PRINTED CIRCUIT BOARD ARRANGEMENT, INVERTER, AND MOTOR VEHICLE

Abstract

The disclosure relates to a printed circuit board arrangement with a printed circuit board with at least two current conducting layers. The current conducting layers extend in an axial direction of the printed circuit board and are arranged in succession in a thickness direction of the printed circuit board. The printed circuit board arrangement has a busbar which is arranged on a lateral surface of the printed circuit board and is in contact with at least one part of the current conducting layers of the printed circuit board.

Claims

1. A printed circuit board arrangement, comprising a printed circuit board with at least two current conducting layers, wherein the current conducting layers extend in an axial direction of the printed circuit board and are arranged in succession in a thickness direction of the printed circuit board, wherein the printed circuit board arrangement has a busbar which is arranged on one lateral surface of the printed circuit board and is in contact with at least one part of the current conducting layers of the printed circuit board.

2. The printed circuit board arrangement according to claim 1, wherein the busbar has a constriction.

3. The printed circuit board arrangement according to claim 1, wherein a current sensor is arranged between the busbar and the printed circuit board.

4. The printed circuit board arrangement according to claim 3, wherein the busbar bypasses the current sensor.

5. The printed circuit board arrangement according to of claim 1, wherein the current conducting layers are cut in the middle and are connected via the busbar.

6. The printed circuit board arrangement according to claim 1, wherein the busbar has a greater thickness than the current conducting layers of the printed circuit board.

7. The printed circuit board arrangement according to claim 1, wherein the busbar has a thickness of at least one millimeter.

8. The printed circuit board arrangement according to claim 1, wherein the busbar encloses a smaller area than the current conducting layers.

9. The printed circuit board arrangement according to claim 1, wherein the busbar is fixed to the printed circuit board by SMD soldering.

10. An inverter comprising an intermediate circuit capacitor and a printed circuit board arrangement, wherein the printed circuit board arrangement is designed according to claim 1.

11. A motor vehicle with a power electronics having a printed circuit board arrangement, wherein the printed circuit board arrangement is designed according to claim 1.

12. The printed circuit board arrangement according to claim 2, wherein a current sensor is arranged between the busbar and the printed circuit board.

13. The printed circuit board arrangement according to claim 12, wherein the busbar bypasses the current sensor.

14. The printed circuit board arrangement according to claim 2, wherein the current conducting layers are cut in the middle and are connected via the busbar.

15. The printed circuit board arrangement according to claim 5, wherein the busbar has a greater thickness than the current conducting layers of the printed circuit board.

16. The printed circuit board arrangement according to claim 5, wherein the busbar has a thickness of at least one millimeter.

17. The printed circuit board arrangement according to claim 5, wherein the busbar encloses a smaller area than the current conducting layers.

18. The printed circuit board arrangement according to claim 5, wherein the busbar is fixed to the printed circuit board by SMD soldering.

19. A printed circuit board arrangement, comprising: a printed circuit board with at least two current conducting layers, wherein the current conducting layers extend in an axial direction of the printed circuit board and are arranged in succession in a thickness direction of the printed circuit board, wherein the printed circuit board arrangement has a busbar which is arranged on a lateral surface of the printed circuit board and is in contact with all of the current conducting layers of the printed circuit board; and wherein the busbar has a constriction.

20. The printed circuit board arrangement of claim 19, wherein the current conducting layers are cut in the middle and are connected via the busbar.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0019] Further advantages, features and details of the disclosure are set forth in the following description of exemplary arrangements and figures. The following are shown therein:

[0020] FIG. 1 shows a motor vehicle,

[0021] FIG. 2 shows a printed circuit board arrangement in a side view, and

[0022] FIG. 3 shows a printed circuit board arrangement in the plan view.

DETAILED DESCRIPTION

[0023] FIG. 1 shows a motor vehicle 1 with a power electronics 2, for example in the form of an inverter 3. The motor vehicle 1 comprises a printed circuit board arrangement 4, as described below in greater detail.

[0024] In particular, the motor vehicle 1 can have an electric axis 5. In one exemplary arrangement, the motor vehicle 1 is designed as a hybrid motor vehicle or as an electric vehicle.

[0025] FIG. 2 shows a printed circuit board arrangement 4 in a side view. The printed circuit board arrangement 4 has a printed circuit board 6 as well as a busbar 7. A current sensor 8 is represented as an individual electrical component, but the printed circuit board 6 can of course be equipped with a multiplicity of electrical components. For example, power switches can be present at the printed circuit board 6. In the configuration shown, the current sensor 8 is in contact with the printed circuit board 6. The busbar 7 is fixed to one of the surfaces 9 of the printed circuit board 6. In one exemplary arrangement, the busbar 7 is fixed to the busbar by using SMD soldering. The busbar 7 is electrically connected to all current conducting layers 10, four of which are rigidly placed. The current conducting layers 10 are separated in the middle, so that the total current first flows over the current conducting layers 10 and then over the busbar 7.

[0026] The thickness of the busbar 7 is greater than the total thickness of all current conducting layers 10. In one exemplary arrangement, the busbar 7 as well as the current conducting layers 10 are constructed of copper. Of course, the busbar 7 can also have a different material than the current conducting layers 10.

[0027] The current flow is represented by arrows 12. In this case, it can be recognized that the busbar 7 is electrically connected to all current conducting layers, so that the total current which flows through the printed circuit board 6 is diverted on the middle piece of the printed circuit board 6 via the busbar 7.

[0028] FIG. 3 shows the printed circuit board arrangement 4 according to FIG. 2 in plan view. In this case, it can be recognized that the busbar 7 has a taper 14 in the middle. This serves to concentrate a magnetic field generated by the electrical current. This magnetic field is measured by the current sensor 8 and is considered for determining the current strength. The current-carrying capacity of the printed circuit board arrangement 4 is specified by the fact that the busbar 7 has a sufficient thickness at the corresponding point. In this case, the total thickness of the printed circuit board arrangement 4 can nevertheless be kept to a minimum, since not all of the current conducting layers 10 have to be thickened. In particular, the busbar 7 can have a thickness which is greater than one millimeter, while the individual current conducting layers 10 can furthermore have a thickness of 100 μm.

[0029] It is also apparent from FIG. 3 that the busbar 7 encloses a smaller area than the current conducting layers 10. In any case, the current conducting layers 10 are applied to the printed circuit board 6 at the edges and thus enclose an area which corresponds to the area of the printed circuit board. In contrast, the busbar 7 encloses a much smaller area.