Inspection socket

Abstract

The inspection socket includes: a contact terminal 80 including a barrel 82 having a flange section 90, a device-side terminal 84, and a board-side terminal 86; housings 10, 30, and 50 having through holes 10c, 30c, and 50c into which the contact terminal 80 is inserted; and housings 20 and 40 having through holes 20c and 40c into which the contact terminal 80 is inserted, the through holes 20c and 40c being larger than the outer diameter of the contact terminal 80 excluding the flange section 90 and smaller than the outer diameter of the flange section 90. The housings 20 and 40 are sandwiched between the housings 10, 30, and 50, the flange section 90 is contained in the through hole 50c, and the through holes 10c, 30c, and 50c are designed to have, for impedance matching, a gap from the outer periphery of the contact terminal 80.

Claims

1. An inspection socket comprising: a contact terminal that includes: a barrel including a tube body extending in an axial direction and a flange section where a part, extending in the axial direction, of an outer periphery of the tube body radially protrudes, a device-side terminal provided at one end of the barrel, and a board-side terminal provided at another end of the barrel; metal housings each of which has a through hole into which the contact terminal is inserted in the axial direction, the through hole has a larger inner diameter than at least the flange section of the barrel; and a resin alignment board that has a positioning hole into which the contact terminal is inserted in the axial direction, an inner diameter of the positioning hole being larger than an outer diameter of the contact terminal excluding the flange section and smaller than an outer diameter of the flange section, wherein the metal housings are disposed, at least, on the board-side terminal side and the device-side terminal side and between the board-side terminal and the device-side terminal, the alignment board is sandwiched between the metal housings, the flange section is contained in the through hole formed in the metal housing on the board-side terminal side, and the through hole is designed to have, for impedance matching, a gap from the outer periphery of the contact terminal.

2. The inspection socket according to claim 1, wherein the flange section has a tapered portion.

3. The inspection socket according to claim 1, wherein the flange section has a cut surface having an outer diameter approximately equal to that of the barrel.

4. The inspection socket according to claim 1, wherein a portion of the gap used for impedance matching and overlapping the flange section has a larger diameter than another portion of the gap.

5. The inspection socket according to claim 1, wherein the metal housing has a plurality of split housings laminated in the axial direction.

6. The inspection socket according to claim 1, wherein the contact terminal is used for a signal line.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a perspective view of an inspection socket.

(2) FIG. 2 is an exploded perspective view of the inspection socket in FIG. 1.

(3) FIG. 3 is a side view of an inspection socket corresponding to that in FIG. 2.

(4) FIG. 4 is a rear perspective view of a socket base.

(5) FIG. 5 is a side view of a contact terminal for a signal line according to a first embodiment.

(6) FIG. 6 is a vertical cross-sectional view of a contact terminal corresponding to that in FIG. 5.

(7) FIG. 7 is another example of a contact terminal for a signal line according to the first embodiment.

(8) FIG. 8 is a side view of a contact terminal for a grounding line and a power supply line according to the first embodiment.

(9) FIG. 9 is a vertical cross-sectional view of a contact terminal corresponding to that in FIG. 8.

(10) FIG. 10 shows another example of a contact terminal for a grounding line and a power supply line.

(11) FIG. 11 is a partial vertical cross-sectional view (nonpopulated state) of the housing according to the first embodiment.

(12) FIG. 12 is a partial vertical cross-sectional view (populated state) of the housing according to the first embodiment.

(13) FIG. 13 is a partial vertical cross-sectional view (IC package-populated state) of the housing according to the first embodiment.

(14) FIG. 14 is a perspective view showing a process for assembling an inspection socket.

(15) FIG. 15 is a partial vertical cross-sectional view showing a process for assembling an inspection socket.

(16) FIG. 16 is a perspective view showing a process for assembling an inspection socket.

(17) FIG. 17 is a partial vertical cross-sectional view showing a process for assembling an inspection socket.

(18) FIG. 18 is a perspective view showing a process for assembling an inspection socket.

(19) FIG. 19 is a partial vertical cross-sectional view showing a process for assembling an inspection socket.

(20) FIG. 20 is a partial vertical cross-sectional view during assembly of an inspection socket as a comparative example.

(21) FIG. 21 is a perspective view of a contact terminal for a signal line according to a second embodiment.

(22) FIG. 22 is a plan view of a flange section according to the second embodiment.

(23) FIG. 23 is a plan view of another example of a flange section according to the second embodiment.

(24) FIG. 24 is a side view of a contact terminal for a signal line according to a third embodiment.

(25) FIG. 25 is a partial vertical cross-sectional view (populated state) of the housing according to the third embodiment.

(26) FIG. 26 is a partially enlarged view of the part A shown in FIG. 25.

(27) FIG. 27 is a diagram showing a modification of the contact terminal according to the third embodiment.

