STAMP FOR MICRO-TRANSFER PRINTING

Abstract

A stamp suitable for use in a micro-transfer printing process. The stamp comprises: a carrier layer; a plurality of stamp base sections, wherein: each stamp base section is attached on a first surface to the carrier layer, and separated from each adjacent stamp base section by a gap; and each stamp base section includes one or more stamping posts, for adhering to a source coupon, each stamping post extending from a second surface of its respective stamp base section.

Claims

1. A stamp, suitable for use in a micro-transfer printing process, the stamp comprising: a carrier layer; a plurality of stamp base sections, wherein: each stamp base section is attached on a first surface to the carrier layer, and separated from each adjacent stamp base section by a gap; and each stamp base section includes one or more stamping posts, for adhering to a source coupon, each stamping post extending from a second surface of its respective stamp base section.

2. The stamp of claim 1, wherein each of the gaps between each of the adjacent stamp base sections is a same size.

3. The stamp of claim 1, wherein each of the gaps between each of the adjacent stamp base sections are respectively different sizes.

4. The stamp of claim 1, wherein the stamp base sections are arranged in a stamp base array.

5. The stamp of claim 4, wherein the gaps between each of the adjacent stamp base sections align to define a plurality of streets through the stamp base array.

6. The stamp of claim 1, wherein the respective stamping posts are arranged in a post array, and the or each stamping post is separated from the stamping posts of the adjacent stamp base sections by a stamping post gap.

7. The stamp of claim 6, wherein each of the stamping post gaps between the stamping posts of the adjacent stamp base sections is a same size.

8. The stamp of claim 6, wherein each of the stamping post gaps between the stamping posts of the adjacent stamp base sections are respectively different sizes.

9. The stamp of claim 1, wherein only one stamping post is attached to each second surface of each of the stamp base sections.

10. The stamp of claim 9, wherein each stamping post is attached to the second surface of a respective stamp base section in a central position on the second surface.

11. The stamp of any of claim 1 wherein a plurality of stamping posts are attached to each second surface of each of the stamp base sections.

12. The stamp of claim 11, wherein the number of stamping posts attached to each of the second surfaces of each of the stamp base sections is either the same or not the same.

13. The stamp of claim 11, wherein the number of stamping posts attached to each of the second surfaces of each of the stamp base sections is respectively different.

14. The stamp of claim 1, wherein each of the stamp base sections has either a same cross-sectional area or respectively different cross-sectional areas, each cross-sectional area being an area of the second surface of each of the stamp base sections, wherein the cross-sectional area may be measured in a direction perpendicular to a direction in which the or each stamping post extends.

15. The stamp of claim 1, wherein each of the stamp base sections have either a same volume or respectively different volumes.

16.-20. (canceled)

21. The stamp of claim 1, wherein the carrier layer is formed from a glass.

22. The stamp of claim 1, wherein a coefficient of thermal expansion of the carrier layer is not more than 1×10.sup.−5 K.sup.−1.

23. The stamp of claim 1, wherein each of the stamp base sections is formed from polydimethylsiloxane, PDMS.

24. The stamp of claim 1, wherein the or each stamping post is formed from PDMS.

25. A method of preparing the stamp of claim 1, the method comprising the steps of: depositing a liquid precursor into a mould, the mould comprising a carrier layer and a fixed layer defining a shape of the plurality of stamping posts and a stamp base precursor; wherein on one sidewall of the mould, the carrier layer contacts the liquid precursor to form the stamp base precursor and on the opposite sidewall of the mould, the fixed layer, containing pre-etched cavities, contacts the liquid precursor to form the posts; solidifying the liquid precursor to form a solid stamp precursor attached to the carrier layer; and removing material from the solid stamp precursor to define the plurality of stamp base sections with gaps therebetween.

26.-35. (canceled)

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Embodiments of the invention will now be described by way of example with reference to the accompanying drawings in which:

[0044] FIGS. 1A and 1B show plots of the expansion of a PDMS stamp in μm as a function of stamp base length given an assumed temperature change;

[0045] FIG. 2A shows a bottom-up view of a stamp according to an embodiment of the present invention;

[0046] FIG. 2B shows a cross-sectional view of the stamp of FIG. 2A along the line A-A′;

[0047] FIG. 3A shows a bottom-up view of a variant stamp according to an embodiment of the present invention; and

[0048] FIG. 3B shows a cross-sectional view of the variant stamp of FIG. 3A along the line A-A′.

DETAILED DESCRIPTION AND FURTHER OPTIONAL FEATURES

[0049] Aspects and embodiments of the present invention will now be discussed with reference to the accompanying figures. Further aspects and embodiments will be apparent to those skilled in the art.

