DUAL ENERGY DETECTOR AND METHODS FOR PROCESSING DETECTOR DATA
20230251208 · 2023-08-10
Inventors
Cpc classification
International classification
Abstract
Disclosed is a dual-energy X-ray detector having a first detector line with first detector elements and a second detector line with second detector elements arranged parallel thereto, the detector lines being arranged parallel to one another in the line direction and being arranged one behind the other in the direction of the X-ray beams to be detected in such a manner that the projection of the first and the second detector lines in the direction of one of the X-ray beams to be detected, which passes through the surface center of gravity of a reference detector element of the first or the second detector line, are overlappingly offset from each other by an effective offset (Dx; Dy). Further disclosed is an X-ray inspection apparatus including such a detector and methods for processing detector data provided by means of the detector.
Claims
1. A dual-energy X-ray detector comprising a first detector line having first detector elements and a second detector line arranged parallel thereto and having second detector elements, wherein the detector lines are arranged parallel to one another in the line direction and are arranged one behind the other in the direction of the X-rays (RX) to be detected in such a way, that the projection of the first and the second detector lines in the direction of one of the X-rays (RX) to be detected, which passes through the surface center of gravity of a reference detector element of the first or the second detector line, are overlappingly offset from one another by an effective offset (Dx; Dy).
2. The dual energy X-ray detector according to claim 1, wherein the detector lines are configured to be differentially spectrally selectively responsive to a spectrum of X-rays (RX) to be detected by the first detector line having associated first detector elements in the form of Lo-detector elements for primarily detecting low energy X-rays and the second detector line having associated second detector elements in the form of Hi-detector elements for primarily detecting high energy X-rays.
3. The dual energy X-ray detector according to claim 1, wherein at least one of: the first detector line and the second detector line are offset in the line direction by a first offset (Dx); the first detector line and the second detector line are offset orthogonally to the line direction by a second offset (Dz); and said first detector line having said first detector elements and said second detector line having said second detector elements are spaced apart from each other by a predetermined distance (D) and inclined with respect to a reference X-ray beam (RXref) in the line direction and/or orthogonal to the line direction by an inclination angle (a).
4. The dual energy X-ray detector according to claim 3, wherein the first offset (Dx) in line direction corresponds to half the width of the first and second detector elements in line direction; and/or the second offset (Dz) orthogonal to the line direction based on a ratio of a readout frequency fin 1/s for the detector elements and on a transport speed b in cm/s of an inspection object (216) relative to the dual energy X-ray detector is defined as
5. An X-ray inspection apparatus comprising a dual-energy X-ray detector according to claim 1, wherein the X-ray inspection apparatus is configured for transporting an inspection object (216) in a transport direction (TD) through the inspection apparatus; the line direction of the dual energy X-ray detector is arranged orthogonal to the transport direction (TD); and configured to provide acquired first detector data (Lo.sub.1, Lo.sub.2, Lo.sub.3, . . . , Lo.sub.N) and second detector data (Hi.sub.1, Hi.sub.2, Hi.sub.3, Hi.sub.N) of the inspection object.
6. A method for processing first detector data (Lo.sub.1, Lo.sub.2, Lo.sub.3, . . . , Lo.sub.N) and second detector data (Hi.sub.1, Hi.sub.2, Hi.sub.3, . . . , Hi.sub.N) provided by the X-ray inspection apparatus according to claim 5, the method comprising: (S1) calculating a respective virtual first detector datum (vLo) at the position of a real second detector element; and/or (S2) calculating a respective virtual second detector datum (vHi) at the position of a real first detector element.
7. The method according to claim 6, wherein the (S1) calculating a virtual first detector datum (vLo) at the position of a real second detector element comprises: (S11) calculating the virtual first detector datum based on a certain first number of real first detector data adjacent to the real second detector element and a certain second number of real second detector data adjacent to the real second detector element; and (S2) calculating a virtual high detector datum (vHi) at the position of a real low detector element comprises: (S21) calculating the virtual second detector datum based on the determined first number of real second detector data adjacent to the real first detector element and the determined second number of real first detector data adjacent to the real first detector element.
