IMAGE SENSOR WITH CONFIGURABLE PIXEL CIRCUIT AND METHOD
20230247325 · 2023-08-03
Inventors
Cpc classification
H04N25/77
ELECTRICITY
H04N25/766
ELECTRICITY
International classification
H04N25/77
ELECTRICITY
H04N25/766
ELECTRICITY
Abstract
The present disclosure relates to an image sensor comprising a plurality of pixel circuits each comprising a photodiode connected between ground and a floating diffusion (FD) node, a reset transistor (MRST) connected between a first voltage supply and the floating diffusion (FD) node, and a source follower transistor (MSF), wherein its drain is connected to a second voltage supply, the gate is connected to a floating diffusion (FD) node and the source is connected to a row select transistor (MSEL). The row select transistor (MSEL) is connected between the source of the source follower transistor (MSF) and a common column output. Each pixel circuit is configured to output an output signal corresponding to a light incident on the photodiode. Each pixel circuit includes at least one additional transistor for configuring each pixel circuit to selectively output a linear integration signal or a logarithmic signal.
Claims
1. An image sensor comprising a plurality of pixel circuits each comprising: a photodiode connected between ground and a floating diffusion (FD) node, a reset transistor (MRST) connected between a first voltage supply and the floating diffusion (FD) node, a source follower transistor (MSF), wherein a drain of the source follower transistor (MSF) is connected to a second voltage supply, a gate of the source follower transistor (MSF) is connected to the floating diffusion (FD) node and a source of the source follower transistor (MSF) is connected to a row select transistor (MSEL), and the row select transistor (MSEL) is connected between the source of the source follower transistor (MSF) and a common column output, wherein each pixel circuit is configured to provide an output signal corresponding to a light incident on the photodiode; and wherein each pixel circuit includes at least one transistor for configuring each pixel circuit to selectively output a linear integration signal or a logarithmic signal.
2. The image sensor of claim 1, wherein each pixel circuit further comprises a transfer gate transistor (MTX) connected between the photodiode and the FD node.
3. The image sensor of claim 1, wherein each pixel circuit is configured to generate the logarithmic output signal and further comprises: a first additional bias transistor (MVB) connected between the second voltage supply and the drain of the source follower transistor (MSF), and a second additional transistor (MS2) connecting a drain of the first additional bias transistor (MVB) to a drain of the reset transistor (MRST), and a third additional transistor (MS3) connecting the reset transistor (MRST) to the first voltage supply, and a fourth additional transistor (MS4) connecting the drain of the reset transistor (MRST) and a gate of the reset transistor (MRST), wherein the row select transistor (MSEL) is closed and the column output is connected to ground, and wherein each pixel circuit comprises an output (vlg_out) connected between the bias transistor (MVB) and the source follower transistor (MSF).
4. The image sensor of claim 1, wherein each pixel circuit is configured to generate the logarithmic output signal and further comprises: a fourth additional switch transistor (MS4) connecting a drain of the reset transistor (MRST) and a gate of the reset transistor (MRST), a bias transistor (MVB) connected between the second voltage supply and the source follower transistor (MSF), and a third additional transistor (MS3) connecting the reset transistor (MRST) to the first voltage supply.
5. An image sensor comprising a plurality of pixel circuits each comprising: a photodiode connected between ground and a floating diffusion (FD) node, a reset transistor (MRST) configured to be connected between a first voltage supply and the floating diffusion (FD) node, a source follower transistor (MSF), wherein a drain of the source follower transistor (MSF) is connected to a second voltage supply, a gate of the source follower transistor (MSF) is connected to the floating diffusion (FD) node and a source of the source follower transistor (MSF) is connected to a row select transistor (MSEL), and the row select transistor (MSEL) is connected between the source of the source follower transistor (MSF) and a common column output, wherein each pixel circuit is configured to provide an output signal corresponding to a light incident on the photodiode; and wherein, to configure each pixel circuit to selectively output a linear integration signal or a logarithmic signal, each pixel circuit further comprises: a first additional bias transistor (MVB) connected between the second voltage supply and the drain of the source follower transistor (MSF), and a second additional transistor (MS2) configured to connect a drain of the bias transistor (MVB) to a drain of the reset transistor (MRST), and a third additional transistor (MS3) configured to connect the reset transistor (MRST) to the first voltage supply, and a fourth additional transistor (MS4) configured to connect the drain of the reset transistor (MRST) to a gate of the reset transistor (MRST).
