ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL, METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE

Abstract

An organic light-emitting diode display panel, a method of manufacturing the same, and a display device are provided. The organic light-emitting diode display panel includes a flexible substrate defined with a test circuit region thereon. The test circuit region is provided with a test circuit and defined with a circuit trace region. The circuit trace region includes a plurality of traces, a plurality of transistors, a control line, and at least one pin. Each one of the traces is connected to one of the transistors. The control line is electrically connected to a control end of each of the transistors to turn on or turn off the transistors to avoid the circuit from short-circuiting.

Claims

1. An organic light-emitting diode display panel, comprising: a flexible substrate, wherein the flexible substrate is defined with a display region and a test circuit region thereon, the test circuit region is provided with a test circuit and defined with a circuit trace region, the circuit trace region comprises a plurality of traces, a plurality of transistors, a control line, and at least one pin, each one of the traces is connected to one of the transistors, the control line is electrically connected to a control end of each of the transistors to turn on or turn off the transistors, and the at least one pin is electrically connected to an end of the control line.

2. The organic light-emitting diode display panel according to claim 1, wherein the transistors are disposed at ends of the traces.

3. The organic light-emitting diode display panel according to claim 1, wherein the test circuit comprises a cell test circuit, and a bonding region is defined between the cell test circuit and the plurality of transistors, wherein the pin is disposed in the bonding region.

4. The organic light-emitting diode display panel according to claim 3, wherein the test circuit further comprises an array test circuit disposed at ends of the plurality of traces.

5. The organic light-emitting diode display panel according to claim 1, wherein the test circuit comprises a cell test circuit, and pad regions of the cell test circuit are provided at two opposite sides of the cell test circuit, wherein the pin is disposed in the pad regions of the cell test circuit.

6. The organic light-emitting diode display panel according to claim 5, wherein the test circuit further comprises an array test circuit disposed at ends of the plurality of traces.

7. The organic light-emitting diode display panel according to claim 6, wherein a gate driving circuits are provided at both sides of the display region, and control traces of the gate driving circuits are extended to the pad regions of the cell test circuit.

8. The organic light-emitting diode display panel according to claim 7, wherein a bonding region is provided between the cell test circuit and the plurality of transistors, wherein a plurality of the pins are provided, and at least one of the plurality of pins is disposed in the bonding region.

9. The organic light-emitting diode display panel according to claim 2, wherein the test circuit comprises a cell test circuit, pad regions of the cell test circuit are provided at two opposite sides of the cell test circuit, a bonding region is provided between the cell test circuit and the plurality of transistors, wherein a plurality of the pins are provided, at least one of the plurality of pins is disposed in the bonding region, and another one of the pins is disposed in the pad regions of the cell test circuit.

10. A display device, comprising an organic light-emitting diode display panel, and a control circuit, wherein the organic light-emitting diode display panel comprises: a flexible substrate, wherein the flexible substrate is defined with a display region and a test circuit region thereon, the test circuit region is provided with a test circuit and defined with a circuit trace region, the circuit trace region comprises a plurality of traces, a plurality of transistors, a control line, and at least one pin, each one of the traces is connected to one of the transistors, the control line is electrically connected to a control end of each of the transistors to turn on or turn off the transistors, the at least one pin is electrically connected to an end of the control line, and the control circuit control a display of the display region through the circuit trace region.

11. The display device according to claim 10, wherein the transistors are disposed at ends of the traces.

12. The display device according to claim 10, wherein the test circuit comprises a cell test circuit, and a bonding region is defined between the cell test circuit and the plurality of transistors, wherein the pin is disposed in the bonding region.

13. The display device according to claim 10, wherein the test circuit comprises a cell test circuit, and pad regions of the cell test circuit are provided at two opposite sides of the cell test circuit, wherein the pin is disposed in the pad regions of the cell test circuit.

14. The display device according to claim 11, wherein the test circuit comprises a cell test circuit, pad regions of the cell test circuit are provided at two opposite sides of the cell test circuit, a bonding region is provided between the cell test circuit and the plurality of transistors, wherein a plurality of the pins are provided, at least one of the plurality of pins is disposed in the bonding region, and another one of the pins is disposed in the pad regions of the cell test circuit.

15. A method of manufacturing an organic light-emitting diode display panel, wherein the organic light-emitting diode display panel, comprises a flexible substrate, wherein the flexible substrate is defined with a display region and a test circuit region thereon, the test circuit region is provided with a test circuit and defined with a circuit trace region, the circuit trace region comprises a plurality of traces, a plurality of transistors, a control line, and at least one pin, each one of the traces is connected to one of the transistors, the control line is electrically connected to a control end of each of the transistors to turn on or turn off the transistors, and the at least one pin is electrically connected to an end of the control line, wherein the test circuit further comprises an array test circuit disposed at ends of the plurality of traces, and the manufacturing method comprises steps of: performing an array test to a pixel array in the display region by sending a test signal thereto through the array test circuit; and performing a laser cutting to cutoff the array test circuit along a cutting line after the array test.

