Thin-type two-phase fluid device
11732974 ยท 2023-08-22
Assignee
Inventors
Cpc classification
F28F2240/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/046
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2225/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
Abstract
A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.
Claims
1. A thin-type two-phase fluid device comprising: a first plate body formed of multiple plate bodies laminated with each other and having a first face, a second face, and multiple bosses-disposed on the first face and raised therefrom; a second plate body formed of multiple plate bodies laminated with each other and having a nanometer capillary layer on one face, the nanometer capillary layer being formed from a mixture of multiple kinds of powders with different sizes attached to a surface of the second plate body opposite to the first face of the first plate body; and a polymer layer selectively sandwiched between the multiple plate bodies of the first plate body or between the multiple plate bodies of the second plate body the total thickness of the thin-type two-phase fluid device being equal to or smaller than 0.25 mm.
2. The thin-type two-phase fluid device as claimed in claim 1, wherein the nanometer capillary layer has multiple first powders and multiple second powders, the diameter of the first powders being larger than the diameter of the second powders, the first and second powders being mixed and formed on one face of the second plate body opposite to the first plate body by means of sintering, adhesion, spraying or printing.
3. The thin-type two-phase fluid device as claimed in claim 1, wherein the polymer layer is selectively formed by means of painting, printing, or adhesion.
4. The thin-type two-phase fluid device as claimed in claim 1, wherein the first and second plate bodies are overlapped and mated with each other to define an airtight chamber, the nanometer capillary layer being disposed in the airtight chamber, a working liquid being filled in the airtight chamber.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
(2)
(3)
(4)
(5)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(6) Please refer to
(7) The first plate body 11 has a first face 111, a second face 112 and multiple bosses 113. The bosses 113 are disposed on the first face 111 and raised therefrom. The second plate body 12 has a nanometer capillary layer 14 on one face. The nanometer capillary layer 14 is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer 14 is attached to a surface of the second plate body 12 opposite to the first face 111 of the first plate body 11. The first and second plate bodies 11, 12 are overlapped and mated with each other to define an airtight chamber 15. The nanometer capillary layer 14 is disposed in the airtight chamber 15. A working liquid (not shown) is filled in the airtight chamber 15.
(8) The polymer layer 13 is selectively connected with the first plate body 11 or the second plate body 12. The total thickness of the thin-type two-phase fluid device 1 is equal to or smaller than 0.25 mm.
(9) The polymer layer 13 is selectively connected with the surface of the first plate body 11 or the second plate body 12 by means of painting or printing or adhesion.
(10) In this embodiment, the heat dissipation device is, but not limited to, a vapor chamber for illustration. Alternatively, the heat dissipation device can be a thin-type flat-plate heat pipe. The first and second plate bodies 11, 12 is made of a material selected from a group consisting of copper, aluminum, stainless steel and commercial pure titanium. The thickness of the first and second plate bodies 11, 12 is approximately 0.1 mm.
(11) The nanometer capillary layer 14 has multiple first powders 141 and multiple second powders 142. The diameter of the first powders 141 is larger than the diameter of the second powders 142. The first and second powders 141, 142 are mixed and formed on one face of the second plate body 12 opposite to the first plate body 11 by means of sintering, adhesion, spraying or printing. Alternatively, multiple kinds of powders with different sizes are adhered to each other by means of an adhesive (liquid phase or solid phase) and painted on the surface of the second plate body 12. After the liquid-phase adhesive is air-dried, the multiple kinds of powders with different sizes are attached to the surface of the second plate body 12 to form the nanometer capillary layer 14.
(12) In a second embodiment, the first plate body is composed of multiple plate bodies 11a laminated with each other, as shown in
(13) The bosses are recessed from the second face to the first face and raised from the first face. The bosses are selectively in contact with or not in contact with the nanometer capillary layer.
(14) A hydrophilic layer is selectively disposed on the first face of the first plate body or one face of the second plate body opposite to the first face of the first plate body or the surface of the nanometer capillary layer.
(15) Alternatively, a hydrophilic layer can be disposed on each of the first face of the first plate body, one face of the second plate body opposite to the first face of the first plate body and the surface of the nanometer capillary layer. In this embodiment, the hydrophilic layer is, but not limited to, disposed on any of the three.
(16) The present invention mainly provides a thin-type two-phase fluid device, especially a vapor chamber or a flat-plate heat pipe. The various capillary structures employed by the conventional techniques are applied to the vapor chamber or flat-plate heat pipe under limitation. Therefore, the vapor chamber or flat-plate heat pipe can be hardly successfully thinned. Therefore, the present invention improves the shortcoming of the conventional vapor chamber and flat-plate heat pipe that in the thinning process, the capillary structure cannot be thinned. In the present invention, multiple kinds of powders with different sizes are mixed and then disposed on the thinned plate body by means of spraying, adhesion, staining, printing and static attraction. Accordingly, the thickness of the capillary structure is minified so as to achieve thinning effect. Also, the capillary structure can still keep the capillary attraction and the thin-type two-phase fluid device can be bent. Therefore, the capillary structure of porous powders with best capillary attraction is kept. In addition, in cooperation with the design of the polymer layer 13, the capillary structure can be thinned and bent without destroying the capillary attraction of the capillary structure. Therefore, the capillary structure has the properties of bendability and flexibility. Under such circumstance, the entire heat dissipation device can be greatly thinned and the total thickness of the heat dissipation device can be even equal to or smaller than 0.25 mm. The present invention improves the shortcoming of the conventional capillary structure that the capillary structure cannot be thinned. By means of the improved technical means and structure, the present invention can achieve the structure, which cannot be made and formed by the conventional technique.
(17) The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.