NI-BASED CORROSION RESISTANT ALLOY POWDER FOR ADDITIVE MANUFACTURING AND MANUFACTURING METHOD OF ADDITIVE MANUFACTURING PRODUCT USING SAID POWDER

Abstract

The invention addresses the problem of providing an Ni-based corrosion resistant alloy powder that is suitable for additive manufacturing, and a manufacturing method for an additive manufacturing product using the powder, the product having excellent corrosion-resistance and few defects. The invention consists of an Ni-based alloy powder having a component composition, in percentages by mass, of 14.5-23.9% Cr, 12.0-23.0% Mo, 0.01-7.00% Fe, 0.001-2.500% Co, 0.010% or less Mg, 0.040% or less N, 0.001-0.50% Mn, 0.001-0.200% Si, more than 0-0.50% Al, 0.001-0.500% Ti, 0.250% or less Cu, 0.001-0.300% V, 0.0001-0.0050% B, 0.0001-0.0200% Zr, and 0.0010-0.0300% O, the remainder being Ni, and contained as inevitable impurities, less than 0.05% C, less than 0.01% S, and less than 0.01% P. The angle of repose of the Ni-based alloy powder is 48 degrees or less.

Claims

1. A Ni-based corrosion resistant alloy powder for additive manufacturing, composed of a powder of a Ni-based alloy having a component composition including, in mass %, Cr: 14.5 to 23.9%, Mo: 12.0 to 23.0%, Fe: 0.01 to 7.00%, Co: 0.001 to 2.500%, Mg: 0.010% or less, N: 0.040% or less, Mn: 0.001 to 0.50%, Si: 0.001 to 0.200%, Al: more than 0 and 0.50% or less, Ti: 0.001 to 0.500%, Cu: 0.250% or less, V: 0.001 to 0.300%, B: 0.0001 to 0.0050%, Zr: 0.0001 to 0.0200%, and O: 0.0010 to 0.0300%, with the remainder being Ni and unavoidable impurities, wherein C, S and P are contained as the unavoidable impurities (C: less than 0.05%, S: less than 0.01% and P: less than 0.01%), and wherein a repose angle of the Ni-based alloy powder is 48 degrees or less.

2. The Ni-based corrosion resistant alloy powder for additive manufacturing according to claim 1, wherein, in the Ni-based alloy powder, in a cumulative distribution curve showing the relationship between a particle size and a cumulative volume from a small particle size side obtained by a laser diffraction method, a particle size d10 corresponding to a cumulative frequency of 10 volume % of the powder is 7 μm or more and 35 μm or less, a particle size d50 corresponding to a cumulative frequency of 50 volume % of the powder is 10 μm or more and 60 μm or less, and a particle size d90 corresponding to a cumulative frequency of 90 volume % of the powder is 20 μm or more and 98 μm or less.

3. The Ni-based corrosion resistant alloy powder for additive manufacturing according to claim 2, wherein, in the cumulative distribution curve, the uniformity represented by (d90-d10)/d50 is 1.5 or less.

4. The Ni-based corrosion resistant alloy powder for additive manufacturing according to claim 1, wherein the component composition of the Ni-based alloy further includes Ta: 2.5% or less.

5. The Ni-based corrosion resistant alloy powder for additive manufacturing according to claim 1, wherein the component composition of the Ni-based alloy further includes W: 5.0% or less.

6. A method of manufacturing an additive manufacturing product, comprising performing additive manufacturing using the Ni-based corrosion resistant alloy powder for additive manufacturing according to claim 1 as a raw material powder.

7. The method of manufacturing an additive manufacturing product according to claim 6, wherein the additive manufacturing product is a member for semiconductor manufacturing device.

8. The method of manufacturing an additive manufacturing product according to claim 6, wherein the additive manufacturing is a powder bed fusion method.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0026] FIG. 1 shows a schematic view of an additive manufacturing device known in a powder bed fusion method.

[0027] FIG. 2 shows a schematic view of an additive manufacturing device known in a directed energy deposition method.

DESCRIPTION OF EMBODIMENTS

[0028] Hereinafter, one embodiment of the present invention will be described. First, the reason for limiting the component composition of the Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention (hereinafter simply referred to as a Ni-based corrosion resistant alloy powder) will be described in detail, and a particle size distribution and a powder particle size will be then described.

[Cr: 14.5% to 24.5% (% is Mass %, the Same Applies Hereinafter)]

[0029] Cr is effective in improving corrosion resistance in a corrosive environment. For example, when the additive manufacturing product is used as a member for semiconductor manufacturing device, it is effective in improving corrosion resistance against halogen-containing gases such as HCl, Cl.sub.2, HF, F.sub.2, NF.sub.3, ClF.sub.3 and HBr. In particular, if the member for semiconductor manufacturing device is temporarily exposed to the outside air when it is opened, water from the atmosphere may be adsorbed on the metal surface, the adsorbed water and a halogen process gas may be hydrated, and electrochemical corrosion may occur. Cr exhibits corrosion resistance with respect to a hydrated acid particularly in an area with a relatively low concentration. In this case, Cr is required to be contained in an amount of 14.5% or more, but when it is contained in an amount of more than 24.5%, in combination with Mo, phase stability is impaired during additive manufacturing, it is difficult to maintain a single phase, a coarse p phase is formed, and corrosion resistance deteriorates. Therefore, the content thereof is set to 14.5% to 24.5%.

[0030] The upper limit of Cr is preferably 22.5%, and more preferably 20.5%. In addition, the lower limit of Cr is preferably 15.0%, and more preferably 18.0%.

[0031] The upper limit values and the lower limit values of the Cr content can be arbitrarily combined. In addition, while the description will be omitted below, the upper limit values and the lower limit values for respective elements to be described below can be arbitrarily combined.

[Mo: 12.0% to 23.0%]

[0032] Like Cr, Mo is effective in improving corrosion resistance in a corrosive environment. That is, it is effective in improving corrosion resistance against halogen-containing gases such as HCl, Cl.sub.2, HF, F.sub.2, NF.sub.3, ClF.sub.3 and HBr. In particular, if the member for semiconductor manufacturing device is temporarily exposed to the outside air when it is opened, water from the atmosphere may be adsorbed on the metal surface, the adsorbed water and a halogen process gas may be hydrated, and electrochemical corrosion may occur. Mo exhibits corrosion resistance with respect to a hydrated acid particularly in an area with an intermediate to high concentration. In this case, Mo is required to be contained in an amount of 12.0% or more, but if it is contained in an amount of more than 23.0%, since Mo is inferior in oxidation at a high temperature, when the powder is produced by a gas atomization method or the like, an oxide film formed on the surface of each powder becomes thick. The additive manufacturing product produced using this powder is not preferable because defects caused by oxides become significant. Therefore, the content thereof is set to 12.0% to 23.0%.

