OPTICAL DEVICE AND MANUFACTURING METHOD

Abstract

Optical Device and Manufacturing Method An optical device (380) is disclosed, the device comprising a substrate (330), first electrically-conductive element (325) formed as a pattern on the substrate, a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370), and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element. Also disclosed is an associated method of manufacturing the optical device (380), and an apparatus (600) comprising at least one of the disclosed optical devices, a camera (605), and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.

Claims

1. An optical device (380) comprising: a substrate (330); a first electrically-conductive element (325) formed as a pattern on the substrate; a layer of material extending over at least a portion of the first electrically-conductive element and forming an optical element (370); and a second electrically-conductive element (355) extending through the layer of material and coupled to the first electrically-conductive element, wherein the second electrically-conductive element (355) comprises a cured conductive polymer.

2. The optical device (380) of claim 1, wherein the second electrically-conductive element (355) forms a conductive path extending from a surface of the layer of material to the first electrically-conductive element (325).

3. The optical device (380) of claim 1, wherein the layer of material comprises a cured polymer or PDMS.

4. The optical device (380) of claim 1, wherein the first electrically-conductive element (325) is an electrical trace for an eye safety circuit.

5. The optical device (380) of claim 1, wherein the optical element (370) comprises at least one of: a lens; a microlens array; a diffraction grating; a diffuser; a Fresnel lens; a filter; a waveguide.

6. The optical device (380) of claim 1, wherein the second electrically-conductive element (355) is substantially spherical-frustum-shaped and/or wherein the second electrically-conductive element is laterally surrounded by the layer of material.

7. The optical device (400) of claim 1, comprising a spacer (415), the spacer comprising a third electrically-conductive element (455), the third electrically-conductive element being conductively coupled to the first electrically-conductive-element (430) by the second electrically-conductive element (455).

8. The optical device (400) of claim 7, comprising a further substrate (420), the spacer (415) disposed between the substrate (405) and the further substrate, the first electrically-conductive element (430) coupled to a fourth electrically-conductive element (460) formed on the further substrate by the second and third electrically-conductive elements (445, 455).

9. The optical device (400) of claim 1, comprising an active element, the active element (425) comprising at least one of: a sensor and/or a radiation emitter.

10. The optical device (400) of claim 9, wherein at least one of: the layer of material is substantially transparent to radiation emitted by the radiation emitter and/or sensed by the sensor; and the first electrically-conductive element (430) is substantially transparent to radiation emitted by the radiation emitter and/or sensed by the sensor.

11. The optical device (400) of claim 1, comprising circuitry configured to detect a variation in a resistance of a circuit formed from the first electrically-conductive element.

12. The optical device (400) of claim 1, wherein the optical device is one of: an illuminator; a proximity sensor; a spectral sensor; an ambient light sensor; a dot-projector; a light-to-frequency sensor.

13. A method of manufacturing an optical device (380), the method comprising the steps of: dispensing a curable conductive polymer onto a tool (315); disposing the tool relative to a substrate (330) such that the curable conductive polymer contacts a first electrically-conductive element (325) formed as a pattern on the substrate; curing the curable conductive polymer to form a second electrically-conductive element (355) coupled to the first electrically-conductive element; and forming a layer of material between the tool and the substrate such that the second electrically-conductive element extends through the layer of material, a profile of the tool configured to define an optical element in the layer.

14. The method of claim 13, wherein the step of forming a layer of material between the tool and the substrate comprises vacuum injection moulding.

15. The method of claim 13, wherein the step of curing the conductive polymer comprises thermal and/or UV curing of the conductive polymer.

16. An apparatus (600) comprising: at least one optical device (610) according to claim 1, a camera (605); and processing circuitry (615) communicably coupled to the at least one optical device and to the camera.

