FLEXIBLE AND LOW COST LEAD-FREE PIEZOELECTRIC COMPOSITES WITH HIGH D33 VALUES

Abstract

Lead-free piezoelectric composites and methods of making and uses thereof are described. The lead-free piezoelectric composites have high flexibility and high piezoelectric properties.

Claims

1. A lead-free piezoelectric composite comprising: a polymeric matrix having a dielectric constant greater than 30 at 20° C.; and greater than 10 vol. % of a lead-free piezoelectric material based on the total volume of the composite dispersed throughout the polymeric matrix, wherein the lead-free piezoelectric composite has an elastic modulus of less than 1 GPa and a piezoelectric coefficient d.sub.33 of greater than 20 pC/N.

2. The lead-free piezoelectric composite of claim 1, wherein the polymeric matrix comprises poly(vinylidine)fluoride-trifluoroethylene-chlorofluoroeethylene) (PVDF-TrFE-CFE) terpolymer.

3. The lead-free piezoelectric composite of any one of claim 2, wherein the polymeric matrix is PVDF-TrFE-CFE.

4. The lead-free piezoelectric composite of claim 1, wherein the amount of lead-free piezoelectric material is 30 vol. % to 70 vol. % based on the total volume of the composite.

5. The lead-free piezoelectric composite of claim 1, wherein the piezoelectric material comprises a member selected from the group consisting of barium titanate (BaTiO.sub.3), potassium sodium niobate (KNaNb)O.sub.3 (KNN), potassium lithium sodium niobate (KLi)(NaNb)O.sub.3 (KLNN), hydroxyapatite, apatite, lithium sulfate monohydrate, sodium bismuth titanate, quartz, an organic material preferably, tartaric acid and poly(vinylidene difluoride) fibers, or combinations thereof.

6. The lead-free piezoelectric composite of claim 1, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is BaTiO.sub.3.

7. The lead-free piezoelectric composite of claim 1, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is KLNN.

8. The lead-free piezoelectric composite of claim 1, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is KNN.

9. The lead-free piezoelectric composite of claim 1, wherein the composite retains its d.sub.33 value at temperatures of greater than 90° C.

10. The lead-free piezoelectric composite of claim 1, wherein the composite is oriented at an electric polarization voltage lower when compared with the same polymer matrix in the absence of the lead-free piezoelectric filler when subjected to the an electric field.

11. The lead-free piezoelectric composite of claim 1, wherein the composite is a flexible sheet or film.

12. The lead-free piezoelectric polymeric composite of claim 11, wherein the film or sheet has a thickness of 50 to 200 microns.

13. The lead-free piezoelectric composite of claim 1, further comprised in an article of manufacture.

14. The lead-free piezoelectric composite of claim 13, wherein the article of manufacture is a component of a touch panel, a human machine interface, an integrated keyboard, or a wearable device.

15. A piezoelectric device comprising the lead-free piezoelectric polymeric composite of claim 1, wherein the device is a piezoelectric sensor, a piezoelectric transducer, or a piezoelectric actuator, and wherein the device is mechanically flexible.

16. A method of forming the lead-free piezoelectric composite of claim 1, the method comprising: (a) adding lead-free piezoelectric particles to a solution comprising a solubilized polymeric material having a dielectric constant of greater than 10 and a solvent to form a dispersion or suspension where the lead-free piezoelectric particles are dispersed or suspended in the solution; (b) forming a polymeric matrix having the lead-free piezoelectric particles dispersed therein; and (c) subjecting the polymeric matrix having the lead-free piezoelectric particles dispersed therein to an electric polarization treatment to form the lead-free piezoelectric composite.

17. The method of claim 16, wherein forming the polymeric matrix comprises: (i) casting the dispersion on a substrate; (ii) drying the polymeric matrix at 25° C. to 80° C. to form the polymeric matrix; and (iii) annealing the dried polymeric matrix at a temperature of 80 to 150° C. for 1 to 50 hours.

18. The method of claim 16, wherein inducing the electric polarization comprises applying a poling field using corona discharge.

