Operational amplifier
11329619 · 2022-05-10
Assignee
Inventors
Cpc classification
H03F2203/7227
ELECTRICITY
H03F3/45659
ELECTRICITY
H03F2203/45212
ELECTRICITY
International classification
Abstract
Disclosed herein is an operational amplifier including a non-inverting input terminal, an inverting input terminal, a P-type metal oxide semiconductor input differential pair, a first input tail current source, an N-type metal oxide semiconductor input differential pair, a second input tail current source, an output stage, a first correction circuit, and a second correction circuit. The first correction circuit and the second correction circuit operate over an operation region of the P-type metal oxide semiconductor input differential pair, an operation region of the N-type metal oxide semiconductor input differential pair, and a transition region in which both the P-type metal oxide semiconductor input differential pair and the N-type metal oxide semiconductor input differential pair operate.
Claims
1. An operational amplifier comprising: a non-inverting input terminal that receives a first input voltage; an inverting input terminal that receives a second input voltage; a P-type metal oxide semiconductor input differential pair connected to the non-inverting input terminal and the inverting input terminal; a first input tail current source connected to sources of the P-type metal oxide semiconductor input differential pair; an N-type metal oxide semiconductor input differential pair connected to the non-inverting input terminal and the inverting input terminal; a second input tail current source connected to sources of the N-type metal oxide semiconductor input differential pair; an output stage that receives an output of the P-type metal oxide semiconductor input differential pair and an output of the N-type metal oxide semiconductor input differential pair; a first correction circuit that corrects an offset voltage of the P-type metal oxide semiconductor input differential pair; and a second correction circuit that corrects an offset voltage of the N-type metal oxide semiconductor input differential pair, wherein the first correction circuit and the second correction circuit operate over an operation region of the P-type metal oxide semiconductor input differential pair, an operation region of the N-type metal oxide semiconductor input differential pair, and a transition region in which both the P-type metal oxide semiconductor input differential pair and the N-type metal oxide semiconductor input differential pair operate.
2. The operational amplifier according to claim 1, wherein the first correction circuit includes a first correction differential amplifier including a P-type metal oxide semiconductor correction differential pair connected to the non-inverting input terminal and the inverting input terminal, and a first gm amplifier that converts an output signal of the first correction differential amplifier into a current signal and supplies the current signal to the output stage, and the second correction circuit includes a second correction differential amplifier including an N-type metal oxide semiconductor correction differential pair connected to the non-inverting input terminal and the inverting input terminal, and a second gm amplifier that converts an output signal of the second correction differential amplifier into a current signal and supplies the current signal to the output stage.
3. The operational amplifier according to claim 2, wherein the first correction differential amplifier further includes a first correction tail current source connected to sources of the P-type metal oxide semiconductor correction differential pair, and a first load circuit and a first correction current source each connected to drains of the P-type metal oxide semiconductor correction differential pair, and the second correction differential amplifier further includes a second correction tail current source connected to sources of the N-type metal oxide semiconductor correction differential pair, and a second load circuit and a second correction current source each connected to drains of the N-type metal oxide semiconductor correction differential pair.
4. The operational amplifier according to claim 1, wherein the output stage includes a first constant current circuit that mirrors a differential current of the P-type metal oxide semiconductor input differential pair and a differential current of the first correction circuit, a first gate-grounded circuit disposed on a path of the differential currents mirrored by the first constant current circuit, a second constant current circuit that mirrors a differential current of the N-type metal oxide semiconductor input differential pair and a differential current of the second correction circuit, and a second gate-grounded circuit disposed on a path of the differential currents mirrored by the second constant current circuit.
5. The operational amplifier according to claim 1, wherein a current of the first input tail current source decreases as the first input voltage and the second input voltage increase, and a current of the second input tail current source changes in a complementary manner to the current of the first input tail current source.
6. The operational amplifier according to claim 2, wherein a current of the first input tail current source decreases as the first input voltage and the second input voltage increase, and a current of the second input tail current source and a current of the second gm amplifier change in a complementary manner to the current of the first input tail current source.
7. The operational amplifier according to claim 6, wherein the first gm amplifier includes a P-type metal oxide semiconductor differential pair, a current source disposed on a source side of the P-type metal oxide semiconductor differential pair, and a stop circuit disposed between the P-type metal oxide semiconductor differential pair and the current source and configured to switch to an interruption state when a current that flows through the P-type metal oxide semiconductor input differential pair becomes zero.
8. The operational amplifier according to claim 7, wherein the stop circuit includes two P-type metal oxide semiconductor transistors disposed such that sources of the P-type metal oxide semiconductor transistors are connected to each other, and one of gates of the P-type metal oxide semiconductor transistors is connected to the inverting input terminal and another one of the gates is connected to the non-inverting input terminal.