Description

BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0063] These and other aspects of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings, wherein:

[0064] FIG. 1 depicts a disassembled prior art optical device;

[0065] FIG. 2a depicts a disassembled prior art optical device;

[0066] FIG. 2b depicts an assembled prior art optical device;

[0067] FIG. 3a a step of dispensing a curable conductive material onto a tool;

[0068] FIG. 3b a step of disposing the tool relative to a substrate;

[0069] FIG. 3c a step of curing the curable conductive material;

[0070] FIG. 3d a step of forming a layer of material between the tool and the substrate;

[0071] FIG. 3e depicts the substrate with the tool removed;

[0072] FIG. 3f depicts a cross-section of a portion of the optical device;

[0073] FIG. 4a depicts a disassembled optical device according to an embodiment of the disclosure;

[0074] FIG. 4b depicts an assembled optical device of FIG. 4a;

[0075] FIG. 5 depicts a plan view of the substrate showing the first electrically-conductive element, according to an embodiment of the disclosure;

[0076] FIG. 6 depicts an example apparatus according to an embodiment of the disclosure; and

[0077] FIG. 7 a method of manufacturing an optical device according to an embodiment of the disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0078] FIG. 1 depicts a disassembled, cross-sectional and simplified view of a prior art optical device 100.

[0079] The optical device 100 comprises a substrate 105, such as a glass or silicon substrate. An optical element 110 is formed or mounted on the substrate 105. For example, the optical element 110 may be a microlens array, or the like.

[0080] The optical device 100 comprises a further substrate 120, such as a glass or silicon substrate.

[0081] For purposes of example, an active device 125 is depicted mounted on the further substrate 120. The active device 125 may be a laser diode, an LED, a sensor or the like.

[0082] The prior art optical device 100 also comprises a spacer 115. The spacer 115 may be formed from a hole, void or bore formed in a substrate. The spacer 115 may be suitable for mounting on the further substrate 120 such that the active device 125 is located within the hole, void or bore.

[0083] FIG. 2a depicts cross-sectional view of a disassembled prior art optical device 200. The prior art optical device 200 is similar to the prior art optical device 100 of FIG. 1, except further detailed with regard to electrical connectivity within the device is depicted.

[0084] The prior art optical device 200 comprises a substrate 205, such as a glass or silicon substrate. The substrate 205 has an optical element 210 formed or mounted on the substrate 205. For example, the optical element 210 may be a microlens array, or the like.

[0085] The optical element 210 may be formed by a process of replication or moulding. During formation of the optical element 210, excess material 250 may be formed at a periphery of the optical element 210. The excess material 250 may be known in the field as “a yard”. Such excess material 250 laterally surrounds the optical element 210. Therefore, a substantial surface area of the substrate 205 may be required for the excess material 250, thus increasing an overall module size of the optical device 200.

[0086] A first electrically-conductive element 230 is formed on the substrate 205. The first electrically-conductive element 230 may be an electrical contact.

[0087] The optical device 200 comprises a further substrate 220, such as a glass or silicon substrate.

[0088] For purposes of example, an active device 225 is depicted mounted on the further substrate 220. The active device 225 may be a laser diode, an LED, a sensor or the like.

[0089] An electrically-conductive trace 245 is also formed on the further substrate 220.

[0090] The prior art optical device 200 also comprises a spacer 215. The spacer 215 may be formed from a hole, void or bore formed in a substrate. The spacer 215 may be suitable for mounting on the further substrate 220 such that the active device 225 is located within the hole, void or bore.

[0091] An electrically-conductive trace 240 is formed on the spacer 215.

[0092] Also depicted is electrically-conductive glue 235a which may be used to adhere the spacer 215 to the substrate 205. More specifically, the electrically-conductive glue 235a may be used to electrically couple the electrically-conductive trace 240 formed on the spacer 215 to the first electrically-conductive element 230 formed on the substrate 205.

[0093] Also depicted is electrically-conductive glue 235b which may be used to adhere the spacer 215 to the further substrate 220. More specifically, the electrically-conductive glue 235b may be used to electrically couple the electrically-conductive trace 240 formed on the spacer 215 to the electrically-conductive trace 245 formed on the further substrate 220.