(28) FIG. 28 is a partial vertical cross-sectional view (populated state) of the housing according to the fifth embodiment.

(29) FIG. 29 is a partial vertical cross-sectional view (IC package-populated state) of the housing according to the fifth embodiment.

(30) FIG. 30 is a partially enlarged view of the part B shown in FIG. 29.

(31) FIG. 31 is a partial vertical cross-sectional view (populated state) showing a modification of the housing.

DESCRIPTION OF EMBODIMENTS

First Embodiment

(32) An inspection socket according to the first embodiment of the present invention will now be described with reference to the accompanying drawings.

(33) The outline of an inspection socket 1 (hereinafter, simply referred to as “socket 1”) will be described below.

(34) FIG. 1 shows the socket 1. The socket 1 is disposed and populated on, for example, a printed wiring board 98 (inspection board 98) as a test board. The socket 1 has a recess 3 in the center, and an inspection device (not shown in the drawing) such as an IC package is supposed to be inserted and installed in the recess 3.

(35) The IC package has a ball grid array (BGA) shape as in this embodiment. Other IC packages have, for example, a land grid array (LGA) shape or a quad flat non-leaded package (QFN) shape.

(36) As shown in FIGS. 2 and 3, the socket 1 includes a socket base 5, a housing 7, and a contact terminal 80.

(37) As shown in FIGS. 1 to 4, the socket base 5 is a component that constitutes the outer shape of the socket 1. The socket base 5 is a rectangular parallelepiped having a generally square upper surface 5a and bottom surface 5b. The socket base 5 is made of a metal such as an aluminum alloy and has conductivity.

(38) As shown in FIG. 1 or 2, the socket base 5 has a recess 3 in the central portion of the upper surface 5a. The recess 3 is recessed from the upper surface 5a toward the bottom surface 5b, and is generally square in a plan view. The recess 3 is a space for containing the inspection device.

(39) As shown in FIG. 4, the socket base 5 has a container recess 5c on the bottom surface 5b. The container recess 5c is recessed from the bottom surface 5b toward the upper surface 5a, and is generally square in a bottom view. The container recess 5c is a space for fixing the housing 7. The container recess 5c communicates with the aforementioned recess 3 (see FIG. 1 or 2). Hence, as shown in FIG. 1, the upper surface of the housing 7 (specifically, the first housing 10 described later) fixed in the container recess 5c is exposed on the bottom of the recess 3.

(40) As shown in FIG. 1, the socket base 5 has a populating screw hole 6, which is used for populating, at each of the four corners. The socket 1 is configured to be populated on the inspection board 98 by cutting male threads in the populating screw holes 6 and fixing them to the inspection board 98 while the housing 7 and the contact terminal 80 are contained in the socket base 5.

(41) As shown in FIGS. 2 and 3, in this embodiment, the housing 7 consists of five parts: first to fifth housings (metal housings) 10 to 50. The housing 7 is a holder member that holds a plurality of contact terminals 80.

(42) The housing 7 has a laminated structure in which a plurality of plate members are laminated in the vertical direction (plate thickness direction): the first housing 10, the second housing (alignment board) 20, the third housing (metal housing) 30, the fourth housing (alignment board) 40, and the fifth housing 50 are provided from top to bottom in the drawing.

(43) A housing fixing thread 9 and a contact terminal 80 are provided so that they pass through the first housing 10 to the fifth housing 50.

(44) The contact terminal 80 will now be described before detailed description of the housing 7.

(45) As shown in FIGS. 5, 6, 8, and 9, the contact terminal 80 in this embodiment comes in two type: a first contact terminal 80a and a second contact terminal 80b. The first contact terminal 80a shown in FIGS. 5 and 6 is used for a signal line. On the other hand, the second contact terminal 80b shown in FIGS. 8 and 9 is used for a ground line or power supply line.

(46) Hereinafter, when it is not necessary to distinguish between the first contact terminal 80a and the second contact terminal 80b, it is simply referred to as “contact terminal 80”.

(47) As shown in FIGS. 5 and 6, the first contact terminal 80a has a tubular barrel 82 extending in the axial direction X, a device-side terminal 84 provided at one end of the barrel 82 (the upper end in the drawing or the end located on the inspection device side), a board-side terminal 86 provided on the other end of the barrel 82 (the lower end in the drawing or the end located on the inspection board side), and a spring 88 contained in the barrel 82.

(48) The device-side terminal 84 is provided so as to slide in the state where the basal end is contained in the barrel 82. A point caulking portion 82a is provided at one end of the barrel 82 so that a part of the inner diameter of the barrel 82 is reduced, which prevents the device-side terminal 84 from separating from the barrel 82. The solder ball 96a of the IC package comes into contact with the tip of the device-side terminal 84.

