GRAPHENE ELECTRONIC HEATING DEVICE AND PREPARATION METHOD THEREOF

Abstract

Provided are a graphene electronic heating device and a preparation method thereof. The graphene electronic heating device comprises a graphene layer, which is used as a heat source for fully heating a to-be-combusted substance in an accommodating cavity, a Teflon layer and a ceramic layer, which are arranged for realizing that the to-be-combusted substance can be continuously and stably combusted in the accommodating cavity without peculiar smell diffusion, and meanwhile increasing the endurance time of the graphene electronic heating device under the equal energy storage; the preparation method has simple process, convenient process control and stable product quality, and facilitates to large-scale production.

Claims

1. A graphene electronic heating device, comprising an accommodating cavity, a first insulating layer, a graphene layer, a second insulating layer and a ceramic layer sequentially from the inside to the outside, wherein a conductive line is arranged on the graphene layer, and the conductive line is electrically connected with one or more electrodes.

2. The graphene electronic heating device according to claim 1, wherein the accommodating cavity comprises a metal cavity.

3. The graphene electronic heating device according to claim 1, wherein the conductive line is encapsulated in the graphene layer.

4. A preparation method of the graphene electronic heating device according to claim 1, comprising the following steps: (1) depositing a first insulating material on the outer side of the accommodating cavity to obtain a first component; arranging the conductive line on the graphene layer to obtain a second component; (2) installing the second component outside the first component to obtain a third component; (3) depositing a second insulating material on the outer side of the third component to obtain a fourth component; and (4) installing a ceramic tube outside the fourth component, and electrically connecting the electrode to the conductive line to obtain the graphene electronic heating device.

5. The preparation method of the graphene electronic heating device according to claim 4, wherein the “arranging the conductive line on the graphene layer” in step (1) comprises immersing the conductive line in a graphene slurry and then subjecting the same to curing molding to obtain the conductive line encapsulated in the graphene slurry.

6. A graphene electronic heating device, comprising a graphene layer and a ceramic layer sequentially from the inside to the outside, wherein a heat-insulating layer and a third insulating layer are sequentially arranged on the outer side of the ceramic layer, and a conductive line is arranged between the graphene layer and the ceramic layer, wherein the conductive line is electrically connected with one or more electrodes.

7. The graphene electronic heating device according to claim 6, wherein a material of the ceramic layer comprises zirconia.

8. A preparation method of the graphene electronic heating device according to claim 6, comprising the following steps: (I) printing the conductive line on the inner wall of a ceramic tube to obtain a pre-treated ceramic tube; (II) depositing graphene on the inner wall of the pre-treated ceramic tube to obtain a semifinished component; and (III) spraying a heat-insulating material and a third insulating material sequentially on the outer side of the semifinished component, and installing an electrode to obtain the graphene electronic heating device.

9. The preparation method of the graphene electronic heating device according to claim 8, wherein in step (II), the graphene deposited on the inner wall of the pre-treated ceramic tube has a thickness of 0.08 mm to 0.12 mm.

10. A method of heating a cigarette body, comprising using the graphene electronic heating device according to claim 1.

11. The graphene electronic heating device according to claim 1, wherein a material of the ceramic layer comprises zirconia.

12. The graphene electronic heating device according to claim 6, wherein a material of the heat-insulating layer comprises aerogel.

13. The graphene electronic heating device according to claim 6, wherein a material of the third insulating layer comprises Teflon.

14. The graphene electronic heating device according to claim 6, wherein a width of the conductive line is 1.0 mm to 1.5 mm, a thickness of the conductive line is 0.08 mm to 0.12 mm.

15. The preparation method of the graphene electronic heating device according to claim 8, wherein the pre-treated ceramic tube in step (I) and the semifinished component in step (II) are both subjected to a baking treatment; a temperature of the baking treatment is 50° C. to 80° C.; a time of the baking treatment is 20 min to 40 min.

16. The preparation method of the graphene electronic heating device according to claim 8, wherein the “spraying a heat-insulating material” in step (III) adopts a chemical deposition method.

17. The preparation method of the graphene electronic heating device according to claim 8, wherein a proportion of the heat-insulating material is 0.56 kg/L to 0.60 kg/L.

18. The preparation method of the graphene electronic heating device according to claim 8, wherein the heat-insulating material is subjected to a drying treatment after being sprayed, a temperature of the drying treatment is 10° C. to 140° C.

19. The preparation method of the graphene electronic heating device according to claim 8, wherein a theoretical coverage rate of the heat-insulating material is 0.65 mm.sup.2/(L.Math.mm) to 0.71 mm.sup.2/(L.Math.mm); a thermal conductivity of the heat-insulating material is 0.033 W/(m.Math.K) to 0.038 W/(m.Math.K); an aging resistance time of the heat-insulating material is 550 h to 650 h.