[0094] FIG. 2b depicts a cross section of an assembled prior art optical device 260. That is, the assembled prior art optical device 260 corresponds to the disassembled prior art optical device 200.

[0095] The cured electrically-conductive glue 235c adheres the spacer 215 to the substrate 205. More specifically, the cured electrically-conductive glue 235c electrically couples the electrically-conductive trace 240 formed on the spacer 215 to the first electrically-conductive element 230 formed on the substrate 205.

[0096] Due to the excess material 250, a location at which the substrate 205 is adhered to the spacer 215 is a substantial distance from the optical element 210 and as such, the optical device 200 may be relatively large.

[0097] The cured electrically-conductive glue 235d adheres the spacer 215 to the further substrate 220. More specifically, the cured electrically-conductive glue 235d electrically couples the electrically-conductive trace 240 formed on the spacer 215 to the electrically-conductive trace 245 formed on the further substrate 220.

[0098] FIGS. 3a to 3f depict a series of steps defining a method of manufacturing an optical device 380 according to an embodiment of the disclosure. The method may be a method of wafer-level manufacturing of a plurality of optical devices 380.

[0099] FIG. 3a depicts a first step 300 of step of dispensing a curable conductive material 310 on a tool 315.

[0100] The tool may be formed from PDMS 315. The tool 315 may be formed from a machined wafer or plate. A surface profile of the tool 315 may define an optical element 370. That is, the tool 315 may comprise a negative of the optical element 315. The tool 315 may be suitable for use in a process of replication using vacuum injection moulding or imprinting of a layer of material 365, to form the optical element 370.

[0101] The tool 315 may be held in a clamp or chuck, such as a vacuum chuck. In the example embodiment of FIG. 3a, the tool 315 is disposed on a back plate 320.

[0102] A nozzle 305 is depicted in FIG. 3a dispensing the curable conductive material 310 on the tool 315. While only a single nozzle is depicted in FIG. 3a, it will be appreciated that a plurality of nozzles may simultaneously or sequentially deposit the curable conductive material 310 on the tool 315.

[0103] Furthermore, in some embodiments the step of dispensing the curable conductive material 310 on the tool 315 may comprise screen-printing. In some embodiments the step of dispensing the curable conductive material onto a tool may comprise jetting.

[0104] The curable conductive material 310 may be dispensed as droplets or beads on the tool 315. The curable conductive material 310 may be dispensed in a liquid, gel or paste form.

[0105] In the example of FIG. 3a, the curable conductive material 310 is dispensed in a region of a surface of the tool 315 between regions of the surface profile of the tool 315 that define the optical element 370. The curable conductive material 310 may comprise a conductive polymer. The curable conductive material 310 may comprise a conductive epoxy or acrylate. The curable conductive material 310 may comprise a conductive liquid, adhesive, paste, glue, fluid, or the like.

[0106] FIG. 3b depicts a second step 340 of disposing the tool 315 relative to a substrate 330. The substrate 330 may be a glass wafer, a silicon wafer or the like.

[0107] A first electrically-conductive element 325 is formed as a pattern on the substrate 330. For example, the first electrically-conductive element 325 may be formed on the substrate 330 by a process of thin film deposition and/or by printing. The first electrically-conductive element 325 may be formed from a transparent conducting film, such as a transparent conducting oxide. In an embodiment, the first electrically-conductive element 325 comprises indium tin oxide.

[0108] The second step 340 comprises disposing the tool 315 relative to the substrate 330 such that the curable conductive material 310 contacts a first electrically-conductive element 325. Furthermore, a force may be applied to the tool 315 and/or substrate to push the tool 315 and substrate together such that the droplets or beads of curable conductive material 310 are deformed. Beneficially, this may ensure a sufficient surface area of the droplets or beads of curable conductive material 310 is in contact with the first electrically-conductive element 325.

