RESONANT LC STRUCTURES
20230253147 · 2023-08-10
Assignee
Inventors
Cpc classification
H01F27/06
ELECTRICITY
H01F27/323
ELECTRICITY
International classification
H01F27/06
ELECTRICITY
Abstract
A resonant coil structure may include a plurality of conductors, including: a first conductor having a first end and a second end; a second conductor having a third end and a fourth end; a third conductor having a fifth end and a sixth end; and a fourth conductor having a seventh end and an eight end; and at least one galvanic coupling conductor that galvanically couples the first end to the fifth end and galvanically couples the fourth end to the eighth end.
Claims
1. A resonant coil structure, comprising: a plurality of conductors, including; a first conductor having a first end and a second end; a second conductor having a third end and a fourth end; a third conductor having a fifth end and a sixth end; a fourth conductor having a seventh end and an eighth end; and at least one galvanic coupling conductor that galvanically couples the first end to the fifth end and galvanically couples the fourth end to the eighth end.
2. The resonant coil structure of claim 1, further comprising a first insulating layer between the first conductor and the second conductor, a second insulating layer between the second conductor and the third conductor, and a third insulating layer between the third conductor and the fourth conductor.
3. The resonant coil structure of claim 1, wherein the first conductor, the second conductor, the third conductor and/or the fourth conductor comprises a plurality of turns.
4. The resonant coil structure of claim 1, wherein the plurality of conductors further comprises a fifth conductor galvanically coupled to the at least one galvanic coupling conductor having a ninth end aligned with the first end and a tenth end aligned with the second end, and the resonant coil structure further comprises a high-loss dielectric separating the first conductor from the fifth conductor, wherein the plurality of conductors further comprises a sixth conductor at least one galvanically coupled to the galvanic coupling conductor having an eleventh end aligned with the third end and a twelfth end aligned with the fourth end, and the resonant coil structure further comprises a high-loss dielectric separating the second conductor from the sixth conductor, wherein the plurality of conductors further comprises a seventh conductor galvanically coupled to the at least one galvanic coupling conductor having a thirteenth end aligned with the fifth end and a fourteenth end aligned with the sixth end, and the resonant coil structure further comprises a high-loss dielectric separating the third conductor from the seventh conductor, and/or wherein the plurality of conductors further comprises an eighth conductor galvanically coupled to the at least one galvanic coupling conductor having a fifteenth end aligned with the seventh end and a sixteenth end aligned with the eighth end, and the resonant coil structure further comprises a high-loss dielectric separating the fourth conductor from the eighth conductor.
5. The resonant coil structure of claim 4, wherein the high-loss dielectric comprises a printed circuit board substrate.
6. The resonant coil structure of claim 1, wherein the at least one galvanic coupling conductor galvanically couples each of the first end, the fourth end, the fifth end and the eighth end to each other.
7. The resonant coil structure of claim 1, wherein the resonant coil structure is inductively coupled to an excitation conductor to inductively excite the plurality of conductors.
8. The resonant coil structure of claim 1, wherein the at least one galvanic coupling conductor comprises a first galvanic coupling conductor that galvanically couples the first end and the fifth end and a second galvanic coupling conductor that galvanically couples the fourth end and the eighth end.
9. The resonant coil structure of claim 1, wherein any of the first to fourth conductors is formed in a conductor layer.
10. The resonant coil structure of claim 9, wherein any of the first to fourth conductors comprises a foil.
11. The resonant coil structure of claim 9, wherein the conductor layer has a C-shaped edge-wound shape.
12. The resonant coil structure of claim 9, wherein the conductor layer has a barrel-wound shape.
13. A plurality of resonant coil structures comprising the resonant coil structure of claim 1 and a second resonant coil structure, the second resonant coil structure comprising: a second plurality of conductors, including; a fifth conductor having a ninth end and a tenth end; a sixth conductor having an eleventh end and a twelfth end; a seventh conductor having a thirteenth end and a fourteenth end; an eighth conductor having a fifteenth end and a sixteenth end; and at least one second galvanic coupling conductor that galvanically couples the ninth end to the thirteenth end and galvanically couples the twelfth end to the sixteenth end, wherein the resonant coil structure and the second resonant coil structure are connected to one another.
14. The plurality of resonant coil structures of claim 13 connected to one another in series.
15. The plurality of resonant coil structures of claim 14, wherein the series connection of the plurality of resonant coil structures has a ring-shape and each resonant coil structure extends no more than partially around the ring.
16. The plurality of resonant coil structures of claim 15, wherein the series connection of the plurality of resonant coil structures extends more than 25% of the distance around the ring.
17. The plurality of resonant coil structures of claim 15, wherein the series connection of the plurality of resonant coil structures extends more than 50% of the distance around the ring.
18. The resonant coil structure of claim 1, wherein the first, second, third and fourth conductors are inductively coupled to one another.
19. The resonant coil structure of claim 1, wherein adjacent conductors of the first, second, third and fourth conductors are capacitively coupled to one another.
20. The resonant coil structure of claim 1, wherein the at least one galvanic coupling conductor comprises one or more vias, through-holes and/or slots plated or filled with one or more conductive materials.
