafer; preparing an ohmic contact electrode on the ohmic contact electrode region of the wafer from which the sacrificial layer on the ohmic contact electrode region has been removed; removing the sacrificial layer in a non-mesa region of the wafer on which the ohmic contact electrode is prepared and on the side surface of the mesa; growing a passivation layer on the upper surface of the wafer and the side surface of the mesa from which the sacrificial layer in the non-mesa region and on the side surface of the mesa has been removed; removing the passivation layer on the upper surface of the mesa of the wafer on which the passivation layer is grown, and removing the passivation layer in the non-mesa region of the wafer corresponding to the ohmic contact electrode region; and removing the sacrificial layer on the upper surface of the mesa of the wafer. With embodiments herein, in preparing the optical window, by growing a sacrificial layer on the upper surface of a wafer and removing the sacrificial layer in two steps, a photosensitive surface of a device is protected from damages, thereby decreasing a leakage current of the device, and improving responsivity and quantum efficiency of the device.

(34) Note that a magnitude of a sequence number of a step or process in embodiments herein does not indicate an order in which the step is executed. The steps or processes are to be executed in an order determined by functions and intrinsic logics thereof. Such a sequence number shall constitute no limit to implementation of the embodiments herein.

(35) The embodiments are merely for explaining a technical solution herein, and are not intended to limit the subject disclosure. The subject disclosure is elaborated with the embodiments. A person having ordinary skill in the art may modify a technical solution according to the embodiments, or perform an equivalent replacement to a feature thereof without essentially departing from the spirit and scope of the technical solution according to the embodiments. Any such modification and/or equivalent replacement should be covered by the scope of the claims herein.

(36) Although embodiments of the present disclosure have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims.

(37) Moreover, the scope of the present disclosure is not intended to be limited to the particular embodiments described here. As one of ordinary skill in the art will readily appreciate from the disclosure of the present disclosure that processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, may perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.