[0109] In a third step 345 depicted in FIG. 3c, the curable conductive material 310 is cured to form a plurality of second electrically-conductive elements 355. In some embodiments. Curing the curable conductive material 310 to form the second electrically-conductive elements causes the curable conductive material to solidify and/or bond to the first electrically-conductive element 325.

[0110] The curing may be performed in an oven 350. The curing may comprise thermal and/or ultraviolet (UV) curing.

[0111] FIG. 3d depicts a fourth step 360 of forming a layer of material 365 between the tool 315 and the substrate 330.

[0112] In some embodiments, the step 360 of forming the layer of material 365 between the tool 315 and the substrate 330 may comprise vacuum injection moulding.

[0113] For example, the tool 315 and/or back plate 320 may comprise one or more vents of channels (not shown) for injecting, forcing, pumping or otherwise motivating material to form the layer of material 365. In other embodiments, the material may be injected, forced, pumped or otherwise motivated directly into a gap between the substrate 330 and the tool 315, e.g. at the sides/periphery of the substrate 330.

[0114] In some embodiments, the step 360 of forming the layer of material 365 between the tool 315 and the substrate 330 may comprise imprinting, such as nanoimprinting.

[0115] The material may be cured, e.g. thermally and/or UV cured, such that the material forms a hardened layer of material 365.

[0116] A fifth step 375 is depicted in FIG. 3e, wherein the tool 315 is removed from the substrate 330. In some embodiments, the substrate 330 may subsequently undergo singulation, e.g. dicing, to form a plurality of optical devices 380. In some embodiments, substrate 330 may be used in subsequent steps of assembling one or more optical devices 380, wherein singulation occurs only after one or more of such subsequent steps. That is, assembly of the one or more optical devices 380 may be performed at a wafer-level, or assembly of the one or more optical devices 380 may be performed at a device-level.

[0117] FIG. 3f depicts a cross-section of a portion of an optical device 380 manufactured according to the steps described with reference to FIGS. 3a to 3d. The second electrically-conductive element 355 extends through the layer of material 365, wherein the layer of material 365 defines an optical element 370.

[0118] FIG. 4a depicts a disassembled optical device 400 according to an embodiment of the disclosure.

[0119] The optical device 400 comprises a substrate 405, such as a glass or silicon substrate. The substrate 405 has an optical element 410 formed or mounted on the substrate 405. For example, the optical element 410 may be a microlens array, or the like.

[0120] The optical element 410 may be formed by a process of replication or moulding, as described above with reference to FIG. 3d. During formation of the optical element 410, excess material 450 may be formed at a periphery of the optical element 410. That is, such excess material 450 may laterally surround the optical element 410.

[0121] A first electrically-conductive element 430 is formed on the substrate 405. The first electrically-conductive element 430 may be an electrical contact. The first electrically-conductive element 430 forms a pattern, e.g. at least a portion of a circuit.

[0122] In contrast to the prior art devices of FIGS. 2a and 2b, a second electrically-conductive element 445 extends through the layer of material that forms the optical element 410. In particular, the second electrically-conductive element 445 extends through the excess material 450 formed at the periphery of the optical element 410.

[0123] The optical device 400 also comprises a spacer 415. The spacer 415 is be formed from a hole, void or bore formed in a substrate.

[0124] A third electrically-conductive element 455 is formed on the spacer 415. In the embodiment depicted in FIG. 4a, the third electrically-conductive element 455 is formed on an inside surface of the hole, void or bore forming the spacer 415.

[0125] In some embodiments, the third electrically-conductive element 415 may be an electrical trace, such as a printed trace. In some embodiments, the third electrically-conductive element 415 may be implemented as a thin film layer or as a coating.

[0126] The optical device 400 comprises a further substrate 420, such as a glass or silicon substrate. An active device 425 is depicted mounted on the further substrate 420. The active device 425 may be a laser diode, an LED, a sensor or the like.

[0127] The spacer 415 is for mounting on the further substrate 220 such that the active device 225 is located within the hole, void or bore.

[0128] The third electrically-conductive element 415 extends over an upper portion 465 of the spacer 415.