8. The method according to claim 6, wherein the method comprises at least one of the following steps: (S12) calculating the virtual first detector data as an average of adjacent first and second detector data and/or calculating (S22) the virtual second detector data as an average of adjacent second and first detector data; (S14) calculating the virtual first detector data taking into account the behavior of the values of the second detector data, and/or (S24) calculating the virtual second detector data taking into account the behavior of the values of the first detector data; and (S5) calculating the virtual second or first detector data based on the provided first and second detector data using a deep learning algorithm.
9. The method (1500) according to claim 6, wherein the detector data acquired and provided by the dual energy X-ray detector is indexed by a location variable n extending in the line direction of the dual energy X-ray detector starting at one end such that the first detector elements are real first detector data Lo.sub.1, Lo.sub.2, . . . , Lo.sub.n, . . . , Lo.sub.N of the inspection object and the second detector elements detect corresponding real second detector data Hi.sub.1, Hi.sub.2, . . . , Hi.sub.N of the inspection object, where 1≤n≤N and N is respectively the number of the second and first detector elements in the line direction of the dual energy X-ray detector; and the method further comprises: (S31) reading out the real second and first detector elements of the dual energy X-ray detector in pairs in the order Hi.sub.1, Lo.sub.1, Hi.sub.2, Lo.sub.2, Lo.sub.n, . . . , Hi.sub.N, Lo.sub.N or vice versa in the order Lo1, Hi.sub.1, Lo.sub.2, Hi.sub.2, . . . , Lo.sub.n, Hi.sub.n, . . . , Lo.sub.N, Hi.sub.N); (S32) forming, by means of a plurality of sequences read out by said reading-out step, a two-dimensional detector data matrix (M5-M10; M6*); and (S33) calculating the virtual second and/or first detector data using an adapted demosaicking algorithm comprising: (S331) reducing a three-color Bayer pattern (BAYER) underlying the demosaicking algorithm to a two-color checkerboard pattern (BAYER*); (S332) rotating the checkerboard pattern (BAYER*) 45° clockwise; (S333) assigning one color of the rotated checkerboard pattern (BAYER**) to the second detector data and the other color of the checkerboard to the first detector data; and (S334) applying the demosaicking algorithm adapted to the rotated checkerboard pattern (BAYER**) to the acquired real second and first detector data of the two-dimensional detector data matrix (M6-M10; M6*).
10. A readout method for first and second detector elements of a dual-energy X-ray detector, in particular in an X-ray inspection apparatus of claim 5, wherein the dual-energy X-ray detector comprises at least one dual-energy X-ray detector line with, per pixel, in each case one high-energy second detector element and one low-energy first detector element, which are arranged substantially congruently one above the other in the direction of the X-rays (RX) to be detected, wherein the second and first detector data of the detector line to be read out are defined as Hi(n) or Lo(n) for a respective second or first detector datum with the location variable n=1, 2, 3, . . . N for the respective position of the associated detector element in the detector line, where 1≤n≤N and N is the respective number of second and first detector elements in the line direction, the readout method comprising: (S7) reading out the second and first detector elements such that initially all detector elements of one type are read out along the location variable n and subsequently all other detector elements of the other type are read out along the location variable n.
11. A processing apparatus for processing the first detector data (Lo.sub.1, Lo.sub.2, Lo.sub.3, . . . , LO.sub.N) and second detector data (Hi.sub.1, Hi.sub.2, Hi.sub.3, . . . , Hi.sub.N) provided by the X-ray inspection apparatus according to claim 5.
12. A system comprising an X-ray inspection apparatus according to claim 5, wherein the X-ray inspection apparatus is configured to provide the second and first detector data based on scanning an inspection object to a processing apparatus and is connected to the processing apparatus (300) for data communication therewith.