6. An image sensor comprising a plurality of pixel circuits each comprising: a photodiode connected between ground and a floating diffusion (FD) node, a reset transistor (MRST) configured to be connected between a first voltage supply and the floating diffusion (FD) node, a source follower transistor (MSF), wherein a drain of the source follower transistor (MSF) is connected to a second voltage supply, a gate of the source follower transistor (MSF) is connected to the floating diffusion (FD) node and a source of the source follower transistor (MSF) is connected to a row select transistor (MSEL), and the row select transistor (MSEL) is connected between the source of the source follower transistor (MSF) and a common column output, wherein each pixel circuit is configured to provide an output signal corresponding to a light incident on the photodiode; and wherein, to configure each pixel circuit to selectively output a linear integration signal or a logarithmic signal, each pixel circuit further comprises: a bias transistor (MVB) connected between the second voltage supply and the drain of the source follower transistor (MSF), a second additional transistor (MS2) configured to connect a drain of the bias transistor (MVB) to a drain of the reset transistor (MRST), and a third additional transistor (MS3) configured to connect the reset transistor (MRST) to the first voltage supply, and a fourth additional switch transistor (MS4) configured to connect the drain of the reset transistor (MRST) and a gate of the reset transistor (MRST).
7. The image sensor of claim 3, wherein at least one additional diode connected transistor is connected in series with the second additional transistor (MS2) and configured to multiply a gain in a logarithmic conversion configuration, or wherein the at least one additional diode connected transistor is connected in parallel with the third additional transistor (MS3) and configured to multiply the gain in the logarithmic conversion configuration.
8. The image sensor of claim 1 wherein the image sensor is configured such that, during distinct time intervals, the at least one transistor is configured to configure the plurality of pixel circuits sequentially in alternate configurations wherein the at least one transistor is configured to configure the alternate configurations independently for each of the plurality of pixel circuits, or for sub-sets of the plurality of pixel circuits, or wherein the at least one transistor is configured to configure the alternate configurations independently for each of the plurality of pixel circuits or for sub-sets of the plurality of pixel circuits based on a previous output signal.
9. The image sensor of claim 1, wherein the image sensor is constructed of multiple semiconductor layers, where each layer is optimised for a function of that layer
10. The image sensor of claim 1, wherein the image sensor is constructed of multiple semiconductor layers, wherein a second layer of the multiple layers contains the at least one transistors for configuring each pixel circuit, and a first layer of the multiple layers comprises the photodiodes, the reset transistors (MRST), the source follower transistors (MSF), and the row select transistors (MSEL).
11. The image sensor of claim 1 further comprising reconfiguration switches that connect floating diffusion nodes (FD) of a sub-set of adjacent ones of the plurality of pixels circuits.
12. The image sensor of claim 1, wherein each pixel circuit further comprises a bias transistor (MVC), wherein the bias transistor (MVC) is connected between ground and the source follower transistor (MSF) and a voltage (vc) is connected to a gate of an output transistor.
13. The image sensor of claim 3, wherein each pixel circuit further comprises a row select transistor (MSEL2) connected between the output (vlg_out) and the common column output, and a fifth additional transistor (MS5) connecting the source follower transistor (MSF) to ground.
14. The image sensor of claim 3, wherein each pixel circuit further comprises a second source follower transistor (MSF2) and a row select transistor (MSEL2) connecting the output (vlg_out) to the common column output, and a fifth additional transistor (MS5) connecting the source follower transistor (MSF) to ground.
15. The image sensor of claim 3, wherein each pixel circuit further comprises a second source follower transistor (MSF2) and a row select transistor (MSEL2) connecting the output (vlg_out) to an additional common column output.
16. A method for reconfiguring an image sensor comprising a plurality of pixel circuits, the method comprising: providing a photodiode connected between ground and a floating diffusion (FD) node, providing a reset transistor (MRST) connected between a first voltage supply and the floating diffusion (FD) node, providing a source follower transistor (MSF), wherein a drain of the source follower transistor (MSF) is connected to a second voltage supply, a gate of the source follower transistor (MSF) is connected to the floating diffusion (FD) node and a source of the source follower transistor (MSF) is connected to a row select transistor (MSEL), and connecting the row select transistor (MSEL) between the source of the source follower transistor (MSF) and a common column output, outputting an output signal corresponding to a light incident on the photodiode; providing each pixel circuit with an output selection transistor, and configuring each pixel circuit using a corresponding one of the output selection transistors to selectively output a linear integration signal or a logarithmic signal.
