CAVITY-TYPE FILM BUCK ACOUSTIC WAVE RESONATOR WITHOUT A SACRIFICIAL LAYER AND A CONSTRUCTION METHOD THEREOF

Abstract

Provided in the present invention are a cavity-type bulk acoustic resonator without the need to prepare a sacrificial layer, and a preparation method therefor, comprising the following steps: taking a piezoelectric single crystal wafer subjected to ion implantation and having a bottom electrode, and forming a cavity on the side of the piezoelectric single crystal wafer having the bottom electrode; then taking a substrate, and bonding the substrate to the side of the piezoelectric single crystal wafer having the cavity; performing heat treatment on the bonded intermediate product to peel off the thin film of the piezoelectric single crystal wafer; and producing a top electrode on the peeled side of the piezoelectric single crystal wafer. The preparation method for the cavity-type bulk acoustic resonator without the need to prepare a sacrificial layer set forth in the present invention does not require the growth of a sacrificial layer, and does not perform etching and hole-forming on the thin film; the mechanical strength of the device is increased, and the thin film is not easily damaged; the cavity structure is formed before film forming, yield is high, and residue from etching is not left after film forming, there being no need to consider the effect of incomplete release on the device.

Claims

1. A method for constructing a cavity-type film bulk acoustic wave resonator without making a sacrificial layer, said method comprising the following steps: (1) using an ion-implanted piezoelectric single crystal wafer with a bottom electrode, and forming a cavity on a bottom electrode side of the piezoelectric single crystal wafer; using a substrate and bonding the substrate to a cavity side of the piezoelectric single crystal wafer to provide a bonded intermediate; (2) performing heat treatment on the bonded intermediate obtained in step 1, peeling off a film from the piezoelectric single crystal wafer and generating a top electrode at a film-peeling side.

2. The method according to claim 1, wherein in step (1), the substrate is bonded to the cavity side of the piezoelectric single crystal wafer by one of the following procedures: applying bonding compound to one side of the substrate and bonding the substrate to the cavity side of the piezoelectric single crystal wafer; wherein, the bonding compound is at least one organic insulating material selected from the group consisting of benzocyclobutene, polyimide, silsesquioxane and rotating coated glass; or growing bonding compound to one side of the substrate and bonding the substrate to the cavity side of the piezoelectric single crystal wafer; wherein, the bonding compound is at least one member selected from the group consisting of silicon oxide, silicon nitride, aluminum oxide and aluminum nitride.

3. The method according to claim 1, wherein: the piezoelectric single crystal wafer is of one of the following: quartz, lithium niobate, lithium tantalate, aluminum nitride, zinc oxide, barium titanate, potassium dihydrogen phosphate and lead magnesium niobate; an ion-implanted piezoelectric single crystal wafer with a bottom electrode is obtained according to the following procedure: taking a piezoelectric single crystal wafer, implanting ions onto the piezoelectric single crystal wafer and growing a bottom electrode on an implanted face thereof to form an ion-implanted piezoelectric single crystal wafer with a bottom electrode.

4. The method according to claim 3, wherein: the ions implanted into the piezoelectric single crystal wafer are at least one member selected from the group consisting of hydrions, boron ions, and arsenic ions, the energy of ion implantation is 100 KeV-1,000 KeV; the implantation dose is 2-8×10.sup.16/cm.sup.2, the ion beam current is 0.1-10 μm/cm.sup.−2; and the implantation depth is 0.3-8 μm.

5. The method according to claim 4, wherein: the bottom electrode of the piezoelectric single crystal wafer is grown by the following procedures: (a) first lithographically forming a pattern to be grown on the surface of the piezoelectric single crystal wafer, then growing the electrode, and finally washing off an excess part; or (b) first, growing electrode on the surface of the piezoelectric single crystal wafer, then preparing a mask, and finally etching away the excess part; an electrode material of the growing bottom electrode is one of Al, Au, Mo, Pt, and W; the thickness of the bottom electrode is 50-500 nm; and the bottom electrode is grown by a process selected from the group consisting of magnetron sputtering, resistive evaporation, and electron beam deposition.