19. The method of claim 16, wherein the polymeric material is poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene), the lead-free piezoelectric material is selected from the group consisting of KLNN, KNN and BaTiO.sub.3, or a combination thereof, and the solvent is selected from the group consisting of tetrahydrofuran, methyl ethyl ketone, dimethyl sulfoxide, ethyl acetate, amyl acetate, dimethyl formamide and dimethyl acetamide, or any combination thereof.

20. The method of claim 16, wherein the polymeric material to solvent ratio is 1:5 to 1:10.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Advantages of the present invention may become apparent to those skilled in the art with the benefit of the following detailed description and upon reference to the accompanying drawings.

[0028] FIG. 1 represents variations of piezoelectric coefficient d.sub.33(pC/N) of comparative piezoelectric composites having increasing volume fraction of PZT volume fraction and lead-free piezoelectric composites of the present invention having increasing volume fraction of KLNN.

[0029] FIG. 2 represents variations of dielectric constant comparative piezoelectric composites having increasing volume fraction of PZT volume fraction and lead-free piezoelectric composites of the present invention having increasing volume fraction of KLNN.

[0030] While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings. The drawings may not be to scale.

DETAILED DESCRIPTION OF THE INVENTION

[0031] Flexible lead-free piezoelectric composites of the present invention with high piezoelectric charge constant values can provide a solution to at least some of the problems associated with PVDF-based and ceramic-based piezoelectric composites. The solution is premised on using a polymeric matrix (e.g., PVDF-TrFE-CFE) having a dielectric constant greater than 30 at 20° C. having at least 10 vol. % of lead-free piezoelectric material, based on the total volume of the composite, dispersed throughout the polymeric matrix. Such a lead-free piezoelectric composites can have a piezoelectric coefficient d.sub.33 of greater than 20 pC/N and be flexible (e.g., have an elastic modulus of less than 1 GPa). By combining polymer-based materials with ceramic-based materials, the composites of the present invention can produce lead-free piezoelectric materials that have the desired piezoelectric and mechanical properties, which can be especially advantageous for flexible sensor-based applications and/or wearable devices and articles of manufacture.

[0032] These and other non-limiting aspects of the present invention are discussed in further detail in the following sections.

A. Materials

[0033] 1. Piezoelectric Materials

[0034] The piezoelectric material can be any lead-free ceramic or single crystal material. Non-limiting examples of piezoelectric materials include inorganic compounds of the perovskite family. Non-limiting examples of piezoelectric ceramics with the perovskite structure include barium titanate BaTiO.sub.3, potassium sodium niobate (KNaNb)O.sub.3 (KNN), potassium lithium sodium niobate (KLi)(NaNb)O.sub.3 (KLNN), hydroxyapatite, apatite, lithium sulfate monohydrate, sodium bismuth titanate, quartz, an organic material (preferably, tartaric acid or poly(vinylidene fluoride) fibers), or combinations thereof. The lead-free piezoelectric particles can have a particle size of 200 nm to 3000 nm, or at least greater than any one of, equal to any one of, or between any two of 200 nm, 225 nm, 250 nm, 275 nm, 300 nm, 325 nm, 350 nm, 375 nm, 400 nm, 425 nm, 450 nm, 475 nm, 500 nm, 525 nm, 550 nm, 575 nm, 600 nm, 625 nm, 650 nm, 675 nm, 700 nm, 725 nm, 750 nm, 775 nm, 800 nm, 825 nm, 850 nm, 875 nm, 900 nm, 925 nm, 950 nm, 975 nm, 1000 nm, 1500 nm, 2000 nm, 2500 nm, and 3000 nm. By way of example, BaTiO.sub.3 can have a particle size of 200 to 500 nm, or 250 to 400 nm, or 300 to 350 nm. In another example KNLN can have a particle size of 1000 to 3000 nm (1 to 3 microns), or 1500 to 2500 nm. Table 1 lists properties of some lead-free piezoelectric materials.

TABLE-US-00001 TABLE 1 T.sub.c d.sub.33 Material (° C.) ε.sub.r (pC/N) BT 120 1800 190 BNT 200 700 120 KLNN 340-475 220 200-490

[0035] 2. Polymers

[0036] The piezoelectric composites of the present invention can include a polymeric matrix having a dielectric constant greater than 30 at 20° C. The polymeric matrix can include a thermoset polymer, copolymer and/or monomer, a thermoplastic polymer, copolymer and/or monomer or a thermoset/thermoplastic polymer or copolymer blend.

