THERMOFORMING PACKAGING MACHINE WITH TRANSVERSE CUTTING STATION

20230264846 ยท 2023-08-24

Assignee

Inventors

Cpc classification

International classification

Abstract

The disclosure relates to a thermoforming machine comprising a transverse cutting station. The transverse cutting station has a punching device for separating one or more film sections from a lower film and/or an upper film by means of a punching tool comprising a punch and a die. The punching device comprises a chamber configured to at least temporarily receive the film sections, and a suction device to convey the film sections out of the transverse cutting station. The suction device is fluidically connected to a compressed gas source.

Claims

1. A thermoforming packaging machine comprising: a transverse cutting station, wherein the transverse cutting station has a punching device including a punching tool comprising a punch and a die for separating one or more film sections from a lower film and/or an upper film, wherein the punching device comprises a chamber configured to at least temporarily receive the one or more film sections, and a suction device to convey the one or more film sections out of the transverse cutting station; and a compressed gas source fluidically connected to the suction device.

2. The thermoforming packaging machine according to claim 1, wherein the suction device is configured as a volume booster into which a compressed gas can be injected by the compressed gas source.

3. The thermoforming packaging machine according to claim 2, wherein the volume booster defines an annular gap through which the compressed gas is injectable.

4. The thermoforming packaging machine according to claim 1, wherein the punching device comprises a hood forming the chamber, wherein the chamber comprises at least first and second openings.

5. The thermoforming packaging machine according to claim 4, wherein the first opening is formed by the die.

6. The thermoforming packaging machine according to claim 4, wherein the suction device forms the second opening of the chamber.

7. The thermoforming packaging machine according to claim 4, wherein a ratio of a cross-section of the chamber, viewed parallel to a transport direction of the thermoforming packaging machine, to a cross-section of the suction device is between 0.5 and 1.5.

8. The thermoforming packaging machine according to claim 7, wherein the ratio is between 0.5 and 1.2.

9. The thermoforming packaging machine according to claim 7, wherein the ratio is between 0.5 and 1.

10. The thermoforming packaging machine according to claim 1, wherein the punching device comprises a compressed gas connection at an end of the chamber opposite the suction device and/or a further opening is present, the opening cross section of which is preferably adjustable.

11. The thermoforming packaging machine according to claim 1, wherein the chamber comprises an opening at an end of the chamber opposite the suction device, wherein a cross-section of the opening is adjustable.

12. The thermoforming packaging machine according to claim 1, further comprising a deflection device attached to the suction device, wherein the deflection device is configured to direct film sections into a collecting container.

13. A method for operating a thermoforming packaging machine comprising a transverse cutting station, wherein the transverse cutting station comprises a punching device for cutting out one or more film sections from a lower film and/or an upper film by a punching tool including a punch and a die, the method comprising: cutting out at least one film section from the lower film and/or the upper film by the punching tool; at least temporarily receiving the at least one film section in a chamber of the punching device; and generating a volume flow by a compressed gas source in order to convey the at least one film section out of the chamber of the transverse cutting station.

14. The method according to claim 13, wherein an opening of the chamber is released by guiding the punch out of the die.

15. The method according to claim 13, wherein the volume flow is generated by injecting gas into a volume booster.

16. The method according to claim 15, wherein the at least one film section is conveyed through the volume booster.

17. The method according to claim 13, wherein the generation of the volume flow is interrupted at least for a duration of a punching operation.

18. The method according to claim 13, wherein a further volume flow is generated by injecting gas, in particular compressed air, into the chamber.

19. The method according to claim 18, wherein the gas comprises compressed air.

20. The method according to claim 13, wherein the thermoforming packaging machine comprises a control system, and the method further comprises adjusting frequency, duration and/or intensity of the volume flow based on an input by an operator at a man-machine interface that is communicated to the control system of the thermoforming packaging machine by the man-machine interface.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In the following, an embodiment of the disclosure is described in more detail with reference to a drawing.

[0025] FIG. 1 shows a schematic view of a thermoforming packaging machine;

[0026] FIG. 2 shows a schematic perspective view of a transverse cutting station;

[0027] FIG. 3 shows a sectional view of the transverse cutting station transverse to the transport direction;

[0028] FIG. 4 shows a sectional view of the transverse cutting station parallel to the transport direction;

[0029] FIG. 5 shows a sectional view of the transverse cutting station parallel to the transport direction; and

[0030] FIG. 6 shows a sectional view of the transverse cutting station parallel to the transport direction.