21. The resonant coil structure of claim 4, wherein the at least one galvanic coupling conductor galvanically couples each of the ninth end, the twelfth end, the thirteenth end and the sixteenth end to each other.
22. A low frequency resonant structure, comprising: a plurality of stacked conductor layers disposed around a center point and inductively coupled to one another, successive conductors of the plurality of stacked conductor layers being capacitively coupled to one another though a respective dielectric layer, each of the plurality of stacked conductor layers having a first end and a second end; and a galvanic coupling conductor connected to first conductor layers of the plurality of stacked conductor layers at first ends of the first conductor layers and second conductor layers of the plurality of stacked conductor layers at second ends of the second conductor layers, wherein the plurality of stacked conductor layers form a closed current loop around the center point.
23. A resonant structure, comprising: a plurality of stacked conductor layers disposed around a center point and inductively coupled to one another, successive conductors of the plurality of stacked conductor layers being capacitively coupled to one another though a respective dielectric layer, each of the plurality of stacked conductor layers having a first end and a second end; a first conductor connecting first conductor layers of the plurality of stacked conductor layers at first ends of the first conductor layers; and a second conductor connecting second conductor layers of the plurality of stacked conductor layers at second ends of the second conductor layers.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0031] In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like reference character. For purposes of clarity, not every component may be labeled in every drawing. The drawings are not necessarily drawn to scale, with emphasis instead being placed on illustrating various aspects of the techniques and devices described herein.
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DETAILED DESCRIPTION
[0050] Electrical conductors operating at high frequency are impacted by the skin effect and the proximity effect. The former confines the HF current to the surface of the conductors, thereby significantly reducing the effective conductor cross-section; the latter causes magnetic field from one conductor to incur extra losses in adjacent conductors, resulting in non-uniform current density among conductors, increasing power loss.
[0051] Multilayer Self-Resonant Structures, or MSRSs, are resonant coils that may be made from alternating conductor (e.g., foil) layers and dielectric layers. These structures form an integrated inductive and capacitive component that achieves resonance with a single component. This integration can be used to force approximately equal current-density throughout the foil layers, which may significantly reduce the loss. Despite the promising performance of the MSRS, it may be difficult to integrate into a power electronic system because of the compensation architecture and constraints on the resonant frequency. Many embodiments of the MSRS are parallel resonators, which may require additional components to interface with voltage-fed power electronic topologies. Furthermore, MSRS embodiments may increase power electronic complexity and loss because of relatively high operating frequencies caused by 1) a single turn winding for creating magnetic flux, and 2) capacitance constraints due to integration of the winding and capacitor.
[0052] The inventors have developed a new electromagnetic component structure termed a “Low-Frequency Resonant Structure,” or LFRS, that can provide parallel resonance and achieve lower resonant frequencies than the MSRS given the same materials and size. The inventors have also developed improvements to the MSRS that enable the structure to be a series resonator and/or multiple turn resonator—enabling lower frequency operation and easier integration with power electronics.
Low-frequency Resonant Structure (LFRS)
[0053] The LFRS may be formed of one, or a string of multiple multilayer conductors with integrated capacitance (MCIC) whose electrical terminals are connected to one another to provide a closed current loop through the integrated capacitance. The MCIC, or the string of multiple MCICs, may be placed, or wrapped, one or multiple times (single-turn or multiturn LFRS) around a central axis or a mandrel of any cross-section, in a barrel-wound or edge-wound manner. Each MCIC may have a plurality of electrical terminals. An LFRS may comprise a MCIC whose terminals are electrically shorted to each other, thereby closing the inductive current loop. Or an LFRS comprising a string of multiple MCICs may be constructed by electrically connecting the second terminal of one MCIC to the first terminal of the subsequent MCIC in the string, and the second terminal of the last MCIC in the string to the first terminal of the first MCIC in the string, thereby closing the inductive current loop. In an LFRS, the total length of the MCICs (along the direction of the current flow) may be greater than 25%, optionally greater than 50%, of the total length of the current loop—the remainder of the length of the current loop being the physical length of the electrical connections.
[0054] The multilayer conductor with integrated capacitance (MCIC) is an electromagnetic component with a plurality of electrical terminals and a plurality of conductor layers. When not shorted together, electrical terminals are conductors that can carry electrical current into or out of a component to interface it with electronic circuits or systems. In an MCIC, the plurality of conductor layers may be isolated from one another by separation dielectric layers, and each conductor layer may be electrically connected to only one of the electrical terminals, and the conductor layers are arranged such that every conductor layer is adjacent to—except for the separation dielectric layers—and have some overlapping area with at least one conductor layer connected to the other electrical terminal; the conductor layers connected to the different electrical terminals are defined as having opposite orientations. Multiple LFRSs, of the same or different designs, may be placed together on the same central axis or mandrel. One or more single-turn or multiturn electrical conductors or MCICs may be wrapped around the same central axis or mandrel as the LFRS, to provide galvanic connection to a larger electrical system or power electronics system (e.g., a power source or a load).
