Method of manufacturing inverter and inverter

Abstract

A method of manufacturing an inverter and an inverter are provided. The method of manufacturing the inverter includes following steps: forming a substrate and forming a first insulating layer on the substrate; forming a semiconductor-type carbon nanotube film on the first insulating layer; patterning the semiconductor-type carbon nanotube film to form a first active layer and a second active layer arranged at an interval; forming a first barrier layer on the first active layer and forming a second barrier layer on the second active layer, wherein the first barrier layer is an electrophilic film layer, and the second barrier layer is an electron donor film layer; and forming a first source and a first drain which are in contact with and spaced apart from two ends of the first active layer and forming a second source and a second drain which are in contact with and spaced with two ends of the second active layer, wherein the first drain is connected to the second source. By using the semiconductor-type carbon nanotube as the active layer to cooperate with the electrophilic film layer and the electron donor film layer as a barrier layer, manufacturing process of the inverter can be simplified, and manufacturing cost of the inverter can be reduced.

Claims

1. An inverter, comprising: a substrate, a first insulating layer disposed on the substrate, a first active layer and a second active layer spaced apart from each other on the first insulating layer, a first barrier layer disposed on the first active layer, a second barrier layer disposed on the second active layer, a first source and a first drain which are in contact with and spaced from two ends of the first active layer, and a second source and a second drain which are in contact with and spaced from two ends of the second active layer, wherein the first drain is connected to the second source; wherein materials of the first active layer and the second active layer comprises semiconductor-type carbon nanotubes, the first barrier layer is an electrophilic film layer, and the second barrier layer is an electron donor film layer.

2. The inverter according to claim 1, wherein the substrate is a heavily doped silicon wafer.

3. The inverter according to claim 1, wherein the substrate comprises a flexible substrate, a buffer layer disposed on the flexible substrate, and a first gate and a second gate arranged at an interval on the buffer layer; wherein the first active layer and the second active layer are respectively disposed corresponding to the first gate and the second gate.

4. The inverter according to claim 1, wherein the substrate comprises a glass substrate and a first gate and a second gate arranged at an interval on the glass substrate; wherein the first active layer and the second active layer are respectively disposed corresponding to the first gate and the second gate.

5. The inverter according to claim 1, wherein material of the first barrier layer comprises silicon nitride, and material of the second barrier layer comprises silicon oxide.

6. An inverter, comprising: a substrate, a first insulating layer disposed on the substrate, a first active layer and a second active layer spaced apart from each other on the first insulating layer, a first barrier layer disposed on the first active layer, a second barrier layer disposed on the second active layer, a first source and a first drain which are in contact with and spaced from two ends of the first active layer, and a second source and a second drain which are in contact with and spaced from two ends of the second active layer, wherein the first drain is connected to the second source; wherein materials of the first active layer and the second active layer comprises semiconductor-type carbon nanotubes, the first barrier layer is an electrophilic film layer, and the second barrier layer is an electron donor film layer; wherein material of the first barrier layer comprises silicon nitride, and material of the second barrier layer comprises silicon oxide; and wherein the first barrier layer and the first active layer form an N-type device, and the second barrier layer and the second active layer form a P-type device.

Description

DESCRIPTION OF DRAWINGS

(1) In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the drawings are only provided for reference and description, and are not intended to limit the present invention.

(2) In the drawings:

(3) FIG. 1 is a schematic diagram of a step S1 of a first embodiment of a method of manufacturing an inverter according to the present invention.

(4) FIG. 2 is a schematic diagram of steps S2 and S3 of the first embodiment of the method of manufacturing the inverter according to the present invention.

(5) FIG. 3 and FIG. 4 are schematic diagrams of a step S4 of the first embodiment of the method of manufacturing the inverter according to the present invention.

(6) FIG. 5 is a schematic diagram of a step S5 of the first embodiment of the method of manufacturing the inverter according to the present invention and a structural diagram of the first embodiment according to the inverter of the present invention.

(7) FIG. 6 is a schematic diagram of a step S1 of a second embodiment of a method of manufacturing an inverter according to the present invention.

(8) FIG. 7 is a schematic diagram of steps S2 and S3 of the second embodiment of the method of manufacturing the inverter according to the present invention.

(9) FIG. 8 and FIG. 9 are schematic diagrams of a step S4 of the second embodiment of the method of manufacturing the inverter according to the present invention.

(10) FIG. 10 is a schematic diagram of a step S5 of the second embodiment of the method of manufacturing the inverter according to the present invention and a structural diagram of the second embodiment of the inverter according to the present invention.

(11) FIG. 11 is a schematic diagram of a step S1 of a third embodiment of a method of manufacturing an inverter according to the present invention.

(12) FIG. 12 is a schematic diagram of steps S2 and S3 of the third embodiment of the method of manufacturing the inverter according to the present invention.

(13) FIG. 13 and FIG. 14 are schematic diagrams of a step S4 of the third embodiment of the method of manufacturing the inverter according to the present invention.

(14) FIG. 15 is a schematic diagram of a step S5 of the third embodiment of the method of manufacturing the inverter according to the present invention and a structural diagram of the third embodiment of the inverter according to the present invention.

