Systems and methods for regenerative ejector-based cooling cycles

Abstract

Systems and methods for regenerative ejector-based cooling cycles that utilize an ejector as the motivating force in a cooling loop to regeneratively sub-cool a refrigerant in a single-stage cooling cycle.

Claims

1. A system for use in a single-stage cooling cycle, which comprises: a single refrigerant; an ejector for mixing a condensed liquid form of the single refrigerant and a first vaporized form of the single refrigerant to form a two-phase form of the single refrigerant; a flash economizer in fluid communication with the ejector for separating the two-phase form of the single refrigerant from the ejector into a second vaporized form of the single refrigerant and a liquid form of the single refrigerant; an expansion valve positioned between a liquid refrigerant line connected to the flash economizer and a sub-cooler for converting a portion of the liquid form of the single refrigerant from the liquid refrigerant line into an expanded two-phase form of the single refrigerant; and the sub-cooler in fluid communication with the expansion valve for cooling another portion of the liquid form of the single refrigerant and producing the first vaporized form of the single refrigerant and a separate sub-cooled liquid form of the single refrigerant.

2. The system of claim 1, further comprising a pump positioned between the flash economizer and the sub-cooler for distributing the liquid form of the single refrigerant.

3. The system of claim 1, further comprising an evaporator in fluid communication with the sub-cooler for heating the separate sub-cooled liquid form of the single refrigerant by transferring heat from an external source to the separate sub-cooled liquid form of the single refrigerant and producing a third vaporized form of the single refrigerant.

4. The system of claim 3, wherein the flash economizer is connected to the evaporator for receiving the third vaporized form of the single refrigerant.

5. The system of claim 1, further comprising a compressor connected to the flash economizer for compressing the second vaporized form of the single refrigerant.

6. The system of claim 1, further comprising a pump positioned upstream from the ejector for increasing at least one of a discharge pressure at the ejector and an intermediate pressure at the flash economizer.

7. The system of claim 1, wherein a temperature and a pressure for the second vaporized form of the single refrigerant are substantially 72° F. and substantially 89 psia, respectively.

8. The system of claim 1, wherein a temperature and a pressure for the liquid form of the single refrigerant are substantially 95° F. and substantially 129 psia, respectively.

9. The system of claim 1, wherein a temperature and a pressure for the separate sub-cooled liquid form of the single refrigerant are substantially 68° F. and substantially 88 psia, respectively.

10. The system of claim 1, wherein a temperature and a pressure for the two-phase form of the single refrigerant are substantially 72° F. and substantially 89 psia, respectively.

11. A single stage cooling method, which comprises: mixing a condensed liquid form of a single refrigerant and a first vaporized form of the single refrigerant to form a two-phase form of the single refrigerant; separating the two-phase form of the single refrigerant into a second vaporized form of the single refrigerant and a liquid form of the single refrigerant; converting a portion of the liquid form of the single refrigerant into an expanded two-phase form of the single refrigerant; and cooling another portion of the liquid form of the single refrigerant by transferring heat from the another portion of the liquid form of the single refrigerant to the expanded two-phase form of the single refrigerant and producing the first vaporized form of the single refrigerant and a separate sub-cooled liquid form of the single refrigerant.

12. The method of claim 11, further comprising heating the separate sub-cooled liquid form of the single refrigerant by transferring heat from an external source to the sub-cooled liquid form of the single refrigerant and producing a third vaporized form of the single refrigerant.

13. The method of claim 11, further comprising compressing the second vaporized form of the single refrigerant.

14. The method of claim 11, further comprising increasing at least one of a discharge pressure at the ejector and an intermediate pressure at a flash economizer with a pump.

15. The method of claim 11, wherein a temperature and a pressure for the second vaporized form of the single refrigerant are substantially 72° F. and substantially 89 psia, respectively.

16. The method of claim 11, wherein a temperature and a pressure for the liquid form of the single refrigerant are substantially 95° F. and substantially 129 psia, respectively.

17. The method of claim 11, wherein a temperature and a pressure for the separate sub-cooled liquid form of the single refrigerant are substantially 68° F. and substantially 88 psia, respectively.

18. The method of claim 11, wherein a temperature and a pressure for the two-phase form of the single refrigerant are substantially 72° F. and substantially 89 psia, respectively.

19. The method of claim 11, wherein a temperature and a pressure for the first vaporized form of the single refrigerant are substantially 60° F. and substantially 72 psia, respectively.

20. The method of claim 11, wherein the single refrigerant is a refrigerant with a cooling duty of 5.4 MW for cooling a circulating cooling water system from substantially 86° F. to substantially 72° F.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The detailed description is described below with reference to the accompanying drawings, in which like elements are referenced with like reference numbers, in which:

(2) FIG. 1 is a schematic diagram illustrating a system for use in a conventional two-stage ejector-based cooling cycle.

