METHOD OF MOUNTING CONNECTION ELEMENT STRUCTURE ON TARGET
20220143763 ยท 2022-05-12
Inventors
Cpc classification
B23K1/0008
PERFORMING OPERATIONS; TRANSPORTING
H01R12/52
ELECTRICITY
H01R43/0256
ELECTRICITY
International classification
B23K37/04
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method of mounting a connection element structure on a target is introduced and includes providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target. Therefore, the method can mount the connection element structure on the target, enhancing the efficiency of subsequent processes.
Claims
1. A method of mounting a connection element structure on a target, the connection element structure comprising a body and a stop element, the method comprising the steps of: providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target.
2. A method of mounting a connection element structure on a target, the connection element structure comprising a body and a stop element, the method comprising the steps of: providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a mounting position of the target with the lifting-laying tool; and pressing the connection element structure downward against the target with the lifting-laying tool and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target.
3. The method of mounting a connection element structure on a target according to claim 2, wherein pressing resiliently the connection element structure against the target with the lifting-laying tool.
4. A method of mounting a connection element structure on a target, the connection element structure comprising a body and a stop element, the method comprising the steps of: providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a mounting position of the target with the lifting-laying tool; and sensing, by the lifting-laying tool, a feedback message indicative of contact between the connection element structure and the target and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target.
5. The method of mounting a connection element structure on a target according to claim 1, further comprising the steps of: comparing, by a comparison device, the connection element structure with the target to determine its mounting position or mounting distance after the lifting-laying tool has lifted the connection element structure; and moving the connection element structure to the mounting position of the target with the lifting-laying tool according to a comparison message of the comparison device.
6. The method of mounting a connection element structure on a target according to claim 2, further comprising the steps of: comparing, by a comparison device, the connection element structure with the target to determine its mounting position or mounting distance after the lifting-laying tool has lifted the connection element structure; and moving the connection element structure to the mounting position of the target with the lifting-laying tool according to a comparison message of the comparison device.
7. The method of mounting a connection element structure on a target according to claim 4, further comprising the steps of: comparing, by a comparison device, the connection element structure with the target to determine its mounting position or mounting distance after the lifting-laying tool has lifted the connection element structure; and moving the connection element structure to the mounting position of the target with the lifting-laying tool according to a comparison message of the comparison device.
8. The method of mounting a connection element structure on a target according to claim 1, wherein the body of the connection element structure has a connection portion and a fixation portion, the connection portion being disposed in the body, the body having at least one connection opening, the fixation portion being fixed to an object, wherein the stop element of the connection element structure is disposed at the connection opening.
9. The method of mounting a connection element structure on a target according to claim 2, wherein the body of the connection element structure has a connection portion and a fixation portion, the connection portion being disposed in the body, the body having at least one connection opening, the fixation portion being fixed to an object, wherein the stop element of the connection element structure is disposed at the connection opening.
10. The method of mounting a connection element structure on a target according to claim 4, wherein the body of the connection element structure has a connection portion and a fixation portion, the connection portion being disposed in the body, the body having at least one connection opening, the fixation portion being fixed to an object, wherein the stop element of the connection element structure is disposed at the connection opening.
11. The method of mounting a connection element structure on a target according to claim 1, wherein the stop element prevents molten solder from entering or flowing into the connection opening.
12. The method of mounting a connection element structure on a target according to claim 2, wherein the stop element prevents molten solder from entering or flowing into the connection opening.
13. The method of mounting a connection element structure on a target according to claim 4, wherein the stop element prevents molten solder from entering or flowing into the connection opening.
14. The method of mounting a connection element structure on a target according to claim 11, wherein, upon its introduction, the solder is cooled to join the body and the target together, and then a tool is configured to remove the stop element from the connection opening.
15. The method of mounting a connection element structure on a target according to claim 12, wherein, upon its introduction, the solder is cooled to join the body and the target together, and then a tool is configured to remove the stop element from the connection opening.
16. The method of mounting a connection element structure on a target according to claim 13, wherein, upon its introduction, the solder is cooled to join the body and the target together, and then a tool is configured to remove the stop element from the connection opening.
17. The method of mounting a connection element structure on a target according to claim 1, wherein the body has a connection portion, the connection portion is fitted to a fastening element for fitting the body and the target together.
18. The method of mounting a connection element structure on a target according to claim 2, wherein the body has a connection portion, the connection portion is fitted to a fastening element for fitting the body and the target together.