[0033] The upper limit of Mo is preferably 20.5%, and more preferably 19.5%. In addition, the lower limit of Mo is preferably 14.0%, and more preferably 16.0%.

[Fe: 0.01% to 7.00%, Co: 0.001% to 2.500%]

[0034] Fe and Co have a higher melting point than Ni and have an effect of increasing the molten viscosity. The powder can be produced by, for example, blowing a molten metal in a spray form into an atmospheric gas and quenching it. When a powder is produced by adding Fe and Co, it is possible to easily control the particle size, and it is possible to minimize formation of a fine powder (particle size of less than 5 μm) with which additive manufacturing tends to be difficult. In this case, Fe is required to be contained in an amount of 0.01% or more, but if it is contained in an amount of more than 7.00%, corrosion resistance with respect to a hydrated acid deteriorates, and thus the content thereof is set to 0.01% to 7.00%.

[0035] The upper limit of Fe is preferably 5.50%, and more preferably 1.00%. In addition, the lower limit of Fe is preferably 0.05%, and more preferably 0.10%.

[0036] Similarly, Co is required to be contained in an amount of 0.001% or more, but if it is contained in an amount of more than 2.500%, this is not preferable because defects caused by shrinkage cavities at the micro level during powder solidification during additive manufacturing become significant. Therefore, the content of Co is set to 0.001 to 2.500%.

[0037] The upper limit of Co is preferably 1.000%, and more preferably 0.500%. In addition, the lower limit of Co is preferably 0.005%, and more preferably 0.010%.

[N: 0.040% or less, Mg: 0.010% or less, Mn: 0.001% to 0.50%]

[0038] When N, Mn and Mg are incorporated together, an effect of minimizing microsegregation is provided. During additive manufacturing, individual powder particles are instantly melted by a laser, while they are solidified by relative quenching and molded. In this case, there is a concern that microsegregation may occur. Due to the occurrence of microsegregation, a dilute area of elements such as Cr and Mo which exhibit corrosion resistance is formed, and corrosion resistance is overcome in this dilute area. Therefore, microsegregation should be minimized. N, Mn and Mg have effects of stabilizing a Ni-fcc phase, which is a parent phase and promoting solid-solutionizing of Cr and Mo, and therefore, as a result, the occurrence of microsegregation during quench solidification is minimized.

[0039] However, if N is contained in a very small amount, it has an effect of minimizing microsegregation during additive manufacturing, but if it is contained in an amount of more than 0.040%, a nitride is formed and the number of defects in the additive manufacturing product increases. Therefore, the content thereof is set to 0.040% or less.

[0040] The upper limit of N is preferably 0.030%, and more preferably 0.020%. In addition, the lower limit of the content of N is more than 0, preferably 0.001%, more preferably 0.003%, and still more preferably 0.005%.

[0041] Similarly, if Mg is contained in a very small amount, it has an effect of minimizing microsegregation during additive manufacturing, but if it is contained in an amount of more than 0.010%, microsegregation is promoted conversely, and it tends to deteriorate corrosion resistance of the additive manufacturing product. Therefore, the content thereof is set to 0.010% or less.

[0042] The upper limit of Mg is preferably 0.0050%, more preferably 0.0030%, and still more preferably 0.0020%. In addition, the lower limit of the content of Mg is more than 0, preferably 0.0001%, more preferably 0.0003%, and still more preferably 0.0005%. On the other hand, when the content of Mn is less than 0.001%, there is no effect of minimizing microsegregation during additive manufacturing, and when it is contained in an amount of more than 0.50%, microsegregation is promoted conversely, and for example, corrosion resistance of the additive manufacturing product with respect to a semiconductor process gas tends to deteriorate. Therefore, the content thereof is set to 0.001% to 0.50%.

[0043] The upper limit of Mn is preferably 0.40%, and more preferably 0.35%. In addition, the lower limit of Mn is preferably 0.005%, more preferably 0.006%, and still more preferably 0.007%.

[0044] Here, it is confirmed that the effects of these three elements are not the same, and when the three elements are not contained in a predetermined range at the same time, there is no effect of minimizing microsegregation.

[Si: 0.001% to 0.200%, Al: more than 0 and 0.50% or less, Ti: 0.001% to 0.500%]

[0045] Si, Al and Ti have an effect of improving the cleanliness in the alloy when added as deoxidizing agents. Thereby, a powder and another powder are smoothly bonded during additive manufacturing, and as a result, the occurrence of defects in the additive manufacturing product is minimized.

[0046] If Si is contained in an amount of 0.0010% or more, the effect thereof is exhibited, but if it is contained in an amount of more than 0.200%, segregation occurs in the grain boundaries and the corrosion resistance tends to deteriorate. Therefore, the content of Si is set to 0.001% to 0.200%.

[0047] The upper limit of Si is preferably 0.100%, and more preferably 0.010%. In addition, the lower limit of Si is preferably 0.002%, and more preferably 0.005%.

[0048] Similarly, if Al is contained in a very small amount, a cleaning effect in the alloy is exhibited, but if it is contained in an amount of more than 0.50%, oxide formation during additive manufacturing becomes significant, and the number of defects in the additive manufacturing product increases. Therefore, the content of Al is set to more than 0 and 0.50% or less.

[0049] The upper limit of Al is preferably 0.40%, and more preferably 0.30%. In addition, the lower limit of Al is preferably more than 0, preferably 0.0010%, more preferably 0.003%, and still more preferably 0.005%.

[0050] Similarly, if Ti is contained in an amount of 0.0010% or more, a cleaning effect in the alloy is exhibited, but if it is contained in an amount of more than 0.500%, oxide formation during additive manufacturing becomes significant, and the number of defects in the additive manufacturing product increases. Therefore, the content of Ti is set to 0.001% to 0.500%.

[0051] The upper limit of Ti is preferably 0.200%, and more preferably 0.100%. In addition, lower limit of Ti is preferably 0.003%, and more preferably 0.005%.

[Cu: 0.250% or Less]

[0052] Cu is effective in improving corrosion resistance in a reducing wet corrosive environment with hydrochloric acid and hydrofluoric acid. Therefore, it is effective against electrochemical corrosion caused by the process gas and water adsorbed on the metal surface. If Cu is contained in a very small amount, the effect is exhibited, but if it is contained in an amount of more than 0.250%, oxides on the surface of the produced powder make the defects in the additive manufacturing product significant. Therefore, the content of Cu is set to 0.250% or less.

