Encapsulation structure of organic light emitting diode display panel and manufacturing method thereof

Abstract

An encapsulation structure of an organic light emitting diode (OLED) display panel and a manufacturing method thereof are provided. By changing an edge design of a panel encapsulation structure and adding an encapsulation reduction layer to the encapsulation structure, the encapsulation reduction layer can be restored by subsequent processing after the encapsulation reduction layer is eroded by water and oxygen. This prevents an OLED display device from being oxidized, thereby extending a life of a device.

Claims

1. A method of manufacturing an encapsulation structure of an OLED display panel, comprising following steps: S1: providing an OLED display panel to be packaged; S2: forming a first inorganic film layer, wherein the first inorganic film layer covers an organic light emitting material region of the OLED display panel; S3: forming a first peelable film on an upper side or an outer side of an end portion of the first inorganic film layer; S4: sequentially forming a first organic film layer, an encapsulation reduction layer, a second organic film layer, and a second inorganic film layer in a region defined by the first peelable film; wherein a top of the second inorganic film layer is lower than a top of the first peelable film; S5: peeling the first peelable film, and forming a second peelable film in a first peelable film region, wherein a top of the second peelable film is lower than the top of the second inorganic film layer; S6: forming a barrier film outside the peelable film, wherein a top of the barrier film is flush with the top of the second inorganic film layer; and S7: determining whether to perform a dry reduction process to the encapsulation reduction layer through a color change of the encapsulation reduction layer.

2. The method of manufacturing the encapsulation structure of the OLED display panel according to claim 1, wherein steps S5 and S6 are combined into following steps: S5: peeling the first peelable film, and forming a peelable water-oxygen barrier film in the first peelable film region, wherein a top of the peelable water-oxygen barrier film is flush with the top of the second inorganic film layer.

3. The method of manufacturing the encapsulation structure of the OLED display panel according to claim 1, wherein S7 further comprises following steps: S71: if the encapsulation reduction layer has no color change, the encapsulation reduction layer is not subjected to the dry reduction process; S72: if the encapsulation reduction layer undergoes a color change, the encapsulation reduction layer is subjected to a dry reduction process, comprising following steps: S721: peeling the second peelable film and the barrier film; S722: passing a one-way flowing reducing gas into the reduction device, and performing the dry reduction process to the encapsulation reduction layer by using a common action of the reducing gas, the molecular sieve water-absorbing film, the first organic film layer, and the second organic film layer; and S723: reforming the second peelable film and the barrier film, wherein the second peelable film and the barrier film are disposed at positions where the second peelable film and the barrier film are originally disposed.

4. The method of manufacturing the encapsulation structure of the OLED display panel according to claim 1, wherein S7 further comprises following steps: S71: if the encapsulation reduction layer has no color change, the encapsulation reduction layer is not subjected to the dry reduction process; S72: if the encapsulation reduction layer undergoes a color change, the encapsulation reduction layer is subjected to the dry reduction process, comprising following steps: S721: peeling the second peelable film and the barrier film; S722: passing a one-way flowing reducing gas into the reduction device, and performing the dry reduction process to the encapsulation reduction layer by using a common action of the reducing gas, the molecular sieve water-absorbing film, the first organic film layer, and the second organic film layer; and S723: forming the peelable water-oxygen barrier film, where t the peelable water-oxygen barrier film is located at positions where the second peelable film and the barrier film are originally disposed.

5. The method of manufacturing the encapsulation structure of the OLED display panel according to claim 1, wherein the first peelable film is peeled using UV light irradiation or laser peeling technology.

Description

DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a schematic diagram of a conventional encapsulation structure of an OLED panel.

(2) FIG. 2 is a schematic diagram of a first encapsulation structure of an OLED panel according to an embodiment of the present application.

(3) FIG. 3A to FIG. 3F are schematic diagrams of a method of manufacturing an encapsulation structure of a panel according to an embodiment of the present application.