13. A computer program product comprising instructions which, when the computer program is executed by a computer, cause the computer to execute the method according to claim 6.
14. A computer-readable data carrier comprising a computer program product according to claim 13.
15. A data carrier signal transmitting the computer program product according to claim 13.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0081] Further advantages, features and details of the here proposed solution(s) will be apparent from the following description, in which embodiments are described in detail with reference to drawings. In this connection, the features mentioned in the claims and in the description may each be essential individually or in any combination. Likewise, the features mentioned above and those further elaborated herein may each be used individually or in any combination. Functionally similar or identical parts or components are partly provided with the same reference signs. The terms “left”, “right”, “top” and “bottom” used in the description of the embodiments refer to the drawings in an orientation with normally readable figure designation or normally readable reference signs. The embodiments shown and described are not to be understood as conclusive but have an exemplary character for explaining the solution proposed here. The detailed description is for the information of the person skilled in the art, therefore known structures and procedures are not shown or explained in detail in the description, in order not to complicate the understanding of the description.
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DETAILED DESCRIPTION
[0097] Dual-energy X-ray radiography is based on the fact that the attenuation coefficient is a material property of the material being radiated through. By scanning an inspection object using X-rays, a grayscale image is initially obtained in which the gray level of a pixel corresponds to the respective measured intensity of the X-rays. By comparing the intensity of the X-rays used with the intensity measured at the image point, the attenuation coefficient of the material irradiated through there can be determined. The attenuation coefficient is a function of the nuclear charge number and the density of the irradiated material as well as the original energy of the used X-rays. If the inspection object is spectrally selectively scanned twice, e.g., with spectrally different X-ray energies, the dependence on the material density can be eliminated from the corresponding equations.
[0098] In order to perform the required two spectrally selective measurements simultaneously, so-called dual-energy detectors with a structure that essentially has two spectrally selective energy channels have become established. Such a detector thus simultaneously provides Hi(gh)-detector data caused by high-energy X-rays and Lo(w)-detector data caused by low-energy X-rays of a radiographed inspection object. With the difference in the magnitudes between the Lo- and the Hi-detector data, the nuclear charge number (also atomic number, proton number) of the material radiographed there or the effective nuclear charge number of the materials radiographed there in an inspection object can be inferred for each image point (pixel) corresponding to a detector element.
[0099] Organic materials largely have an atomic number of about 10 or less and metallic materials have an atomic number of more than 10. The materials in an inspection object can thus be classified according to the determined effective atomic number and, for optical material discrimination, the pixels in a displayed X-ray image can be colored accordingly. This principle is used, for example, in the visual evaluation of X-ray images of baggage at airport checkpoints, in that inspection apparatuses color image pixels with predominantly organic compounds orange, with predominantly metallic material blue and with a mixture of organic and metallic green in displayed X-ray images for optical material discrimination to the operating personnel.
[0100] The following description of
[0101] It should be noted that the representation of the detector used here is a simplification compared to the U- or L-shaped detector lines commonly used in practice. In case of a U- or L-shaped detector line and a fan-shaped X-ray fan aligned to it, the detector line does not run exclusively in the transport plane of the inspection objects. But the legs of the detector line always run orthogonal to the detected X-rays and also orthogonal to the transport or scanning direction z. Thus, the considerations made here for an I-shaped detector line running only in the xz-plane can be easily transferred to the U- and L-shaped detector lines used in practice.
[0102]
[0103] The detector line 2 includes dual-energy detector elements 3 arranged side by side; for clarity, only four such elements are shown, although in reality the number is usually higher (e.g., 1,000). For this purpose, each detector element 3 includes low-energy Lo(w)-detector elements 4 and high-energy Hi-(gh)-detector elements 5, respectively, which are sandwiched with respect to X-rays RX to be detected with a filter layer 6 (e.g. made of copper) in between. During the scanning of an inspection object, the Lo-detector elements 4 generate Lo-detector data which are mainly due to low-energy X-rays RX, while the Hi-detector elements 5 generate Hi-detector data which are due to high-energy X-rays RX. The detector 1 thus has at least two output channels: one at which the Hi-detector data is provided and one at which the Lo-detector data is provided.