16. The method of manufacturing the organic light-emitting diode display panel according to claim 15, further comprising a step of: turning off one or several of the plurality of transistors to isolating a shorting trace from other regions of the traces.

17. The method of manufacturing the organic light-emitting diode display panel according to claim 15, wherein the test circuit comprises a cell test circuit, and pad regions of the cell test circuit are provided at two opposite sides of the cell test circuit, wherein the pin is disposed in the pad regions of the cell test circuit.

18. The method of manufacturing the organic light-emitting diode display panel according to claim 17, wherein a gate driving circuits are provided at both sides of the display region, and control traces of the gate driving circuits are extended to the pad regions of the cell test circuit.

19. The method of manufacturing the organic light-emitting diode display panel according to claim 17, wherein a cell test signal is transmitted to the cell test circuit through the pad region of the cell test circuit when the organic light-emitting diode display panel is undergone a cell test; and wherein the plurality of transistors are turned off through the pin in the pad region of the cell test circuit to avoid the cell test from interference.

20. The method of manufacturing the organic light-emitting diode display panel according to claim 15, wherein the cutting line is defined between the array test circuit and the transistors, the array test circuit is cut off by the laser along the cutting line after the array test is finished, and the transistors are located at ends of the traces after the array test circuit is cut off.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0028] FIG. 1 is a schematic view of a structure of an organic light-emitting diode display panel according to an embodiment of the present disclosure.

[0029] FIG. 2 is a schematic view of a structure of an organic light-emitting diode display panel according to another embodiment of the present disclosure.

[0030] FIG. 3 is a schematic view of a structure of display device according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

[0031] The descriptions of the following embodiments refer to the attached drawings to illustrate specific embodiments that can be implemented in the present disclosure.

[0032] The following description of the embodiments is provided by reference to the drawings and illustrates the specific embodiments of the present disclosure. Directional terms mentioned in the present disclosure, such as “up,” “down,” “top,” “bottom,” “forward,” “backward,” “left,” “right,” “inside,” “outside,” “side,” “peripheral,” “central,” “horizontal,” “peripheral,” “vertical,” “longitudinal,” “axial,” “radial,” “uppermost” or “lowermost,” etc., are merely indicated the direction of the drawings. Therefore, the directional terms are used for illustrating and understanding of the application rather than limiting thereof.

[0033] In the figure, units with similar structures are indicated by the same reference numerals.

[0034] Referring to FIG. 1, one embodiment of the disclosure provides an organic light-emitting diode display panel 100 including a flexible substrate 102. The flexible substrate 102 is defined with a display region 110 and a test circuit region 120 thereon. The test circuit region 120 is provided with a test circuit 122 and defined with a circuit trace region 124. The circuit trace region 124 includes a plurality of traces 124a, a plurality of transistors 124b, a control line 124c, and at least one pin 124d. Each one of the traces 124a is connected to one of the transistors 124b. The control line 124c is electrically connected to a control end of each of the transistors 124b to turn on or turn off the transistors 124b. The at least one pin 124d is electrically connected to an end of the control line 124d.

[0035] Referring to FIG. 1, in one embodiment of the organic light-emitting diode display panel 100, the test circuit 122 includes a cell test circuit 122a. A bonding region 126 is defined between the cell test circuit 122a and the plurality of transistors 124b. The pin 124d′ is disposed in the bonding region 126.

[0036] In detail, a corresponding test circuit electrically connects with the plurality of traces 124a through the bonding region 126 when the organic light-emitting diode display panel 100 is undergone a module test. The pin 124d′ is disposed in the bonding region 126 to connected to a corresponding signal in the module test to turn off the plurality of transistors 124b to avoid the module test from interference.

[0037] Referring to FIG. 1, in one embodiment of the organic light-emitting diode display panel 100, the test circuit 122 includes a cell test circuit 122a. Pad regions 128 of the cell test circuit are provided at two opposite sides of the cell test circuit 122a. The pin 124d is disposed in the pad regions 128 of the cell test circuit.

[0038] In detail, a corresponding test circuit electrically connects with the cell test circuit 122a through the pad region 128 of the cell test circuit when the organic light-emitting diode display panel 100 is undergone a cell test. The pin 124d is disposed in the pad region 128 of the cell test circuit to connected to a corresponding signal in the cell test to turn off the plurality of transistors 124b to avoid the cell test from interference.