17. The method of claim 16, further comprising: connecting a first additional transistor (MVB) between the second voltage supply and the drain of a source follower transistor (MSF), and providing a second additional transistor (MS2) configured to connect a drain of the first additional transistor (MVB) to a drain of the reset transistor (MRST), and providing a third additional transistor (MS3) configured to connect the reset transistor (MRST) to the first voltage supply, and providing a fourth additional transistor (MS4) configured to connect the drain of the reset transistor (MRST) to a gate of the reset transistor (MRST).
18. (canceled)
19. The method of claim 17, wherein each pixel circuit is configured to generate the logarithmic output signal and the method further comprises: connecting the drain of the first additional transistor (MVB) to the drain of the reset transistor (MRST) using the second additional transistor (MS2), maintaining the third additional transistor (MS3) in an open state, and connecting the drain of the reset transistor (MRST) and the gate of the reset transistor (MRST) using the fourth additional transistor (MS4), maintaining the row select transistor (MSEL) in a closed state, connecting the common column output to ground, and for each pixel circuit connecting an output (vlg_out) between the bias transistor (MVB) and the source follower transistor (MSF).
20. The method of claim 17, wherein each pixel circuit is configured to generate the logarithmic output signal and the method further comprises: connecting the drain of the reset transistor (MRST) and the gate of the reset transistor (MRST) using the fourth additional switch transistor (MS4), connecting the reset transistor (MRST) to the first voltage supply using the third additional transistor (MS3), maintaining the second additional transistor (MS2) in an open state, and closing the row select transistor (MSEL), whereby the logarithmic output is made available on the common column output.
21. The image sensor of claim 5, each pixel circuit comprises an output (vlg_out) connected between the bias transistor (MVB) and the source follower transistor (MSF), and wherein at least one of the plurality of pixels circuits is configured such that: the second additional transistor (MS2) connects the drain of the bias transistor (MVB) to the drain of the reset transistor (MRST), the third additional transistor (MS3) is open, the fourth additional transistor (MS4) connects the drain of the reset transistor (MRST) and the gate of the reset transistor (MRST), and the row select transistor (MSEL) is closed and the column output is connected to ground, whereby the at least one pixel circuit generates a logarithmic output signal.
22. The image sensor of claim 6, wherein at least one of the plurality of pixels circuits is configured such that: the fourth additional switch transistor (MS4) connects the drain of the reset transistor (MRST) and gate of the reset transistor (MRST), the third additional transistor (MS3) connects the reset transistor (MRST) to the first power supply, and the second additional transistor (MS2) is open and the row select transistor (MSEL) is closed, whereby the logarithmic output is made available on the column output.
Description
[0039] The invention is described with reference to the following figures.
[0040]
[0041]
[0042]
[0043]
[0044]
[0045]
[0046]
[0047]
[0048]
[0049]
[0050]
[0051]
[0052] The same reference signs in the figures denote the same or similar elements. If not indicated otherwise, the figures may also show the same circuitry in the same or similar elements or parts of the respective figures. As the switching functionality described below may be realised by transistors, the terms switch and transistor may be used interchangeably.
[0053]
[0054] In the logarithmic mode illustrated in
[0055]
[0056] Charge integration is carried out with MTX off, and the charge is transferred to the floating diffusion (FD) node by turning on MTX following the integration time. The source follower MSF and select transistor, MSEL, again select a single row of the pixel array to be read by the read-out electronics.
[0057] Other configurations of the pixels such as 5T and 6T pixels also exist. By adding extra transistors, functions such as global shutter, as opposed to the more common rolling shutter, are possible.
[0058] The logarithmic mode illustrated in
[0059] Alternative logarithmic configurations are known, which provide an improved response. J. Guo et al., 2008, SENSORS, 2008 IEEE, provides electrical reconfiguration between linear and logarithmic modes, but without a pixel-local output. This is shown in
[0060] Configurations exist, see
[0061] Alternative solutions are reported with multiple exposure times, S. D. Freedman, 2015, 2nd International Conference on Knowledge-Based Engineering and Innovation (KBEI), and time based conversion methods, e.g. according to
[0062]
[0063] Some foundry standard cells provide additional functions, for example additional gain ranges, which are implemented with additional transistors creating a 5T, 6T, . . . nT structure. The invention is compatible with these extensions of the standard cell.