DETAILED DESCRIPTION

[0031] FIG. 1 schematically shows an embodiment of a thermoforming packaging machine 16 according to the disclosure. A lower film 4 is transported along a transport direction T and is connected to an upper film 5. In a transverse cutting station 1, cuts are made in the lower film 4 and/or the upper film 5. The thermoforming packaging machine 16 according to the disclosure has a man-machine interface 17 and a control system 18. In addition, a compressed gas source 19 is provided, which is connected to at least the transverse cutting station 1 via a compressed gas line 20.

[0032] FIG. 2 shows an embodiment of the transverse cutting station 1 of the thermoforming packaging machine 16 according to the disclosure. A punching device 2 with a punching tool 6 in the open position is shown. A punch 7 is located outside or below a die 8. A hood 11 is attached to the punching device 2. Together with the transverse cutting station 1, the hood 11 forms a chamber 9, as shown in FIG. 3. A suction device 10 is located on the hood 11 and is connected to a deflection device 15. Film sections 3 cut off by the punching tool 2 are conveyed out of the transverse cutting station 1 by the suction device 10 and guided into a collecting container 14 with the aid of the deflection device 15. In the collecting container 14, the cutting waste or film sections 3 are collected. In the variant shown, the suction device 10 is configured as a volume booster 10A. A compressed gas connection 24 can be seen on the volume booster 10A. Via this connection, the volume booster 10A is connected to the compressed gas source 19 through the compressed gas line 20.

[0033] FIG. 3 shows a sectional view of a transverse cutting station transverse to the transport direction T. It can be seen that the hood 11 forms a chamber 9. In the embodiment shown, the chamber 9 of the transverse cutting station 1 has a total of three openings 12, 13 and 22. A film section 3 is located in the chamber 9. It can be transported out of the transverse cutting station 1 through the suction device 10 and thus through the opening 13. This is done by means of a volume flow V, which is generated by the suction device 10. In addition, there is a compressed gas connection 21 at one end of the chamber 9, which can generate a volume flow V2. This volume flow V2 can support the removal of the film sections 3. It is preferred if the volume flow V2 is directed towards the die 8. This specifically supports the removal of film sections 3 in the form of a strip cut, which could get caught in the die 8.

[0034] FIG. 4 shows a sectional view of the transverse cutting station 1 parallel to the transport direction T. In this embodiment, the opening 12 of the die 8 widens towards the top. This reduces the risk of cut film sections 3 becoming caught in the die and causing clogging of the opening 12 with film sections 3.

[0035] FIG. 5 shows a sectional view of the transverse cutting station 1 parallel to the transport direction T. The cross-sectional area A of the suction device 10 is shown hatched.

[0036] FIG. 6 shows a sectional view of the transverse cutting station 1 parallel to the transport direction T. The cross-sectional area B of the chamber 9 is shown hatched.

[0037] As those skilled in the art will understand, the man-machine interface 17, the control system 18, as well as any other controller, unit, system, subsystem, interface, sensor, device, or the like described herein may individually, collectively, or in any combination comprise appropriate circuitry, such as one or more appropriately programmed processors (e.g., one or more microprocessors including central processing units (CPU)) and associated memory, which may include stored operating system software, firmware, and/or application software executable by the processor(s) for controlling operation thereof and for performing the particular algorithm or algorithms represented by the various methods, functions and/or operations described herein, including interaction between and/or cooperation with each other. One or more of such processors, as well as other circuitry and/or hardware, may be included in a single Application-Specific Integrated Circuitry (ASIC) or Electronic Control Unit (ECU), or several processors and various circuitry and/or hardware may be distributed among several separate components, whether individually packaged or assembled into a System-on-a-Chip (SoC).

LIST OF REFERENCE SIGNS

[0038] 1 transverse cutting station [0039] 2 punching device [0040] 3 film section [0041] 4 lower film [0042] 5 upper film [0043] 6 punching tool [0044] 7 punch [0045] 8 die [0046] 9 chamber [0047] 10 suction device [0048] 10A volume booster [0049] 11 hood [0050] 12 first opening [0051] 13 second opening [0052] 14 collecting container [0053] 15 deflection device [0054] 16 thermoforming packaging machine [0055] 17 man-machine interface [0056] 18 control system [0057] 19 compressed gas source [0058] 20 compressed gas line [0059] 21 compressed gas connection [0060] 22 further opening [0061] 23 annular gap [0062] 24 compressed gas connection [0063] V, V2 volume flow [0064] T transport direction [0065] A cross-sectional area of the suction device [0066] B cross-sectional area of the chamber