[0037] Non-limiting examples of thermoset polymeric matrices include those comprising an epoxy resin, an unsaturated polyester resin, a polyurethane, bakelite, duroplast, urea-formaldehyde, diallyl-phthalate, an epoxy vinylester, a polyimide, a cyanate ester of polycyanurate, dicyclopentadiene, a phenolic, a benzoxazine, co-polymers thereof, or blends thereof. In a particularly preferred embodiment, the thermoset polymeric matrix is an epoxy resin. The epoxy resin can include diglycidyl ether bisphenol-A and polyoxypropylene diamine. In another instance, the polymeric matrix can be a thermoplastic polymeric matrix. Non-limiting examples of thermoplastic polymeric matrices include those that include polyethylene terephthalate (PET), a polycarbonate (PC) family of polymers, polybutylene terephthalate (PBT), poly(1,4-cyclohexylidene cyclohexane-1,4-dicarboxylate) (PCCD), glycol modified polycyclohexyl terephthalate (PCTG), poly(phenylene oxide) (PPO), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), polyethyleneimine or polyetherimide (PEI) and their derivatives, thermoplastic elastomer (TPE), terephthalic acid (TPA) elastomers, poly(cyclohexanedimethylene terephthalate) (PCT), polyethylene naphthalate (PEN), polyamide (PA), polysulfone sulfonate (PSS), sulfonates of polysulfones, polyether ether ketone (PEEK), acrylonitrile butyldiene styrene (ABS), polyether ketone ketone (PEKK), polyphenylene sulfide (PPS), co-polymers thereof, or blends thereof.

[0038] Non-limiting examples of thermoplastic polymers that can be used in the context of the present invention include poly(vinylidine)fluoride-trifluoroethylene-chlorofluoroeethylene) (PVDF-TrFE-CFE) terpolymer, odd-numbered nylon, cyano-polymer, polyethylene terephthalate (PET), a polycarbonate (PC) family of polymers, polybutylene terephthalate (PBT), poly(1,4-cyclohexylidene cyclohexane-1,4-dicarboxylate) (PCCD), glycol modified polycyclohexyl terephthalate (PCTG), poly(phenylene oxide) (PPO), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polymethyl methacrylate (PMMA), polyethyleneimine or polyetherimide (PEI) and their derivatives, thermoplastic elastomer (TPE), terephthalic acid (TPA) elastomers, poly(cyclohexanedimethylene terephthalate) (PCT), polyethylene naphthalate (PEN), polyamide (PA), polysulfone sulfonate (PSS), sulfonates of polysulfones, polyether ether ketone (PEEK), polyether ketone ketone (PEKK), acrylonitrile butyldiene styrene (ABS), polyphenylene sulfide (PPS), co-polymers thereof, or blends thereof. In a preferred instance, a PVDF-TRFE-CFE is used, which has a dielectric constant of about 50.

[0039] Additives can be included with the polymers to form polymeric matrices that include the additives. Non-limiting examples of additives include coupling agents, antioxidants, heat stabilizers, flow modifiers, colorants, etc., or any combinations thereof.

B. Method of Producing Piezoelectric Composites

[0040] The piezoelectric composite of the present invention can be made using solution casting or forming methodology. A solution of a polymer described in the Materials section can be obtained. The solution can include a solvent and polymer described in the Materials section, preferably PVDF-TRFE-CFE. Non-limiting examples of solvents include tetrahydrofuran (THF), methyl ethyl ketone (MEK), dimethylsulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), or combinations thereof. The polymer to solvent ratio can range between 1:5 to 1:10, 1:6 to 1:9, or about 1:8. In some embodiments, the solution includes at least any one of, equal to any one of, or between any two of 10 wt. %, 20 wt. %, 30 wt. %, 40 wt. %, or 50 wt. %, or about 12.5 wt. % of PVDF-TRFE-CFE. In some embodiments, no compatibility improvers are used to make the lead-free polymeric composites of the present invention.