(49) The board-side terminal 86 is provided so as to slide in the state where the basal end is contained in the barrel 82. A one-sided caulking portion 82b is provided at the other end of the barrel 82 so that a part of the inner diameter of the barrel 82 is reduced, which prevents the board-side terminal 86 from separating from the barrel 82. The inspection board 98 comes into contact with the tip of the board-side terminal 86.

(50) A spring 88 contained in the barrel 82 is in contact with the basal end of the device-side terminal 84 and the basal end of the board-side terminal 86, and urges the device-side terminal 84 and the board-side terminal 86 in a direction to separate them from each other.

(51) A flange section 90 is integrally formed on the barrel 82. The flange section 90 is a section of the barrel 82 extending along the axial direction X and having a diameter increased to have radial expansion. In FIG. 5, the outer diameter (maximum outer diameter) of the flange section 90 is indicated by D1, and the outer diameter (maximum outer diameter) of the barrel 82 in the portion where the flange section 90 is not formed is indicated by D2. At this time, D1/D2 is preferably, for example, about 1.1 to 1.3. As a result, the volume of the flange section 90 can be reduced and the flange section 90 can be reliably brought into contact with the fourth housing 40.

(52) The flange section 90 is preferably provided within a half range from the other end side of the barrel 82 (inspection board 98 side) in the axial direction X, more preferably a quarter range from the other end side of the barrel 82.

(53) As shown in FIG. 7 in addition to the examples shown in FIGS. 5 and 6, the flange section 90 may be formed at the other end (lower end in the drawing) of the barrel 82. Hence, the other end of the barrel 82 and the end of the flange section 90 coincide with each other, which makes it easy to control the dimension of the flange section 90 in the axial direction X. Accordingly, the barrel 82 with the flange section 90 can be easily manufactured.

(54) A tapered portion 90a may be formed in the flange section 90. The tapered portion 90a is a surface whose diameter decreases from one end side to the other end side of the barrel 82. Although the impedance of the contact terminal 80 may change due to the formation of the flange section 90, the change in impedance can be minimized by using the tapered portion 90a to reduce the volume of the flange section 90. This configuration is advantageous for the first contact terminal 80a used for a signal line.

(55) FIGS. 8 and 9 show the second contact terminal 80b. The configuration of the second contact terminal 80b differs from that of the first contact terminal 80a in the following points. The second contact terminal 80b has a larger diameter than the first contact terminal 80a, the device-side terminal 84 is held by the one-sided caulking portion 82b, and the flange section 90 does not have the tapered portion 90a. These differences will be explained below.

(56) The barrel 82 of the second contact terminal 80b has a larger diameter (inner diameter and outer diameter) than the barrel 82 of the first contact terminal 80a. Moreover, the diameters of the device-side terminal 84 and the board-side terminal 86 of the second contact terminal 80b are set large according to the dimensions of the barrel 82. Hence, the electric resistance of the second contact terminal 80b can be made low. This configuration is advantageous for the second contact terminal 80b used as a ground line or power supply line.

(57) The device-side terminal 84 is provided so as to slide in the state where the basal end is contained in the barrel 82. A one-sided caulking portion 82b is provided at the other end of the barrel 82 so that a part of the inner diameter of the barrel 82 is reduced, which prevents the device-side terminal 84 from separating from the barrel 82.

(58) A flange section 90 is integrally formed on the barrel 82 of the second contact terminal 80b. However, unlike the first contact terminal 80a, it does not have the tapered portion 90a. This is because the second contact terminal 80b is used as a ground line or power supply line and does not require consideration of the impedance.

(59) Note that the tapered portion 90a may also be formed in the flange section 90 of the second contact terminal 80b. Further, as shown in FIG. 10, the flange section 90 may be formed at the other end of the barrel 82 (the lower end in the drawing).

(60) The first to fifth housings 10 to 50 constituting the housing 7 will now be described.

(61) As shown in FIGS. 2, 3 and 11, the first housing 10 is made of a metal such as an aluminum alloy and has conductivity. This contributes to a reduction in crosstalk between adjacent contact terminals 80. An insulating layer is formed on the upper surface of the first housing 10 and on the region in contact with the IC package, and on the inner surface of the through holes 10c in contact with the solder balls 96a of the IC package. This prevents short-circuiting between the IC package and the first housing 10. The insulating layer may be, for example, alumite (anodized film) or an insulating film formed by painting.

(62) The first housing 10 is a plate-like body having an outer shape having a generally square or a generally rectangular shape with chamfered corners. The first housing 10 is required to be thick enough to accommodate at least the solder balls 96a of the IC package. For instance, in FIG. 11, the height of the solder balls 96a of the IC package is about 0.35 mm, whereas the thickness of the first housing 10 is 0.5 mm or more and 1.5 mm or less, specifically about 0.8 mm. A fixing hole 10a through which a housing fixing thread 9 is inserted is formed at each of the four corners of the first housing 10. A positioning pin hole 10b through which a positioning pin 30b provided in the third housing 30 is inserted is formed near each of a pair of opposite corners of the first housing 10. A plurality of through holes 10c through which the respective contact terminals 80 are inserted are formed in the central portion of the first housing 10. The plurality of through holes 10c are located in positions overlapping the positions of the solder balls 96a of the IC package.