9. The operational amplifier according to claim 7, wherein the first gm amplifier further includes a variable current source that sinks, from a connection node between the current source and the stop circuit, a current that changes in a complementary manner to the current of the first input tail current source.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(15) The present disclosure will now be described based on preferred embodiments with reference to the drawings. The same or equivalent components, members, and processes illustrated in the drawings will be denoted by the same reference signs, and redundant description will be omitted as appropriate. The embodiments will be described for exemplary purposes only and are by no means intended to limit the present disclosure. All the features and combinations thereof described in the embodiments are not necessarily essential to the disclosure.
(16) In the present specification, a “state in which a member A is connected to a member B” includes not only a state in which the member A and the member B are physically directly connected to each other but also a state in which the member A and the member B are indirectly connected to each other via another member that does not affect an electric connection therebetween.
(17) Similarly, a “state in which a member C is disposed between the member A and the member B” includes not only a state in which the member A and the member C or the member B and the member C are directly connected to each other but also a state in which the member A and the member C or the member B and the member C are indirectly connected to each other via another member that does not affect an electric connection therebetween.
First Embodiment
(18)
(19) A first input voltage V.sub.+ is input into a non-inverting input terminal INP, while a second input voltage V.sub.− is input into an inverting input terminal INN. An upper-side power supply voltage is input into an upper-side power supply terminal VDD, while a lower-side power supply voltage (e.g., ground voltage) is supplied to a lower-side power supply terminal (ground terminal) VSS. The operational amplifier 1A amplifies the difference between the first input voltage V.sub.+ and the second input voltage V.sub.− and outputs an output voltage Vout from an output terminal OUT.
(20) The PMOS input differential pair 10, the NMOS input differential pair 12, the first input tail current source 14, the second input tail current source 16, and the output stage 20 constitute a Rail-To-Rail folded cascode operational amplifier.
(21) The PMOS input differential pair 10 includes two PMOS transistors MP1 and MP2. A gate of one of the PMOS transistors MP1 and MP2 is connected to the inverting input terminal INN, while a gate of the other one of the PMOS transistors MP1 and MP2 is connected to the non-inverting input terminal INP.
(22) The NMOS input differential pair 12 includes two NMOS transistors MN1 and MN2. A gate of one of the NMOS transistors MN1 and MN2 is connected to the non-inverting input terminal INP, while a gate of the other one of the NMOS transistors MN1 and MN2 is connected to the inverting input terminal INN.
(23) The first input tail current source 14 supplies a first tail current Itp to the PMOS input differential pair 10. The second input tail current source 16 supplies a second tail current Itn to the NMOS input differential pair 12.
(24) The output stage 20 includes an upper-side circuit 22 and a lower-side circuit 21, which are vertically stacked between a power supply line VDD and a ground line VSS. The lower-side circuit 21 is connected to the PMOS input differential pair 10, while the upper-side circuit 22 is connected to the NMOS input differential pair 12. The output terminal OUT is drawn from a node of the inside of the output stage 20. In this example, a connection node between the upper-side circuit 22 and the lower-side circuit 21 serves as an OUT terminal.
(25) The first correction circuit 40 corrects an offset voltage V.sub.OSP of the PMOS input differential pair 10. The second correction circuit 70 corrects an offset voltage V.sub.OSN of the NMOS input differential pair 12.
(26) The configurations of the first correction circuit 40 and the second correction circuit 70 are not limited. The first correction circuit 40 of
(27) A differential current corresponding to an offset flows through the PMOS correction differential pair 52. The differential current is converted into a voltage signal by the first load circuit 56. The first load circuit 56 also operates as a common-mode feedback circuit.
(28) The first gm amplifier 60 includes a PMOS differential pair 62 and a current source 64 and converts the differential voltage signal, which is the output of the first correction differential amplifier 50, into a differential current signal. The differential current signal is supplied to the lower-side circuit 21 of the output stage 20.
(29) The first correction differential amplifier 50 can cancel the input offset voltage V.sub.OSP of the PMOS input differential pair 10 by adjusting the amount of current generated by the first offset current source 58 and its polarity.
(30) The second correction circuit 70 includes a second correction differential amplifier 80 and a second gm amplifier 90 and has a configuration similar to that of the first correction circuit 40. The second correction differential amplifier 80 has a configuration similar to that of the first correction differential amplifier 50 and includes an NMOS correction differential pair 82, a second correction tail current source 84, a second load circuit 86, and a second offset current source 88.
(31) The second gm amplifier 90 includes an NMOS differential pair 92 and a current source 94 and has a configuration similar to that of the first gm amplifier 60. The second correction differential amplifier 80 can cancel the input offset voltage V.sub.OSN of the NMOS input differential pair 12 by adjusting the amount of current generated by the second offset current source 88 and its polarity.