[0041] The piezoelectric material can be dispersed or suspended in the polymer solution. The piezoelectric material can be a plurality (e.g., 2 or more, suitably 5 or more, 10 or more, 50 or more, 100 or more, 500 or more, 1000 or more, etc.) of lead-free piezoelectric particles. The lead-free piezoelectric particles can be dispersed in the solution via any suitable method, including mixing, stirring, folding or otherwise integrating the lead-free piezoelectric particles in the matrix so as to generate a uniform dispersion or suspension of the particles in the matrix. In some embodiments, the solution is added to the piezoelectric material.

[0042] The dispersion or suspension can be subjected to conditions suitable to form the piezoelectric composites of the present invention. The terms dispersion and suspension can be used interchangeably throughout this specification. In one instance, the dispersion includes PVDF-TRFE-CFE and barium titanate. In another instance, the dispersion includes PVDF-TRFE-CFE and KLNN. In some embodiments, the dispersion can be shaped or cast. Shaped or shaping or casting can include a mechanical or physical process to change the dispersion to a desired form. Shaped or shaping or casting can also include placing a dispersion into a desired container or receptacle, thereby providing it with a maintained shape or form. It should be noted that the shaped form is not necessarily the final form, as additional processing (e.g., machining, forming, etc.) can be completed on the final, cured composite. The act of shaping or casting the dispersion for use in the methods described herein is primarily to give some initial structure to the dispersion prior to further processing. A rigid or specific shape can be obtained but is not required.

[0043] Casting can include pouring the dispersion on a casting surface. Non-limiting examples of casting include air casting (e.g., the dispersion passes under a series of air flow ducts that control the evaporation of the solvents in a particular set period of time such as 24 to 48 hours), solvent, or emersion casting, (e.g., the dispersion is spread onto a moving belt and run through a bath or liquid in which the liquid within the bath exchanges with the solvent). The spreading of the dispersion on the casting surface can be done with a doctor blade, rolling spreader bar or any of several configurations of flat sheeting extrusion dies.

[0044] During casting or shaping, the solvent can be removed thereby leaving the dispersion on the substrate or in the mold. Heat can be applied to assist in the removal of the solvent. By way of example, the shaped material can be heated at a temperature of at least any one of, equal to any one of, or between any two of 25° C., 30° C., 35° C., 40° C., 45° C., 50° C., 55° C., 60° C., 65° C., 70° C., 75° C., and 80° C. The resulting shaped polymeric composite material can be annealed at a temperature of at least any one of, equal to any one of, or between any two of 80° C., 85° C., 90° C., 95° C., 100° C., 105° C., 110° C., 115° C., 120° C., 125° C., 130° C., 135° C., 140° C., 145° C., and 150° C. for a desired amount of time (e.g., 5, 10, 15, 20, 25 30, 35, 40, 45, 50 hours or any range or value there between). The shaped material can be a film, a sheet or the like.

[0045] After annealing the shaped polymeric composite material can be subjected conditions to induce electric polarization in the lead-free piezoelectric material (e.g., plurality of particles) in the polymeric composited material. During electric polarization, the piezoelectric particles can be connected to one another in a linear or semi-linear manner (e.g., chains of particles). Columns of piezoelectric particles are suitably formed by the stacking or aligning of more than one chain. In a non-limiting example, the shaped polymeric composite material can be poled. By way of example, the polymeric composite material can be poled with a selected electric field at room temperature (e.g., after cooling of the composite), or at a selected electric field at a selected temperature, at least one of the selected electric field and the selected temperature being chosen in accordance with a desired dipole orientation, a desired polarization strength, or property of the article of manufacture.

[0046] The temperature for performing poling can be in accordance with a desired dipole orientation and/or a desired polarization strength, or in accordance with a desired stress state of a finished actuator. For example, the poling of polymeric composite materican can be performed at a selected cooling temperature range, through a selected heating temperature, or through a selected heating temperature heating and cooling temperature range. In some instance, the poling may occur over a “range” (e.g., selected range) of temperatures rather than at a specific constant temperature. In some embodiments, poling can be performed at a temperature of at least, equal to, or between any two of 80° C., 85° C., 90° C., 95° C., 100° C., 105° C., 110° C., 115° C., and 120° C. The applied voltage level parameter for the poling can be selected in various ways. For example, the applied voltage level parameter can be selected as constant, or changing (e.g., ramped) over a period of time. In some embodiments, poling is performed using corona discharge using an electrode gap of 0.5 to 1.5 cm, or about 1 cm for a desired amount of time (e.g., about 1 hour) at 6 to 15 kV/m or 10 to 13 kV/m or any range or value therebetween.