[0039] Referring to FIG. 1, in one embodiment of the organic light-emitting diode display panel 100, the test circuit 122 further includes an array test circuit 122b disposed at ends of the plurality of traces 124a.

[0040] In detail, the array test circuit 122b electrically connects with a pixel array (not shown) in the display region 110 through the traces 124a when the organic light-emitting diode display panel 100 is undergone an array test. The pin 124d or 124d′ controls the plurality of transistors 124b to turn on to make the traces 124a conductive to pass a test signal into the pixel array in the display region 110.

[0041] In detail, a laser cutting can be performed to cutoff the array test circuit 122b along a cutting line LC-Line after the array test.

[0042] Referring to FIG. 1, in one embodiment of the organic light-emitting diode display panel 100, a gate driving circuits 112 are provided at both sides of the display region 110. Control traces 112a of the gate driving circuits 112 are extended to the pad regions 128 of the cell test circuit.

[0043] In detail, the gate driving circuits 112 and the control traces 112a at both sides of the display region 100 have symmetric components about the display region 100, so the FIG. 1 only shows one of the components at one of the sides.

[0044] Referring to FIG. 1, in one embodiment of the organic light-emitting diode display panel 100, a bonding region 126 is provided between the cell test circuit 122a and the plurality of transistors 124b. A plurality of the pins 124d, 124d′ are provided. At least one of the plurality of pins 124d′ is disposed in the bonding region 126.

[0045] In detail, a number of pins can be adjusted according to actual needs, and the present disclosure is not limited.

[0046] Referring to FIG. 2, in one embodiment of the organic light-emitting diode display panel 100′, the transistors 124b are disposed at ends of the traces 124a.

[0047] In detail, a laser cutting can be performed to cutoff the array test circuit 122b along a cutting line LC-Line in FIG. 1 after the array test. Then, the transistors 124b are disposed at ends of the traces 124a as shown in FIG. 2. If high temperature generated during the laser cutting process on a cutting region cause a conductor material of an original trace to melt, splash or remain, resulting in a short circuit between adjacent trace, turning off one or several of the plurality of transistors can isolate a shorting region from other regions of the traces to avoid a following test and yield of products from affected.

[0048] Referring to FIG. 2, in one embodiment of the organic light-emitting diode display panel 100′, the test circuit 122′ includes a cell test circuit 122a. Pad regions 128 of the cell test circuit are provided at two opposite sides of the cell test circuit 122a. A bonding region 126 is provided between the cell test circuit 122a and the plurality of transistors 124b. A plurality of the pins 124d, 124d′ are provided. At least one of the plurality of pins 124d′ is disposed in the bonding region 126. Another one of the pins 124d is disposed in the pad regions 128 of the cell test circuit.

[0049] In detail, a description of the pin 124d, 124d′ please refer the abovementioned paragraph, the disclosure will not repeat here.

[0050] Referring to FIG. 3, another embodiment of the disclosure provides a display device 300 including an organic light-emitting diode display panel 100′ as shown in FIG. 2 and a control circuit 200. The control circuit 200 control a display of the display region through the circuit trace region.

[0051] In detail, means of electrical connect between the organic light-emitting diode display panel 100′ and the control circuit 200 can be welding or socketing, the disclosure is not limit.

[0052] In comparison with prior art, the organic light-emitting diode display panel, the method of manufacturing the same, and the display device provides the control line electrically connected to the control end of each of the transistors to turn on or turn off the transistors. It can control the traces to be electrical conduct before laser cutting to undergo a test and control the ends of the traces to be open circuit after laser cutting to avoid yield of the organic light-emitting diode display panel from affected by short-circuiting of the ends of the traces.

[0053] Although the present disclosure has been shown and described with respect to one or more embodiments, those skilled in the art will obtain equivalent variations and modifications based on reading and understanding of this specification and the drawings. This disclosure includes all such modifications and variations, and is limited only by the scope of the appended claims. With particular reference to the various functions performed by the above-mentioned components, the terminology used to describe such components is intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (eg, it is functionally equivalent) Even if it is structurally different from the disclosed structure that performs the functions in the exemplary embodiment of the present specification shown herein. Furthermore, although specific features of this specification have been disclosed with respect to only one of several embodiments, such features may be combined with one or more other embodiments as may be desirable and advantageous for a given or specific application. Moreover, to the extent that the terms “including”, “having”, “containing” or variations thereof are used in specific embodiments or claims, such terms are intended to be included in a manner similar to the term “comprising”.

[0054] The present disclosure has been described by the above embodiments, but the embodiments are merely examples for implementing the present disclosure. It must be noted that the embodiments do not limit the scope of the invention. In contrast, modifications and equivalent arrangements are intended to be included within the scope of the invention.