(32) When the operational amplifier 1A is incorporated into a feedback loop, the first input voltage V.sub.+ and the second input voltage V.sub.− are substantially equal to each other (virtual ground). In a region in which these equal input voltages V.sub.+ and V.sub.− are low (this region will be hereinafter referred to as a “PMOS differential pair operation region”), the operation of the PMOS input differential pair 10 is dominant. In a region in which these equal input voltages V.sub.+ and V.sub.− are high (this region will be hereinafter referred to as an “NMOS differential pair operation region”), the operation of the NMOS input differential pair 12 is dominant. A voltage range in which both the PMOS input differential pair 10 and the NMOS input differential pair 12 operate will be hereinafter referred to as a “transition region.”
(33)
(34) The configuration of the operational amplifier 1A is as described above. Before the operation of the operational amplifier 1A is described, an operational amplifier 1S will be examined. The operational amplifier 1S has a simplified configuration (hereinafter referred to as a “comparative technique 1”) from the configuration of the operational amplifier 1A.
(35) (Comparative Technique 1)
(36)
(37)
(38) An effect of an offset voltage V.sub.OFS on the output voltage V.sub.OUT in the operational amplifier 1S is examined.
(V.sub.OSP−V.sub.OUT)G.sub.1−V.sub.OUT×G.sub.S=V.sub.1
V.sub.OUT=V.sub.1×G.sub.0
V.sub.OUT=G.sub.0{(V.sub.OSP−V.sub.OUT)G.sub.1−V.sub.OUT×G.sub.S}
V.sub.OUT/G.sub.0=(V.sub.OSP−V.sub.OUT)G.sub.1−V.sub.OUT×GS≈0
V.sub.OUT(G.sub.1+G.sub.S)=V.sub.OSPG.sub.1
V.sub.OUT=V.sub.OSP/(1+G.sub.S/G.sub.1)
(39) That is, when the gain G.sub.S of the first correction circuit 40 is sufficiently large and G.sub.S>>G.sub.1 holds, the effect of the offset voltage V.sub.OSP of the main amplifier can be significantly reduced. The offset voltage V.sub.OSN of the NMOS input differential pair 12 is output as it is without being corrected.
(40)
(41) With the comparative technique 1, the offset voltage of the NMOS input differential pair 12 is not corrected. Consequently, the offset voltage V.sub.OFS becomes large in the transition region and the NMOS differential pair operation region.
(42) Return to the description of the operation of the operational amplifier 1A according to the first embodiment.
(43) An effect of the offset voltage V.sub.OSP included in the output voltage V.sub.OUT in the PMOS differential pair operation region is expressed by the following equation.
V.sub.OUT=V.sub.OSP/(1+G.sub.S1/G.sub.1)
(44) Therefore, when G.sub.S1>>G.sub.1 holds, the effect of the offset voltage V.sub.OSP is corrected by the first correction circuit 40.
(45) An effect of the offset voltage V.sub.OSN included in the output voltage V.sub.OUT in the NMOS differential pair operation region is expressed by the following equation.
V.sub.OUT=V.sub.OSN/(1+G.sub.S2/G.sub.2)
(46) Therefore, when G.sub.S2>>G.sub.2 holds, the effect of the offset voltage V.sub.OSN is corrected by the second correction circuit 70.
(47) The following focuses on the transition region. In the transition region, both the first correction circuit 40 and the second correction circuit 70 operate. An effect of the offset voltage V.sub.OSP included in the output voltage V.sub.OUT is expressed by the following equation.
V.sub.OUT=V.sub.OSP/(1+(G.sub.S1+G.sub.S2)/G.sub.1)
(48) Since (G.sub.S1+G.sub.S2)>>G.sub.1 holds, the effect of the offset voltage V.sub.OSP is corrected by both the first correction circuit 40 and the second correction circuit 70.
(49) Similarly, an effect of the offset voltage V.sub.OSN included in the output voltage V.sub.OUT is expressed by the following equation.
V.sub.OUT=V.sub.OSN/(1+(G.sub.S1+G.sub.S2)/G.sub.2)
(50) Since (G.sub.S1+G.sub.S2)>>G.sub.2 holds, the effect of the offset voltage V.sub.OSN is corrected by both the first correction circuit 40 and the second correction circuit 70.
(51)
(52) Particularly, in the transition region, the offset voltage V.sub.OSP of the PMOS input differential pair 10 can be corrected not only by the first correction circuit 40 but also by the second correction circuit 70. Therefore, the effect of the offset voltage V.sub.OSP of the PMOS input differential pair 10 in the transition region is smaller than that of the comparative technique 1.
(53) Similarly, in the transition region, the offset voltage V.sub.OSN of the NMOS input differential pair 12 can be corrected not only by the second correction circuit 70 but also by the first correction circuit 40.