C. Piezoelectric Composite

[0047] The piezoelectric composite can include a polymer and a lead-free piezoelectric material. The piezoelectric composite can include at least any one of, equal to any one of, or between any two of 10, 20, 30, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, and 99 wt. % of the polymer that forms the polymer matrix. The amount of lead-free piezoelectric additive present in the polymer matrix can be at least, equal to, or between any two of 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, and 70 vol. %. In some embodiments, the piezoelectric composite includes PVDF-TRFE-CFE and 20 vol. % to 60 vol. %, or 40 vol. % to 60 vol. % barium titanate particles. In some embodiments, the piezoelectric composite includes PVDF-TRFE-CFE and 20 vol. % to 60 vol. %, or 40 vol. % to 60 vol. % KLNN particles. In some embodiments, the piezoelectric composite includes, consists of, or consists essentially of PVDF-TRFE-CFE and 20 vol. % to 60 vol. % barium titanate particles having an average particle size of 200 to 500 nm. In some embodiments, the piezoelectric composite includes, consists of, or consists essentially of PVDF-TRFE-CFE and 20 vol. % to 60 vol. % KLNN particles.

[0048] In some embodiments, the piezoelectric composite can have any shape or form. In some embodiments, the piezoelectric composite is a film or sheet. In some embodiments, the film or sheet has a thickness dimension of 50 to 200 microns, or at least, equal to, or between any two of 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, and 200 microns.

[0049] Properties of the piezoelectric composite include electrical and mechanical properties. Non-limiting examples of electrical properties can include piezoelectric constant, dielectric constant, and the like. The d.sub.33 of the piezoelectric composite be greater than any one of, equal to any one of, or between any two of 20 pC/N, 25 pC/N, 30 pC/N, 35 pC/N, 40 pC/N, 45 pC/N, 50 pC/N, 55 pC/N, 56 pC/N, 57 pC/N, 58 pC/N, 59 pC/N, and 60 pC/N. The piezoelectric composite can have a dielectric constant that is between 30 to 210, or at least one of, equal to any one of, or between any two of 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200, 205, and 210. The lead-free piezoelectric composite can have a storage modulus can range from 100 to 325 MPa, or at least, equal to, or between any two of 100, 125, 150, 175, 200, 225, 250, 275, 300, and 325 MPa. Storage modulus can be measured according to ISO 6721 at room temperature and a 1 Hz strain of 0.2%. The lead-free piezoelectric composite can have an elongation break of 100 to 500% under uniaxial loading at room temperature (e.g., 25 to 35° C.). Elongation break can be measured using standard dynamic mechanical analyzer such as a RDA III analyser (TA Instruments, U.S.A.). The lead-free piezoelectric composite can have an elastic modulus of less than 1 GPa, or from 0.1 to 0.99 GPa, or less than any one of, equal to any one of, or between any two of 0.1, 0.25, 0.5, 0.75, 0.8, 0.9, 0.99 GPa. Elastic modulus can be measured using a universal tensile testing machine. Notably, composites when tested up to 110° C. and they retained their piezoelectric properties without depoling.

D. Devices and Articles of Manufacture

[0050] The piezoelectric composites of the present invention can be incorporated into a device. In a preferred instance, the device is flexible. In some particular, instances, the piezoelectric composites of the present invention can be used in articles of manufacture that have curved surfaces, flexible surfaces, deformable surfaces, etc. Non-limiting examples of such articles of manufacture include a piezoelectric sensor, a piezoelectric transducer, a piezoelectric actuator. These components can be used in tactile sensitive devices, electronic devices (e.g., smart phones, tablets, computers, etc.), virtual reality devices, augmented reality devices, fixtures that require flexibility such as adjustable mounted wireless headsets and/or ear buds, communication helmets with curvatures, medical batches, flexible identification cards, flexible sporting goods, packaging materials, medical devices, and/or applications where the presence of a bendable material simplifies final product design, engineering, and/or mass production.

