High-efficiency phase-change condenser of a supercomputer

Abstract

The application relates to a high-efficiency phase-change condenser for a supercomputer, including a condenser box body, a refrigerant input pipe, a refrigerant output pipe and a condensing coil; a liquid refrigerant accommodated in the condenser box body, and a gas-phase region existing between a liquid level of the liquid refrigerant and a top of the condenser box body; one portion of the condensing coil immersed into the liquid refrigerant, and the other portion of the condensing coil located in the gas-phase region above the liquid level of the liquid refrigerant; and in the gas-phase region, refrigerant vapor bubbles are liquified by the condensing coil. Liquid-phase and gas-phase saturated refrigerants can be completely condensed by the condensing coil in a limited condenser space, thereby improving heat exchange efficiency of the condenser.

Claims

1. A high-efficiency phase-change condenser of a supercomputer, comprising: a condenser box body; a refrigerant input pipe; a refrigerant output pipe; and a condensing coil, wherein a liquid refrigerant is accommodated in the condenser box body, and a gas-phase region exists between a liquid level of the liquid refrigerant and a top of the condenser box body, a refrigerant vapor outlet at a lower end of the refrigerant input pipe stretches below the liquid level of the liquid refrigerant, wherein one portion of the condensing coil is immersed into the liquid refrigerant, and another portion of the condensing coil is located in the gas-phase region above the liquid level of the liquid refrigerant, wherein refrigerant vapor bubbles are liquified by the condensing coil in the gas-phase region, wherein the condensing coil comprises a cooling liquid input port and a cooling liquid output port, a cooling liquid flows into the another portion of the condensing coil from the cooling liquid input port and exchanges heat with the refrigerant vapor bubbles in the gas-phase region, and flows into the one portion of the condensing coil and exchanges heat with the liquid refrigerant in the condenser box body, and then flows out of the cooling liquid output port, wherein a section of the refrigerant output pipe extends upward from a bottom of the condenser box body and into the condenser box body to a distance above a lowermost end of the refrigerant vapor outlet at the lower end of the refrigerant input pipe.

2. The high-efficiency phase-change condenser of the supercomputer according to claim 1, wherein the refrigerant vapor outlet is trumpet-shaped.

3. The high-efficiency phase-change condenser of the supercomputer according to claim 2, the condensing coil is snakelike.

4. The high-efficiency phase-change condenser of the supercomputer according to claim 2, wherein the liquid level of the liquid refrigerant is located at half a height of the condensing coil.

5. The high-efficiency phase-change condenser of the supercomputer according to claim 2, wherein the liquid refrigerant is an electric insulation liquid refrigerant.

6. The high-efficiency phase-change condenser of the supercomputer according to claim 1, wherein the condensing coil is snakelike.

7. The high-efficiency phase-change condenser of the supercomputer according to claim 1, wherein the liquid level of the liquid refrigerant is located at half a height of the condensing coil.

8. The high-efficiency phase-change condenser of the supercomputer according to claim 1, wherein the liquid refrigerant is an electric insulation liquid refrigerant.

9. The high-efficiency phase-change condenser of the supercomputer according to claim 8, wherein the electric insulation liquid refrigerant is an electric insulation liquid with a boiling point between 30° C. and 60° C.

10. The high-efficiency phase-change condenser of the supercomputer according to claim 9, wherein the electric insulation liquid refrigerant is fluoride.

Description

BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS

(1) FIG. 1 is a schematic structural diagram of a condenser according to an embodiment of the application.

DESCRIPTION OF ACCOMPANYING DRAWING MARKS

(2) 1—refrigerant input pipe, 2—saturated refrigerant, 3—refrigerant vapor gas outlet, 4—refrigerant output pipe, 5—refrigerant liquid, 6—vapor bubbles, 7—condensing coil, 8—low-temperature cooling liquid, 9—high-temperature cooling liquid, and 10—condenser.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(3) For clearer descriptions of the objects, technical solutions and advantages in the present application, embodiments of the present application will be described in details with reference to the accompanying drawings. It should be noted that the embodiments of the present application and the characteristics in the embodiments can be combined with other another arbitrarily without conflict.

(4) According to an embodiment of the application, as shown in FIG. 1, a high-efficiency phase-change condenser 10 for a supercomputer 11 is provide, comprising: a condenser box body, a refrigerant input pipe 1, a refrigerant output pipe 4 and a condensing coil 7; a liquid refrigerant accommodated in the condenser box body, and a gas-phase region exists between a liquid level of the liquid refrigerant and a top of the condenser box body; a refrigerant vapor outlet 3 at a lower end of the refrigerant input pipe 1 stretching below the liquid level of the liquid refrigerant; and one portion of the condensing coil 7 immersed into the liquid refrigerant, and the other portion of the condensing coil 7 located in the gas-phase region above the liquid level of the liquid refrigerant. A section of the refrigerant output pipe 4 extends upward from a bottom of the condenser box body and into the condenser box body to a distance above a lowermost end of the refrigerant vapor outlet 3 at the lower end of the refrigerant input pipe 1.

(5) The condenser 10 encapsulates the condensing coil 7 into a closed cavity of the condenser box body which stores refrigerant liquid. Cooling liquid is introduced into the condensing coil 7, and a saturated refrigerant 2 which is heated and boiled by heating elements (electrical elements such as a CPU, a server mainboard, etc.) in a server is dispersed into tiny vapor bubbles 6 at an outlet terminal of the refrigerant vapor outlet 3. Then the tiny vapor bubbles 6 and the refrigerant liquid are mixed, whereby most of the vapor bubbles 6 are cooled into liquid by the refrigerant liquid, and the rest of tiny vapor bubbles 6 ascend to the gas-phase region in an upper portion of the cavity and are in contact with the condensing coil 7 to be cooled into liquid by the condensing coil 7 and flow back to the bottom of the cavity. An upper half part of the condensing coil 7 cools the refrigerant bubbles 6, while the part, of the condensing coil 7 immersed into the refrigerant liquid cools the refrigerant liquid.

(6) The condensing coil 7 comprises a cooling liquid input port and a cooling liquid output port. Low-temperature cooling liquid 8 flows into the condensing coil 7 from the cooling liquid input port and exchanges heat with the refrigerant liquid and the vapor bubbles 6, then high-temperature cooling liquid 9 flows out of the cooling liquid output port. The cold water may be selected as the low-temperature cooling liquid 8.

(7) The saturated refrigerant 2 enters into the condenser 10 where the saturated refrigerant 2 and the vapor bubbles 6 are condensed into refrigerant liquid 5, through the refrigerant input pipe 1. Then the condensed refrigerant liquid 5 flows out of the refrigerant output pipe 4 for recycling. The liquid refrigerant is an electric insulation liquid refrigerant, for example, fluoride. Since the boiling point of the fluoride is between 30° C. and 60° C., heat absorbed from a heating element may be taken out timely by the refrigerant vapor.

(8) The refrigerant vapor outlet 3 is trumpet-shaped.

(9) According to one or more embodiments of the application, the refrigerant vapor outlet 3 is trumpet-shaped.

(10) According to one or more embodiments of the application, the condensing coil 7 is snakelike.

(11) According to one or more embodiments of the application, the liquid level of the liquid refrigerant is located at half a height of the condensing coil 7.

(12) The implementations disclosed by the present application are as above, but the content is only used for understanding the implementations adopted by the present application conveniently, not for limiting the present application. Any modifications and changes in the form and detail of implementation may be made by the skilled in the art, which the application relates to, but without departing from the spirit and scope disclosed by the application, they should be within the protection scope of the present application.