[0053] The upper limit of Cu is preferably 0.100%, and more preferably 0.010%. In addition, the lower limit of the content of Cu is more than 0, preferably 0.001%, more preferably 0.002%, and still more preferably 0.005%.

[V: 0.001% to 0.300%]

[0054] V is effective in minimizing the formation of powder particles with a large diameter when the powder is produced in the form of a mist from the molten metal. A powder with a diameter that is too large is not preferable because in this case defects become significant due to large gaps between particles during additive manufacturing. Therefore, large powder particles are removed during powder classification, but the yield (powder yield) thereby decreases, which causes a problem in industrial production. Unless V is added in an amount of 0.001% or more, an effect of minimizing coarse powder is not obtained, but if it is contained in an amount of more than 0.300%, this is not preferable because micronization proceeds conversely, and the required yield (powder yield) of the particle size is also reduced. Therefore, the content of V is set to 0.001% to 0.300%.

[0055] The upper limit of V is preferably 0.200%, and more preferably 0.100%. In addition, the lower limit of V is preferably 0.003%, and more preferably 0.005%.

[B: 0.00010% to 0.0050%, Zr: 0.00010% to 0.0200%]

[0056] B and Zr become nuclei in the solidification process and are effective in preventing the occurrence of shrinkage cavities. When the additive manufacturing product is molded, the process of melting and solidifying individual powder particles is repeated, but when shrinkage cavities occur in the solidification process, these defects become the source of particle generation, and thus it is inappropriate for an additive manufacturing product used as a member or component for the semiconductor manufacturing device.

[0057] If B is contained in an amount of 0.0001% or more, an effect of preventing the occurrence of shrinkage cavities is exhibited, but if it is contained in an amount of more than 0.0050%, segregation occurs in the grain boundaries and the corrosion resistance tends to deteriorate. Therefore, the content of B is set to 0.0001% to 0.0050%.

[0058] The upper limit of B is preferably 0.0040%, and more preferably 0.0030%. In addition, the lower limit of B is preferably 0.0002%, and more preferably 0.0005%.

[0059] Similarly, if Zr is contained in an amount of 0.00010% or more, an effect of preventing the occurrence of shrinkage cavities is exhibited, but if it is contained in an amount of more than 0.0200%, as in B, segregation occurs in the grain boundaries and the corrosion resistance tends to deteriorate. Therefore, the content of Zr is set to 0.0001% to 0.0200%.

[0060] The upper limit of Zr is preferably 0.0100%, more preferably 0.0080%, and still more preferably 0.0060%. In addition, the lower limit of Zr is preferably 0.0005%, and more preferably 0.0008%.

[0061] Here, it is confirmed that the effects of these two elements are not the same, and when the two elements are not contained in a predetermined range at the same time, there is no effect of preventing the occurrence of shrinkage cavities.

[O: 0.0010% to 0.0300%]

[0062] O is mainly instantly combined with Cr in a high temperature state immediately after solidification in the spraying process of the molten metal during powder production, and forms a very thin and strong oxide film on the powder surface, and thereby it has an effect of minimizing further progress of oxidation. Thereby, the amount of powder-derived oxides incorporated as a foreign substance into the additive manufacturing product is reduced to a very low level. If O is contained in an amount of 0.0010% or more, the effect is exhibited, but if it is contained in an amount of more than 0.0300%, oxides on the surface of the powder make the defects in the additive manufacturing product significant. Therefore, the content of O is set to 0.0010% to 0.0300%.

[0063] The upper limit of O is preferably 0.0200%, and more preferably 0.0100%. In addition, the lower limit of O is preferably 0.0020%, and more preferably 0.0050%.

[Ta: 2.5% or Less]

[0064] Ta is effective in improving corrosion resistance against a reducing acid or an oxidizing acid and corrosion resistance against pitting corrosion and crevice corrosion, and thus it is added as necessary. If added, 2.5% or less may be added. Here, if it is contained in an amount of more than 1.0%, an effect of significantly improving corrosion resistance is exhibited, but if it is contained in an amount of more than 2.5%, the amount of oxides formed on the powder surface during powder production increases, and thereby defects in the laminated product become significant. Therefore, the content is preferably more than 1.0% and 2.5% or less.

[0065] The upper limit of Ta is preferably 2.3%, and more preferably 2.2%. In addition, the lower limit of Ta is preferably 1.10%, and more preferably 1.2%.

[W: 5.0% or Less]

[0066] Like Mo, W is effective in improving corrosion resistance against a reducing acid, and at the same time, it increases the melting point, and increases the viscosity of the molten metal, which makes it easy to control the particle size when the powder is produced. Simultaneously, it can minimize formation of a fine powder (particle size of less than 5 μm) with which additive manufacturing tends to be difficult, and thus it is added as necessary. If added, 5.0% or less may be added. In order to obtain a greater effect, it is preferable to add 2.0% or more. However, if it is contained in an amount of more than 5.0%, the melting point becomes higher than necessary, and thus the powder tends to become coarse, and the yield (powder yield) for classifying an appropriate powder diameter decreases. Therefore, the content is preferably 2.0% to 5.0%.

[0067] The upper limit of W is preferably 4.9%, and more preferably 4.5%. In addition, the lower limit of W is preferably 2.2%, and more preferably 2.5%.

[Unavoidable Impurities: C: Less than 0.05%, S: Less than 0.01%, P: Less than 0.01%]

[0068] The remainder is Ni and unavoidable impurities. As unavoidable impurities, C forms carbides with Cr near crystal grain boundaries, and increases deterioration of corrosion resistance. Therefore, the content of C is set to less than 0.05%. In addition, S and P segregate at the grain boundaries and cause cracks at a high temperature, and thus the amount thereof should be minimized to less than 0.01%.

[0069] In addition, the content of these unavoidable impurities is preferably small and may be 0%.

[0070] The component composition of the Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention can be determined by the following measurement method.

[0071] As will be described below in examples, the powder for additive manufacturing after classification is melted in an appropriate aqueous solution, the aqueous solution is subjected to high frequency inductively coupled plasma (ICP) analysis, and the content of a predetermined component is measured.

[0072] Here, the content of C and S is determined using a carbon sulfur analysis device, and the content of N and O is determined using an oxygen nitrogen analysis device by performing gas analysis according to a combustion method.

[0073] The Ni-based corrosion resistant alloy powder of the present invention is used for the above additive manufacturing (additive manufacturing). For example, in the additive manufacturing by a powder bed fusion method (hereinafter referred to as a powder bed method), it is necessary to spread the metal powder on the stage bed to form a flat and uniform metal powder layer having a thickness of about 20 to 100 μm, and repeat this operation. Surface roughness and defects are affected according to powder properties of the metal powder in this case. Therefore, it is required that the metal powder be smoothly supplied, and flow efficiently when squeegeed, and spread to a flat and uniform thickness. That is, good fluidity and good spreading properties are required. Hereinafter, the powder properties, the fluidity, and the spreading properties of the Ni-based corrosion resistant alloy powder will be described.