[0104] The effective area A4 of the Lo-detector elements 4 and the effective area A5 of the Hi-detector elements 5 are essentially the same size. The effective areas of the Lo-detector elements 4 and the Hi-detector elements 5 have a length L in the line direction (i.e., longitudinal direction of the detector line 2) and a width W orthogonal thereto.
[0105] For example, the effective area of a detector element may be 0.8 mm (length L in the line direction) times 0.8 mm (width W across the line direction). For example, a typical detector line may be 80 cm in total in the line direction, so that the line includes approximately 1,000 detector elements. In principle, the dimensions of the detector elements are within a technically reasonable range and the length of the detector line is freely selectable.
[0106] In use, the detector line 2 is usually arranged transversely to a transport direction TD for an inspection object, so that the inspection object can be scanned line by line with the X-rays RX. The detector 1 can in principle include several detector lines 2. That is, with the detector 1 of
[0107]
[0108] The usual readout for providing the Hi- and/or Lo-detector data acquired with the detector 1 is illustrated in the left part of
[0109]
[0110] In the embodiments shown, each Hi-detector element and each Lo-detector element have the same length L in the row direction, i.e., longitudinal direction of the detector 100, and the same width W orthogonal thereto. In the embodiments shown, the lengths L.sub.Hi and L.sub.Lo as well as the widths W.sub.Hi and W.sub.Lo are equal, i.e. the effective areas of the Hi-detector elements 111 and Lo-detector elements 122 are equal.
[0111]
[0112] In the
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[0114] In the first detector line 110, a Lo-detector element 115 is shown providing a Lo-detector datum Lo.sub.4. However, unlike the detector lines 1 of
[0115] As explained above, the inventor has found that various approaches are possible for calculating the virtual Hi-detector data vHi.sub.# and Lo-detector data vLo.sub.#, which can be used alone or in combination.
[0116] For example, in a particularly simple approach, a virtual Lo-detector datum vLo.sub.# or Hi-detector datum vHi.sub.# can be calculated based on the mean or median of adjacent Hi- and/or Lo-detector data. For example, the Hi-detector datum missing from the real detector datum Lo.sub.4 acquired and provided by the Lo-detector element 113 may be calculated as a virtual Hi-detector datum vHi.sub.4 as follows:
[0117] Based on two as a certain first number of immediately adjacent real Hi-detector data Hi.sub.4 and Hi.sub.5, i.e., the detector data of the two Hi-detector elements 123 and 127 overlapping with the Lo-detector element 115 under consideration, i.e., adjacent in line to the left and right thereof, and the three as a certain second number of nearest real Lo-detector data Lo.sub.3, Lo.sub.4, and Lo.sub.5, i.e., the detector data of the Lo-detector element 115 under consideration and of the two Lo-detector elements 113 and 117 adjacent thereto on the left and right, the virtual Hi-detector datum vHi.sub.4 can be calculated.
[0118] Thus, the behavior of the values of the Lo-detector data, by means of the values Lo.sub.3, Lo.sub.4 and Lo.sub.5, can be considered when calculating the virtual Hi-detector datum vHi.sub.4. The values Hi.sub.3 and Hi.sub.4 can be averaged and used as a base value for the virtual Hi-detector datum vHi.sub.4. This approach can also be used as a basis for a machine learning algorithm, e.g., deep learning algorithm.