(15) FIG. 16 is a flowchart of a method of manufacturing an inverter according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(16) In order to further explain the technical means adopted by the present invention and its effects, the following describes in detail with reference to the preferred embodiments of the present invention and the accompanying drawings.

(17) Referring to FIG. 16, an embodiment of the present invention provides a method of manufacturing an inverter, including the following steps.

(18) Step S1, forming a substrate 1 and forming a first insulating layer 2 on the substrate 1.

(19) Specifically, as shown in FIG. 1, in a first embodiment of the present invention, the substrate 1 is a heavily doped silicon wafer.

(20) Specifically, as shown in FIG. 6, in a second embodiment of the present invention, a step of forming the substrate 1 in the step S1 includes: providing a flexible substrate 10, covering the flexible substrate 10 with a buffer layer 20, forming a first gate 31 and a second gate 32 arranged at an interval on the buffer layer to obtain the substrate 1.

(21) Specifically, as shown in FIG. 10, in a third embodiment of the present invention, a step of forming the substrate 1 in the step S1 includes: providing a glass substrate 10′ and forming a first gate 31′ and a second gate 32′ arranged at an interval on the glass substrate 10′ to obtain the substrate 1.

(22) Therefore, the manufacturing method of the inverter of the embodiment of the present invention is applicable to both silicon wafer substrate, flexible substrate, and glass substrate devices.

(23) Specifically, in the second and third embodiments of the present invention, the process of forming the first gate and the second gate includes: cleaning the substrate 1 and depositing a conductive film on an entire surface of the substrate by physical vapor deposition or evaporation, then applying a photoresist, then exposing a photoresist through a photomask, and then developing, acid wet etching, and eluting to complete photolithography of a conductive film to obtain the first gate and the second gate.

(24) Specifically, in an embodiment of the present invention, the first insulating layer 2 is manufactured by atomic layer deposition or chemical vapor deposition.

(25) Specifically, material of the first insulating layer 2 is a combination of one or more of hafnium dioxide, silicon oxide, silicon nitride, and aluminum oxide.

(26) Preferably, in the first embodiment of the present invention, the material of the first insulating layer 2 is silicon oxide. In the second and third embodiments of the present invention, the material of the first insulating layer 2 is nitrogen silicon.

(27) Step S2, forming a semiconductor-type carbon nanotube film on the first insulating layer 2.

(28) Specifically, in the step S2, the semiconductor-type carbon nanotube film is manufactured by a solution printing and film-forming process, and the semiconductor-type carbon nanotube film is a semiconductor-type single-walled carbon nanotube (sc-SWCNT).

(29) It should be noted that production of the semiconductor-type carbon nanotube film by the solution printing and film-forming process has advantages of being simple and easy, requiring no vacuum, high temperature, and high pressure environment and conditions, being easy to prepare in a large area, having a rich source of carbon elements, having stable chemical properties, being non-toxic, and being conducive to building green and cheap devices. By using a bipolar semiconductor-type carbon nanotube as an active layer, the inverter has advantages of simple structure, low power consumption, and high stability.

(30) Step S3, patterning the semiconductor-type carbon nanotube film to form a first active layer 51 and a second active layer 52 arranged at an interval.

(31) Specifically, referring to FIG. 2, FIG. 7, and FIG. 12, the step S3 includes: patterning the semiconductor-type carbon nanotube film by applying photoresist, photomask exposure, development, and plasma dry etching processes to obtain the first active layer 51 and the second active layer 52.

(32) Specifically, as shown in FIG. 7, in a second embodiment of the present invention, the first active layer 51 and the second active layer 52 are respectively disposed corresponding to the first gate 31 and the second gate 32.

(33) Specifically, as shown in FIG. 12, in a third embodiment of the present invention, the first active layer 51 and the second active layer 52 are respectively disposed corresponding to the first gate 31′ and the second gate 32′.

(34) Step S4, forming a first barrier layer 61 on the first active layer 51 and forming a second barrier layer 62 on the second active layer 52, wherein the first barrier layer 61 is an electrophilic film layer, and the second barrier layer 62 is an electron donor film layer.

(35) Specifically, as shown in FIG. 3 and FIG. 4, FIG. 8 and FIG. 9, and FIG. 13 and FIG. 14, the step S4 includes: step of forming a first photoresist layer on the first insulating layer 2, the first active layer 51, and the second active layer 52.

(36) Step of removing the first photoresist layer on the first active layer 51, forming a first barrier film on the remaining first photoresist layer and the first active layer 51, removing the remaining first photoresist layer and the first barrier film on the remaining first photoresist layer to obtain a first barrier layer 61 on the first active layer 51.

(37) Step of forming a second photoresist layer on the first insulating layer 4, the first barrier layer 61, and the second active layer 52.

(38) Step of removing the second photoresist layer on the second active layer 52, forming a second barrier film on the remaining second photoresist layer and the second active layer 52, removing the remaining second photoresist layer and the second barrier film on the remaining second photoresist layer to obtain a second barrier layer 62 on the second active layer 52.