[Fluidity]

[0074] The fluidity of the Ni-based corrosion resistant alloy powder is evaluated by a repose angle according to JIS R9301-2-2. When the repose angle exceeds 48 degrees, the fluidity is poor and spreading properties are poor. The repose angle needs to be 48 degrees or less, and is preferably 40 degrees or less. The lower limit is not particularly limited and can be, for example, 20 degrees or more.

[Particle Size Distribution]

[0075] The particle size distribution of the Ni-based corrosion resistant alloy powder of the present invention is determined by a laser diffraction method using a laser diffraction type particle size distribution measurement device. In the cumulative distribution curve showing the relationship between the particle size and the cumulative volume from the small particle size side, when a particle size d10 corresponding to a cumulative frequency of 10 volume %, a particle size d50 corresponding to a cumulative frequency of 50 volume %, and a particle size d90 corresponding to a cumulative frequency of 90 volume % are measured, d10 is 7 μm or more and 35 μm or less. The lower limit of d10 is preferably 10 μm. The upper limit of d10 is preferably 25 μm. The upper limit values and the lower limit values of the d10 can be arbitrarily combined. Although the description is omitted, the same applies to the following d50 and d90.

[0076] d50 is 10 μm or more and 60 μm or less. The lower limit of d50 is preferably 20 μm. The upper limit of d50 is preferably 40 μm.

[0077] d90 is 20 μm or more and 98 μm or less. The lower limit of d90 is preferably 40 μm. The upper limit of d90 is preferably 80 μm.

[0078] Particles that are too small cause the powder layer to be frayed and biased, which results in poor coatability. On the other hand, particles that are too large may affect defects and surface roughness due to concerns about the melted residue due to insufficient power of the laser. When the above particle size distribution is provided or when the numerical value requirements for d50 are simply satisfied, the powder layer can be repeatedly spread to a flat and uniform thickness. Therefore, good spreading properties are obtained. Here, a Ni-based alloy powder having the above particle size distribution is suitable for SLM.

[Uniformity of Particle Size]

[0079] In addition, in the present invention, a numerical value represented by (d90-d10)/d50 is defined as uniformity. When the uniformity of the Ni-based corrosion resistant alloy powder is 1.5 or less, the spreading properties are good, and the uniformity is preferably 1.2 or less, and more preferably 1.1 or less. For the lower limit, the value of the uniformity can be reduced by classification or the like, but the powder yield and the productivity are lowered, for example, 0.8 or more is preferable and 0.9 or more is more preferable. For the uniformity represented by the above formula, it can be said that, when the numerical value is smaller, the width of the particle size distribution is narrower, the variation is smaller and the median diameter is uniform. In addition, it can be said that, as the value of the uniformity is smaller, the cohesiveness is weaker, the fluidity is higher, and spreading properties are favorable, and this suitable for additive manufacturing.

[0080] As described above, when the range of the above repose angle and/or the above particle size distribution and uniformity are provided, the Ni-based corrosion resistant alloy powder of the present invention has favorable fluidity and excellent spreading properties. As a result, it is possible to reduce the defect rate during additive manufacturing and it is possible to obtain an additive manufacturing product in which the occurrence of defects is minimized

[Powder Particle Size]

[0081] Additive manufacturing is a molding method in which individual powder particles are repeatedly melted and solidified to impart a shape. However, if the particle size of the Ni-based corrosion resistant alloy powder is less than 5 μm, it is difficult to obtain a volume required for one melting and solidification, and thus it is difficult to obtain a sound additive manufacturing product. If the amount of the powder having a particle size of less than 5 μm is small, the powder yield is improved, and it contributes to reduction of the defect rate. On the other hand, if the particle size of the Ni-based corrosion resistant alloy powder exceeds 100 μm, a volume required for one melting and solidification is too large and it is difficult to obtain a sound additive manufacturing product. Since the amount of the powder having a particle size of more than 100 μm is small, power shortage of the laser is minimized, which contributes to reduction of the defect rate. Among these, in the powder bed method using SLM, it is preferable to use a Ni-based corrosion resistant alloy powder having a particle size distribution range of 5 μm or more and 100 μm or less. The particle size distribution range of the Ni-based corrosion resistant alloy powder is more preferably a range of 20 μm or more and 80 μm or less.

[0082] In addition, the Ni-based corrosion resistant alloy powder can be produced using a gas atomization method, a water atomization method, a jet atomization method or the like. The particle shape of the Ni-based corrosion resistant alloy powder is preferably spherical, and the powder is more preferably produced by the gas atomization method.

[0083] The Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention can be suitably used for the powder bed method (SLM) using a laser. For example, in an additive manufacturing device shown in FIG. 1, the Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention is supplied, a powder layer having a thickness of 20 to 100 μm, and preferably 30 to 60 μm is formed by squeezing, a high energy laser with an output adjusted to, for example, 400 W or less, is emitted to an area in which the powder is provided, and the alloy powder is selectively melted and bonded. The scanning speed in this case may be adjusted to, for example, 7,000 mm/s or less. When the melting and solidification operation is repeated in this manner, additive manufacturing products having a desired shape can be additive manufactured.

[0084] According to additive manufacturing using the Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention, there are very few defects, and a valve member of a cylinder for being filled with halogen-containing gases and halogen compound gases, which exhibits excellent corrosion resistance under a wet environment or semiconductor process gas environment, a gas contact member in a mass flow meter, a gas block member, and a member for semiconductor manufacturing device such as gas fittings can be obtained.

[0085] In addition, as the additive manufacturing device, not only the device shown in FIG. 1, but also a directed energy deposition method additive manufacturing device shown in FIG. 2 can be used depending on the shape of the additive manufacturing product and the like. The model of the additive manufacturing device and the like are not particularly limited.

[0086] Next, examples of the present invention will be described.

EXAMPLES

Example 1

[0087] Melted raw materials were prepared and melted using a high frequency vacuum melting furnace, and about 10 kg of each base alloy was prepared. In an argon atmosphere, using a gas atomization method, raw powders for obtaining the Ni-based corrosion resistant alloy powder for additive manufacturing having component compositions shown in Table 1 to Table 4 were prepared. Here, regarding C, S, and P corresponding to unavoidable impurities, the content of C was less than 0.05%, and the contents of S and P were less than 0.01%.

[0088] The raw gas atomized powders obtained above were directly classified into powders having a particle size of 20 to 80 μm for additive manufacturing and other powders using a plurality of sieves.