(63) As shown in FIG. 11, each through hole 10c has a tubular shape having an inner diameter that is fixed in the plate thickness direction of the first housing 10. The inner diameter of each through hole 10c is larger than the outer diameter of the contact terminal 80 (that is, the outer diameter D2 of the flange, which is the maximum outer diameter of the entire barrel 82). The inner diameter of each through hole 11c is larger than the diameter of the solder balls 96a of the IC package.

(64) As shown in FIGS. 2, 3 and 11, the second housing 20 is a rigid board that is a rigid resin board. To be specific, the second housing 20 is a printed circuit board (PCB). The printed circuit board is a glass epoxy board in which a glass woven cloth of glass fibers woven into cloth is impregnated with epoxy resin, a polyimide (PI) board, or the like, preferably one having higher strength than a polyetherimide (PEI) board.

(65) Metal layers as conductive layers are formed on the upper surface and the lower surface of the second housing 20. Plated through vias are provided to establish electrical continuity between the plating layers formed on the upper and lower surfaces. Hence, the second housing 20 is electrically connected to the upper first housing 10 and also electrically connected to the lower third housing 30, and the first housing 10 and the third housing 30 are electrically connected.

(66) The second housing 20 is a plate-like body having an outer shape having a generally square or a generally rectangular shape with chamfered corners. The outer shape of the second housing 20 in a plan view substantially matches the outer shape of the first housing 10. The thickness of the second housing 20 is, for example, 0.1 mm or more and 1.0 mm or less, and is specifically 0.2 mm. A fixing hole 20a through which a housing fixing thread 9 is inserted is formed at each of the four corners of the second housing 20. A positioning pin hole 20b through which a positioning pin 30b provided in the third housing 30 is inserted is formed near each of a pair of opposite corners of the second housing 20. A plurality of through holes (positioning holes) 20c through which the respective contact terminals 80 are inserted are formed in the central portion of the second housing 20. The arrangement of the plurality of through holes 20c corresponds to the arrangement of the through holes 10c.

(67) As shown in FIG. 11, each through hole 20c has a tubular shape having an inner diameter that is fixed in the plate thickness direction of the second housing 20. The inner diameter of each through hole 20c is slightly larger than the outer diameter D2 of the barrel 82 (excluding the flange section 90) of the contact terminal 80, and smaller than the outer diameter D1 of the flange section 90. Each through hole 20c is a positioning hole for positioning the contact terminal 80 (barrel 82). Therefore, the diameter of each through hole 20c is set so that a predetermined gap from the barrel 82 is secured to such an extent that the contact terminal 80 is not inclined. The gap is, for example, 10 μm or more and 50 μm or less.

(68) Of the contact terminals 80, the through hole 20c through which the first contact terminal 80a for a signal line is inserted, and the through hole 20c through which the second contact terminal 80b as a power supply line is inserted are non-plated holes which are not plated. In other words, electrical insulation is provided between the first contact terminal 80a and the second housing 20.

(69) On the other hand, the through hole 20c through which the second contact terminal 80b as a grounding line is inserted is a plated hole which is provided with a plating layer. The through hole 20c through which the second contact terminal 80b as a grounding line is inserted is therefore also used as a through via.

(70) As shown in FIGS. 2, 3 and 11, like the first housing 10, the third housing 30 is made of a metal such as an aluminum alloy and has conductivity. However, unlike the first housing 10, the third housing 30 does not have an insulating layer on either the upper surface or the lower surface. Consequently, it is electrically connected to the upper second housing 20 and the lower fourth housing 40. A plating layer is formed on the surface of the third housing 30. This improves the connection between the second housing 20 and the fourth housing 40 and makes it less likely to be affected by corrosion or the like even after long-term use. To be specific, Ni—Au plating with good conductivity and corrosion resistance is preferable. Similarly to the first housing 10, the third housing 30 has a generally square or generally rectangular shape in a plan view, and has fixing holes 30a and through holes 30c. The arrangement of the plurality of through holes 30c corresponds to the arrangement of the through holes 10c. Positioning pins 30b protruding upward are provided on the upper surface of the third housing 30 in positions overlapping the positioning pin holes 10b formed in the first housing 10 and the like. Positioning pins 30b protruding downward are also provided on the lower surface of the third housing 30 in positions overlapping the positioning pin holes 40b formed in the fourth housing 40 and the like.

