PROBE PIN MATERIAL INCLUDING Ag-Pd-Cu-BASED ALLOY
20230250513 · 2023-08-10
Assignee
Inventors
- Takeshi FUSE (Isehara-shi, JP)
- Kunihiro SHIMA (Isehara-shi, JP)
- Takeyuki SAGAE (Isehara-shi, JP)
- Shinji KOUNO (Isehara-shi, JP)
Cpc classification
G01R3/00
PHYSICS
International classification
Abstract
A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.
Claims
1. A probe pin material comprising a Ag—Pd—Cu-based alloy comprising: Ag, Pd and Cu; B as a first additive element; at least any element of Zn, Bi and Sn as a second additive element, and unavoidable impurities, wherein the alloy contains no In; wherein S.sub.Ag is a ratio of a concentration of Ag in the alloy to a combined concentration of Ag, Pd and Cu in the alloy as mass %, S.sub.Pd is a ratio of a concentration of Pd in the alloy to the combined concentration of Ag, Pd and Cu in the alloy as mass %, S.sub.Cu is a ratio of a concentration of Cu in the alloy to the combined concentration of Ag, Pd and Cu in the alloy as mass %, wherein all values of the S.sub.Ag, the S.sub.Pd and the S.sub.Cu fall within a range of a polygon (A1-A2-A3-A4) surrounded with straight lines connecting respective points of a point A1 (Ag: 5.5 mass %, Pd: 47.5 mass %, Cu: 47 mass %), a point A2 (Ag: 5.5 mass %, Pd: 58.5 mass %, Cu: 36 mass %), a point A3 (Ag: 18 mass %, Pd: 49 mass %, Cu: 33 mass %) and a point A4 (Ag: 18 mass %, Pd: 45 mass %, Cu: 37 mass %) in a Ag—Pd—Cu ternary system phase diagram, a concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less.
2. The probe pin material according to claim 1, wherein all values of the S.sub.Ag, the S.sub.Pd and the S.sub.Cu fall within a range of a polygon (A1-A2-B3-B4) surrounded with straight lines connecting respective points of the point A1, the point A2, a point B3 (Ag: 13 mass %, Pd: 52.8 mass %, Cu: 34.2 mass %) and a point B4 (Ag: 13 mass %, Pd: 46 mass %, Cu: 41 mass %).
3. The probe pin material according to claim 1, wherein all values of the S.sub.Ag, the S.sub.Pd, and the S.sub.Cu fall within a range of a polygon (C1-A2-C3-C4) surrounded with straight lines connecting respective points of a point C1 (Ag: 5.5 mass %, Pd: 52 mass %, Cu: 42.5 mass %), the point A2, a point C3 (Ag: 11 mass %, Pd: 54.3 mass %, Cu: 34.7 mass %) and a point C4 (Ag: 11 mass %, Pd: 50 mass %, Cu: 39 mass %).
4. The probe pin material according to claim 1, wherein a specific resistance after an aging heat treatment is 10μΩ.Math.cm or less.
5. The probe pin material according to claim 1, wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.
6. The probe pin material according to claim 1, wherein when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.
7. A probe pin comprising the probe pin material defined in claim 1.
8. A method for producing a probe pin material, the method comprising a step of melt casting: Ag, Pd and Cu; the Ag, Pd and Cu each having a composition falling within a range of a polygon (A1-A2-A3-A4) surrounded with straight lines connecting respective points of a point A1 (Ag: 5.5 mass %, Pd: 47.5 mass %, Cu: 47 mass %), a point A2 (Ag: 5.5 mass %, Pd: 58.5 mass %, Cu: 36 mass %), a point A3 (Ag: 18 mass %, Pd: 49 mass %, Cu: 33 mass %) and a point A4 (Ag: 18 mass %, Pd: 45 mass %, Cu: 37 mass %) in a Ag—Pd—Cu ternary system phase diagram, the first additive element at a concentration of 0.1 mass % or more and 1.5 mass % or less; and the second additive element at a concentration of 0.1 mass % or more and 1.0 mass % or less, to thereby produce a Ag—Pd—Cu-based alloy.
9. The probe pin material according to claim 2, wherein all values of the S.sub.Ag, the S.sub.Pd, and the S.sub.Cu fall within a range of a polygon (C1-A2-C3-C4) surrounded with straight lines connecting respective points of a point C1 (Ag: 5.5 mass %, Pd: 52 mass %, Cu: 42.5 mass %), the point A2, a point C3 (Ag: 11 mass %, Pd: 54.3 mass %, Cu: 34.7 mass %) and a point C4 (Ag: 11 mass %, Pd: 50 mass %, Cu: 39 mass %).