(3) FIG. 2 is a schematic diagram illustrating one embodiment of a system for use in a single-stage regenerative ejector-based cooling cycle.

(4) FIG. 3 is a Pressure-Enthalpy diagram comparing anticipated pressure/enthalpy values at state points for the system illustrated in FIG. 2 and a conventional four (4) component cooling cycle.

(5) FIG. 4 is the schematic diagram of the system in FIG. 2 with the reference numbers replaced by the corresponding state points in FIG. 3.

(6) FIG. 5 is a schematic diagram illustrating one embodiment of a system for use in two combined single-stage regenerative ejector-based cooling cycles.

DETAILED DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS

(7) The subject matter of the present disclosure is described with specificity, however, the description itself is not intended to limit the scope of the disclosure. The subject matter described herein thus, might also be embodied in other ways, to include different structures, steps and/or combinations similar to and/or fewer than those described herein, in conjunction with other present or future technologies. Although the term “step” may be used herein to describe different elements of methods employed, the term should not be interpreted as implying any particular order among or between various steps herein disclosed unless otherwise expressly limited by the description to a particular order. Other features and advantages of the disclosed embodiments will be or will become apparent to one of ordinary skill in the art upon examination of the following figures and detailed description. It is intended that all such additional features and advantages be included within the scope of the disclosed embodiments. Further, the illustrated figures are only exemplary and are not intended to assert or imply any limitation with regard to the environment, architecture, design, or process in which different embodiments may be implemented. To the extent that temperatures and pressures are referenced in the following description, those conditions are merely illustrative and are not meant to limit the disclosure.

(8) The systems and methods disclosed herein thus, improve conventional two-stage cooling cycles by utilizing an ejector as the motivating force in a cooling loop to regeneratively sub-cool a refrigerant in a single-stage cooling cycle. The systems and methods disclosed herein accomplish the same or greater energy efficiency as a conventional two-stage cooling cycle, but with less equipment because a second stage is not needed to accomplish the subcooling effect. The single-stage cooling cycle disclosed herein also do not require a high entrainment ratio ejector, which reduces the compression ratio and increases the energy efficiency of the cooling cycle.

(9) In one embodiment, the present disclosure includes a system for use in a single-stage cooling cycle, which comprises: i) a single refrigerant; ii) an ejector for mixing a condensed liquid form of the single refrigerant and a first vaporized form of the single refrigerant to form a two-phase form of the single refrigerant; iii) a flash economizer in fluid communication with the ejector for separating the two-phase form of the single refrigerant from the ejector into a second vaporized form of the single refrigerant and a liquid form of the single refrigerant; iv) an expansion valve positioned between a liquid refrigerant line connected to the flash economizer and a sub-cooler for converting a portion of the liquid form of the single refrigerant from the liquid refrigerant line into an expanded two-phase form of the single refrigerant; and v) the sub-cooler in fluid communication with the expansion valve for cooling another portion of the liquid form of the single refrigerant and producing the first vaporized form of the single refrigerant and a separate sub-cooled liquid form of the single refrigerant.

(10) In another embodiment, the present disclosure includes a single stage cooling method, which comprises: i) mixing a condensed liquid form of a single refrigerant and a first vaporized form of the single refrigerant to form a two-phase form of the single refrigerant; ii) separating the two-phase form of the single refrigerant into a second vaporized form of the single refrigerant and a liquid form of the single refrigerant; iii) converting a portion of the liquid form of the single refrigerant into an expanded two-phase form of the single refrigerant; and iv) cooling another portion of the liquid form of the single refrigerant by transferring heat from the another portion of the liquid form of the single refrigerant to the expanded two-phase form of the single refrigerant and producing the first vaporized form of the single refrigerant and a separate sub-cooled liquid form of the single refrigerant.

(11) Referring now to FIG. 2, one embodiment of a system 200 for use in a single-stage regenerative ejector-based cooling cycle with a single refrigerant is illustrated. An exemplary refrigerant is an R-134A refrigerant with a cooling duty of 5.4 MW for cooling a circulating cooling water system from 30° C. (86° F.) to 22° C. (72° F.), although others may be used.

(12) A vapor refrigerant enters a compressor 204 from a first vaporized refrigerant line 202 and is compressed to a pressure of 114 psig and a temperature of 107° F. The compressed vapor refrigerant passes through a compressed refrigerant line 206 to a heat exchanger referred to as an evaporative condenser 208. The condensed liquid refrigerant passes through a condensed refrigerant line 210 with the aid of a pump 207 at a temperature of 95° F. to an ejector 214. Due to the flexibility provided by the pump 207 and the ejector 214, the system 200 can achieve a higher coefficient of performance and lower energy consumption than conventional systems. The pump 207 thus, enables a higher discharge pressure at the ejector 214 and a higher intermediate pressure at the flash economizer 212. Optionally, the pump 207 may be removed based on capital costs, maintenance concerns and/or system restrictions.