6. The method according to claim 2, wherein in step (1), forming a cavity on the bottom electrode side of the piezoelectric single crystal wafer includes the following steps: growing a support layer on the bottom electrode side of the piezoelectric single crystal wafer, and forming a cavity on a grown film.

7. The method according to claim 6, wherein forming a cavity on the bottom electrode side of the piezoelectric single crystal wafer includes the following steps: taking the piezoelectric single crystal wafer, growing a supporting layer on the bottom electrode side of the piezoelectric single crystal wafer, and then performing pattern etching on the side of the growing supporting layer to etch the supporting layer to form a cavity; and the supporting layer is one or more of silicon oxide, silicon nitride, amorphous silicon, and metal.

8. The method according to claim 2, wherein: in step (1), the bonding compound is applied by spin coating to form a bonding layer; the spin coating includes a low rotation speed phase and a high rotation speed phase; the rotation speed of the low rotation speed phase is 200 rpm/s-800 rpm/s, the rotation time is 10 s-30 s; the rotation speed of the high rotation speed phase is 1,000 rpm/s-8,000 rpm/s, and the rotation time is 15 s-60 s.

9. The method according to claim 8, wherein in step (2), the film of the bonded intermediate obtained in step (1) is peeled off at a temperature of 180-400° C., and then annealed at a temperature of 180-400° C. for 10 to 600 minutes to obtain an off-peeled film.

10. A cavity type film bulk acoustic wave resonator obtained by the method.

11. The cavity type film bulk acoustic resonator according to claim 9, which comprises a top electrode, a piezoelectric film, a bottom electrode, a supporting layer, a bonding layer and a substrate that are sequentially arranged from top to bottom, and the supporting layer is provided with a cavity.

12. The method according to claim 2, wherein the applied bonding compound is 100 nm to 4,000 nm in thickness.

13. The method according to claim 3, wherein the ions implanted into the piezoelectric single crystal wafer are at least one member selected from the group consisting of H.sup.+, He.sup.+, B.sup.+ and As.sup.+, the energy of ion implantation is 100 KeV-1,000 KeV; the implantation dose is 2-8×10.sup.16/cm.sup.2, the ion beam current is 0.1-10 μm/cm.sup.−2; and the implantation depth is 0.3-8 μm.

14. The method according to claim 5, wherein the material of the substrate is one or more of silicon, silicon on an insulating layer, glass, quartz, lithium niobate, lithium tantalate, silicon carbide, gallium nitride, and gallium arsenide.

15. The method according to claim 6, wherein a cavity depth of the cavity is greater than 100 nm.

16. The method according to claim 7, wherein an electrode protection layer is also grown between the supporting layer and the bottom electrode; the electrode protection layer includes one or more of silicon oxide, silicon nitride, amorphous silicon, aluminum oxide, and aluminum nitride; and dry etching or wet etching is adopted for the etching of the growing supporting layer.

17. The method according to claim 8, wherein a step of pre-baking the piezoelectric single crystal wafer spin-coated with the bonding compound is included; the pre-baking temperature is 50-120° C., and the pre-baking time is 60-600 s; and in step (1), the substrate is pre-bonded with the cavity side of the piezoelectric single crystal wafer, and then the bonding is performed; the pre-bonded pressure is 1×10.sup.5 pa-5×10.sup.6 pa, and the pressure holding time is 3-30 min; after pre-bonding, slowly increasing the temperature to 150-500° C., and keeping the temperature at 150-500° C. to make an organic polymer layer completely cured and the bonding is completed.

18. The method according to claim 9, wherein the thickness of the piezoelectric single crystal wafer with the film peeled off is 500-1,000 nm; the electrode material of the growing top electrode is one of Al, Au, Mo, Pt, and W; and the thickness of the top electrode is 50-300 nm.