[0129] A fourth electrically-conductive element 460 is formed on the further substrate 400. The fourth electrically-conductive element 460 may be an electrical trace.

[0130] Also depicted is electrically-conductive glue 435a which may be used to adhere the spacer 415 to the substrate 405. More specifically, the electrically-conductive glue 435a may be used to electrically couple the second electrically-conductive element 445 which extends through the layer forming the optical element 410, to the third electrically-conductive element 415 formed on the spacer 415.

[0131] Also depicted is electrically-conductive glue 435b which may be used to adhere the spacer 415 to the further substrate 420. More specifically, the electrically-conductive glue 435b may be used to electrically couple the third electrically-conductive element 455 formed on the spacer 415 to the fourth electrically-conductive element 460 formed on the further substrate 420.

[0132] FIG. 4b depicts a cross section of an assembled optical device 440. That is, the assembled optical device 440 corresponds to the disassembled prior art optical device 400.

[0133] A cured electrically-conductive glue 435c adheres the spacer 415 to the substrate 405. More specifically, the cured electrically-conductive glue 435c electrically couples the second electrically-conductive element 445 which extends through the layer forming the optical element 410, to the third electrically-conductive element 415 formed on the spacer 415.

[0134] Also depicted is a cured electrically-conductive glue 435d adheres the spacer 415 to the further substrate 420. More specifically, the cured electrically-conductive glue 435b electrically couples the third electrically-conductive element 455 formed on the spacer 415 to the fourth electrically-conductive element 460 formed on the further substrate 420.

[0135] As such an electrical circuit is formed, wherein the first electrically-conductive element 430 is conductively coupled to the fourth electrically-conductive element 460 through the second electrically-conductive element 445, the third electrically-conductive element 255 and the electrically-conductive glue 435a, 435b.

[0136] In an embodiment of the disclosure, the optical device 440 is implemented in an eye-safety circuit in an illuminator, such as an illuminator for 3D-sensing in smart-phone and automotive applications.

[0137] FIG. 5 depicts a plan view of an optical device 500 for use in an eye-safety apparatus, such as an infrared illuminator. The optical device 500 comprises a substrate 515. For example, the substrate 515 of the optical device 500 of FIG. 5 may correspond to the substrate 405 of the optical device 440 of FIG. 4b.

[0138] A first electrically-conductive element 505 is formed on the substrate 515. The first electrically-conductive element 505 may correspond to the first electrically-conductive element 430 of the optical device 440 of FIG. 4b.

[0139] The first electrically-conductive element 505 forms a meandering or winding trace across at least a portion of the substrate 515. The precise pattern of the first electrically-conductive element 505 in FIG. 5 is shown for purposes of example only, and it will be appreciated that other patterns comprising other shapes or conductive paths may be implemented which fall within the scope of the present invention.

[0140] A plurality of second electrically-conductive elements 510a, 510b are coupled to the first electrically-conductive element 505. Each second electrically-conductive element 510a, 510b, may correspond to the second electrically-conductive element 445 of the optical device 440 depicted in FIG. 4b. Each second electrically-conductive element 510a, 510b extends through a layer or material 525 formed on the substrate 515, wherein the layer of material defines an optical element.

[0141] Such an arrangement may be used for detection of damage to the first electrically-conductive element 505, such as by an impact or crack in the substrate 515. For example, a change in the electrical resistance of the first electrically-conductive element 505 due to cracking, corrosion or damage, may be detected by an electrical circuit coupled to the first electrically-conductive element 505.

[0142] That is, beneficially the provision of the second electrically-conductive elements 510a, 510b extending through the layer of material and coupled to the first electrically-conductive element 505 may permit coupling of detection circuitry to the first electrically-conductive element 505 in a compact device. Such detection circuitry may, for example, be configured to detect variation in a resistance of the first electrically-conductive element 505.