[0064] The operation of the pixel in this configuration consists of four phases. (i) In the FD reset phase, signal reset is high and the transistor MRST is on. The FD node is connected to vrst and any integrated charge of the previous cycle is drained. (ii) In the PD charge accumulation phase, MTX is off and the photo-generated carriers accumulate in the PD when light is incident. (iii) In the PD charge transfer phase, MTX is on and the accumulated charge is transferred from PD to FD and converted to a voltage. (iv) In the FD voltage readout phase, MSEL is activated and the transferred charge is held on FD. The FD voltage is read out to the column line via buffer source follower transistor, MSF, when signal sel is high.
[0065]
[0066] The current I.sub.PD through transistor MRST is given by the current flowing through photodiode PD. MRST operates in weak inversion with the current to voltage relationship given by:
[0067] Thus, signal vlg_out is a logarithmic function of I.sub.PD plus a constant offset given by the biasing:
vlg_out≈nU.sub.T ln(I.sub.PD/I.sub.D0)+V.sub.FD+V.sub.TH
where I.sub.D0 is the I.sub.PD current when vlg_out−V.sub.FD=V.sub.TH for the MSF transistor, n is the slope factor, U.sub.T is the thermal voltage and V.sub.TH is the threshold voltage of MRST. Therefore, the current I.sub.PD through transistor MRST is converted to a well-defined output voltage on output line vlg_out.
[0068] With respect to the logarithmic mode shown in
[0075] With respect to the logarithmic mode shown in
[0078] The logarithmic mode shown in
[0079] Further diode connected transistors may optionally be added in series with transistor MRST in the concept circuit. These transistors operate in the same manner and provide a multiplication of the voltage gain. These transistors are not a reuse of the foundry standard cell and represent additional cost (area) but are compatible with the invention.
[0080] Preferably, at least one additional diode connected transistor is connected in series with the second additional transistor (MS2) and configured to multiply the gain in a logarithmic conversion configuration, or at least one additional diode connected transistor is connected in parallel with the third additional transistor (MS3) and configured to multiply the gain in a logarithmic conversion configuration. This is shown in
[0081]
[0082] This alternative logarithmic mode is enabled with the current invention with no additional transistors in the pixel circuit. It may also be advantageous in some embodiments to extend the dynamic range for frame image operation with no additional cost, i.e. silicon area.
[0083] The alternative logarithmic configuration can be combined with the linear integrating configuration as shown in
[0084] The response of the circuit at low light illumination intensities is linear as MRST is not conducting and the FD voltage change is proportional to the illumination intensity and the integration time. At high illumination intensity MRST provides a logarithmic voltage response and the FD voltage is a logarithmic function of the intensity.
[0085] This configuration is well known and is compatible with the current invention. It is advantageous as it provides additional dynamic range for frame image data. The linear response is degraded as the isolation provided by the foundry standard transfer transistor, MTX, is not used.
[0086] As in the first logarithmic mode described above, further diode connected transistors may be added in series with transistor MRST in the concept circuit of the alternative configuration.
[0087] These transistors operate in the same manner and provide a multiplication of the voltage gain. These transistors are not a reuse of the foundry standard cell and represent additional cost (area), but are compatible with the invention.
[0088] The pixel circuit illustrated in
[0089] The core is the 4T pixel of
[0090] The photodiode PD is connected via a transmitting transistor MTX to the floating diffusion node FD.
[0091] The transistor MRST is connected between the floating diffusion node FD and a second switch MS3, which is further connected to a supply voltage, vrst. The gate of MRST is connected to the output of tristate logic gate X1. The operation of X1, MRST and MS3 provides the reset path for node FD.
[0092] Switch MS4 further connects the gate and drain of transistor MRST. This connection is used to allow the reuse of transistor MRST as the transistor converting from a linear photo-current to a logarithmic voltage in the logarithmic modes.
[0093] The gate of transistor MSF is connected to the floating diffusion node, FD, the source to the selection switch transistor MSEL and the drain to the drain of transistor MVB, which in turn connects to power supply, vdd. Transistor MSF creates the source follower circuit to copy the voltage on node FD to the column line in configurations where this function is used.