19. The method of mounting a connection element structure on a target according to claim 4, wherein the body has a connection portion, the connection portion is fitted to a fastening element for fitting the body and the target together.
20. The method of mounting a connection element structure on a target according to claim 1, wherein the body has a rotation-proof portion, and the target has a corresponding rotation-proof portion, wherein the rotation-proof portion and the corresponding rotation-proof portion prevent each other from rotating.
21. The method of mounting a connection element structure on a target according to claim 2, wherein the body has a rotation-proof portion, and the target has a corresponding rotation-proof portion, wherein the rotation-proof portion and the corresponding rotation-proof portion prevent each other from rotating.
22. The method of mounting a connection element structure on a target according to claim 4, wherein the body has a rotation-proof portion, and the target has a corresponding rotation-proof portion, wherein the rotation-proof portion and the corresponding rotation-proof portion prevent each other from rotating.
23. The method of mounting a connection element structure on a target according to claim 20, wherein a welding layer is disposed between the rotation-proof portion and the corresponding rotation-proof portion, the welding layer is heated then cooled to solidify.
24. The method of mounting a connection element structure on a target according to claim 21, wherein a welding layer is disposed between the rotation-proof portion and the corresponding rotation-proof portion, the welding layer is heated then cooled to solidify.
25. The method of mounting a connection element structure on a target according to claim 22, wherein a welding layer is disposed between the rotation-proof portion and the corresponding rotation-proof portion, the welding layer is heated then cooled to solidify.
26. The method of mounting a connection element structure on a target according to claim 1, further comprising a fixing element disposed at the fixation portion or the object to fix the fixation portion to the object.
27. The method of mounting a connection element structure on a target according to claim 2, further comprising a fixing element disposed at the fixation portion or the object to fix the fixation portion to the object.
28. The method of mounting a connection element structure on a target according to claim 4, further comprising a fixing element disposed at the fixation portion or the object to fix the fixation portion to the object.
29. The method of mounting a connection element structure on a target according to claim 1, wherein a welding layer is disposed between the target and a lateral part of the fixation portion of the body or between the target and the fixation portion of the body, the welding layer is heated then cooled to solidify.
30. The method of mounting a connection element structure on a target according to claim 2, wherein a welding layer is disposed between the target and a lateral part of the fixation portion of the body or between the target and the fixation portion of the body, the welding layer is heated then cooled to solidify.
31. The method of mounting a connection element structure on a target according to claim 4, wherein a welding layer is disposed between the target and a lateral part of the fixation portion of the body or between the target and the fixation portion of the body, the welding layer is heated then cooled to solidify.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0063] To facilitate understanding of the object, characteristics and effects of this present disclosure, embodiments together with the attached drawings for the detailed description of the present disclosure are provided.
[0064] Referring to
[0065] Therefore, the connection element structure of the present disclosure is advantageous in that, owing to the stop element 2, contaminants cannot enter connection portion 11 of the connection element structure to otherwise impede the connection of another target and the connection portion 11, so as to enhance the efficiency of subsequent processes.
[0066] Referring to
[0067] Referring to
[0068] Referring to
[0069] Referring to
[0070] Preferably, the stop element 2 is squeezed into, riveted to, expandedly connected to, adhered to, welded to, fastened to, thermally fused with, painted onto, spraying-coated to, adhesive-dispensed to or integrally formed with the body 1.
[0071] Referring to
[0072] Referring to
[0073] Referring to
[0074] Preferably, the fixing element 3 is tin paste, soldering flux, solder paste, glue, fixing agent, liquid, grease, solid, solder, viscous body, film body, adhesive-like body, plastic or metal.
[0075] Regarding the method of mounting a connection element structure on a target, the stop element 2 is removed from the body 1 under a force of 0.0005 kg to 200 kg, so as to overcome the connection force between the stop element 2 and the body 1 or overcome the connection force between the stop element 2, the body 1 and the fixing element 3.
[0076] Referring to
[0077] Referring to
[0078] Referring to
[0079] Referring to
[0080] (1) As shown in
[0081] (2) As shown in
[0082] (3) As shown in
[0083] Referring to
[0084] Referring to
[0085] Referring to
[0086] Referring to
[0087] Referring to
[0088] Preferably, the fixing element 3 is tin paste, soldering flux, solder paste, glue, fixing agent, liquid, grease, solid, solder, viscous body, film body, adhesive-like body, plastic or metal.
[0089] Preferably, the target 10 is a circuit board, plastic target or metal target.