19. The method according to claim 11, wherein the bonding layer has a thickness of 2-6 μm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG. 1 is a structure diagram of an ion-implanted piezoelectric single crystal wafer with a bottom electrode obtained in step (a) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0042] FIG. 2 is a structure diagram of growing a supporting layer on a piezoelectric single crystal wafer obtained in step (b) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0043] FIG. 3 is a structure diagram of a piezoelectric single crystal wafer with a cavity obtained in step (b) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0044] FIG. 4 is a structure diagram of the substrate coated with the bonding compound obtained in step (c) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0045] FIG. 5 is a structure diagram of the bonded intermediate obtained in step (c) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0046] FIG. 6 is a structure diagram of the film peeling obtained in step (d) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0047] FIG. 7 is a structure diagram of the cavity type film bulk acoustic wave resonator without a sacrificial layer obtained in step (d) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention.

[0048] FIG. 8 is a structure diagram of an ion-implanted piezoelectric single crystal wafer with a bottom electrode obtained in step (b) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 3 of the invention.

[0049] FIG. 9 is a diagram of the structure of growing a supporting layer on the piezoelectric single crystal wafer obtained in step (c) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 3 of the invention.

[0050] FIG. 10 is a structure diagram of the cavity type film bulk acoustic wave resonator without making a sacrificial layer obtained in step (d) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 3 of the invention.

[0051] In drawings, 1—Substrate; 2—Cavity; 3—Bonding layer; 4—Piezoelectric single crystal wafer; 5—Ion damage layer; 6—Implantation face; 7—Bottom electrode; 8—Supporting layer; 9—Top electrode.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0052] In the following paragraphs, the technical schemes presented in the embodiments of the invention are described in a clear and complete manner on the basis of the drawings attached to the embodiments of the invention. Obviously, the described embodiments are a part, not the whole, of the embodiments of the invention. Based on the embodiments of the invention, all other embodiments obtained by the ordinary skilled in the art without contributing creative work are fall within the scope of protection of the invention.

[0053] It shall be noted that for the embodiments of the invention with no specific conditions specified, the conventional conditions or the conditions recommended by the manufacturer shall be followed. With no manufacturers specified, the reagents or instruments used are conventional products available in the market. The raw materials produced by different manufacturers or of different types have no impact on the implementation of the technical effects and the realization of the technical schemes related to the invention.

Embodiment 1

[0054] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer of this embodiment comprises the following steps:

[0055] (a) a piezoelectric single crystal wafer is applied; the piezoelectric single crystal wafer is a lithium tantalate wafer; ion implantation is performed on the piezoelectric single crystal wafer to form an ion damage layer, and the implanted ions are H ions; the energy for the implanted ions is 195 KeV, the implantation dose is 6×10.sup.16/cm.sup.2, the ion beam current is 1 1 μm/cm.sup.−2, and the implantation depth is 6 μm; as a result, the pyroelectric material is obtained. The implantation surface of the pyroelectric material is lithographically formed a pattern to be grown, and then the electrode is grown by magnetron sputtering; the electrode material is Au. Finally, the excess part is washed off with acetone to obtain an ion-implanted piezoelectric single crystal wafer with a bottom electrode. The thickness of the bottom electrode is 100 nm; as shown in FIG. 1, a structure diagram of an ion-implanted piezoelectric single crystal wafer with a bottom electrode obtained in step (a);

[0056] (b) using the piezoelectric single crystal wafer obtained in step (a), growing a supporting layer on the bottom electrode side of the piezoelectric single crystal wafer, and then performing pattern etching on one side of the growing supporting layer to etch the supporting layer to form a cavity; the supporting layer is one or more of silicon oxide, silicon nitride, amorphous silicon, and metal;

[0057] specifically, the supporting layer is grown on the piezoelectric single crystal wafer, and the supporting layer is SiO.sub.2. FIG. 2 is a structure diagram of growing a supporting layer on a piezoelectric single crystal wafer obtained in step (b); then, the pattern to be etched is transferred on the supporting layer, and then a mask is prepared on the surface of the supporting layer, and the convex corners of the pattern of the mask are provided with convex corner compensation parts, and then wet etching is performed. During the etching process, the part covered by the mask is retained, and the part not covered by the mask is etched away to form a cavity; the wet etching can be adopted for anisotropic etching of single crystal silicon. When wet etching is used to etch single crystal silicon, the etching solution shows the fastest corrosion rate for the supporting layer under the convex corner structure in the mask pattern. Therefore, a convex corner compensation is set through the etching pattern design, and the “convex corner” can be compensated to avoid structural loss; as shown in FIG. 3, a structure diagram of a piezoelectric single crystal wafer with a cavity obtained in step (b);