EXAMPLES

[0051] The present invention will be described in greater detail by way of specific examples. The following examples are offered for illustrative purposes only, and are not intended to limit the invention in any manner. Those of skill in the art will readily recognize a variety of noncritical parameters which can be changed or modified to yield essentially the same results.

Example 1

Preparation of Piezoelectric Material of the Present Invention

[0052] PVDF-TrFE-CFE (RT™-CFE Standard Composition Powder) was obtained from Piezotech®, Arkema Group (France). BaTiO.sub.3 (BT) was obtained from Inframat Corporation (U.S.A.). KLNN was prepared following the procedure of WO 2016157092 to Bella et al. PVDF-TrFE-CFE was dissolved in tetrahydrofuran (THF) by magnetic stirring with a polymer to solvent ratio of 1:8 at 25° C. for 1 hour in an oil bath at a speed of 50 rpm. After complete dissolution of the polymer, different volume fractions of BT or KLNN were added to the solution and stirred at 300 rpm for 30 minutes to completely homogenize the BT or KLNN powder inside the PVDF-TrFE-CFE solution. After homogenization, the mixture was casted as onto a glass plate, or a glass plate wrapped with an aluminium foil. The casted films were dried at room temperature and subsequently annealed at 110° C. for 2-5 hours under atmospheric conditions. The samples were poled at 110° C. for 0.5 hour under 10 KV/mm. Table 2 lists the properties of PZT and the lead-free piezoelectric materials. Table 3 lists the compositions of the lead-free piezoelectric composites of the present invention.

TABLE-US-00002 TABLE 2 T.sub.c d.sub.33 Material (° C.) ε.sub.r (pC/N) PZT 165-360 1000-3800 250-700 BT 120 1800 190 KLNN 340-475 220 200-490

TABLE-US-00003 TABLE 3 Lead free Sample piezoceramic Loading d33 id Polymer filler (vol %) (pC/N) 1* PVDF-TrFE-CFE BT 40 49.6 2* PVDF-TrFE-CFE BT 60 51.6  3** PVDF-TrFE-CFE BT 50 40.0  4** PVDF BT 50 19.0 5* PVDF-TrFE-CFE KLNN 40 47.2  6** PVDF-TrFE-CFE KLNN 50 43 *Free standing piezocomposite film **Aluminium foil supported film ***Piezocomposite films prepared using corona poling technique

[0053] FIG. 1 represents variation of d.sub.33 with increasing PZT volume fraction (comparative sample) and KLNN. FIG. 2 represents variation of dielectric constant with increasing PZT volume fraction (comparative sample) and KLNN. While the KLNN samples showed lower d.sub.33, the results are acceptable for a lead free as it has a high d.sub.33, a low dielectric constant and a high curie temperatures. Both PZT and lead free piezoceramic described in the invention, barium titanate and KLNN are perovskites. The properties of the piezoceramics are summarized in the Table 2.