(4) FIG. 4A to FIG. 4C are schematic diagrams of a reduction process of an encapsulation structure of a panel according to an embodiment of the present application.

(5) FIG. 5 is a schematic diagram of a second encapsulation structure of an OLED panel according to an embodiment of the present application.

(6) FIG. 6 is a schematic diagram of a third encapsulation structure of an OLED panel according to an embodiment of the present application.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(7) The present application provides n encapsulation structure of an organic light emitting diode (OLED) display panel and a manufacturing method thereof. In order to make the purpose, technical scheme and effect of the present application clearer and clearer. Hereinafter, the present application will be described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

(8) Referring to FIG. 2, which is a schematic diagram of a first encapsulation structure of an OLED panel according to an embodiment of the present application, comprising: a thin film encapsulation layer disposed on a surface of an OLED display panel.

(9) The OLED display panel includes a substrate 201, a protective layer 202, and a light emitting layer 203 disposed on the substrate.

(10) The thin film encapsulation layer comprises an encapsulation reduction layer 206, an encapsulation overlay layer, and a peelable water-oxygen barrier film 209. The encapsulation overlay layer comprises at least one organic film layer 205 and at least one inorganic film layer 204 which are arranged on top of each other. The peelable water-oxygen barrier film 209 comprises a peelable film 207 and a barrier film 208.

(11) The protective layer 202 is covered on the substrate 201. The light emitting layer 203 covers a part of a surface of the protective layer 202. Both the organic film layer 205 and the inorganic film layer 204 are centered on the encapsulation reduction layer 206 and are symmetrically arranged up and down. The inorganic film layer 204 is located outside the organic film layer 205. The inorganic film layer 204 on a side of the substrate 201 covers an organic light emitting material region of the light emitting layer 203. The peelable film 207 is located on an upper side of an end of the inorganic film layer on the substrate, and on an outside of an end of the inorganic film layer on the substrate. A top of the peelable film 207 is lower than a top of the inorganic film layer facing away from the substrate. The barrier film 208 is located outside the peelable film 207. A top of the barrier film 208 is flush with a top of the inorganic film layer 204 remote from the substrate.

(12) Referring to FIG. 3A to FIG. 3F, an embodiment of the present application also provides a method of manufacturing an encapsulation structure of an OLED display panel, comprising following steps:

(13) S1: referring to FIG. 3A, an OLED display panel to be packaged is provided. The OLED display panel includes a substrate 301, and a protective layer 302 and a light emitting layer 303 prepared on the substrate 301. A first inorganic film layer 304 is prepared on the OLED display panel. The first inorganic film layer 304 covers an organic light emitting material region of the light emitting layer 303.

(14) S3: as shown in FIG. 3B, a first peelable film 307 is prepared in an edge region of the first inorganic film layer 304, and a thickness of the first peelable film is about 20 μm.

(15) S4: as shown in FIG. 30, in a region defined by the first peelable film 307, a first organic film layer 305, an encapsulation reduction layer 306, a second organic film layer 309, and a second inorganic film layer 310 are sequentially prepared.

(16) S5: as shown in FIG. 3D, the first peelable film 307 is peeled by using UV light irradiation or laser peeling technology.

(17) S8: as shown in FIG. 3E, a second peelable film 311 is prepared in a region of the first peelable film 307, and a top of the second peelable film 311 is lower than a plane on which a top of the second inorganic film layer 310 is located.

(18) S9: as shown in FIG. 3F, a barrier film 308 is prepared outside the second peelable film 311, and a top of the barrier film 308 is flush with the top of the second inorganic film layer 310.

(19) S10: determining whether to perform a dry reduction process to the encapsulation reduction layer through a color change of the encapsulation reduction layer is provided.

(20) S101: if the encapsulation reduction layer has no color change, the encapsulation reduction layer is not subjected to the dry reduction process.