[0090] Referring to
[0091] providing a lifting-laying tool 6 to lift the connection element structure;
[0092] moving the connection element structure with the lifting-laying tool 6 to a predetermined height a above the mounting position (i.e., fixation hole 101) of the target 10;
[0093] releasing or loosening the connection element structure from the lifting-laying tool 6, such that the connection element structure falls and rests on the mounting position of the target 10. Therefore, not only is the connection element structure fixed to the target 10, so as to enhance the efficiency of subsequent processes, but the stop element 2 also prevents contaminants from entering the body 1 of the connection element structure, so as to enhance the efficiency of subsequent processes.
[0094] Preferably, after the lifting-laying tool 6 has lifted the connection element structure, a comparison device 7 compares the connection element structure with the target 10 to determine its mounting position or mounting distance; and the lifting-laying tool 6 moves the connection element structure to a default height a above the mounting position of the target according to a comparison message of the comparison device 7; the lifting-laying tool 6 releases or loosens the connection element structure, such that the connection element structure falls onto the mounting position of the target 10.
[0095] Preferably, after the lifting-laying tool 6 has lifted the connection element structure, a comparison device 7 compares the connection element structure with the target 10 to determine the position or distance of the weldable surface 102 at the mounting position; the lifting-laying tool 3 moves the connection element structure to a predetermined height a above the weldable surface 102 of the target 10 according to a comparison message of the comparison device 7; and the lifting-laying tool 6 releases or loosens the connection element structure, such that the connection element structure falls onto the weldable surface 102 of the target 10.
[0096] Preferably, the lifting-laying tool 6 is a forceps-like tool, clasp-like tool, vacuum extraction device, magnetic suction device or resilient movable component, such that the present disclosure meets the needs related to a mounting process.
[0097] Preferably, the stop element 2 is mounted on the body 1 to provide a hermetic seal thereto when the tool 6 is a vacuum extraction tool, such that the tool 6 extracts the connection element structure without failure, air leakage or difficulty.
[0098] Preferably, the comparison device 7 is a visual comparison device, distance comparison device, image comparison device, AI comparison device or photographic comparison device, such that the present disclosure meets the needs related to a mounting process.
[0099] Referring to
[0100] The lifting-laying tool 6 has a sensor 62 (for example, a sensor capable of resilience). When the lifting-laying tool 6 moves the connection element structure to the mounting position of the target 10, the sensor 62 of the lifting-laying tool 6 senses a feedback message indicative of contact between the connection element structure and the target 10, the lifting-laying tool 6 releases or loosens the connection element structure, such that the connection element structure is laid at the mounting position of the target 10. Therefore, the present disclosure meets the needs related to a mounting process.
[0101] In an embodiment of the present disclosure, after the connection element structure has been in contact with the target 10 to thereby enter an electrical conduction state, the sensor 62 senses a resultant feedback message. The feedback message drives the lifting-laying tool 6 to release or loosen the connection element structure.
[0102] The method of mounting a connection element structure on a target according to the present disclosure has advantageous technical features described below. The lifting-laying tool 6 lifts the connection element structure and moves the connection element structure to a mounting position of the target 10. The lifting-laying tool 6 presses the connection element structure downward against the target 10 and then releases or loosens the connection element structure, such that the connection element structure is laid at the mounting position of the target 10. Therefore, the present disclosure meets the needs related to a mounting process.
[0103] Furthermore, the method of mounting a connection element structure on a target according to the present disclosure has advantageous technical features described below. The lifting-laying tool 60 lifts the connection element structure moves the connection element structure to the mounting position of the target 10. The lifting-laying tool 6 presses resiliently the connection element structure against the target 10 and then releases or loosens the connection element structure to allow the connection element structure to be laid at the mounting position of the target 10. Therefore, the present disclosure meets the needs related to a mounting process.
[0104] Referring to
[0105] In an embodiment of the present disclosure, a welding layer (i.e., the weldable surface 102) is disposed between the target 10 and a lateral part of the fixation portion 12 of the body 1 or between the target 10 and the fixation portion 12 of the body 1. Thus, the body 1 is firmly mounted on the target 10.
[0106] In an embodiment of the present disclosure, the body 1 and the target 10 each have a weldable surface 102, and the weldable surface 102 is made of tin or copper or nickel.
[0107] Referring to
[0108] Referring to
[0109] In conclusion, the present disclosure is aimed at providing a method of mounting a connection element structure on a target, so as to enhance the efficiency of subsequent processes.
[0110] While the present disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the present disclosure set forth in the claims.