10. The probe pin material according to claim 2, wherein a specific resistance after an aging heat treatment is 10 μΩ.Math.cm or less.
11. The probe pin material according to claim 3, wherein a specific resistance after an aging heat treatment is 10 μΩ.Math.cm or less.
12. The probe pin material according to claim 2, wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.
13. The probe pin material according to claim 3, wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.
14. The probe pin material according to claim 4, wherein a Vickers hardness is 380 Hv or more and 580 Hv or less.
15. The probe pin material according to claim 2, wherein when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.
16. The probe pin material according to claim 3, wherein when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.
17. The probe pin material according to claim 4, wherein when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.
18. The probe pin material according to claim 5, wherein when one end of a wire rod comprising the Ag—Pd—Cu-based alloy is secured: and a first bending step of bending the wire rod at an angle of substantially 90° from a straight line state and a second bending step of bending the wire rod so as to return the wire rod from a bent state to the straight line state are alternately repeated, the first bending step and the second bending step being each defined as a single time of bending, and the number of times of bending until the wire rod is broken is counted, the number of times of bending counted is five or more.
19. A probe pin comprising the probe pin material defined in claim 2.
20. A probe pin comprising the probe pin material defined in claim 3.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0054]
[0055]
[0056]
[0057]
[0058]
[0059]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0060] Hereinafter, a suitable embodiment of the present invention is described. In the present embodiment, probe pin materials including Ag—Pd—Cu-based alloys having various compositions were produced, and the hardness and the specific resistance of each of the probe pin materials were measured and furthermore an evaluation test of bending resistance of such each probe pin material was performed.
[0061] In the present embodiment, a base material where bare metal raw materials of Ag, Pd and Cu were mixed was produced, bare metal raw materials of a first additive element (B) and second additive element(s) (Zn, Bi and Sn) were added to the base material, thereafter the resulting mixture was subjected to melt casting, and thus a Ag—Pd—Cu-based alloy ingot was produced. In the present embodiment, twelve types of base materials (used in Examples 1 to 34 and Comparative Examples 5 to 12) were produced where Ag, Pd and Cu were mixed at a ratio falling within a range of A1-A2-A3-A4 in
[0062] The concentration of each constituent element in various alloy ingots produced was analyzed by ICP. The Ag concentration, the Pd concentration and the Cu concentration measured were converted into S.sub.Ag, S.sub.Pd and S.sub.Cu. The locations of the S.sub.Ag, the S.sub.Pd and the S.sub.Cu in each of the Ag—Pd—Cu-based alloys produced in the present embodiment, in a Ag—Pd—Cu ternary system phase diagram, are illustrated in
[0063] Next, alloy ingots of Ag—Pd—Cu ternary alloys having various compositions and Ag—Pd—Cu-based alloys having various compositions were each worked into a 4-mm square rod material, with cold groove rolling, and further subjected to cold wire drawing, to provide a wire rod having a diameter of 2 mm. Such an alloy wire rod was subjected to the first solution treatment involving heating at 800° C. for 30 minutes and then water cooling. Next, such an alloy wire rod was worked into a wire rod having a diameter of 1 mm, with cold wire drawing, and the wire rod was subjected to the second solution treatment involving heating at 850° C. for 30 minutes and water cooling. The wire rod was worked into a fine line having a diameter of 0.1 mm, with cold wire drawing, and then subjected to an aging heat treatment. The aging heat treatment was made with heating at 300 to 580° C. for 60 minutes.
[0064] The respective fine lines produced of the Ag—Pd—Cu ternary alloys having various compositions and the Ag—Pd—Cu-based alloys having various compositions were each subjected to measurements of the hardness and the specific resistance. These measurements were performed with respect to both the respective fine lines before the aging heat treatment (after working) and after the aging treatment. The hardness measurement was performed with a Vickers hardness meter at a load of 200 gf for an indentation time of seconds. The specific resistance measurement was performed with measurement of the electric resistance with an electric resistance meter, and the specific resistance was calculated from the cross-sectional area and the length of a sample.
[0065] An evaluation test of the bending resistance of each of the fine lines was performed. The evaluation test was performed by a method based on the above evaluation method. As illustrated in
[0066] Various measurement results about the respective fine lines of the Ag—Pd—Cu ternary alloys and the Ag—Pd—Cu-based alloys produced in the present embodiment are shown in Table 1.