20. The preparation method of the graphene electronic heating device according to claim 8, wherein the third insulating material sprayed on the outer side of the heat-insulating material has a thickness of 0.08 mm to 0.15 mm.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0066] FIG. 1 is a schematic structural diagram of the graphene electronic heating device provided in Example 1 of the present disclosure.

[0067] FIG. 2 is a schematic structural diagram of the electrodes in the graphene electronic heating device provided in Example 1 of the present disclosure.

[0068] FIG. 3 is a cross-sectional view of the graphene electronic heating device provided in Example 1 of the present disclosure.

[0069] FIG. 4 is a schematic structural diagram of the graphene electronic heating device provided in Example 3 of the present disclosure.

[0070] FIG. 5 is a schematic structural diagram of the silver conductive paste line in the graphene electronic heating device provided in Example 3 of the present disclosure.

[0071] FIG. 6 is a cross-sectional view of the graphene electronic heating device provided in Example 3 of the present disclosure.

REFERENCE LIST

[0072] 1—accommodating cavity; 2—first insulating layer; 3—graphene layer; 4—second insulating layer; 5—ceramic layer; 6—component; 7—to-be-combusted substance; 8—enclosure case; 9—heat-insulating layer; and 10—third insulating layer.

DETAILED DESCRIPTION

[0073] Technical solutions of the present disclosure are further described below with reference to the accompanying drawings and through specific embodiments.

[0074] The present disclosure is further described in details below. However, the embodiments described below are merely simple examples of the present disclosure, and do not represent or limit the protection scope of the present disclosure. The protection scope of the present disclosure is intended to be limited solely by the appended claims.

[0075] It should be understood that in the description of the present disclosure, the terms “center”, “lengthways”, “crosswise”, “over”, “under”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer” and the like indicate an orientation or a positional relationship based on an orientation or a positional relationship shown in accompanying drawings, which is only used for describing the present application conveniently and simplifying the description, rather than indicating or implying that the device or unit referred to necessarily has a particular orientation or needs to be arranged and operated in a particular orientation, and thereby should not be construed as a limitation to the present application. In addition, the terms “primary”, “secondary” and the like are only used for descriptive purposes, and should not be construed as indicating or implying relative importance, or indicating or implying a number of the technical feature referred to. Hence, a feature defined as “first”, “second” or the like may expressly or implicitly include one or more of the features. In the description of the present disclosure, unless otherwise specified, “a plurality of” refers to two or more than two.

[0076] It should be noted that, in the description of the present application, unless otherwise specified or defined particularly, the terms “arrange”, “link” and “connect” should be understood in a broad sense; for example, there may be a fixed connection, a detachable connection, or an integral connection; there may be a mechanical connection or an electrical connection; and there may be a direct connection, an indirect connection through an intermediate medium, or an internal communication between two units. For those skilled in the art, specific meanings of the above terms in the present application can be understood through specific situations.

Example 1

[0077] This example provides a graphene electronic heating device, of which the schematic structural diagram is shown in FIG. 1 and the cross-sectional view is shown in FIG. 3.

[0078] The graphene electronic heating device included an accommodating cavity 1, a first insulating layer 2, a graphene layer 3, a second insulating layer 4 and a ceramic layer 5 sequentially from the inside to the outside. The graphene electronic heating device also included a component 6 and an enclosure case 8 for assembling the various layers together. FIG. 1 also included a to-be-combusted substance 7.

[0079] A conductive line was arranged on the graphene layer 3, specifically, the conductive line encapsulated in a graphene slurry. The conductive line was electrically connected with electrodes, and the schematic structural diagram of the electrodes was shown in FIG. 2.

[0080] The accommodating cavity 1 included a metal cavity; a material of the ceramic layer 5 included zirconia, and a material of the first insulating layer 2 and the second insulating layer 4 included Teflon.

Example 2

[0081] This example provides a preparation method of the graphene electronic heating device provided in Example 1, and the preparation method included the steps described below.

[0082] (1) A first insulating material of Teflon was deposited on the outer side of the accommodating cavity to obtain a first component; the conductive line was immersed in a graphene slurry and then subjected to curing molding to obtain the conductive line encapsulated in the graphene slurry as a second component;

[0083] (2) The second component was installed outside the first component to obtain a third component;

[0084] (3) A second insulating material of Teflon was deposited on the outer side of the third component to obtain a fourth component; and

[0085] (4) A ceramic tube was installed outside the fourth component, and the electrodes were electrically connected with the conductive line to obtain the graphene electronic heating device.

Example 3

[0086] This example provides a graphene electronic heating device, of which the schematic structural diagram is shown in FIG. 4 and the cross-sectional view is shown in FIG. 6.

