Optical Transmitter
20220149591 · 2022-05-12
Inventors
- Shigeru Kanazawa (Musashino-shi, Tokyo, JP)
- Takahiko Shindo (Musashino-shi, Tokyo, JP)
- Naoki Fujiwara (Musashino-shi, Tokyo, JP)
Cpc classification
H01L2924/19105
ELECTRICITY
H01S5/12
ELECTRICITY
H01L2924/00014
ELECTRICITY
H01S5/02325
ELECTRICITY
H01L2924/00014
ELECTRICITY
International classification
Abstract
An optical transmitter capable of significantly suppressing a fluctuation in frequency response characteristics due to a fabrication error in internal wire length while reducing a subcarrier size of a module of the optical transmitter is provided. The optical transmitter includes: a subcarrier on which an RF wiring board, a modulated laser chip, and a terminating resistor are mounted and which has a ground pad on an upper surface thereof; and a wire for electrically connecting at least the RF wiring board and the modulated laser chip to each other, wherein the RF wiring board and the modulated laser chip are arranged in a width direction of the subcarrier, and a length of the wire in an electric path which starts at the RF wiring board, passes through the terminating resistor, and reaches the ground pad is 0.5 to 1.5 mm or an inductance of the wire is 0.4 to 1.2 nH.
Claims
1. An optical transmitter, comprising: a subcarrier; an RF wiring board mounted on the subcarrier; a modulated laser chip mounted on the subcarrier; a terminating resistor mounted on the subcarrier; a ground pad on an upper surface of the subcarrier; and a wire for electrically connecting at least a part of an electric path, the electric path extending from the RF wiring board to the ground pad and passing through the terminating resistor; and wherein: the RF wiring board and the modulated laser chip are arranged in a width direction of the subcarrier, and a length of the wire in the electric path extending to the ground pad ranges from 0.5 to 1.5 mm or an inductance of the wire ranges from 0.4 to 1.2 nH.
2. The optical transmitter according to claim 1, wherein the terminating resistor is monolithically integrated on the RF wiring board or on the subcarrier.
3. The optical transmitter according to claim 1, further comprising at least one capacitor connected in series as a circuit to the electric path from the RF wiring board to the ground pad.
4. The optical transmitter according to claim 3, wherein the capacitor is arranged on an opposite side to the terminating resistor with the modulated laser chip therebetween.
5. The optical transmitter according to claim 1, wherein an output optical waveguide of the modulated laser chip emits light at a non-90 degree angle with respect to a light-outgoing end surface of the modulated laser chip.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0018]
[0019]
[0020]
[0021]
[0022]
[0023]
DESCRIPTION OF EMBODIMENTS
[0024] In order to solve the problems described above, an optical transmitter according to the present invention arranges a terminating resistor, an EA-DFB laser chip, and a ground pad on a subcarrier in a width direction of the subcarrier. Studies conducted based on embodiments described hereinafter revealed that a structure such as that described below is optimal for suppressing a change in frequency response characteristics of an optical transmitter. The structure includes an inductor in which a length of a wire existing on an electric circuit which starts at the RF wiring board, passes through the terminating resistor, and reaches the ground pad ranges from around 0.5 to 1.5 mm or an inductance of the wire corresponds to a total range of 0.4 to 1.2 nH. Adopting such a structure enables a fluctuation of a 3 dB band due to a variation in a length of a wire connecting the ground pad and the terminating resistor to each other to be suppressed and enables a mounting yield to be improved. In addition, a width of the subcarrier can be reduced.
[0025] The present invention achieves stable frequency response characteristics independent of a wire length and a reduction in a width of a subcarrier by optimally designing an arrangement of each part on the subcarrier and a wire length.
[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First Embodiment
[0027]
[0028] In the optical transmitter according to the first embodiment shown in
[0029] A wire 11 is drawn out from an end of the RF wiring that is connected to one end of the terminating resistor 6 of the RF wiring board 20 integrating the terminating resistor 6 and connected to an electrode of an EA modulator 5, and supplies a modulated electric signal to the EA modulator 5. A wire 12 is drawn out from an electrode connected to another end of the terminating resistor 6 integrated on the RF wiring board 20 and connected to an end of the capacitor 7 for DC interruption (DC cut) across the EA-DFB laser chip 3. Another end of the capacitor 7 is connected to and grounded by the ground pad 8. As shown in
[0030] For comparison, an optical transmitter subassembly was created using the same EA-DFB laser chip 3 by applying a conventional structure. This is a structure as shown in
[0031]
[0032] The frequency response characteristics of the optical transmitter when conventional art is applied are as shown in
[0033] When conventional art is applied (
[0034] In addition, it is confirmed that, even when comparing widths of the created subassemblies, with respect to 0.95 mm for the conventional type, the width in the structure according to the first embodiment is 0.75 mm, which represents a reduction in width by 0.2 mm.
Second Embodiment
[0035]
[0036] In the optical transmitter subassembly according to the second embodiment shown in
[0037] An end electrode on a right side of the capacitor 7 is connected to and grounded by the ground pad 8 positioned in an upper right corner of the subcarrier 1, and an end electrode on a left side of the capacitor 7 is drawn out by a wire 13 and connected to one end of the terminating resistor 6 across the EA-DFB laser chip 3.
[0038] The terminating resistor 6 is arranged in an orientation which causes end electrodes to be positioned above and below unlike in the conventional example, another end of the terminating resistor 6 is connected to the electrode of the EA modulator 5 by the wire 10 in a similar manner to the conventional example, and the electrode of the EA modulator 5 is supplied with a modulated electric signal by the wire 11 from an upper end of the RF wiring.
[0039]
[0040] In addition, it is confirmed that, even when comparing widths of the created subassemblies, with respect to 0.95 mm for the conventional type, the width in the structure according to the second embodiment is 0.75 mm, which represents a reduction in the width by 0.2 mm. This is also attributable to the fact that it is possible to absorb a relatively small width of the terminating resistor 6 by an open area in an upper left corner of the EA-DFB laser chip 3 having been obliquely arranged.
[0041] Moreover, since the capacitor 7 for DC cut need only interrupt DC voltage that is applied to the EA modulator 5 on an electric path which starts at the RF wiring board 2, passes through the terminating resistor 6, and reaches the ground pad 8, at least one capacitor need only be connected in series as a circuit on the electric path. In addition, the terminating resistor 6 may be the terminating resistor 6 having been monolithically integrated on the subcarrier 1.
[0042] While both embodiments adopt the EA-DFB laser chip 3 as a laser chip in the present invention, it is obvious that the laser chip is not limited thereto and may be a modulated laser chip having an optical modulation function.
INDUSTRIAL APPLICABILITY
[0043] As described above, with the optical transmitter according to the present invention, an optical transmitter capable of significantly suppressing a fluctuation in frequency response characteristics due to a fabrication error in internal wire length while reducing a subcarrier size of a module can be provided.
REFERENCE SIGNS LIST
[0044] 1 Subcarrier [0045] 2, 20 RF wiring board [0046] 3 EA-DFB laser chip [0047] 4 DFB laser [0048] 5 EA modulator [0049] 6 Terminating resistor [0050] 7 Capacitor [0051] 8 Ground pad [0052] 10, 11, 12, 13 Wire