TABLE-US-00001 TABLE 1 Alloy constitution AgPdCu ternary Composition (mass %) alloy conversion of AgPdCu-based alloy (mass %) Ag Pd Cu B Zn Sn Bi S.sub.Ag S.sub.Pd S.sub.Cu Example 1 10.60 53.50 35.25 0.15 0.5 — — 10.67 53.85 35.48 Example 2 14.95 49.17 35.23 0.15 0.5 — — 15.05 49.49 35.46 Example 3 10.17 50.20 38.98 0.15 0.5 — — 10.24 50.53 39.23 Example 4 12.72 47.68 38.95 0.15 0.5 — — 12.80 47.99 39.21 Example 5 6.99 53.89 38.52 0.1 0.5 — — 7.03 54.21 38.76 Example 6 6.96 53.67 38.37 0.5 0.5 — — 7.03 54.21 38.76 Example 7 6.89 53.15 37.96 1.5 0.5 — — 7.03 54.21 38.76 Example 8 7.01 54.07 38.67 0.15 0.1 — — 7.03 54.21 38.76 Example 9 6.98 53.86 38.51 0.15 0.5 — — 7.03 54.21 38.76 Example 10 6.95 53.59 38.31 0.15 1 — — 7.03 54.21 38.76 Example 11 7.01 54.07 38.67 0.15 — 0.1 — 7.03 54.21 38.76 Example 12 6.98 53.86 38.51 0.15 — 0.5 — 7.03 54.21 38.76 Example 13 6.95 53.59 38.31 0.15 — 1 — 7.03 54.21 38.76 Example 14 7.01 54.07 38.66 0.15 — — 0.1 7.03 54.21 38.76 Example 15 6.98 53.86 38.51 0.15 — — 0.5 7.03 54.21 38.76 Example 16 6.95 53.59 38.31 0.15 — — 1 7.03 54.21 38.76 Example 17 14.48 47.81 37.06 0.15 0.5 — — 14.57 48.12 37.31 Example 18 9.02 48.95 41.38 0.15 0.5 — — 9.08 49.27 41.6 Example 19 16.86 46.82 35.67 0.15 0.5 — — 16.97 47.12 35.91 Example 20 5.96 48.68 44.71 0.15 0.5 — — 6.00 49.00 45.00 Example 21 5.76 56.83 36.76 0.15 0.5 — — 5.80 57.20 37.00 Example 22 10.07 52.18 37.10 0.15 0.5 — — 10.14 52.52 37.34 Example 23 12.59 49.70 37.11 0.1 0.5 — — 12.67 50.00 37.33 Example 24 12.54 49.50 36.96 0.5 0.5 — — 12.67 50.00 37.33 Example 25 12.42 49.02 36.56 1.5 0.5 — — 12.67 50.00 37.33 Example 26 12.64 49.88 37.23 0.15 0.1 — — 12.67 50.00 37.33 Example 27 12.59 49.68 37.08 0.15 0.5 — — 12.67 50.00 37.33 Example 28 12.53 49.43 36.89 0.15 1 — — 12.67 50.00 37.33 Example 29 12.64 49.88 37.23 0.15 — 0.1 — 12.67 50.00 37.33 Example 30 12.59 49.68 37.08 0.15 — 0.5 — 12.67 50.00 37.33 Example 31 12.53 49.43 36.89 0.15 — 1 — 12.67 50.00 37.33 Example 32 12.64 49.88 37.23 0.15 — — 0.1 12.67 50.00 37.33 Example 33 12.59 49.68 37.08 0.15 — — 0.5 12.67 50.00 37.33 Example 34 12.53 49.43 36.89 0.15 — — 1 12.67 50.00 37.33 Comparative 3.97 53.65 41.73 0.15 0.5 — — 4.00 54.00 42.00 Example 1 Comparative 19.87 51.10 28.38 0.15 0.5 — — 20.00 51.43 28.5 Example 2 Comparative 20.37 45.21 33.77 0.15 0.5 — — 20.50 45.50 34.00 Example 3 Comparative 12.89 45.12 41.34 0.15 0.5 — — 12.97 45.41 41.62 Example 4 Comparative 7.03 54.21 38.76 — — — — 7.03 54.21 38.76 Example 5 Comparative 7.02 54.16 38.72 0.1 — — — 7.03 54.21 38.76 Example 6 Comparative 7.00 53.94 38.56 0.5 — — — 7.03 54.21 38.76 Example 7 Comparative 6.93 53.41 38.16 1.5 — — — 7.03 54.21 38.76 Example 8 Comparative 12.36 48.78 36.36 2 0.5 — — 12.67 50.00 37.33 Example 9 Comparative 12.48 49.26 36.76 — 1.5 — — 12.67 50.00 37.33 Example 10 Comparative 12.48 49.26 36.76 — — 1.5 — 12.67 50.00 37.33 Example 11 Comparative 12.48 49.26 36.76 — — — 1.5 12.67 50.00 37.33 Example 12 Specific Number of resistance times of Hardness (Hv) (μΩ .Math. cm) bending (times) After After heat After After heat After After heat working treatment working treatment working treatment Example 1 304 458 25.22 6.69 10 15 Example 2 308 465 26.47 7.81 11 13 Example 3 302 512 25.97 6.48 13 12 Example 4 298 499 27.49 8.00 12 12 Example 5 298 538 26.78 6.10 9 5 Example 6 320 556 27.41 6.84 9 7 Example 7 337 560 27.65 7.62 9 7 Example 8 290 458 26.58 6.13 12 13 Example 9 295 551 27.17 6.21 13 