THERMOFORMING PACKAGING MACHINE WITH TRANSVERSE CUTTING STATION
20230264846 ยท 2023-08-24
Assignee
Inventors
Cpc classification
B65B9/04
PERFORMING OPERATIONS; TRANSPORTING
B65B47/04
PERFORMING OPERATIONS; TRANSPORTING
B65B57/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B65B47/04
PERFORMING OPERATIONS; TRANSPORTING
B65B57/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The disclosure relates to a thermoforming machine comprising a transverse cutting station. The transverse cutting station has a punching device for separating one or more film sections from a lower film and/or an upper film by means of a punching tool comprising a punch and a die. The punching device comprises a chamber configured to at least temporarily receive the film sections, and a suction device to convey the film sections out of the transverse cutting station. The suction device is fluidically connected to a compressed gas source.
Claims
1. A thermoforming packaging machine comprising: a transverse cutting station, wherein the transverse cutting station has a punching device including a punching tool comprising a punch and a die for separating one or more film sections from a lower film and/or an upper film, wherein the punching device comprises a chamber configured to at least temporarily receive the one or more film sections, and a suction device to convey the one or more film sections out of the transverse cutting station; and a compressed gas source fluidically connected to the suction device.
2. The thermoforming packaging machine according to claim 1, wherein the suction device is configured as a volume booster into which a compressed gas can be injected by the compressed gas source.
3. The thermoforming packaging machine according to claim 2, wherein the volume booster defines an annular gap through which the compressed gas is injectable.
4. The thermoforming packaging machine according to claim 1, wherein the punching device comprises a hood forming the chamber, wherein the chamber comprises at least first and second openings.
5. The thermoforming packaging machine according to claim 4, wherein the first opening is formed by the die.
6. The thermoforming packaging machine according to claim 4, wherein the suction device forms the second opening of the chamber.
7. The thermoforming packaging machine according to claim 4, wherein a ratio of a cross-section of the chamber, viewed parallel to a transport direction of the thermoforming packaging machine, to a cross-section of the suction device is between 0.5 and 1.5.
8. The thermoforming packaging machine according to claim 7, wherein the ratio is between 0.5 and 1.2.
9. The thermoforming packaging machine according to claim 7, wherein the ratio is between 0.5 and 1.
10. The thermoforming packaging machine according to claim 1, wherein the punching device comprises a compressed gas connection at an end of the chamber opposite the suction device and/or a further opening is present, the opening cross section of which is preferably adjustable.
11. The thermoforming packaging machine according to claim 1, wherein the chamber comprises an opening at an end of the chamber opposite the suction device, wherein a cross-section of the opening is adjustable.
12. The thermoforming packaging machine according to claim 1, further comprising a deflection device attached to the suction device, wherein the deflection device is configured to direct film sections into a collecting container.
13. A method for operating a thermoforming packaging machine comprising a transverse cutting station, wherein the transverse cutting station comprises a punching device for cutting out one or more film sections from a lower film and/or an upper film by a punching tool including a punch and a die, the method comprising: cutting out at least one film section from the lower film and/or the upper film by the punching tool; at least temporarily receiving the at least one film section in a chamber of the punching device; and generating a volume flow by a compressed gas source in order to convey the at least one film section out of the chamber of the transverse cutting station.
14. The method according to claim 13, wherein an opening of the chamber is released by guiding the punch out of the die.
15. The method according to claim 13, wherein the volume flow is generated by injecting gas into a volume booster.
16. The method according to claim 15, wherein the at least one film section is conveyed through the volume booster.
17. The method according to claim 13, wherein the generation of the volume flow is interrupted at least for a duration of a punching operation.
18. The method according to claim 13, wherein a further volume flow is generated by injecting gas, in particular compressed air, into the chamber.
19. The method according to claim 18, wherein the gas comprises compressed air.
20. The method according to claim 13, wherein the thermoforming packaging machine comprises a control system, and the method further comprises adjusting frequency, duration and/or intensity of the volume flow based on an input by an operator at a man-machine interface that is communicated to the control system of the thermoforming packaging machine by the man-machine interface.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In the following, an embodiment of the disclosure is described in more detail with reference to a drawing.
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DETAILED DESCRIPTION
[0031]
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[0037] As those skilled in the art will understand, the man-machine interface 17, the control system 18, as well as any other controller, unit, system, subsystem, interface, sensor, device, or the like described herein may individually, collectively, or in any combination comprise appropriate circuitry, such as one or more appropriately programmed processors (e.g., one or more microprocessors including central processing units (CPU)) and associated memory, which may include stored operating system software, firmware, and/or application software executable by the processor(s) for controlling operation thereof and for performing the particular algorithm or algorithms represented by the various methods, functions and/or operations described herein, including interaction between and/or cooperation with each other. One or more of such processors, as well as other circuitry and/or hardware, may be included in a single Application-Specific Integrated Circuitry (ASIC) or Electronic Control Unit (ECU), or several processors and various circuitry and/or hardware may be distributed among several separate components, whether individually packaged or assembled into a System-on-a-Chip (SoC).
LIST OF REFERENCE SIGNS
[0038] 1 transverse cutting station [0039] 2 punching device [0040] 3 film section [0041] 4 lower film [0042] 5 upper film [0043] 6 punching tool [0044] 7 punch [0045] 8 die [0046] 9 chamber [0047] 10 suction device [0048] 10A volume booster [0049] 11 hood [0050] 12 first opening [0051] 13 second opening [0052] 14 collecting container [0053] 15 deflection device [0054] 16 thermoforming packaging machine [0055] 17 man-machine interface [0056] 18 control system [0057] 19 compressed gas source [0058] 20 compressed gas line [0059] 21 compressed gas connection [0060] 22 further opening [0061] 23 annular gap [0062] 24 compressed gas connection [0063] V, V2 volume flow [0064] T transport direction [0065] A cross-sectional area of the suction device [0066] B cross-sectional area of the chamber