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[0056] Current is induced in an LFRS from an alternating magnetic field, which may be created by a current loop proximal to the LFRS. The overlapping areas of adjacent conductor layers, each connected to a different terminal, forms integrated capacitance, through which current induced by the magnetic field is transferred in the form of a displacement current. The magnetic field may be generated by current running through one or more electrical conductors 5 wrapped around the same central axis or mandrel as the LFRS (as shown in
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[0059] The conductors 2, 3 and 5 (electrical conductors), may be, wholly or partially, made of any electrically conductive material or combination of materials, including but not limited to one or more metals such as silver, copper, aluminum, gold and titanium, and non-metallic materials such as graphite. The electrically conductive material may have an electrical conductivity of higher than 200 kS/m, optionally higher than 1 MS/m. The electrical conductors may have any physical shape including, but not limited to, solid material, foil, conductors laminated on a substrate, printed circuit board traces, electrode layers in multilayer ceramic capacitor (MLCC) processes, electrode layers in low-temperature co-fired ceramic (LTCC) processes, integrated circuit traces, or any combination of them.
[0060] Conductor layers, or electrical conductor layers or foils or foil layers, are electrical conductors in which the width of the conductor is much smaller (e.g., at least 10 times smaller) than the height of the conductor. Some examples may include, but are not limited to, foil layers forming a flat current loop (e.g. C-shaped, arc-shaped, rectangular-shaped, or any polygon-shaped conductors); foil layers wrapped around a cylinder or prism; barrel-wound and edge-wound conductors; and/or toroids or toroidal polyhedrons with circular, polygonal or rounded-polygon cross-section whose surfaces are wholly or partially covered with electrically conductive materials.
[0061] The conductor layers may be separated by any electrically non-conductive material (dielectric material) or combination of materials, including but not limited to one or more of air, FR4, PLA, ABS, polyimide, PTFE, polypropylene, a mix of PTFE and supporting materials for ease of handling (e.g. Rogers Substrates, Gore Materials, or Taconic TLY materials), plastic, glass, alumina, ceramic, dielectric or ceramic layers in multilayer ceramic capacitor (MLCC) processes, or dielectric or ceramic layers in low-temperature co-fired ceramic (LTCC) processes.
[0062] The galvanic coupling conductor between conductors 2 (e.g., galvanic coupling conductor 3), may be formed by any type of electrical connection. In some embodiments, such electrical connections include one or more vias, through-holes and/or slots plated or filled with one or more conductive materials. Electrical connections that include one or more vias, through-holes and/or slots plated or filled with conductive materials may be useful in MCICs formed by printed circuit board (PCB), multilayer ceramic capacitor (MLCC), or low-temperature co-fired ceramic (LTCC) processes and structures.
[0063] The LFRS may be placed near or inside a magnetic core (e.g., as shown in
[0064] Experimental results validate the high-Q and low-frequency capabilities of this embodiment of the LFRS. A prototype (
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[0068] In some embodiments, an LFRS may be formed with a conductor that extends around a central axis or mandrel for a plurality of turns.
[0069] In some embodiments, the LFRS can be constructed from alternating layers of spiral shaped conductor layers separated by dielectric layers optionally placed in or near a magnetic core. For this embodiment, consider a spiral of foil where the beginning of the spiral along the outer diameter is Point A and the end of the spiral along the inner diameter is Point B (see
[0070] Experimental results validate the low-frequency capabilities of the multiple-turn edge-wound LFRS. A prototype (
[0071] Some embodiments of the LFRS structure allow high-loss substrates to be incorporated into the LFRS without adding significant loss. This structure is herein termed the Modified LFRS. In an LFRS made of an MCIC in which every conductor layer, on both sides of the layer, is adjacent to—except for the separation dielectric layers—conductor layers with opposite orientations, dielectric layers made of a high-loss material may result in poor performance (low-Q). An LFRS which may partially be constructed using high-loss dielectric or substrate material can enable construction of the LFRS using standard printed circuit board (PCB) processes. PCBs are typically thin foil laminated on substrates (e.g. FR4, polyimide, or Rogers' material), which may have loss tangents too high to make an effective LFRS.
[0072] The inventors recognize that if the two conductors adjacent to a high-loss dielectric or substrate layer are duplicated—same orientation and same galvanic connections, then the impact of the high-loss substrate will be significantly reduced. The high-loss substrate is any dielectric or substrate material that has a loss-tangent greater than that of any other dielectric layer, optionally greater than 1.5× of that of the dielectric layer.
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[0074] Some embodiments relate to improvements to the MSRS that enable the structure to be series-resonant and/or have multiple turns, enabling lower-frequency operation and easier integration with a larger electrical system or power electronics system, enabling easier integration with power electronics. One embodiment is shown in
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[0076] In some embodiments, an MSRS may be formed similar to that shown in
[0077] Various aspects of the apparatus and techniques described herein may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing description and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
[0078] Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.
[0079] The terms “substantially,” “approximately,” “about” and the like refer to a parameter being within 10%, optionally less than 5% of its stated value.
[0080] Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.