Light metal joining method and joint filler for same

Abstract

A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.

Claims

1. A light metal joint filler, formed by uniformly mixing a solvent with a light metal powder and a silver powder, wherein: a powder particle size of the light metal powder is micron-scale, and a powder particle size of the silver powder is nanoscale or submicron-scale; the particle size of the silver powder is between 400 nm and 500 nm; the particle size of the light metal powder is between 200 μm and 500 μm; and the total weight of the light metal powder and the silver powder comprises: a weight fraction of the silver powder that is 2 wt % to 6 wt %, and a weight fraction of the light metal powder that is 94 wt % to 98 wt %.

2. The metal joint filler according to claim 1, wherein the light metal powder is an aluminum powder.

3. A light metal joining method, comprising: coating a joint of two to-be-joined light metal pieces with any light metal joint filler according to claim 1; and hot pressing the two to-be-joined light metal pieces and heating the two to-be-joined light metal pieces at a pre-determined temperature, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.

4. The metal joining method according to claim 3, wherein the pre-determined temperature is between 200 degrees Celsius and 400 degrees Celsius.

5. The metal joining method according to claim 3, wherein a pressurizing apparatus applies 2 MPa to 10 MPa of joining pressure on the to-be-joined light metals in vacuum or under an atmospheric pressure.

6. The metal joining method according to claim 3, wherein the light metal powder is an aluminum powder.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram of components of a metal joint filler according to the present invention;

(2) FIG. 2A and FIG. 2B are schematic diagrams of applying a metal joint filler according to the present invention; and

(3) FIG. 3 is a flowchart of steps of a metal joining method according to the present invention.

DETAILED DESCRIPTION

(4) A main problem to be resolved by the present invention is that, currently, a brazing filler and a nano-silver paste used as a joint filler of a light metal respectively have problems of metal piece deformation in high-temperature joining and high costs. The present invention provides a metal joint filler that reduces costs and that can perform low-temperature joining.

(5) To resolve the foregoing problem, the present invention provides a metal joint filler 1 that is applied to joining metal pieces. As shown in FIG. 1, components of the metal joint filler 1 include a silver powder A1, a light metal powder A2, and a solvent B. The solvent B is uniformly mix with the light metal powder A2 and the silver powder A1. A particle size of silver particles of the silver powder A1 is nanoscale or submicron-scale. A particle size of light metal particles of the light metal powder A2 is micron-scale. A density of the light metal powders is lower than 5 g/cm.sup.3.

(6) In an embodiment, the particle size of the silver powder A1 is between 10 nm and 500 nm.

(7) In an embodiment, the particle size of the light metal powder A2 is between 5 μm and 500 μm.

(8) In an embodiment, the silver powder A1 has a weight ratio of 2 wt % to 50 wt %, and the light metal powder A2 has a weight ratio of 50 wt % to 98 wt %.

(9) In an embodiment, the light metal powder A2 is an aluminum powder.

(10) In the foregoing embodiment, the particle size of the aluminum powder is between 5 μm and 500 μm.

(11) In the foregoing embodiments, the silver powder A1 has a weight ratio of 2 wt % to 50 wt %, and the aluminum powder has a weight ratio of 50 wt % to 98 wt %.

(12) That is, the present invention provides a metal joint filler 1 of low operation temperature. The metal joint filler 1 is formed by a silver powder A1, a light metal powder A2 (for example, an aluminum powder), and a solvent B. A particle size of the silver powder A1 is between 10 nm and 500 nm, and a ratio thereof is between 2 wt % and 50 wt %. A particle size of the light metal powder A2 is between 5 μm and 500 μm, and a ratio thereof is between 50 wt %-98 wt %. The solvent B may be alcohol, and especially may be a multi-carbon number compound, for example, terpineol. The solvent B enables the silver powder A1 and the light metal powder A2 to be uniformly mixed.

(13) Still referring to FIG. 2A and FIG. 2B, FIG. 2A and FIG. 2B are schematic diagrams of applying a metal joint filler according to the present invention. As shown in the figures, the present invention is applicable to metal joining of a non-structural part made of a light metal, for example, joining between a first metal piece 2A (for example, an aluminum alloy heat-dissipation base plate shown in the figure) and a second metal piece 2B (for example, aluminum alloy heat-dissipation fins).

(14) When metal piece joining is performed by using the metal joint filler 1 of the present invention, first, as shown in FIG. 2A, a joint where the first metal piece 2A (the aluminum alloy heat-dissipation base plate) and the second metal piece 2B (the aluminum alloy heat-dissipation fins) is to join is coated with the metal joint filler 1. Subsequently, when the first metal piece 2A is joined with the second metal piece 2B, an environment of heating H at a low temperature and pressurizing P is provided.

(15) In this embodiment, low-temperature heating of 200 degrees Celsius to 400 degrees Celsius is performed, and a pressure of 2 MPa to 10 MPa is applied.

(16) That is, in metal joining by using the metal joint filler 1 provided by the present invention, hot pressing is performed on two to-be-joined metal pieces (the first metal piece 2A and the second metal piece 2B) by processes of heating H and pressurizing P. After the solvent B in the metal joint filler 1 is vaporized, the nanoscale or micron-scale silver powder A1 reaches a melting point and the surface thereof melts, there by bonding with the light metal powder A2 and the to-be-joined metal pieces (the first metal piece 2A and the second metal piece 2B). The light metal powder A2 still remains in a solid state, and voids in the metal powder are eliminated. After being cooled, the silver metal freezes and joins the two to-be-joined metal pieces. In this way, desired metal joining with desired shear strength is formed between the two to-be-joined metal pieces. Experimental data is shown in the following Table 1:

(17) TABLE-US-00001 TABLE 1 Silver Light metal powder A1 powder A2 Particle Particle Joining Joining Shear Content size Content size temperature pressure strength (wt %) (nm) (wt %) (μm) (° C.) (MPa) (MPa) 5 20 95 5 400 10 5.6 300 1.9 6 20 94 200 400 12.7 300 5.0 5 400 95 5 400 6.5 300 3.3 5 400 95 200 400 5.6 300 2.2

(18) That is, the present invention further discloses a metal joining method S1. As shown in FIG. 3, the metal joining method includes:

(19) step S11: Coat a joint of two to-be-joined light metal pieces with a light metal joint filler; and

(20) step S12: Hot press the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and complete joining of the two to-be-joined light metal pieces after the silver powder is condensed.

(21) Compared with a brazing process, in the present invention, operation can be performed at a lower joining temperature. Using aluminum alloy as an example, the joining temperature (200° C. to 400° C.) of the present invention is lower than the temperature (greater than 580° C.) of a conventional aluminum alloy brazing process. This saves process costs and reforming costs of a brazed workpiece. The joining temperature is 200° C. lower than a melting point of a base metal, and the joining does not need to be performed in a vacuum environment. The requirement on process precision is low and the equipment investment is reduced. Compared with a process of a nano-silver paste, in the present invention, because the aluminum powder is mixed, costs of required materials (approximately 5 NTD/g) are much lower than costs of a full nano-silver metal paste (greater than 100 NTD/g).

(22) In conclusion, the metal joining method and the joint filler disclosed by the present invention may be used in metal joining in an environment of a normal atmospheric pressure by heating at a low temperature, thereby preventing a metal piece from deformation in high-temperature joining. In addition, costs of a filler of low-temperature joining are reduced by controlling the component proportion.

(23) The foregoing implementations or embodiments of the technical means used by the present invention are not used to limit the implementation scope of the present invention. Equivalent change and modification that is consistent with application content of the present invention or according to the patent scope of the present invention shall fall with the protection scope of the present invention.