(21) S102: if the encapsulation reduction layer undergoes a color change, the encapsulation reduction layer is subjected to a dry reduction process. Referring to FIG. 4A to FIG. 40, which are schematic diagrams of a reduction process of an encapsulation structure of a panel according to an embodiment of the present application, comprising an encapsulation structure of a panel and a reduction device 410. The encapsulation structure of the panel includes a substrate 401, a protective layer 402, and a light emitting layer 403. The thin film encapsulation layer includes an encapsulation reduction layer 406, an encapsulation overlay layer formed by stacking an organic film layer 405 and an inorganic film layer 404 on each other, and a peelable water-oxygen barrier film. The water-oxygen barrier film includes a peelable film 407 and a barrier film 408. The reduction device 410 includes at least a molecular sieve water-absorption film 411 and a reducing gas 412. The dry reduction process of the encapsulated reduction layer includes the following steps:

(22) S1021: first, peel the peelable film 407 and the barrier film 408 by using UV light irradiation or laser peeling technology to obtain a panel encapsulation structure 409 after peeling the peelable film 407 and the barrier film 408, as shown in FIG. 4A.

(23) S1022: the panel encapsulation structure 409 is then placed in the reduction device 410. The reduction device 410 is provided with a reducing gas 412 flowing in a unidirectional direction at 80-100° C. Utilizing unidirectional fluidity of the reducing gas 412, flow of water and oxygen in the encapsulation reduction layer 406 in the panel encapsulation structure 409 is driven. The organic film layer 405 in the panel encapsulation structure 409 expands a path for water and oxygen flow in the encapsulation reduction layer 406. The circulating water and oxygen in the encapsulated reduction layer 406 will be adsorbed in the molecular sieve water-absorption film 411 in the reduction device 410. This realizes the reduction of the encapsulation reduction layer 406, and the reduction process is shown in FIG. 4B.

(24) S1023: finally re-package the restored panel encapsulation structure to obtain the encapsulation structure shown in FIG. 4C. That is, a new peelable film 407 and a barrier film 408 are formed in a region of the original peelable film 407 and the barrier film 408. This completes the packaging of the panel encapsulation structure and achieves recyclability.

(25) Referring to FIG. 5, which is a schematic diagram of a second encapsulation structure of an OLED panel according to an embodiment of the present application, including a substrate 501, a protective layer 502, a light emitting layer 503, and an encapsulation layer prepared on the substrate 501. The encapsulation layer includes a first inorganic film layer 504, a first organic film layer 505, an encapsulation reduction layer 506, a second organic film layer 509, a second inorganic film layer 510, and a peelable water-oxygen barrier film. The water-oxygen barrier film includes a peelable film 507 and a barrier film 508.

(26) The first inorganic film layer 504 covers an organic light emitting material region of the light emitting layer 503, and a region covered by the first inorganic film layer 504 is equal to a region defined by the water-oxygen barrier film.

(27) Referring to FIG. 6, which is a schematic diagram of a third encapsulation structure of an OLED panel according to an embodiment of the present application. Reference numerals are the same as those in FIG. 2, and will not be repeated here. Compared with FIG. 2 and FIG. 5, the difference is that the water-oxygen barrier film adopts an integrated design of a peelable film and a barrier film, which reduces the manufacturing process.

(28) As shown in FIG. 2, FIG. 5, and FIG. 6, respectively, three types of OLED panel encapsulation structure diagrams are shown. In the OLED panel encapsulation structure, the inorganic film layer, the organic film layer, and the encapsulation reduction layer are not limited to symmetrical settings. Different layer sequences can be selected according to different needs.

(29) In summary, by changing an edge design of the panel encapsulation structure and adding an encapsulation reduction layer to the encapsulation structure, the encapsulation reduction layer can be restored by subsequent processing after being eroded by water and oxygen. This prevents the OLED display device from being oxidized, thereby extending a life of the device.

(30) It can be understood that, for a person of ordinary skill in the art, equivalent replacements or changes may be made according to the technical solution and the inventive concept of the present application. All these changes or replacements should fall within the protection scope of the claims attached to the present application.