(71) As shown in FIG. 11, each through hole 30c has a tubular shape having an inner diameter that is fixed in the plate thickness direction of the third housing 30. The inner diameter of each through hole 30c is larger than the outer diameter of the contact terminal 80 (that is, the outer diameter D2 of the flange, which is the maximum outer diameter of the entire barrel 82).

(72) The third housing 30 has a larger thickness than the first housing 10 and the fifth housing 50. The thickness of the third housing 30 is, for example, 1.0 mm or more and 3.0 mm or less, and is specifically 1.5 mm.

(73) As shown in FIGS. 2, 3, and 11, the fourth housing 40 is a rigid board that is a rigid resin board, similarly to the second housing 20. Similarly to the second housing 20, the fourth housing 40 has plating layers on the upper and lower surfaces, and has through vias for establishing electrical continuity between the plating layers on the upper and lower surfaces. Hence, the fourth housing 40 is electrically connected to the upper third housing 30 and also electrically connected to the lower fifth housing 50, and the third housing 30 and the fifth housing 50 are electrically connected.

(74) The fourth housing 40 is a plate-like body having an outer shape having a generally square or a generally rectangular shape with chamfered corners. The outer shape of the fourth housing 40 in a plan view substantially matches the outer shape of the first housing 10. The thickness of the fourth housing 40 is, for example, 0.1 mm or more and 1.0 mm or less, and is specifically 0.2 mm. A fixing hole 40a through which a housing fixing thread 9 is inserted is formed at each of the four corners of the fourth housing 40. A positioning pin hole 40b through which a positioning pin 30b provided in the third housing 30 is inserted is formed near each of a pair of opposite corners of the fourth housing 40. A plurality of through holes (positioning holes) 40c through which the respective contact terminals 80 are inserted are formed in the central portion of the fourth housing 40. The arrangement of the plurality of through holes 40c corresponds to the arrangement of the through holes 10c.

(75) As shown in FIG. 11, each through hole 40c has a tubular shape having an inner diameter that is fixed in the plate thickness direction of the fourth housing 40. The inner diameter of each through hole 40c is slightly larger than the outer diameter D2 of the barrel 82 (excluding the flange section 90) of the contact terminal 80, and smaller than the outer diameter D1 of the flange section 90. Each through hole 40c is a positioning hole for positioning the contact terminal 80 (barrel 82). Therefore, the diameter of each through hole 40c is set so that a predetermined gap from the barrel 82 is secured to such an extent that the contact terminal 80 is not inclined. The gap is, for example, 10 μm or more and 50 μm or less.

(76) Of the contact terminals 80, the through hole 40c through which the first contact terminal 80a for a signal line is inserted, and the through hole 40c through which the second contact terminal 80b as a power supply line is inserted are non-plated holes which are not plated. In other words, electrical insulation is provided between the first contact terminal 80a and the fourth housing 40.

(77) On the other hand, the through hole 40c through which the second contact terminal 80b as a grounding line is inserted is a plated hole which is provided with a plating layer. The through hole 40c through which the second contact terminal 80b as a grounding line is inserted is therefore also used as a through via.

(78) As shown in FIGS. 2, 3 and 11, like the first housing 10, the fifth housing 50 is made of a metal such as an aluminum alloy and has conductivity. To be electrically connected to the fourth housing 40, the fifth housing 50 does not have an insulating layer on the upper surface. However, an insulating layer is provided on the bottom surface in order to prevent short circuiting between the electrodes (pads) disposed on the inspection board and the wiring. Moreover, an insulating layer is also provided on the inner surface of the through holes 50c and the small-diameter portion 50d to come into contact with the contact terminal 80. Similarly to the first housing 10, the fifth housing 50 has a generally square or generally rectangular shape in a plan view, and has fixing holes 50a and through holes 50c. The arrangement of the plurality of through holes 50c corresponds to the arrangement of the through holes 10c. A positioning pin hole 50b through which a positioning pin 30b provided in the third housing 30 is inserted is formed near each of a pair of opposite corners of the fifth housing 50.

(79) As shown in FIG. 11, each through hole 50c has a tubular shape having an inner diameter that is fixed in the plate thickness direction of the fifth housing 50. The inner diameter of each through hole 50c is larger than the outer diameter of the contact terminal 80 (that is, the outer diameter D2 of the flange, which is the maximum outer diameter of the entire barrel 82). The flange section 90 of the contact terminal 80 is contained in the through hole 50c. A small-diameter portion 50d whose diameter decreases toward the inspection board 98 side (the lower side in the drawing) is formed in each through hole 11c. The inner diameter of the small-diameter portion 50d is smaller than the outer diameter of the other end of the barrel 82 and larger than the outer diameter of the tip of the board-side terminal 86. Hence, the other end (the lower end in the drawing) of the barrel 82 can be brought into contact with the small-diameter portion 50d while the tip of the board-side terminal 86 is projected from the through holes 50c. The small-diameter portion 50d has a tapered shape in the drawing, but may have a stepped shape.