[0089] In Example 1, additive manufacturing was performed by a powder bed method (SLM) using a laser, and the corrosion resistance (wet environment and semiconductor process gas) of the Ni-based corrosion resistant alloy powder was confirmed. Here, in the tables, No. 41 to No. 48, No. 52, No. 54 to No. 60, No. 62 to No. 67, and No. 69 to No. 70 marked with * are examples outside the range of the composition according to the present invention. Here, there was no conventional product as the Ni-based corrosion resistant alloy powder for additive manufacturing.

TABLE-US-00001 TABLE 1 (Continued in Table 2) Alloy pow- Component composition (mass %) der Cr Mo Fe Co Mg N Mn Si Al 1 18.8 18.7 0.34 0.011 0.0018 0.008 0.011 0.013 0.31 2 21.2 13.4 4.55 0.732 0.0013 0.012 0.161 0.031 0.32 3 15.4 16 6.04 1.214 0.0043 0.023 0.490 0.040 0.34 4 22.8 15.7 0.56 0.009 0.0004 0.027 0.132 0.013 0.21 5 20.4 16.3 0.14 0.152 0.0007 0.026 0.231 0.011 0.28 6 15.2 22.2 0.97 0.621 0.0008 0.022 0.244 0.026 0.24 7 14.6 15.4 0.62 0.399 0.0018 0.010 0.063 0.044 0.13 8 23.9 14.3 1.94 0.015 0.0024 0.027 0.162 0.016 0.08 9 22.5 12.1 4.04 0.062 0.0008 0.006 0.236 0.020 0.40 10 18.6 22.9 2.71 0.007 0.0021 0.012 0.325 0.046 0.23 11 16.3 14.6 0.01 0.714 0.0018 0.012 0.195 0.028 0.40 12 15.8 16.7 6.98 0.593 0.0007 0.012 0.355 0.008 0.11 13 19.8 15.8 2.03 0.001 0.0025 0.028 0.074 0.094 0.30 14 16.9 15.5 3.97 2.495 0.0022 0.027 0.290 0.081 0.27 15 20.2 14.6 4.46 0.419 0.0001 0.023 0.054 0.048 0.38 16 19.8 20.2 0.06 0.920 0.0049 0.010 0.091 0.040 0.31 17 21.0 18.8 0.62 0.970 0.0006 0.001 0.179 0.005 0.04 18 17.4 19.9 1.95 0.035 0.0028 0.040 0.248 0.037 0.31 19 18.4 19.2 0.54 0.469 0.0012 0.022 0.005 0.048 0.08 20 16.3 20.3 0.41 0.546 0.0022 0.005 0.495 0.066 0.11 21 15.7 14.8 4.23 0.279 0.0018 0.017 0.012 0.001 0.08 22 19.2 19.9 1.72 0.204 0.0029 0.029 0.343 0.199 0.30 23 22.1 18.4 1.19 0.171 0.0026 0.013 0.203 0.013 0.01 24 18.0 19.9 2.43 0.077 0.0024 0.027 0.326 0.021 0.49 25 21.7 19.7 3.87 0.806 0.0006 0.004 0.056 0.052 0.34 26 19.9 18.7 0.58 0.609 0.0017 0.019 0.045 0.063 0.08 27 20.8 16.2 2.24 0.644 0.0028 0.015 0.141 0.048 0.21 28 20.6 14.2 2.03 0.662 0.0026 0.009 0.236 0.007 0.30 29 17.0 18.4 2.31 0.812 0.0005 0.028 0.359 0.036 0.11 30 17.7 15.7 2.10 0.256 0.0013 0.024 0.123 0.070 0.39 31 21.6 15.8 2.54 0.723 0.0016 0.012 0.273 0.009 0.24 32 18.5 19.8 2.79 0.110 0.0020 0.016 0.036 0.026 0.21 33 19.1 14.1 0.82 0.785 0.0008 0.026 0.197 0.097 0.08 34 15.9 15.8 3.79 0.565 0.0008 0.021 0.090 0.073 0.33 35 19.7 14.1 3.43 0.242 0.0010 0.019 0.191 0.028 0.24 36 15.3 16.5 4.45 0.244 0.0005 0.028 0.361 0.064 0.24 37 18.5 14.5 0.38 0.477 0.0013 0.011 0.305 0.040 0.40 38 20.5 17.2 3.51 0.927 0.0016 0.004 0.138 0.050 0.04 39 18.8 14.7 1.49 0.372 0.0003 0.016 0.349 0.015 0.34 40 18.3 16.0 4.06 0.700 0.0003 0.019 0.356 0.004 0.14

TABLE-US-00002 TABLE 2 (Continued from Table 1) Component composition (mass %) Ni + Alloy unavoidable powder Ti Cu V B Zr O Ta W impurities 1 0.012 0.031 0.008 0.0007 0.0062 0.0012 1.8 — Remainder 2 0.014 0.033 0.043 0.0006 0.0083 0.0154 — 2.9 Remainder 3 0.009 0.021 0.007 0.0007 0.0064 0.0176 — 3.7 Remainder 4 0.006 0.027 0.103 0.0007 0.0071 0.0157 — — Remainder 5 0.063 0.035 0.088 0.0012 0.0086 0.0174 — 3.9 Remainder 6 0.041 0.044 0.109 0.0016 0.0010 0.0166 — — Remainder 7 0.062 0.058 0.078 0.0024 0.0034 0.0176 — — Remainder 8 0.165 0.043 0.037 0.0003 0.0074 0.0174 — — Remainder 9 0.163 0.046 0.181 0.0018 0.0043 0.0032 — — Remainder 10 0.188 0.060 0.153 0.0037 0.0030 0.0089 — — Remainder 11 0.183 0.066 0.053 0.0038 0.0073 0.0092 — — Remainder 12 0.070 0.081 0.115 0.0025 0.0047 0.0178 — — Remainder 13 0.031 0.057 0.196 0.0029 0.0049 0.0107 — — Remainder 14 0.134 0.030 0.105 0.0020 0.0035 0.0199 — — Remainder 15 0.049 0.092 0.108 0.0010 0.0018 0.0098 — — Remainder 16 0.101 0.073 0.149 0.0023 0.0061 0.0157 — — Remainder 17 0.052 0.056 0.138 0.0010 0.0046 0.0130 — — Remainder 18 0.177 0.094 0.016 0.0025 0.0072 0.0089 — — Remainder 19 0.066 0.043 0.018 0.0014 0.0020 0.0112 — — Remainder 20 0.133 0.057 0.076 0.0037 0.0072 0.0112 — — Remainder 21 0.113 0.011 0.098 0.0033 0.0047 0.0029 — — Remainder 22 0.136 0.083 0.120 0.0021 0.0067 0.0054 — — Remainder 23 0.096 0.020 0.135 0.0021 0.0023 0.0113 — — Remainder 24 0.181 0.058 0.025 0.0012 0.0071 0.0145 — — Remainder 25 0.001 0.028 0.162 0.0029 0.0043 0.0156 — — Remainder 26 0.496 0.078 0.171 0.0030 0.0079 0.0171 — — Remainder 27 0.019 0.001 0.127 0.0026 0.0016 0.0109 — — Remainder 28 0.038 0.248 0.165 0.0024 0.0066 0.0142 — — Remainder 29 0.088 0.098 0.001 0.0013 0.0045 0.0157 — — Remainder 30 0.190 0.020 0.298 0.0039 0.0023 0.0155 — — Remainder 31 0.130 0.047 0.153 0.0001 0.0073 0.0179 — — Remainder 32 0.073 0.076 0.097 0.0049 0.0045 0.0165 — — Remainder 33 0.030 0.074 0.182 0.0033 0.0001 0.0134 — — Remainder 34 0.046 0.033 0.117 0.0025 0.0099 0.0031 — — Remainder 35 0.127 0.065 0.100 0.0010 0.0018 0.0010 — — Remainder 36 0.094 0.049 0.127 0.0030 0.0048 0.0297 — — Remainder 37 0.144 0.091 0.040 0.0021 0.0048 0.0035 1.1 — Remainder 38 0.019 0.047 0.155 0.0034 0.0067 0.0031 2.5 — Remainder 39 0.020 0.005 0.039 0.0033 0.0068 0.0140 — 2.1 Remainder 40 0.152 0.082 0.180 0.0013 0.0031 0.0192 — 5.0 Remainder