13 Example 10 314 581 29.42 7.08 8 5 Example 11 285 451 28.44 6.21 13 13 Example 12 298 538 28.13 6.37 12 13 Example 13 324 573 29.25 7.09 8 6 Example 14 284 447 27.64 6.09 12 12 Example 15 295 514 28.90 6.19 13 12 Example 16 326 570 28.97 7.14 8 7 Example 17 290 472 26.83 7.98 10 13 Example 18 288 501 26.59 7.45 13 13 Example 19 315 398 27.09 8.28 11 12 Example 20 285 380 25.40 7.58 13 13 Example 21 312 478 25.98 6.28 12 11 Example 22 317 384 26.23 6.04 11 12 Example 23 312 418 26.14 7.04 11 6 Example 24 379 456 28.99 7.55 9 11 Example 25 388 509 30.24 8.00 8 11 Example 26 320 442 25.32 7.68 10 11 Example 27 324 442 26.50 7.38 12 12 Example 28 330 484 26.94 7.94 8 6 Example 29 314 445 27.14 7.70 9 8 Example 30 319 453 27.48 7.85 9 8 Example 31 348 497 27.55 7.86 9 5 Example 32 308 429 27.08 7.61 14 11 Example 33 324 438 27.16 7.74 11 10 Example 34 336 484 26.16 7.89 10 5 Comparative 285 422 25.77 10.08 14 8 Example 1 Comparative 299 317 27.61 26.73 11 11 Example 2 Comparative 313 486 29.10 11.40 9 3 Example 3 Comparative 326 484 19.79 9.01 11 4 Example 4 Comparative 273 289 29.10 5.06 10 10 Example 5 Comparative 313 364 26.43 5.78 11 6 Example 6 Comparative 324 368 26.81 6.84 9 8 Example 7 Comparative 322 375 27.14 7.52 9 8 Example 8 Comparative 273 474 29.10 8.30 10 0 Example 9 Comparative 279 477 29.70 7.85 13 0 Example 10 Comparative 284 469 29.30 8.50 15 0 Example 11 Comparative 383 475 26.71 8.01 12 1 Example 12
[0067] It can be seen from Table 1 that optimization of the composition ranges of Ag, Pd and Cu and addition of appropriate additive elements are necessary for a reduction in resistance and improvements in hardness (wear resistance) and bending resistance, as objects of the present invention. In other words, a Ag—Pd—Cu-based alloy having concentrations of Ag, Pd and Cu so that S.sub.Ag, S.sub.Pd and S.sub.Cu are outside a region of a polygon (A1-A2-A3-A4) in
[0068] Additive elements are required to be appropriately added to a Ag—Pd—Cu-based alloy. A Ag—Pd—Cu ternary alloy including no additive elements is considered to have the lowest hardness and be inferior in wear resistance (Comparative Example 5). Addition of B in an amount outside an appropriate range results in a poor effect of enhancing hardness (Comparative Examples 6 to 8). Furthermore, excess addition of B can lead to clear deterioration in bending resistance (Comparative Example 9). Furthermore, if the amounts of addition of Zn, Bi and Sn being additive elements each having an effect of enhancing hardness are outside proper ranges, the number of times of bending is less than 5 and bending resistance is deteriorated (Comparative Examples 10 to 12).
[0069] The Ag—Pd—Cu-based alloys (Examples 1 to 34), in which the concentrations of Ag, Pd and Cu are controlled so that S.sub.Ag, S.sub.Pd and S.sub.Cu fall within a range of a polygon (A1-A2-A3-A4) in
INDUSTRIAL APPLICABILITY
[0070] As described above, the probe pin material of the present invention is low in resistance and excellent in wear resistance, and is also good in bending resistance. The probe pin material of the present invention is applied to a probe pin of a probe card for inspection in various electronic equipment, semiconductor devices, power devices, and the like. In particular, the probe pin material of the present invention, which is excellent in bending resistance, can also be usefully applied to a cantilever type probe pin, and a probe pin having a pogo pin shape.