(80) When the socket 1 is not populated on the inspection board 98, the protruding length of the board-side terminal 86 protruding from the lower surface of the fifth housing 50 is q1. The length from the lower surface of the fourth housing 40 to the upper surface of the flange section 90 is q2. Here, q1 is set larger than q2. As a result, as shown in FIG. 12, when the socket 1 is populated on the inspection board 98, the upper surface of the flange section 90 formed on the barrel 82 of the contact terminal 80 pushed up by the inspection board 98 comes into contact with the lower surface of the fourth housing 40, and the board-side terminal 86 is further pushed into the barrel 82. Accordingly, an initial load (preload) can be applied to the contact terminal 80.

(81) The through holes 10c of the first housing 10, the through holes 30c of the third housing 30, and the through holes 50c of the fifth housing are all larger than the outer diameter of the contact terminals 80 (that is, the outer diameter D2 of the flange which is the maximum outer diameter of the entire barrel 82).

(82) In particular, a predetermined gap is provided for the outer diameter of the first contact terminals 80a used for signal lines. The gaps are not merely an insertion margin for allowing the first contact terminals 80a to be inserted, but gaps (dielectric layers) for impedance matching. Each gap can be changed as appropriate according to the specifications of the socket 1, and is adjusted so that a desired impedance (for example, about 40Ω to 50Ω) can be obtained. In other words, the socket 1 according to this embodiment adopts a so-called coaxial structure. The dielectric layers may be mere gaps (air) or composed of a substance such as a resin or ceramic.

(83) As shown in FIG. 13, the IC package is placed on the socket 1 populated on the inspection board 98, from the upper surface of the first housing 10. The solder balls 96a of the IC package are contained in the through holes 10c of the first housing 10, come into contact with the tips of the device-side terminals 84 of the contact terminals 80, and push the device-side terminals 84 into the barrels 82. As a result, electrical continuity is established between the IC package and the inspection board 98 via the socket 1.

(84) A method of assembling the socket 1 will now be described.

(85) First, as shown in FIG. 14, the socket base 5 is turned upside down so that the bottom surface 5b faces upward.

(86) Positioning pin holes 5d are formed in the container recess 5c formed in the socket base 5. The positioning pins 30b provided on a surface (the lower surface during assembly) of the third housing 30 are inserted into the positioning pin holes 5d. Further, taps 5e are formed at the four corners in the container recess 5c. Housing fixing threads 9 are inserted through the taps 5e.

(87) The first housing 10, the second housing 20, the third housing 30, and the fourth housing 40 are inserted in this order into the container recess 5c formed in the socket base 5 and laminated (see FIG. 15). At this time, the positioning pins 30b provided on the surface of the third housing 30 pass through the positioning pin holes 20b in the second housing 20 and the positioning pin holes 10b in the first housing 10, and are inserted through the positioning pin holes 5d of the socket base 5.

(88) Similarly, the positioning pins 30b provided on the bottom surface (the upper surface during assembly) of the third housing 30 are inserted into the positioning pin holes 40b of the fourth housing 40, so that the first to fourth housings 10 to 40 are positioned relatively to the socket base 5.

(89) The housing fixing threads 9 are then passed through the two fixing holes 10a, 20a, 30a, and 40a located at the opposite corners of the first to fourth housings 10 to 40 and screwed to the taps 5e of the socket base 5, whereby the first to fourth housings 10 to 40 are integrally fixed to the socket base 5.

(90) Subsequently, as shown in FIG. 16, the contact terminals 80 are inserted into the through holes 10c, 20c, 30c, and 40c in the axial direction X (FIG. 17). Each inserted contact terminal 80 is positioned and aligned at two points: the through hole 20c of the second housing 20 and the through hole 40c of the fourth housing 40. Further, the flange section 90 is hung on the fourth housing 40, and the contact terminal 80 is hung from the fourth housing 40. At this time, the flange section 90 is provided within a half range (preferably a quarter range) from the other end of the barrel 82. Hence, each contact terminal 80 has the center of gravity vertically below the flange section 90 when assembled upside down. As a result, the contact terminals 80 stably hang from the fourth housing 40. In particular, the contact terminals 80 hang from the fourth housing 40 so that the axis X of each contact terminal 80 is parallel with the vertical direction. This makes it possible to prevent the inclination of each contact terminal 80.

(91) Note that a mask that has an array of holes defined according to each outer diameter of the contact terminal 80 may be prepared and inserted into the through holes 10c, 20c, 30c, and 40c. The mask is removed when all the contact terminals 80 have been inserted.