(13) The condensed liquid refrigerant enters the ejector 214 as motive fluid where it is mixed with vaporized refrigerant from a second vaporized refrigerant line 226 and is ejected from the ejector 214 as a two-phase refrigerant. The motive fluid will always be a liquid because it is located directly downstream from the evaporative condenser 208. The two-phase refrigerant passes through a two-phase refrigerant line 216 to a flash economizer 212 where it is flashed into a vapor refrigerant and a liquid refrigerant. Optionally, an adjustment valve may be used for operational flexibility.

(14) The vapor refrigerant from the flash economizer 212 enters the compressor 204 through the first vaporized refrigerant line 202. The liquid refrigerant from the flash economizer 212 passes through a liquid refrigerant line 220 to a pump 222. Optionally, the flash economizer 212 and the pump 202 may be unnecessary for smaller cooling cycles and thus, removed. The liquid refrigerant is pumped to an expansion valve 223 and/or a sub-cooler 224 based on a control valve (not shown).

(15) The liquid refrigerant expands as it passes through the expansion valve 223. The expanded two-phase refrigerant passes through an expanded refrigerant line 225 to the sub-cooler 224 where it is vaporized by heat and used to cool the liquid refrigerant from the pump 222. The vaporized refrigerant from the sub-cooler 224 passes through the second vaporized refrigerant line 226 to the ejector 214.

(16) The sub-cooled liquid refrigerant from the sub-cooler 224 passes through a sub-cooled refrigerant line 228 to an evaporator 230 where it is vaporized by heat into a vaporized refrigerant that passes through a third vaporized refrigerant line 232 to the flash economizer 212 where it is eventually recycled back to the compressor 204 through the first vaporized refrigerant line 202. The system 200 requires a single refrigerant and thus, fewer components than the conventional system 100 for use in a two-stage ejector-based cooling cycle, which is less economical and efficient at cooling.

(17) The Pressure-Enthalpy diagram in FIG. 3 compares anticipated pressure/enthalpy values at state points for the system 200 illustrated in FIG. 2 and a conventional four (4) component cooling cycle. The dashed lines connect the state points for the system 200 and the dashed/dotted lines connect the state points for the conventional 4 component cooling cycle. The Bubble Point Curve represents the line beyond which the refrigerant is a liquid. The Dew Point Curve represents the line beyond which the refrigerant is a vapor.

(18) In FIG. 4, the system 200 in FIG. 2 is illustrated with the reference numbers replaced by the corresponding state points in FIG. 3. Significantly, the transition of the refrigerant from state point 040 to state point 010 by means of the sub-cooler 224 facilitates a higher inlet pressure at the compressor 204 at state point 001 and a subsequent reduction in the differential pressure between state points 001 and 002. State point 0010 for the system 200 compared to state point 008 in the conventional 4 component cycle illustrated in FIG. 3 demonstrate that the single refrigerant in the system 200 achieves the same cooling temperature as the conventional 4 component cycle while operating at a higher pressure than the conventional 4 component cycle, which reduces compression energy.

(19) Table 1 below compares the anticipated performance of the conventional 4 component cooling cycle and the single-stage regenerative ejector-based cooling cycle illustrated in FIG. 2 using a simulation model (Aspen HYSYS version 12.1) with projected ejector performance. As demonstrated by the anticipated results, the single-stage regenerative ejector-based cooling cycle illustrated in FIG. 2 would yield a higher coefficient of performance with less compression power.

(20) TABLE-US-00001 TABLE 1 Conventional FIG. 2 Cooling Cycle Cooling Cycle Cooling Duty, MW 5.4 5.4 Coefficient of Performance 10.05 11.43 Compression Power, kW 534 470

(21) The system 200 in FIG. 2 can be combined with another single-stage regenerative ejector-based cooling cycle like the one illustrated in FIG. 2 by replacing the evaporator 230 in one cooling cycle and the evaporative condenser 208 in the other cooling cycle with a single cascade exchanger 502 as illustrated in FIG. 5, which enables cooling at lower temperatures such as, for example, in ultra-low temperature applications with independent refrigerants.

(22) While the present disclosure has been described in connection with presently preferred embodiments, it will be understood by those skilled in the art that it is not intended to limit the disclosure of those embodiments. Preexisting ejector-based cooling cycles may be retrofitted or modified according to the disclosure herein, which may also be implemented in any other refrigeration process employed in an enclosed structure for heating or cooling to achieve similar results. It is therefore, contemplated that various alternative embodiments and modifications may be made to the disclosed embodiments without departing from the spirit and scope of the disclosure defined by the appended claims and equivalents thereof