[0058] as a preferred implementation of this embodiment, a supporting layer is grown on the piezoelectric single crystal wafer; the support layering is SiO.sub.2. The pattern to be etched is transferred on the supporting layer, and the cleaning solution is used to clean the supporting layer, removing impurities from the surface, and then spin-coating photoresist on the surface of the supporting layer as a mask, and obtaining a pattern of the mask by photolithography. The convex corner of the pattern of the mask is provided with a convex corner compensation; then, the target location is etched by wet etching to form a cavity, and the depth of the cavity is 4,000 nm, and the location of the cavity is the cavity layer; after the target location is etched, the cleaning solution is used to remove impurities from the surface to obtain a piezoelectric single crystal wafer with a cavity;

[0059] as a preferred implementation of this embodiment, the cleaning solution is one or more of water, acetone, ethanol, and hydrogen fluoride; in this embodiment, acetone and ethanol solutions are used respectively to remove impurities from the surface, and then deionized water is used for rinsing, then immersion in 15 w % hydrogen fluoride is performed for 20 minutes to remove the oxide layer, and rinsing with deionized water repeatedly is conducted as the last step;

[0060] Wherein, the wet etching is specifically: etching with an etchant at a temperature of 90° C. for 30 minutes; the etchant is a KOH solution with a concentration of 30 w %;

[0061] (c) using a substrate of silicon, coating bonding compound onto one side of the substrate to form a bonding layer; the bonding layer is combined with the bottom electrode side of the piezoelectric single crystal wafer obtained in step (b) to form a bonded intermediate; as shown in FIG. 4, a structure diagram of the substrate applied with the bonding compound obtained in step (c). As shown in FIG. 5, a structure diagram of the bonded intermediate obtained in step (c);

[0062] wherein, as a preferred implementation of this embodiment: the bonding compound is benzocyclobutene and the thickness of the bond layer is 4 μm; the bonding compound is coated by spin coating; the spin coating includes a low speed phase and a high speed phase; the speed of the low speed phase is 800 rpm/s, and the rotation time is 10 s; the speed of the high speed phase is 3,000 rpm/s, and the rotation time is 30 s;

[0063] as a preferred implementation of this embodiment, the substrate spin-coated with the bonding compound is placed in an oven for pre-baking, the pre-baking temperature is 100° C., and the pre-baking time is 4 min;

[0064] as a preferred implementation of this embodiment, the bonding specifically includes the following steps: first, the piezoelectric single crystal wafer that has undergone ion implantation and has a bottom electrode and the substrate are placed in a bonding machine or a tube furnace for pre-bonding; the pre-bonding pressure is 4×10.sup.5 pa, and the pressure holding time is 30 min; then, the temperature is slowly increased to 200° C., and the temperature is maintained at 200° C. for 2 hours to make the benzocyclobutene completely cured; the bonding is completed, and the bonded intermediate product is obtained;

[0065] (d) the bonded intermediate obtained in step (c) is annealed at a temperature of 350° C. for 2 hours to peel off the film. The off-peeled film can recover the lattice damage caused by ion implantation during the annealing process, thereby obtaining the off-peeled film; as shown in FIG. 6, a structure diagram of the film peeling obtained in step (d). Electron beam evaporation or magnetron sputtering is used to prepare a top electrode of patterned metal on the surface of the off-peeled film to obtain a cavity type bulk acoustic resonator without a sacrificial layer; wherein, the electrode material of the top electrode is Al, and the electrode thickness is 100 nm. FIG. 7 is a structure diagram of the cavity type film bulk acoustic wave resonator without making a sacrificial layer obtained in step (d) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 1 of the invention;

[0066] as a preferred implementation of this embodiment, the step of bombarding the obtained peeling film is included: RIE plasma is used to bombard the obtained peeling film to reduce its roughness to 4 nm; in the RIE plasma bombarding step, the ion used is Ar+ ion, the pressure is 20 mT, the flow rate is 30 sccm, the RIE power is 100 W, the vacuum degree is 10.sup.−4 Pa, and the treatment time is 120 s.