(92) Next, as shown in FIG. 18, the fifth housing 50 is laminated on the fourth housing 40 (see FIG. 19). Hence, the flange sections 90 of the contact terminals 80 are contained in the through holes 50c of the fifth housing 50. At this time, the positioning pins 30b provided in the third housing 30 are inserted into the positioning pin holes 50b so that the fifth housing 50 is relatively positioned. The housing fixing threads 9 are then inserted into the remaining two fixing holes 10a, 20a, 30a, 40a, and 50a in the first to fifth housings 10 to 50 and screwed to the socket base 5, whereby the first to fifth housings 10 to 50 are integrally fixed to the socket base 5. Thus, the assembly of the socket 1 is completed.

(93) According to this embodiment, when the socket 1 is populated on the inspection board 98, the contact terminals 80 are pushed by the fourth housing 40 via the flange sections 90, so that the contact terminals 80 are preloaded. At this time, the reaction force of the preload acts on the fourth housing 40 that is on the flange sections 90. However, since the fourth housing 40 can be pressed by the first to third housings 10 to 30 laminated on the fourth housing 40, warpage in the fourth housing 40 on the flange section 90 can be suppressed.

(94) In addition, preloading the contact terminals 80 (flange sections 90) with the fourth housing 40 eliminates the need for preloading the shoulder portion of the barrel 82 from the IC package side. Therefore, a housing (alignment board) for pushing the barrel 82 from the IC package side is unnecessary, and the device-side terminal 84 can be shortened accordingly. Consequently, the attenuation of the transmission signal can be suppressed. Moreover, since the heat value is reduced, the allowable current can be improved. Further, the deflection due to the inclination of the device-side terminal 84 is reduced, so that the concentric accuracy can be improved.

(95) Also, for assembling the socket 1 upside down, the contact terminals 80 can be hung from the fourth housing 40 through the flange sections 90, being aligned using two through holes 40c and 20c. This stabilizes the positions of the contact terminals 80, thereby facilitating the assembly of the socket 1 and maintenance (for example, replacement of the contact terminals 80).

(96) Note that the socket 100 shown in FIG. 20 is taken as a comparative example. The contact terminals 800 contained in the socket 100 are of a type preloaded at the shoulder portion 821 of the barrel 820. Therefore, the shoulder portion 821 of the barrel 820 comes into contact with the second housing 200 at the time of assembling upside down. At this time, the center of gravity of each contact terminal 800 is located above the contact portion between the second housing 200 and the barrel 820. Since the contact terminals 800 are only aligned through the second housing 200, they are positioned at one point. Hence, the contact terminals 800 may be inclined in the through holes of the third housing 300. If a contact terminal 800 is inclined, the fourth housing 400 may come into contact with the board-side terminal 860 of the contact terminal 800 and be damaged when the fourth housing 400 is laminated.

(97) With a conductive metal housing, crosstalk between a contact terminal 80 and another contact terminal 80 can be reduced. For this reason, even if the impedance of the contact terminal 80 is slightly lowered due to the formation of the flange section 90, its influence on the socket 1 as a whole can be suppressed.

(98) Each flange section 90 has a tapered portion 90a. This makes it possible to minimize the impedance mismatch that may occur in the contact terminal 80 due to the formation of the flange section 90. This is particularly useful for the first contact terminal 80a for a signal line where the influence of impedance mismatch should be eliminated.

Second Embodiment

(99) The inspection socket according to the second embodiment of the present invention will now be described with reference to the drawings.

(100) Note that this embodiment differs from the first embodiment in the shape of the flange sections. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals in the following description, and components different therefrom will be described.

(101) As shown in FIGS. 21 and 22, a cut surface 90b is formed on the flange section 90 of the first contact terminal 80a. The cut surface 90b is formed by cutting off a part of the expanded flange section 90 so that the outer diameter of a part of the flange section 90 is approximately equal to the outer diameter D2 of the barrel 82 (see FIG. 5). The cut surface 90b, which has two faces in the drawing, may have one face or three or more faces, which are, however, preferably provided symmetrically to the axis X so as to come into contact with the fourth housing 40 with an even force. When the cut surface 90b has many faces, the area of the contact portion is small and the surface pressure is high. For this reason, the cut surface 90b preferably has two to six faces (see FIG. 23).

(102) According to this embodiment, the change in impedance can be minimized by reducing the volume of the flange section 90 through the cut surface 90b. This configuration is advantageous for the first contact terminal 80a used for a signal line.

Third Embodiment

(103) An inspection socket according to the third embodiment of the present invention will now be described with reference to the accompanying drawings.

(104) Note that this embodiment differs from the first embodiment in the shape of the flange sections and the shape of the through holes in the fifth housing. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals in the following description, and components different therefrom will be described.

(105) As shown in FIG. 24, no tapered portion 90a is formed on the flange section 90 of the first contact terminal 80a.

(106) As shown in FIGS. 25 and 26, the through hole 50c in the fifth housing 50 has a large-diameter portion 50e in a position overlapping the position of the flange section 90 of the first contact terminal 80a.