[0143] FIG. 6 depicts an example apparatus 600 according to an embodiment of the disclosure. The example apparatus 600 may be a smart-phone, a tablet device, or the like. The apparatus 600 comprises an optical device 610 according to an embodiment of the disclosure. That is, the optical device 610 may be, or may comprise, an optical device 380 as manufactured according to the method described above with reference to FIGS. 3a to 3f.

[0144] The apparatus 600 also comprises an imaging device which, in some embodiments, may be a camera 605.

[0145] The apparatus 600 comprises processing circuitry 615 communicably coupled to the optical device 610 and to the camera 605.

[0146] In one embodiment, the optical device 610 may be a component of an infrared illuminator for use in conjunction with the camera 605, for example for determining a focus of the camera and/or for object recognition and/or proximity detection.

[0147] FIG. 7 depicts a method of manufacturing an optical device according to an embodiment of the disclosure.

[0148] A first step 710 of the method comprises dispensing a curable conductive material onto a tool.

[0149] A second step 720 comprises disposing the tool relative to a substrate such that the curable conductive material contacts a first electrically-conductive element formed as a pattern on the substrate.

[0150] A third step 730 comprises curing the curable conductive material to form a second electrically-conductive element coupled to the first electrically-conductive element.

[0151] A fourth step 740 comprises forming a layer of material between the tool and the substrate such that the second electrically-conductive element extends through the layer of material, wherein a profile of the tool is configured to define an optical element in the layer.

[0152] A further step may comprise removing the tool from the substrate.

[0153] In some embodiments, the substrate may subsequently undergo singulation, e.g. dicing, to form a plurality of optical devices. In some embodiments, substrate may be used in subsequent steps of assembling one or more optical devices, wherein singulation occurs only after one or more of such subsequent steps.

[0154] The Applicant discloses in isolation each individual feature described herein and any combination of two or more such features, to the extent that such features or combinations are capable of being carried out based on the specification as a whole in the light of the common general knowledge of a person skilled in the art, irrespective of whether such features or combinations of features solve any problems disclosed herein, and without limitation to the scope of the claims. The applicant indicates that aspects of the disclosure may consist of any such individual feature or combination of features. In view of the foregoing description it will be evident to a person skilled in the art that various modifications may be made within the scope of the disclosure.

[0155] Although the disclosure has been described in terms of preferred embodiments as set forth above, it should be understood that these embodiments are illustrative only and that the claims are not limited to those embodiments. Those skilled in the art will be able to make modifications and alternatives in view of the disclosure, which are contemplated as falling within the scope of the appended claims. Each feature disclosed or illustrated in the present specification may be incorporated in any embodiments, whether alone or in any appropriate combination with any other feature disclosed or illustrated herein.

TABLE-US-00001 List of Reference Numerals 100 optical device 105 substrate 110 optical element 115 spacer 120 further substrate 125 active device 200 optical device 205 substrate 210 optical element 215 spacer 220 further substrate 225 active device 230 first electrically-conductive element 235a conductive glue 235b conductive glue 235c cured conductive glue 235d cured conductive glue 240 electrically-conductive trace 245 electrically-conductive trace 250 excess material 260 optical device 300 first step 305 nozzle 310 curable conductive material 315 tool 320 back plate 325 first electrically-conductive element 330 substrate 340 second step 345 third step 350 oven 355 second electrically-conductive element 360 fourth step 365 layer of material 370 optical element 375 fifth step 380 optical device 400 optical device 405 substrate 410 optical element 415 spacer 420 further substrate 425 active device 430 first electrically-conductive element 435a conductive glue 435b conductive glue 435c cured conductive glue 435d cured conductive glue 440 optical device 445 second electrically-conductive element 450 excess material 455 third electrically-conductive element 460 fourth electrically-conductive element 465 upper portion 500 optical device 505 first electrically-conductive element 510a second electrically-conductive element 510b second electrically-conductive element 515 substrate 525 optical element 600 Apparatus 605 camera 610 optical device 615 processing circuitry 710 first step 720 second step 730 third step 740 fourth step