[0067] The cavity type film bulk acoustic wave resonator constructed in this embodiment without making a sacrificial layer includes a top electrode, a piezoelectric film, a bottom electrode, a supporting layer, a bonding layer, and a substrate that are sequentially arranged from top to bottom. The supporting layer is provided with a cavity; the piezoelectric film is an off-peeled film. The upper surface area of the bottom electrode of the cavity type film bulk acoustic wave resonator constructed in this embodiment without making a sacrificial layer is smaller than the upper surface area of the cavity.

Embodiment 2

[0068] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer of this embodiment comprises the following steps:

[0069] (a) using a piezoelectric single crystal wafer; the piezoelectric single crystal wafer is a lithium tantalate wafer; ion implantation is performed on the piezoelectric single crystal wafer, and the implanted ions are As ions; the energy for the implanted ions is 150 KeV-1,000 KeV, and the implantation depth is 0.5-1.8 μm; as a result, the pyroelectric material is obtained. An electrode of Au is then grown by magnetron sputtering on the implantation surface of the obtained pyroelectric material. Then, the mask is prepared. Finally, the excess part is washed off to obtain an ion-implanted piezoelectric single crystal wafer with a bottom electrode. The thickness of the bottom electrode is 100 nm;

[0070] (b) using an ion-implanted piezoelectric single crystal wafer with a bottom electrode, and form a cavity on the bottom electrode side of the piezoelectric single crystal wafer with a supporting layer around the cavity, using a substrate; growing bonding compound on one side of the substrate, and bonding the substrate to the cavity side of the piezoelectric single crystal wafer; wherein, the bonding compound is one or more of silicon oxide, silicon nitride, aluminum oxide, and aluminum nitride; in this embodiment, the bonding compound is silicon dioxide;

[0071] as a preferred implementation of this embodiment, the bonding specifically includes the following steps: first, the piezoelectric single crystal wafer that has undergone ion implantation and has a bottom electrode and the substrate are placed in a bonding machine or a tube furnace for pre-bonding; the pre-bonding pressure is 4×10.sup.5 pa, and the pressure holding time is 30 min; then, the temperature is slowly increased to 200° C., and the temperature is maintained at 200° C. for 2 hours to ensure complete curing; the bonding is completed, and the bonded intermediate product is obtained;

[0072] (c) the bonded intermediate obtained in step (b) is annealed at a temperature of 350° C. for 2 hours to peel off the film. The off-peeled film can recover the lattice damage caused by ion implantation during the annealing process, thereby obtaining the off-peeled film. Electron beam evaporation or magnetron sputtering is used to prepare a top electrode of patterned metal on the surface of the off-peeled film; wherein, the electrode material of the top electrode is Al, and the electrode thickness is 100 nm.

[0073] The cavity type film bulk acoustic wave resonator without making a sacrificial layer obtained in this embodiment comprises a top electrode, a piezoelectric film, a bottom electrode, a supporting layer, a bonding layer and a substrate that are sequentially arranged from top to bottom, and the supporting layer is provided with a cavity; wherein, the bonding layer has a thickness of 2-6 μm. The piezoelectric film is the off-peeled film.

Embodiment 3

[0074] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in this embodiment is exactly the same as the method in embodiment 1, except that the upper surface area of the bottom electrode is greater than the upper surface area of the cavity.

[0075] As shown in FIG. 8, a structure diagram of an ion-implanted piezoelectric single crystal wafer with a bottom electrode obtained in step (b).

[0076] FIG. 9 is a structure diagram of the structure of growing a supporting layer on the piezoelectric single crystal wafer obtained in step (c) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 3 of the invention.

[0077] FIG. 10 is a structure diagram of the cavity type film bulk acoustic wave resonator without making a sacrificial layer obtained in step (d) of the method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in embodiment 3 of the invention.