(107) According to this embodiment, the impedance can be matched using the large-diameter portion 50e, whereby the impedance mismatch that may occur due to the formation of the flange section 90 can be minimized. This configuration is advantageous for the first contact terminal 80a used for a signal line.

(108) As shown in FIG. 27, the impedance may be matched by reducing the outer diameter of the tip side of the board-side terminal 86. This configuration is not only for this embodiment and can be adopted in each embodiment.

Fourth Embodiment

(109) An inspection socket according to the fourth embodiment of the present invention will now be described with reference to the accompanying drawings.

(110) Note that this embodiment differs from the first embodiment in the configuration of the contact terminals and the configuration of the fifth housing. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals in the following description, and components different therefrom will be described.

(111) As shown in FIG. 28, the device-side terminal 84 of the contact terminal 80 is fixed with its base end side contained in the barrel 82. In other words, the contact terminal 80 is a so-called one-sided sliding type.

(112) As shown in FIG. 29, each device-side terminal 84 does not slide with respect to the barrel 82, so that when the IC package is placed on the first housing 10, the device-side terminal 84 in contact with the solder ball 96a is pushed down together with the barrel 82. Accordingly, the flange section 90 formed on the barrel 82 also moves downward. Consequently, as shown in FIGS. 29 and 30, the flange section 90 is located in the middle layer of the fifth housing 50.

(113) In the case where the fifth housing 50 is integrally formed, it is troublesome in processing to provide the large-diameter portion 50e of the through hole 50c only in the middle layer of the fifth housing 50. Here, in this embodiment, the fifth housing 50 consisting of 5-1st to 5-6th housings (split housings) 56a to 56f is prepared.

(114) As shown in FIG. 30, the fifth housing 50 has a laminate of, from top to bottom, the 5-1st housing 56a, 5-2nd housing 56b, 5-3rd housing 56c, 5-4th housing 56d, 5-5th housing 56e, and 5-6th housing 56f in this order.

(115) Before the 5-1st to 5-6th housings 56a to 56f are laminated, the large-diameter portion 50e is preliminarily formed only on the 5-2nd housing 56b and 5-3rd housing 56c overlapping the middle layer where the flange section 90 is located. After that, the 5-1st to 5-6th housings 56a to 56f are laminated, so that the large-diameter portion 50e can be easily provided in the middle layer of the fifth housing 50. In other words, the large-diameter portion 50e adjusted to the position of the flange section 90 can be easily processed.

(116) The 5-1st to 5-6th housings 56a to 56f are bonded to each other by diffusion bonding, for example. Further, instead of diffusion bonding, electroforming may be used for fabrication.

(117) [Modification]

(118) As shown in FIG. 31, in the first to fourth embodiments, a sixth housing 60 and a seventh housing 70 may be provided between the first housing 10 and the second housing 20.

(119) At this time, the sixth housing 60 has the same configuration as the second housing 20. However, the inner diameter of the through hole 60c formed in the sixth housing 60 is set slightly larger than the outer diameter of the tip side of the device-side terminal 84. The seventh housing 70 has the same configuration as the third housing 30. Note that the thickness of the seventh housing 70 is approximately equal to that of the first housing 10.

(120) This configuration, particularly the sixth housing 60 adds a positioning spot for the device-side terminal 84. As a result, the accuracy of the position of the device-side terminal 84 can be improved and the inclination can be suppressed.

REFERENCE SIGNS LIST

(121) 1 socket (inspection socket) 3 recess 5 socket base 5a upper surface 5b bottom surface 5c container recess 5d positioning pin hole 5e tap 6 populating screw hole 7 housing 10 first housing (metal housing) 10a fixing hole 10b positioning pin hole 10c through hole 20 second housing (alignment board) 20a fixing hole 20b positioning pin hole 20c through hole (positioning hole) 30 third housing (metal housing) 30a fixing hole 30b positioning pin 30c through hole 40 fourth housing (alignment board) 40a fixing hole 40b positioning pin hole 40c through hole (positioning hole) 50 fifth housing (metal housing) 50a fixing hole 50b positioning pin hole 50c through hole 50d small-diameter portion 50e large-diameter portion 56a 5-1st housing (split housing) 56b 5-2nd housing (split housing) 56c 5-3rd housing (split housing) 56d 5-4th housing (split housing) 56e 5-5th housing (split housing) 56f 5-6th housing (split housing) 60 sixth housing (metal housing) 70 seventh housing (alignment board) 80a(80) first contact terminal (contact terminal) 80b(80) second contact terminal (contact terminal) 82 barrel 82a point caulking portion 82b one-sided caulking portion 84 device-side terminal 86 board-side terminal 88 spring 90 flange section 90a tapered portion 90b cut surface 96a solder ball 98 printed wiring board (inspection board)