[0050] FIG. 2A shows a bottom-up view of a stamp 200 according to an embodiment of the present invention. The stamp comprises a carrier layer 102, in this example formed from glass with a CTE of less than 1×10.sup.−5K.sup.−1. The carrier layer is attached to a plurality of stamp base sections 104a-104i, in this example each being made of PDMS. The stamp base sections are attached at a first surface to the carrier layer, and are separated from each other by distance l.sub.2 and l.sub.3. On a second surface of each stamp base section are one or more posts 106. In this example, each stamp base section has nine posts in a 3×3 array. As there are 9 stamp base sections in the example shown in FIG. 2A, the stamp provides a total of 81 stamp posts and so can be used to transfer 81 device coupons from a device wafer to a platform wafer (for example an SOI wafer). The distances l.sub.2 and l.sub.3 may be at least 50 μm and no more than 100 μm.

[0051] FIG. 2B shows a cross-sectional view of the stamp of FIG. 2A along the line A-A′. Like features are indicated by like reference numerals. As shown in this figure, each stamp base section 104a-104c and its corresponding stamp post(s) extends a height h.sub.1 from the carrier layer 102. h.sub.1 can take a value of at least 3 mm and no more than 4 mm. The stamp posts themselves extend a height h.sub.2 from its respective stamp base section, and h.sub.2 can take a value of at least 50 μm and no more than 100 μm. The stamp base sections themselves have a width, Ii, which may be at least 1 mm and no more than 5 mm.

[0052] FIG. 3A shows a bottom-up view of a variant stamp 200 according to an embodiment of the present invention. Again, in this example, the stamp comprises a carrier layer 102 formed from glass with a CTE of less than 1×10.sup.−5K.sup.−1. The carrier layer is attached to a plurality of stamp base sections 204a-204n, arranged in a 6×7 array. In this example, each stamp base section contains only a single stamp post 206 for a total of 42 total stamp posts. In this example, the alignment is improved that in FIG. 2A as the expansion of each stamp post is less noticeable. However this comes at the expense of the overall density of stamping posts. In both examples, the stamp posts can be formed from PDMS. The stamp base sections are separated by distances l.sub.2 and l.sub.3, which may be the same or may be respectively different. In this example, they are different with l.sub.2 being larger than l.sub.3. Both l.sub.2 and l.sub.3 may be at least 50 μm and no more than 100 μm.

[0053] FIG. 3B shows a cross-sectional view of the variant stamp of FIG. 3A along the line A-A′.

[0054] Like features are indicated by like reference numerals. As shown in this figure, each stamp base section 204a-204g and its corresponding stamp post extends a height h.sub.1 from the carrier layer 102. H.sub.1 can take a value of at least 3 mm and no more than 4 mm. The stamp post for each stamp base section extends a height h.sub.2 from its respective stamp base section, and h.sub.2 can take a value of at least 50 μm and no more than 100 μm.

[0055] In use, the stamp of either FIG. 2A or 3A is placed on top of a device wafer such that the stamp posts are in contact with respective device coupons on the device wafer. The stamp posts adhere to the respective device coupons, and the entire stamp is then lifted away severing the connection between the device coupons and the device wafer, in a manner known per se in the art. The stamp is then placed on top of a host wafer, such as a SOI wafer, and the device coupons (now residing on the stamp posts) are deposited onto the SOI wafer.

[0056] A method of preparing the stamp of either FIG. 2A or 3A involves the use of a mould. The mould includes the carrier layer, and a fixed layer defining a shape of the plurality of stamping posts and a stamp base precursor. The mould is then filled with liquid precursor which fills pre-etched cavities (the cavities providing the stamp posts). The liquid precursor is then solidified to form a solid stamp precursor attached to the carrier layer, and material is removed from the solid stamp precursor to define the plurality of stamp base sections with gaps therebetween.

[0057] The features disclosed in the description, or in the following claims, or in the accompanying drawings, expressed in their specific forms or in terms of a means for performing the disclosed function, or a method or process for obtaining the disclosed results, as appropriate, may, separately, or in any combination of such features, be utilised for realising the invention in diverse forms thereof.

[0058] While the invention has been described in conjunction with the exemplary embodiments described above, many equivalent modifications and variations will be apparent to those skilled in the art when given this disclosure. Accordingly, the exemplary embodiments of the invention set forth above are considered to be illustrative and not limiting. Various changes to the described embodiments may be made without departing from the spirit and scope of the invention.

[0059] For the avoidance of any doubt, any theoretical explanations provided herein are provided for the purposes of improving the understanding of a reader. The inventors do not wish to be bound by any of these theoretical explanations.

[0060] Any section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described.

[0061] Throughout this specification, including the claims which follow, unless the context requires otherwise, the word “comprise” and “include”, and variations such as “comprises”, “comprising”, and “including” will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps.

[0062] It must be noted that, as used in the specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Ranges may be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by the use of the antecedent “about,” it will be understood that the particular value forms another embodiment. The term “about” in relation to a numerical value is optional and means for example +/−10%.