Vapor chamber with support structure and manufacturing method therefor
11731220 · 2023-08-22
Assignee
Inventors
Cpc classification
F28F2240/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2275/067
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F19/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/085
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2225/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/086
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2255/18
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/083
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F28D15/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
Claims
1. A manufacturing method for a vapor chamber, comprising following steps: S1) preparing a first plate, a second plate and a plurality of support elements, the first plate including an outer surface and an inner surface, and the second plate including an outer surface and an inner surface, wherein each of the first and second plates has a thickness of 0.02 to 0.2 mm, and a capillary layer is disposed on a surface of the first plate or a surface of the second plate corresponding to the chamber; S2) placing the support elements in the chamber between the inner surface of the first plate and the inner surface of the second plate; and S3) applying laser welding to the outer surface of the first plate and the outer surface of the second plate at positions corresponding to the support elements and forming recessed weld ports without penetrating the first plate and the second plate, so that the first and second plates are joined to the support elements and weld ports are formed on the outer surface of the first plate and the outer surface of the second plate.
2. The manufacturing method for the vapor chamber according to claim 1, wherein in step S2), the support elements are disposed on the first plate or the second plate, and then one of the plates is covered by the other plate.
3. The manufacturing method for the vapor chamber according to claim 1, wherein in step S3), laser welding is dot welding or strip-shaped welding.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The disclosure will become more fully understood from the detailed description and the drawings given herein below for illustration only, and thus does not limit the disclosure, wherein:
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DETAILED DESCRIPTION
(13) Detailed descriptions and technical contents of the present disclosure are illustrated below in conjunction with the accompanying drawings. However, it is to be understood that the descriptions and the accompanying drawings disclosed herein are merely illustrative and exemplary and not intended to limit the scope of the present disclosure.
(14) Please refer to
(15) As shown in
(16) The support elements 3 are disposed inside the chamber 12 and constitute pillars. The support elements 3 are made of sintered powders or rigid materials. In step S2, the support elements 3 are disposed on the first plate 1 or the second plate 2. In the embodiment of the present invention, the chamber 12 of the first plate 1 is kept flat and faces upwards. The support elements 3 are arranged in a predetermined configuration inside the chamber 12. Examples of the predetermined configuration include a matrix array or other suitable arrays, and the configuration may vary according to shapes of the first and second plates 1, 2. Each of the support elements 3 is disposed between the first and second plates 1, 2 to provide structural support and has a height of 0.025 to 0.25 mm.
(17) Referring to
(18) Finally, the first and second plates 1, 2 are sealed at their edges, and after sealing, a gas removal tube 13 preinstalled still remains there. The gas removal tube 13 communicates the outside with the chamber 12 inside the vapor chamber, and thereby a degas process which fills a work fluid into the chamber 12 can be carried out, and then the gas removal tube 13 is sealed after the degas process to complete the production of the vapor chamber.
(19) Furthermore, please refer to
(20) The aforementioned content describes the vapor chamber with the support structure and the manufacturing method therefor.
(21) In the vapor chamber with the support structure and the manufacturing method therefor, the first plate 1 or the second plate 2 is welded by the heat generated from a laser beam focused thereon by means of laser welding. This approach is ideal for a thin plate since the support structure inside the thin vapor chamber can be fixed without causing an increase to the total thickness of the product. This also solves the problem that it is difficult to fix the support structure inside the thin vapor chamber. Therefore, the product yields improve, which allows for mass production.
(22) In summary, the present invention can certainly achieve the anticipated objects and solve the problems of conventional techniques, and has novelty and non-obviousness, so the present invention completely meets the requirements of patentability. Therefore, a request to patent the present invention is filed according to patent laws. Examination is kindly requested, and allowance of the present invention is solicited to protect the rights of the inventor.
(23) It is to be understood that the above descriptions are merely the preferable embodiments of the present invention and are not intended to limit the scope of the present invention. Equivalent changes and modifications made in the spirit of the present invention are regarded as falling within the scope of the present invention.