[0119] As a result, with the dual-energy X-ray detector 100 of the embodiment example of
[0120]
[0121] In
[0122] To calculate the missing detector data, the provided detector data can be processed, similar to what is explained in the
[0123] As a result, the dual-energy X-ray detector 100 of the embodiment of
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[0126] In the detector 1 of
[0127] For better understanding, a normal N passing through the centers of the two lines formed by the associated Hi-detector and Lo-detector elements is plotted in the
[0128] In the
[0129] The principle of the third implementation, which is thus illustrated in the
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[0131] The X-ray inspection apparatus 200, shown in highly simplified form, has radiation shielding curtains 202, 204, one of which is arranged at each of an input 206 and an output 208 of a radiation tunnel 210 of the X-ray inspection apparatus 200. Between the radiation shielding curtains 202, 204, within the radiation tunnel 210 is a radiation area 212 having at least one radiation source 214, such as an X-ray tube, with a collimator for generating an X-ray fan 215 that is aligned with the dual-energy X-ray detector 100 proposed herein. A transport device 218, for example a sliding belt conveyor, is used to transport a baggage item 216 as an inspection object in the transport direction TD through the radiation tunnel 210. The line-shaped detector 100 is L-shaped or U-shaped and arranged with its longitudinal direction orthogonal to the transport direction TD, so that the transport direction TD corresponds to the scanning direction of the inspection object 216.
[0132] The processing apparatus 300 is substantially configured for performing at least one of the methods proposed herein for processing the Hi- and/or Lo-detector data acquired by the dual-energy X-ray detector proposed herein. For example, the dual-energy X-ray detector 100 is one as shown in simplified form in the
[0133] The processing apparatus 300 may be part of a control device 220 of the X-ray inspection apparatus 100, as shown in the
[0134] The processing unit 300 may also be part of the detector 100, so that the detector data generated by the detector 100 is already processed at the detector 100 according to the measures proposed herein. Thus, the detector 100 proposed herein can in principle be made compatible with existing X-ray inspection apparatuses having conventional detector units. I.e., as a result, an implementation of the new detector 100 proposed here with integrated processing of the detector data could be used with lower system costs with a constant image quality in an X-ray inspection apparatus which is otherwise sufficiently identical in construction. Alternatively, the spatial resolution of an existing X-ray inspection apparatus could be increased at nearly the same system cost.
[0135] Referring now to
[0136] With reference to
[0137] The detector setup illustrated in the
[0138] A “real detector datum” is understood here as an intensity value for measured X-rays actually detected with a specific detector element physically present at the detector 100.
[0139] A “virtual detector datum” is understood herein to mean a virtual intensity value generated for at a particular location of a detector element physically absent from the detector 100, by calculation or otherwise.
[0140] If the value of a particular Lo-detector element 111, for example the detector datum Lo.sub.4, takes the value x, the associated Hi-detector datum can take values from x to x+a depending on the material being transmitted. For plastic, the difference a would be very small, i.e., the sought Hi-detector datum vHi.sub.4 and the Lo detector datum Lo.sub.4 would be approximately identical. For steel, the difference captured in a would be substantial. It is precisely this circumstance—as explained above—that is used for material detection by dual-energy radiography. That is, in order to distinguish steel from plastic or aluminum at a location, the information from the Hi-channel and the Lo-channel of the dual-energy X-ray detector 100 is needed for that location. If the value of the associated Lo detector datum could be inferred directly from a Hi-detector datum, two differently spectrally selective measurements would not be required.
[0141] The inventor has found that in the place of a real Lo- or Hi-detector datum, the associated missing value can be determined as a virtual vLo- or vHi-detector datum with a sufficient degree of accuracy. In this context, it is desirable for practicality to achieve a result as close to reality as possible with as little computing power as possible.
[0142] A simple approach would be, for example, to calculate the missing real Hi-detector datum to the real Lo-detector datum Lo.sub.4 as the average of the two neighboring real Hi-detector datums Hi.sub.4 and Hi.sub.5. However, this simple approach does not achieve the required accuracy.
[0143] The inventor has further found that the behavior of Hi-detector data in the Hi-channel and the behavior of Lo-detector data in the Lo-channel of the detector 100 are similar. In other words, when the signal in the Hi-channel decreases, it also decreases in the Lo-channel under real conditions and vice versa. Depending on the material being radiated through, more or less strongly. That is, the behavior of the detector data in the Lo-channel, i.e., the Lo-detector line 110 can be used in determining the virtual Hi-detector value vHi.sub.4. For example, as mentioned elsewhere, a deep-learning algorithm could be used that is trained to compute the missing virtual Hi- and/or Lo-detector data.