TABLE-US-00003 TABLE 3 (Continued in Table 4) Alloy Component composition (mass %) powder Cr Mo Fe Co Mg N Mn Si Al 41 14.3* 14.6 2.50 1.405 0.0024 0.018 0.053 0.063 0.37 42 24.2* 14.8 2.46 0.086 0.0028 0.030 0.059 0.019 0.45 43 19.0 11.8* 0.17 0.952 0.0009 0.014 0.224 0.075 0.10 44 21.1 23.2* 5.13 1.193 0.0012 0.011 0.347 0.018 0.21 45 22.6 19.4 —* 1.849 0.0016 0.031 0.413 0.096 0.16 46 20.4 18.1  7.05* 1.432 0.0021 0.021 0.245 0.006 0.06 47 18.1 13.7 0.77 —* 0.0037 0.038 0.318 0.109 0.10 48 17.4 14.3 4.35  2.505* 0.0009 0.031 0.156 0.039 0.17 49 16.7 16.6 0.47 0.073 — 0.012 0.466 0.126 0.29 50 21.8 19.2 4.85 1.692 0.0052 0.015 0.496 0.047 0.27 51 20.7 20.0 3.47 1.551 0.0018 — 0.450 0.119 0.02 52 15.5 17.3 3.80 2.027 0.0020  0.043* 0.431 0.017 0.13 53 14.9 17.7 5.23 0.996 0.0006 0.018 0.003 0.064 0.15 54 22.2 21.9 4.27 1.017 0.0049 0.016 0.522* 0.011 0.05 55 16.3 12.9 0.54 2.172 0.0026 0.028 0.366 —* 0.33 56 21.6 22.4 5.34 1.325 0.0038 0.006 0.298  0.204* 0.42 57 14.8 18.3 0.46 0.615 0.0047 0.006 0.446 0.085 —* 58 18.2 13.7 0.58 1.870 0.0045 0.021 0.372 0.087  0.53* 59 22.3 17.7 0.53 0.550 0.0018 0.007 0.241 0.076 0.28 60 23.9 19.7 3.33 1.398 0.0039 0.038 0.304 0.019 0.47 61 21.6 19.4 5.36 1.385 0.0025 0.010 0.295 0.190 0.49 62 18.4 16.6 2.88 0.371 0.0023 0.037 0.338 0.065 0.12 63 20.3 18.8 3.71 0.176 0.0027 0.006 0.430 0.187 0.30 64 21.0 21.0 1.80 0.397 0.0045 0.028 0.215 0.184 0.28 65 21.0 19.5 2.92 1.267 0.0030 0.037 0.179 0.140 0.22 66 18.4 14.0 3.50 0.908 0.0040 0.014 0.294 0.146 0.07 67 20.5 14.3 3.82 0.513 0.0013 0.007 0.250 0.111 0.39 68 21.4 20.7 1.97 0.648 0.0036 0.002 0.161 0.133 0.04 69 19.8 18.0 0.14 2.089 0.0005 0.016 0.258 0.120 0.09 70 17.8 20.8 0.83 0.921 0.0015 0.023 0.343 0.200 0.31 (note) *indicates beyond the scope of the present invention

TABLE-US-00004 TABLE 4 (Continued from Table 3) Component composition (mass %) Ni + Alloy unavoidable powder Ti Cu V B Zr O Ta W impurities 41 0.340 0.074 0.076 0.0027 0.0081 0.0291 — — Remainder 42 0.236 0.110 0.027 0.0037 0.0020 0.0196 — — Remainder 43 0.126 0.025 0.074 0.0004 0.0027 0.0085 — — Remainder 44 0.358 0.019 0.282 0.0030 0.0054 0.0193 — — Remainder 45 0.406 0.097 0.219 0.0003 0.0074 0.0260 — — Remainder 46 0.382 0.166 0.251 0.0002 0.0078 0.0110 — — Remainder 47 0.454 0.126 0.091 0.0003 0.0037 0.0173 — — Remainder 48 0.348 0.166 0.112 0.0044 0.0075 0.0158 — — Remainder 49 0.193 0.094 0.078 0.0025 0.0087 0.0229 — — Remainder 50 0.129 0.094 0.216 0.0048 0.0033 0.0059 — — Remainder 51 0.142 0.203 0.258 0.0014 0.0021 0.0107 — — Remainder 52 0.197 0.126 0.190 0.0049 0.0010 0.0136 — — Remainder 53 0.108 0.215 0.037 0.0025 0.0051 0.0033 — — Remainder 54 0.199 0.086 0.230 0.0017 0.0060 0.0106 — — Remainder 55 0.369 0.036 0.275 0.0006 0.0023 0.0124 — — Remainder 56 0.201 0.072 0.271 0.0024 0.0027 0.0083 — — Remainder 57 0.098 0.094 0.174 0.0004 0.0041 0.0246 — — Remainder 58 0.475 0.054 0.233 0.0023 0.0006 0.0162 — — Remainder 59 —* 0.064 0.158 0.0048 0.0071 0.0095 — — Remainder 60  0.505* 0.237 0.064 0.0019 0.0081 0.0192 — — Remainder 61 0.417 — 0.148 0.0004 0.0083 0.0125 — — Remainder 62 0.064  0.253* 0.045 0.0025 0.0090 0.0244 — — Remainder 63 0.435 0.247 —* 0.0022 0.0074 0.0168 — — Remainder 64 0.073 0.152  0.303* 0.0019 0.0001 0.0284 — — Remainder 65 0.149 0.199 0.246 —* 0.0056 0.0015 — — Remainder 66 0.001 0.236 0.245  0.0052* 0.0044 0.0099 — — Remainder 67 0.006 0.212 0.284 0.0022 —* 0.0149 — — Remainder 68 0.162 0.064 0.119 0.0028 0.0105 0.0222 — — Remainder 69 0.280 0.175 0.106 0.0033 0.0001 —* — — Remainder 70 0.255 0.161 0.009 0.0026 0.0097  0.0303* — — Remainder (note) *indicates beyond the scope of the present invention