(39) Preferably, material of the first barrier layer 61 comprises silicon nitride, and material of the second barrier layer 62 comprises silicon oxide.

(40) Further, the first barrier layer 61 and the first active layer 51 form an N-type device, and the second barrier layer 62 and the second active layer 52 form a P-type device, thereby achieving bipolar characteristics of the inverter.

(41) Step S5, forming a first source 71 and a first drain 72 which are in contact with and spaced apart from two ends of the first active layer 51 and forming a second source 73 and a second drain 74 which are in contact with and spaced with two ends of the second active layer 52, wherein the first drain 72 is connected to the second source 73.

(42) Specifically, as shown in FIG. 5, FIG. 10, and FIG. 15, in the step S5, a whole surface of a conductive film is deposited on the substrate by physical vapor deposition or evaporation, followed by coating photoresist, exposing, developing, wet etching with acid, and eluting photoresist to complete patterning of a conductive film to obtain a first source 71, a first drain 72, a second source 73, and a second drain 74.

(43) Referring to FIG. 5, FIG. 10, or FIG. 15, an embodiment of the present invention also provides an inverter, comprising a substrate 1, a first insulating layer 2 disposed on the substrate 1, a first active layer 51 and a second active layer 52 spaced apart from each other on the first insulating layer 2, a first barrier layer 61 disposed on the first active layer 51, a second barrier layer 62 disposed on the second active layer 52, a first source 71 and a first drain 72 which are in contact with and spaced from two ends of the first active layer 51, and a second source 73 and a second drain 74 which are in contact with and spaced from two ends of the second active layer 52, wherein the first drain 72 is connected to the second source 73.

(44) Materials of the first active layer 51 and the second active layer 52 comprises semiconductor-type carbon nanotubes, the first barrier layer 61 is an electrophilic film layer, and the second barrier layer 62 is an electron donor film layer.

(45) Specifically, as shown in FIG. 5, in a first embodiment of the present invention, the substrate 1 is a heavily doped silicon wafer.

(46) Specifically, as shown in FIG. 10, in a second embodiment of the present invention, the substrate 1 comprises a flexible substrate 10, a buffer layer 20 disposed on the flexible substrate 10, and a first gate 31 and a second gate 32 arranged at an interval on the buffer layer 20.

(47) The first active layer 51 and the second active layer 52 are respectively disposed corresponding to the first gate 31 and the second gate 32.

(48) Specifically, as shown in FIG. 10, in a third embodiment of the present invention, the substrate 1 comprises a glass substrate 10′ and a first gate 31′ and a second gate 32′ arranged at an interval on the glass substrate 10′.

(49) The first active layer 51 and the second active layer 52 are respectively disposed corresponding to the first gate 31′ and the second gate 32′.

(50) Therefore, the manufacturing method of the inverter of the embodiment of the present invention is applicable to both silicon wafer substrate, flexible substrate, and glass substrate devices.

(51) Preferably, material of the first barrier layer 61 comprises silicon nitride, and material of the second barrier layer 62 comprises silicon oxide.

(52) Further, the first barrier layer 61 and the first active layer 51 form an N-type device, and the second barrier layer 62 and the second active layer 52 form a P-type device, thereby achieving bipolar characteristics of the inverter.

(53) Specifically, in the step S2, the first active layer 51 and the second active layer 52 are manufactured by a solution printing and film-forming process, and the semiconductor-type carbon nanotube film is a semiconductor-type single-walled carbon nanotube (sc-SWONT).

(54) It should be noted that production of the semiconductor-type carbon nanotube film by the solution printing and film-forming process has advantages of being simple and easy, requiring no vacuum, high temperature, and high pressure environment and conditions, being easy to prepare in a large area, having a rich source of carbon elements, having stable chemical properties, being non-toxic, and being conducive to building green and cheap devices. By using a bipolar semiconductor-type carbon nanotube as an active layer, the inverter has advantages of simple structure, low power consumption, and high stability.

(55) In summary, an embodiment of the present invention provides a method of manufacturing an inverter comprising following steps: a step S1, forming a substrate and forming a first insulating layer on the substrate; a step S2, forming a semiconductor-type carbon nanotube film on the first insulating layer; a step S3, patterning the semiconductor-type carbon nanotube film to form a first active layer and a second active layer arranged at an interval; a step S4, forming a first barrier layer on the first active layer and forming a second barrier layer on the second active layer, wherein the first barrier layer is an electrophilic film layer, and the second barrier layer is an electron donor film layer; and a step S5, forming a first source and a first drain which are in contact with and spaced apart from two ends of the first active layer and forming a second source and a second drain which are in contact with and spaced with two ends of the second active layer, wherein the first drain is connected to the second source. By using the semiconductor-type carbon nanotube as the active layer to cooperate with the electrophilic film layer and the electron donor film layer as a barrier layer, manufacturing process of the inverter can be simplified, and manufacturing cost of the inverter can be reduced. An embodiment of the present invention is also to provide an inverter, which can simplify manufacturing process of the inverter and reduce manufacturing cost of the inverter.