[0144] Before detailing here one approach that has been shown to be surprisingly implementable and to require low computational power to provide practical results, it is shown with reference to
[0145] In the
[0146] With reference to the X-ray inspection apparatus 200 shown as an example in the
[0147] As shown, for example, in
[0148] In the upper half of
[0149] The right part of the
[0150] The continuous movement of the inspection object during scanning as well as the sequential readout of the real detector elements effectively leads to a temporal offset between two adjacent readout processes as well as to a spatial offset in the pixels of an X-ray image assigned to the individual detector data. In the matrices M0 and M6-M10 of the right parts of
[0151] Now, with reference to the upper section of
[0152] With reference to the matrix M6 of
[0153] The configuration of the detector line 100 and the readout situation of
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[0155] With reference to the matrix M7 of
[0156] The readout situation of
[0157] For the overlapping offset Dy between the Hi-detector line 120 and the Lo-detector line 110 in the scanning direction (orthogonal to the line direction of the detector 100), it has proven particularly suitable to define the offset Dz as (m b)/(2 f), where b is the belt speed in cm/s and f is the readout frequency in 1/s and m is an odd integer (m=1, 3, 5, 7, . . . ). Alternatively or complementarily, the spatial resolution can be increased in the scan direction or orthogonal to the line direction of the detector by increasing the readout frequency f.
[0158] Now, with reference to
[0159] The readout situation illustrated in the
[0160] As shown in the left part of
[0161] Comparison of matrices M7 and M8 shows that the same result can be achieved with the modified readout sequence of
[0162] The readout situation of
[0163] Another effect of the second implementation will now be illustrated with reference to
[0164] Since X-ray machines are often integrated in a complex system of conveyors, it may sometimes be desirable to adapt the belt speed to these conditions.
[0165] The inventor has recognized that it is not necessary to develop different types of equipment to implement multiple conveyor speeds, since the second implementation of the present disclosure provides a high degree of flexibility. Now, with reference to
[0166] To the same offset Dz belong other pairs of values (b.sub.2, f.sub.2) at which a situation arises as shown below in
[0167] Now, with reference to
[0168] For a compromise between a good algorithm and an efficient algorithm for processing the real Hi- and/or Lo-detector data, the inventor has found that an algorithm from the field of digital optical photography is suitable. Digital photography uses image sensors with an upstream Color Filter Array (CFA), so that each individual pixel of the image sensor can detect only one of the three primary colors (red, blue, or green). The most commonly used pattern of such a CFA is the Bayer pattern mentioned above.
[0169] The inventor has recognized that the structure of the matrices M6-M10 provided by the detectors 100 proposed herein (
[0170] In the case of the image data generated by the image sensor with Bayer CFA, for each pixel, the respective two other color information must be supplemented by a suitable calculation. In the Hi- and/or Lo-detector data of
[0171] The inventor proposes to modify a CFA demosaicking used in digital image sensors for a processing of the real detector data of the detectors 100 proposed herein. Since there are numerous known implementations for CFA demosaicking, it should be sufficient here to explain the basic principle of adaptation. Indeed, the present disclosure is in no way limited to any particular single or particular implementation.
[0172] The core idea of CFA demosaicking is to calculate for each pixel of a Bayer pattern the missing two colors from the known actually detected colors in the near environment.
[0173] Correspondingly, this means for the matrix M6* that e.g., at the position of the real Hi-detector datum 44 the missing virtual Hi-detector datum 44 can be calculated from the actually acquired Hi- and/or Lo-detector data in the nearer environment.
[0174]
[0175] In the
[0176] In
[0177] Based on the foregoing, the CFA demosaicking algorithm for the Bayer pattern can be applied to the detector data in matrix M6*.