Embodiment 4

[0078] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer of this embodiment comprises the following steps:

[0079] (1) using an ion-implanted piezoelectric single crystal wafer with a bottom electrode, and forming a cavity on the side of the piezoelectric single crystal wafer having a bottom electrode; using a substrate and coating bonding compound onto one side of the substrate, bonding the substrate to the cavity side of the piezoelectric single crystal wafer; wherein, the bonding compound is an organic insulating material which includes at least one of benzocyclobutene and polyimide; preferably, the thickness of the coated bonding compound is 100 nm-4,000 nm; in this embodiment, the organic insulating material is polyimide amine, the thickness of the coated bonding compound is 2,000 nm;

[0080] (2) performing heat treatment on the bonded intermediate obtained in step (1), peeling off the film from the piezoelectric single crystal wafer and generating top electrode at the film-peeling side.

Embodiment 5

[0081] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer of this embodiment comprises the following steps:

[0082] (1) using an ion-implanted piezoelectric single crystal wafer with a bottom electrode, and forming a cavity on the bottom electrode side of the piezoelectric single crystal wafer, using a substrate; growing bonding compound on one side of the substrate, and bonding the substrate to the cavity side of the piezoelectric single crystal wafer; wherein, the bonding compound is one or more of silicon oxide, silicon nitride, aluminum oxide, and aluminum nitride; in this embodiment, the bonding compound is aluminum oxide;

[0083] (2) performing heat treatment on the bonded intermediate formed in step (1), peeling off the film from the piezoelectric single crystal wafer and generating top electrode at the film-peeling side.

Comparative Example

[0084] The method for constructing a cavity type film bulk acoustic wave resonator without making a sacrificial layer in the comparative example is of the same conditions and practice as in embodiment 1, except that a substrate with a cavity is replaced by a substrate with a sacrificial layer, comprising the following steps:

[0085] using a substrate and growing a sacrificial layer of amorphous silicon thereon, using an ion-implanted piezoelectric single crystal wafer with a bottom electrode, growing a bonding compound on the bottom electrode side to bond with the substrate, and then performing peeling to obtain a piezoelectric film, after that etching an opening in the upper surface of the piezoelectric single crystal wafer, introducing XeF.sub.2 gas through the etched hole to etch the amorphous silicon sacrificial layer, after forming a cavity, a cavity type film bulk acoustic wave resonator without making a sacrificial layer is obtained.

Effect Test Example

[0086] To verify the technical effect of the method for constructing a single crystal film device with a cavity structure described in the invention, the single crystal film is formed with the methods in embodiments 1-5 and the comparative example, respectively, and the following comparative detection tests are performed.

[0087] 100 single crystal films are formed according to the methods in embodiments 1-5 and the comparative example, which are inspected and recorded,

[0088] using the single crystal films formed according to the methods in embodiments 1-5 and the comparative example and measuring their Q value, and recording the results,

[0089] using the single crystal films formed according to the methods in embodiments 1-5 and the comparative example respectively to construct film bulk acoustic wave resonators, then measuring their clutter number and recording the results.

[0090] The data obtained from the above tests are as follows:

TABLE-US-00001 Group Yield Q value Clutter number Embodiment 1 98% 2,500 None Embodiment 2 99% 3,000 None Embodiment 3 98% 2,800 None Embodiment 4 98% 1,500 None Embodiment 5 99% 2,000 A few Comparative example 76% 300 Many

[0091] It can be seen from the above test results that the single crystal film device with a cavity structure constructed by the method of the invention has improved its mechanical strength, and the film thereof is not easy damaged by etching, and the quality of the film is not affected; The cavity structure formed before the film has high yield and no residue left from etching after the film formation, with high-quality single crystal oxide film grown on a polycrystalline metal bottom electrode to construct a single crystal film device with the film peeing method. Besides, in embodiment 2, the Q value of the single crystal film obtained by bonding using silicon dioxide as the bonding compound is superior to the Q value of the single crystal film obtained by bonding using benzocyclobutene as the bonding compound in embodiment 1.

[0092] Common technical knowledge shows that the invention can be realized through other implementations remaining pertinent to its spirit or necessary features. As a result, the above-disclosed embodiments are merely illustrative in all aspects, and not the only ones. All changes within the scope of the invention or within the scope equivalent to the invention are encompassed by the invention.