[Powder Yield (%)]

[0090] For the powder in a particle size range of 20 to 80 μm for additive manufacturing obtained by classification, the powder yield (%) was determined as the value of (a mass of powders with a particle size of 20 to 80 μm)×100/(a mass of gas atomized powders without change).

[0091] Table 5 and Table 6 show the values of the powder yield (%). Here, the particle size distribution before classification was measured, and in powders having an excellent yield, the proportion of powders with a particle size of less than 5 μm was 10% or less, and the proportion of powders with a particle size of 5 μm or more was high according to adjustment of the composition.

[0092] Next, according to the powder bed method (SLM) additive manufacturing device using a laser shown in FIG. 1, using Ni-based corrosion resistant alloy powders 1 to 70, 10 plates (30×30×5 mm) were prepared as evaluation additive manufacturing products for each powder.

[0093] These plates (30×30×5 mm) as the evaluation additive manufacturing products were evaluated as follows.

[Measurement of Defect Rate (Area %)]

[0094] A cross section of the plate (30×30×5 mm) as the evaluation additive manufacturing product was cut and embedded in a resin, and the plate was polished to #1500 with water resistant emery paper, and then additionally polished with a diamond paste having a particle size of 1 μm to achieve a mirror-finished surface.

[0095] The mirror-finished surface was observed under an optical microscope, defects (voids and nests of 1 μm square or more) within a range of 1 mm×1 mm were identified by an image analysis device (digital microscope VHX6000: commercially available from Keyence Corporation), and the area ratio thereof was determined as a defect rate (area %).

[0096] Here, the resolution was 1,024×1,280 pixels, binarization was performed by image analysis software, and a black part of 8 or more pixels was defined as a defect.

[0097] Table 5 and Table 6 show the values of the defect rate (area %).

[Evaluation of Corrosion Resistance in Wet Environment]

[0098] The surface of the plate (30×30×5 mm) as the evaluation additive manufacturing product was polished, and finally finished to #400 with water resistant emery paper. Then, electropolishing was performed, and the polished sample was kept in an ultrasonic vibration state in acetone for 5 minutes and degreased to prepare a corrosion test piece.

[0099] A corrosion test was performed using these corrosion test pieces in boiling 10% HCl and 35% HCl for 24 hours.

[0100] When the weight loss amount before and after the test was measured, a corrosion rate (mm/year) was calculated from the surface area before the test and the test period.

[0101] The results are shown in Table 5 and Table 6.

[Evaluation of Corrosion Resistance with Respect to Semiconductor Process Gas]

[0102] The surface of the plate (30×30×5 mm) as the evaluation additive manufacturing product was polished, and finally finished to #400 with water resistant emery paper. Then, electropolishing was performed, and the polished sample was kept in an ultrasonic vibration state in acetone for 5 minutes and degreased to prepare a corrosion test piece.

[0103] These corrosion test pieces were placed in a small test chamber made of a Ni-based alloy (UNS N06022), the chamber was evacuated, and then filled with a corrosion gas (Cl.sub.2, HBr, NF.sub.3), and kept at a predetermined temperature (Cl.sub.2: 250° C., HBr: 250° C., NF.sub.3: 350° C.) for 24 hours according to the type of the corrosion gas, and the temperature was then cooled to room temperature, replacement with argon gas was performed and the sample was then quickly stored in a vacuum desiccator.

[0104] The corrosion test pieces were sequentially subjected to SEM observation, and an area ratio of the corroded part observed in an island shape from the captured image was measured by image analysis software (winRooF2015).

[0105] Here, the resolution was 1,024×1,280, and the magnification was 500, and an area of 8 pixels or more was defined as a corroded area.

[0106] The results are shown in Table 5 and Table 6.

[0107] Here, for the comparative alloy powders with a low powder yield or a high defect rate, corrosion test pieces were not prepared and no corrosion resistance evaluation was performed.

TABLE-US-00005 TABLE 5 Corrosion resistance in wet environment Corrosion resistance Defect (corrosion rate, with respect to halogen- Alloy rate (mm/year) containing gas (area ratio pow- (area 1% 35% % of corroded part) der %) HCl HCl Cl.sub.2 HBr NF.sub.3 Note 1 0.5 0.01 0.11 0.35 0.47 0.43 2 0.4 0.13 0.13 2.55 0.40 2.34 3 0.3 0.45 0.15 3.26 0.94 3.79 4 0.7 0.15 0.18 3.84 4.87 2.53 5 0.7 0.03 0.16 4.78 3.28 4.63 6 0.7 0.08 0.12 0.45 2.83 3.00 7 0.4 0.08 0.16 0.93 2.87 3.85 8 0.5 0.06 0.13 0.38 2.28 4.64 9 0.9 0.06 0.26 3.57 2.37 3.23 10 0.6 0.01 0.10 3.78 2.82 2.98 11 0.6 0.21 0.18 0.36 0.68 4.60 12 0.4 0.16 0.17 0.42 1.81 4.35 13 0.9 0.17 0.02 4.81 3.07 1.50 14 0.4 0.07 0.26 1.34 4.84 2.09 15 0.6 0.11 0.02 0.99 3.75 4.60 16 0.7 0.18 0.05 2.39 3.19 1.01 17 0.4 0.04 0.02 1.01 2.42 0.99 18 0.4 0.13 0.05 2.03 3.65 4.48 19 0.6 0.01 0.04 4.15 1.49 2.32 20 0.3 0.11 0.19 4.95 2.39 0.96 21 0.4 0.08 0.08 1.83 3.50 2.29 22 0.4 0.11 0.08 4.72 3.51 2.93 23 0.4 0.03 0.11 2.93 3.68 2.16 24 0.2 0.05 0.19 1.21 2.15 0.35 25 0.5 0.01 0.20 1.51 4.35 1.32 26 0.8 0.01 0.13 2.87 3.36 1.27 27 0.8 0.11 0.11 2.58 1.23 2.80 28 0.4 0.06 0.23 3.91 4.68 0.73 29 0.3 0.07 0.05 0.54 1.02 4.68 30 0.9 0.15 0.07 4.05 4.63 1.64 31 0.8 0.02 0.19 3.55 2.36 1.05 32 0.3 0.21 0.07 4.64 4.78 4.72 33 0.9 0.11 0.07 4.84 3.12 2.49 34 0.6 0.13 0.15 1.61 3.54 3.80 35 0.6 0.03 0.19 3.33 2.15 3.18 36 0.7 0.20 0.02 0.37 4.34 3.89 37 0.5 0.15 0.13 1.76 4.41 0.52 38 0.9 0.07 0.10 0.53 0.87 1.25 39 0.6 0.12 0.12 0.74 0.41 0.99 40 0.9 0.41 0.14 1.98 2.99 1.83