[0054] In the context of the present invention, at least twenty embodiments are now described. Embodiment 1 is a lead-free piezoelectric composite. The composite contains a polymeric matrix having a dielectric constant greater than 30 at 20° C.; and greater than 10 vol. % of a lead-free piezoelectric material based on the total volume of the composite dispersed throughout the polymeric matrix. The lead-free piezoelectric composite has an elastic modulus of less than 1 GPa and a piezoelectric coefficient d.sub.33 of greater than 20 pC/N. Embodiment 2 is the lead-free piezoelectric composite of embodiment 1, wherein the polymeric matrix contains poly(vinylidine)fluoride-trifluoroethylene-chlorofluoroeethylene) (PVDF-TrFE-CFE) terpolymer. Embodiment 3 is the lead-free piezoelectric composite of any one of embodiments 1 or 2, wherein the polymeric matrix is PVDF-TrFE-CFE. Embodiment 4 is the lead-free piezoelectric composite of any one of embodiments 1 to 3, wherein the amount of lead-free piezoelectric material is 30 vol. % to 70 vol. %, preferably 40 vol. % to about 60 vol. % based on the total volume of the composite. Embodiment 5 is the lead-free piezoelectric composite of any one of embodiments 1 to 4, wherein the piezoelectric material contains barium titanate (BaTiO.sub.3), potassium sodium niobate (KNaNb)O.sub.3 (KNN), potassium lithium sodium niobate (KLi)(NaNb)O.sub.3 (KLNN), hydroxyapatite, apatite, lithium sulfate monohydrate, sodium bismuth titanate, quartz, an organic material preferably, tartaric acid or poly(vinylidene difluoride) fibers, or combinations thereof. Embodiment 6 is the lead-free piezoelectric composite of any one of embodiments 1 to 5, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is BaTiO.sub.3. Embodiment 7 is the lead-free piezoelectric composite of any one of embodiments 1 to 6, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is KLNN. Embodiment 8 is the lead-free piezoelectric composite of any one of embodiments 1 to 7, wherein the polymeric matrix is PVDF-TrFE-CFE and the piezoelectric material is KNN. Embodiment 9 is the lead-free piezoelectric composite of any one of embodiments 1 to 8, wherein the composite retains its d.sub.33 value at temperatures of greater than 90° C. Embodiment 10 is the lead-free piezoelectric composite of any one of embodiments 1 to 9, wherein the composite is oriented at an electric polarization voltage lower when compared with the same polymer matrix in the absence of the lead-free piezoelectric filler when subjected to the an electric field. Embodiment 11 is the lead-free piezoelectric composite of any one of embodiments 1 to 10, wherein the composite is a flexible sheet or film. Embodiment 12 is the lead-free piezoelectric polymeric composite of embodiment 11, wherein the film or sheet has a thickness of 50 to 200 microns. Embodiment 13 is the lead-free piezoelectric composite of any one of embodiments 1-12, further comprised in an article of manufacture. Embodiment 14 is the lead-free piezoelectric composite of embodiment 13, wherein the article of manufacture is a component of a touch panel, a human machine interface, an integrated keyboard, or a wearable device.

[0055] Embodiment 15 is a piezoelectric device including any one of the lead-free piezoelectric polymeric composites of embodiments 1-12, wherein the device is preferably a piezoelectric sensor, a piezoelectric transducer, or a piezoelectric actuator, and wherein the device is preferably mechanically flexible. Embodiment 16 is a method of forming the lead-free piezoelectric composite of any one of embodiments 1-12, the method including: (a) adding lead-free piezoelectric particles to a solution containing a solubilized polymeric material having a dielectric constant of greater than 10 and a solvent to form a dispersion or suspension where the lead-free piezoelectric particles are dispersed or suspended in the solution; (b) forming a polymeric matrix having the lead-free piezoelectric particles dispersed therein; and (c) subjecting the polymeric matrix having the lead-free piezoelectric particles dispersed therein to an electric polarization treatment to form the lead-free piezoelectric composite of any one of embodiments 1-12. Embodiment 17 as the method of embodiment 16, wherein forming the polymeric matrix contains: (i) casting the dispersion on a substrate; (ii) drying the polymeric matrix at 25° C. to 80° C. to form the polymeric matrix; and (iii) annealing the dried polymeric matrix at a temperature of 80 to 150° C. for 1 to 50 hours, preferably 110° C. for 5 to 25 hours. Embodiment 18 is the method of any one of embodiments 16 to 17, wherein inducing the electric polarization contains applying a poling field using corona discharge. Embodiment 19 is the method of any one of embodiments 16 to 18, wherein the polymeric material is poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene), the lead-free piezoelectric material is KLNN, KNN, BaTiO.sub.3, or a combination thereof, and the solvent is tetrahydrofuran, methyl ethyl ketone, dimethyl sulfoxide, ethyl acetate, amyl acetate, dimethyl formamide, dimethyl acetamide, or any combination thereof. Embodiment 20 is the method of any one of embodiments 16 to 19, wherein the polymeric material to solvent ratio is 1:5 to 1:10.

[0056] Although embodiments of the present application and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the above disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein can be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.