(54)
(55) A constant voltage Vp generated by a bias circuit 23 is input into a gate of the PMOS transistor MP4. A current I.sub.P4 resulting from Ip.sub.0−Itp flows through the PMOS transistor MP4. This current is copied by a current mirror circuit including NMOS transistors MN4 and MN3. The NMOS transistor MN3 corresponds to the second input tail current source 16. In other words, the current Itn of the second input tail current source 16 increases as the current Itp of the first input tail current source 14 decreases.
(56) The PMOS differential pair 62 includes PMOS transistors MP5 and MP6. The current source 64 includes a PMOS transistor MP7. The PMOS correction differential pair 52 includes PMOS transistors MP12 and MP13. The first correction tail current source 54 includes a PMOS transistor MP14. The current mirror voltage V.sub.CMP is applied to gates of the PMOS transistors MP7 and MP14 such that a constant current flows.
(57) The output stage 20 includes PMOS transistors MP8 to MP11 and NMOS transistors MN7 to MN10. The current mirror voltage V.sub.CMP is applied to gates of the PMOS transistors MP10 and MP11 such that a constant current flows.
(58) A bias voltage Vbp is applied to gates of the PMOS transistors MP8 and MP9. The bias voltage Vbp is generated by a bias circuit, not illustrated. The bias voltage Vbp may be equal to the current mirror voltage V.sub.CMP.
(59) A constant current circuit 24 and a gate-grounded circuit 25 constitute a low-voltage cascode current mirror circuit. A bias voltage Vbn is applied to gates of the NMOS transistors MN7 and MN8, which serve as the gate-grounded circuit 25. The bias voltage Vbn may be equal to a current mirror voltage V.sub.CMN.
(60) The NMOS differential pair 92 includes NMOS transistors MN5 and MN6. The current source 94 includes the NMOS transistor MN6. The NMOS correction differential pair 82 includes NMOS transistors MN11 and MN12. The second correction tail current source 84 includes an NMOS transistor MN13.
(61) The current mirror voltage V.sub.CMN is applied to gates of the NMOS transistors MN6 and MN13 such that a constant current flows.
(62) The configuration of the operational amplifier 1A is not limited to the configuration illustrated in
Second Embodiment
(63) If threshold voltages of the PMOS transistors included in the PMOS input differential pair 10 and the NMOS transistors included in the NMOS input differential pair 12 vary, the offset voltage may have a peak or a dip in the transition region.
(64)
(65) As described above, the tail current Itp generated by the first input tail current source 14 decreases as the input voltages V.sub.+ and V.sub.− increase.
(66) In the first embodiment, the second input tail current source 16 operates in a complementary manner to the first input tail current source 14, and as the tail current Itp decreases, the tail current Itn increases. By contrast, the current source 94 of the second gm amplifier 90 generates a constant current independent of the input voltages V.sub.+ and V.sub.−.
(67) On the other hand, in the second embodiment, the current of the second input tail current source 16 and the current of the current source 94 of the second gm amplifier 90 change in a complementary manner to the current of the first input tail current source 14.
(68) The first gm amplifier 60 includes a stop circuit 66 and a variable current source 68 in addition to the PMOS differential pair 62 and the current source 64. When the stop circuit 66 detects a state in which the current that flows through the PMOS input differential pair 10 becomes zero, the stop circuit 66 switches to an off (interruption) state, interrupting the current to be supplied to the PMOS differential pair 62.
(69) The variable current source 68 sinks current from a connection node between the current source 64 and the stop circuit 66. The current of the variable current source 68 is in conjunction with the second input tail current source 16 and the current source 94 and changes in a complementary manner to the current of the first input tail current source 14.
(70) The first input tail current source 14, the second input tail current source 16, the variable current source 68, and the current source 94 illustrated in
(71)
(72) The PMOS transistors MP15 and MP16 are replicas of the PMOS transistors MP1 and MP2 of the PMOS input differential pair 10 and operate in conjunction with the state of the PMOS input differential pair 10. When the input voltage V.sub.+ and V.sub.− increase and the current that flows through the PMOS input differential pair 10 becomes zero, the stop circuit 66 switches to the off (interruption) state.
(73) The variable current source 68 includes a PMOS transistor MP17 and an NMOS transistor MN14. A gate of the NMOS transistor MN14 is connected to gates of the NMOS transistors MN3, MN4, and MN6, forming a current mirror circuit. The NMOS transistor MN14 sinks current that is in conjunction with the NMOS transistor MN3 (second input tail current source 16).
(74) The configuration of the operational amplifier 1B is as described above.
(75) As can be understood from
(76) While the embodiments of the present disclosure have been described using specific terms, these embodiments have been presented only to describe some principles and applications of the present disclosure. These embodiments are for illustrative purposes only and various other modifications and arrangement changes can be made without departing from the spirit and scope of the present disclosure defined in appended claims.