TABLE-US-00006 TABLE 6 Corrosion resistance in wet environment Corrosion resistance Defect (corrosion rate, with respect to halogen- Alloy rate (mm/year) containing gas (area ratio pow- (area 1% 35% % of corroded part) der %) HCl HCl Cl.sub.2 HBr NF.sub.3 Note 41 0.7 0.56 0.32 7.26 6.35 5.74 42 0.3 0.53 0.33 7.36 7.23 8.32 43 0.6 0.66 0.29 8.55 5.33 6.21 44 1.4 — — — — — Large defect 45 1.0 — — — — — Poor yield 46 0.9 0.75 0.44 6.52 4.53 5.33 47 0.4 — — — — — Poor yield 48 0.6 — — — — — Poor yield 49 0.5 0.23 0.11 5.67 3.28 4.44 50 1.0 0.16 0.23 2.67 6.57 8.32 51 0.6 0.17 0.21 3.88 5.78 5.99 52 1.7 — — — — — Large defect 53 0.5 0.08 0.02 5.48 3.29 6.66 54 0.7 0.55 0.37 5.26 7.62 6.27 55 1.4 — — — — — Large defect 56 0.8 0.52 0.28 5.16 7.03 8.68 57 1.6 — — — — — Large defect 58 2.3 — — — — — Large defect 59 1.2 — — — — — Large defect 60 1.4 — — — — — Large defect 61 0.8 0.09 0.16 5.78 6.32 6.47 62 1.5 — — — — — Large defect 63 0.7 — — — — — Poor yield 64 0.6 — — — — — Poor yield 65 1.3 — — — — — Large defect 66 0.9 0.14 0.28 6.24 5.87 7.21 67 1.4 — — — — — Large defect 68 0.4 0.16 0.12 7.21 6.93 8.56 69 1.3 — — — — — Large defect 70 1.6 — — — — — Large defect

[0108] As can be clearly understood from the results shown in Table 5 and Table 6, it was confirmed that, in the Ni-based corrosion resistant alloy powder for additive manufacturing having the composition according to the present invention, all the manufacturing yield, the defect rate of the additive manufacturing product produced using this powder, and the corrosion resistance (wet environment or semiconductor process gas) were better than those of the Ni-based corrosion resistant alloy powder for additive manufacturing outside the present invention and the additive manufacturing product produced using this powder. In addition, it was confirmed that, when a more preferable composition was used, high corrosion resistance was exhibited even under a corrosive environment with a semiconductor process gas.

Example 2

[0109] Samples with different particle size distributions were prepared for the No. 1 alloy powder from the Ni-based corrosion resistant alloy powders for additive manufacturing having the above component compositions, and d10, d50, and d90 were measured using a laser diffraction type particle size distribution measurement device (SALD-2300: commercially available from SHIMADZU). In addition, the uniformity represented by (d90-d10)/d50 was determined.

[0110] In addition, the repose angle of these samples was measured according to JIS R9301-2-2. Specifically, using a repose angle measurement instrument (ASK-01), the sample was supplied to a saucer, and the angle of the formed mountain was measured.

[0111] Spreading properties when these Ni-based corrosion resistant alloy powders were supplied onto the bed and squeezed to form a powder layer having a thickness of 40 to 60 μm were evaluated. For the spreading properties, according to visual inspection, if the powders were spread to a uniform thickness, the spreading properties were regarded as “good,” and if the powder layer was frayed and biased, the coatability was regarded as not good “NG.”

[0112] The results are shown in Table 7.

TABLE-US-00007 TABLE 7 Repose Particle size Sample angle Spreading distribution No. (degrees) properties d.sub.10 d.sub.50 d.sub.90 Uniformity 2-1* 55.3 NG 0.6 4.3 16.3 3.7 2-2* 51.4 NG 2.4 8.4 24.3 2.6 2-3 46.2 Good 7.5 12.5 25.1 1.4 2-4 36.8 Good 19.5 37.6 57.1 1.0 2-5 32.3 Good 32.8 58.6 97.4 1.1 2-6* 48.4 NG 19.3 52.4 110.8 1.7 *indicates beyond the scope of the present invention

[0113] Based on Table 7, in the Ni-based corrosion resistant alloy powder for additive manufacturing of the present invention, when the repose angle exceeded 48.0 degrees, the spreading properties were poor. Therefore, it was confirmed that spreading properties were improved at 48.0 degrees or less, and the alloy powder at 46.2 degrees or less had good spreading properties. In addition, it was found that the repose angle differed depending on the particle size distribution. Here, the alloy powder within the particle size distribution range of the present invention had good spreading properties. In addition, the uniformity was within 1.5 or less, and good results were obtained at 1.4 or less.

[0114] As described above, it is possible to obtain an additive manufacturing product having a low defect rate using these Ni-based corrosion resistant alloy powders.

INDUSTRIAL APPLICABILITY

[0115] When the Ni-based corrosion resistant alloy powder of the invention is used as a raw material powder for additive manufacturing, an additive manufacturing product having excellent corrosion resistance and very few defects can be obtained. For example, it is possible to provide a member for semiconductor manufacturing device made of an additive manufacturing product, but it is expected to be applied as a corrosion resistant metal powder for additive manufacturing of a member having a complex shape not only for a member for semiconductor manufacturing device, but also in a wide range of fields such as chemical plants, pharmaceutical manufacturing facilities, and oil and gas fields.