[0178] The inventor has found that the results are somewhat poorer because the detector dimensions are farther apart in the horizontal and vertical directions than the pixels in the Bayer pattern. However, this can be compensated for by the fact that the vertical detector data series can still be considered in the M6* matrix, which does not exist in the BAYER** Bayer pattern.
[0179] The algorithm for calculating the missing values is based on the publication “Color filter array demosaicking using high-order interpolation techniques with a weighted median filter for sharp color edge preservation” by Li and Randhawa (IEEE Transactions on image processing, Vol. 18, No. 9, September 2009), the contents of which are hereby incorporated by reference.
[0180] In this work, an interpolated value for the missing pixel is initially determined for each of a given number of spatial directions, based on a Taylor series expansion of the measured data in the near vicinity. Then, for each of these spatial directions, a gradient is calculated, which is a measure of how much the signal changes in the respective direction. With the help of these gradients, in a last step the weighted average value is formed from all interpolated values.
[0181] Using the adapted demosaicking method, the matrices of detector data provided by the detectors 100 proposed here provide surprisingly good results with an unanticipated low computational cost.
[0182] Finally, the following
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[0184] In the method 1300, the step S1 for calculating a virtual Hi-detector datum vLo at the position of a real Hi-detector element 122 includes: A step S11 for calculating the virtual Lo-detector datum based on a certain first number of real Lo-detector data adjacent to the real Hi-detector element 122 and a certain second number of real Lo-detector data adjacent to the real Hi-detector element 122.
[0185] In the method 1300, the step S2 for calculating a virtual Hi-detector datum vHi at the position of a real Lo-detector element 111 includes: A step S21 for calculating a virtual Hi-detector datum based on the determined first number of real Hi-detector data adjacent to the real Lo-detector element 111 and the determined second number of real Lo-detector data adjacent to the real Lo-detector element 111.
[0186] The step S11 has a step S12 for calculating the virtual Lo-detector data as a mean value from adjacent Hi- and/or Lo-detector data.
[0187] The step S21 includes a step S22 for calculating the virtual Hi-detector data as a mean value from adjacent Hi- and/or Lo-detector data.
[0188]
[0189] In the methods 1300, 1400 illustrated in the
[0190]
[0191] A step S31 of reading out the real Hi-detector and Lo-detector elements 111, 122 (cf.
[0192] A step S32 for forming, by means of several sequences Hi.sub.1, Lo.sub.1, Hi.sub.2, Lo.sub.2, . . . , Hi.sub.n, Lo.sub.n, . . . , Hi.sub.N, LO.sub.N (or Lo.sub.1, Hi.sub.1, Lo.sub.2, Hi.sub.2, . . . , Lo.sub.n, Hi.sub.n, . . . , LO.sub.N, Hi.sub.N) read out in this way, a two-dimensional Hi/Lo-detector data matrix M5-M10; M6* (cf.
[0193] A step S33 for calculating the virtual Hi- and/or Lo-detector data using an adapted demosaicking algorithm. The adaptation and application of the demosaicking algorithm have the following steps:
[0194] A step S331 for reducing a three-color Bayer pattern BAYER underlying the demosaicking algorithm to a two-color checkerboard pattern BAYER*.
[0195] A step S332 for computationally rotating the checkerboard pattern BAYER* by 45° clockwise.
[0196] A step S333 for assigning one color of the rotated checkerboard pattern BAYER** to the Hi- and/or Lo-detector data and the other color of the checkerboard to the Lo-detector data.
[0197] A step S334 for applying the demosaicking algorithm to the rotated checkerboard pattern BAYER** to the acquired real Hi- and/or Lo-detector data of the two-dimensional Hi/Lo-detector data matrix M6-M10; M6*.
[0198] As a result, the required virtual (i.e., missing) detector data are calculated by means of the adapted demosaicking algorithm in a similar way as the other two primary colors missing for a certain pixel can be calculated for a photosensor chip with BAYER color filter.
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[0200] The readout method 1600 of