[0087] The graphene electronic heating device included a graphene layer 3 and a ceramic layer 5 sequentially from the inside to the outside; a heat-insulating layer 9 and a third insulating layer 10 were sequentially arranged on the outer side of the ceramic layer 5. The graphene electronic heating device also included a component 6 and an enclosure case 8 for assembling the various layers together. FIG. 3 also included a to-be-combusted substance 7.

[0088] A silver conductive paste line was arranged between the graphene layer 3 and the ceramic layer 5. The schematic structural diagram of the silver conductive paste line is shown in FIG. 5. The silver conductive paste line was electrically connected with an electrode.

[0089] A material of the ceramic layer 5 included zirconia; a material of the heat-insulating layer 9 included aerogel; a material of the third insulating layer 10 included Teflon; a width of the silver conductive paste line was 1.5 mm; and a thickness of the silver conductive paste line was 0.1 mm.

Example 4

[0090] This example provides a preparation method of the graphene electronic heating device provided in Example 3, and the preparation method included the steps described below.

[0091] (I) The silver conductive paste line was printed on the inner wall of a ceramic tube to obtain a pre-treated ceramic tube;

[0092] (II) The pre-treated ceramic tube was subjected to a baking treatment at 70° C. for 30 min, and graphene was deposited with a thickness of 0.1 mm on the inner wall of the pre-treated ceramic tube to obtain a semifinished component; and

[0093] (III) The semifinished component was subjected to a baking treatment at 60° C. for 30 min, then a heat-insulating material was sprayed on the outer side of the semifinished component by a chemical deposition method, a third insulating material was successively sprayed with a thickness of 0.1 mm on the outer side, and an electrode was installed to obtain the graphene electronic heating device.

[0094] A proportion of the heat-insulating material was 0.58 kg/L; a volume solid content of the heat-insulating material was 86%; the heat-insulating material sprayed on the outer side of the semifinished component had a thickness of 0.5 mm; the heat-insulating material was subjected to a drying treatment after being sprayed; a temperature of the drying treatment was 120° C.; a theoretical coverage rate of the heat-insulating material was 0.71 mm.sup.2/(L.Math.mm); a thermal conductivity of the heat-insulating material was 0.033 W/(m.Math.K); and an aging resistance time of the heat-insulating material was 600 h.

Example 5

[0095] This example provides a preparation method of the graphene electronic heating device provided in Example 3, and the preparation method included the steps described below.

[0096] (I) The silver conductive paste line was printed on the inner wall of a ceramic tube to obtain a pre-treated ceramic tube;

[0097] (II) The pre-treated ceramic tube was subjected to a baking treatment at 50° C. for 40 min, and graphene was deposited with a thickness of 0.08 mm on the inner wall of the pre-treated ceramic tube to obtain a semifinished component; and

[0098] (III) The semifinished component was subjected to a baking treatment at 80° C. for 20 min, then a heat-insulating material was sprayed on the outer side of the semifinished component by a chemical deposition method, a third insulating material was successively sprayed with a thickness of 0.15 mm on the outer side, and an electrode was installed to obtain the graphene electronic heating device.

[0099] A proportion of the heat-insulating material was 0.60 kg/L; a volume solid content of the heat-insulating material was 90%; the heat-insulating material sprayed on the outer side of the semifinished component had a thickness of 0.8 mm; the heat-insulating material was subjected to a drying treatment after being sprayed; a temperature of the drying treatment was 100° C.; a theoretical coverage rate of the heat-insulating material was 0.65 mm.sup.2/(L.Math.mm); a thermal conductivity of the heat-insulating material was 0.038 W/(m.Math.K); and an aging resistance time of the heat-insulating material was 650 h.

[0100] To sum up, the graphene electronic heating device provided in the present disclosure uses the graphene layer as a heat source, which realizes the full combustion of the to-be-combusted substance in the accommodating cavity without peculiar smell diffusion, improving the user experience; Teflon is used for coating on the outer sides of the accommodating cavity and the graphene layer respectively, which protects the accommodating cavity and the graphene layer from chemically reacting with the external substances, significantly increasing the serve life of the graphene electronic heating device; and the ceramic layer is configured for preventing heat loss, guaranteeing the continuous and stable combustion of the to-be-combusted substance in the accommodating cavity and increasing the endurance time of the graphene electronic heating device under the equal energy storage.

[0101] The applicant has stated that the description hereinabove is only specific embodiments of the present disclosure, and the protection scope of the present disclosure is not limited to the description hereinabove. It should be apparent to those skilled in the art that any variations or replacements in the technical scope disclosed by the present disclosure, which are obvious to those skilled in the art of the technical filed, all fall within the protection extent and disclosure scope of the present disclosure.