[0094] The source of transistor MVB is connected to supply vdd, the drain to output node vlg_out and the gate to signal vb. This transistor is used as a switch (on) in configurations where a source follower function of MSF is required and as a current source where an output on vlg_out is required.
[0095] Switch MS2 is connected between the drain of transistor MRST and vlg_out and is closed in the first logarithmic mode.
[0096] The reconfigurable circuit provides a high quality (low noise at low light) image data frame output as well as high dynamic range and low noise continuous data for event generation from the same pixel array.
[0097] The reuse of the foundry provided 4T cell is advantageous as: [0098] these cells are provided in area optimised form, including process technology optimisations to optimise the area [0099] these cells are provided in performance optimised form, including process technology optimisations to optimise the performance [0100] characterisation information is available for these cells [0101] reliability information is available for these cells [0102] yield information is available for these cells [0103] foundries have a commitment to maintain the performance specifications of the cell across technology changes [0104] the migration of designs from one process node to the next is facilitated by the availability of the characterisation information.
[0105] In linear integration mode (cf.
[0106] In the first logarithmic mode (cf.
[0107] In one embodiment, the voltage vlg_out is used locally for in-pixel processing. In a further embodiment, the voltage, vlg_out, is connected via an additional row select transistor (MSEL2) to the column line and the source of MSF is switched to ground with additional switch MS5. In a further embodiment, the voltage, vlg_out, is connected via a second source follower (MSF2) and row select transistor (MSEL2) to the existing column line and the source of MSF is switched to ground with additional switch MS5. In a further embodiment, the voltage, vlg_out, is connected via a second source follower (MSF2) and row select (MSEL2) to an additional column line.
[0108] In the alternative logarithmic mode, MS2 is open, X1 is inactive, while MS3, MS4, MTX and MVB are closed. MSEL is used as a row select and, when the row is selected, the logarithmic voltage is continuously available on the column line. The effective circuit in this configuration matches
[0109] The image sensor may electrically reconfigure the entire pixel arrangement between alternate configurations from time to time. This is advantageous to provide different data qualities from the same image sensor, e.g. high quality low light frame image data and also low-latency dynamic response.
[0110] The image sensor may also electrically reconfigure different areas (sub-sets of pixels) in different configurations at the same time, where the sub-set may change from time to time. This is advantageous to obtain different qualities of data simultaneously from different regions of an image.
[0111] The image sensor may switch the configuration of the entire pixel arrangement or sub-sets of the pixel arrangement based on the image output over a preceding time interval. This is advantageous to provide high quality data under changing illumination conditions.
[0112] In a further embodiment additional reconfiguration switches connect equivalent FD nodes between a sub-set of adjacent pixels is a logarithmic configuration where a single read-out MRST transistor enabled. In this way, multiple photodiodes are connected in parallel, increasing the total photodiode current through the active MRST transistor and resulting in a larger voltage and more gain from the illumination intensity to the output voltage. This is advantageous as it improves the signal to noise ratio and improves the response speed.
[0113] In a further embodiment shown in
[0114] This embodiment is advantageous as it reduces the noise in operation of the pixel-local continuous processing at lower illumination intensities. In combination with the logarithmic processing at higher light levels, this provides an extended dynamic range for local processing and low latency response.
[0115] The speed of response is reduced in this operation (increased latency), but the speed is still higher than full frame output.
[0116] According to a further configuration depicted in
[0117] In one embodiment, the image sensor integrated circuit is constructed of a single semiconductor layer.
[0118] In a further embodiment the image sensor is constructed of multiple semiconductor layers, where the semiconductor process type of each layers is optimised for the function of that layer.
[0119] This implementation is advantageous as the optimisation for function of the semiconductor processes allows (i) improvements in performance, (ii) reduction of silicon area and following (ii), a reduction in device size and device cost. The altered physical structure improves the optical performance for (i) fill factor (ii) quantum efficiency and reduces electrical disturbance between controlling signal lines and the photosensor circuit.
[0120] In particular the foundry standard base cell may be implemented on one semiconductor layer, where this semiconductor layer is optimised for the optical performance and the cell density and fill factor. The additional switching transistors are realised in an additional semiconductor layer.
[0121] The proposed structure provides reconfiguration with a limited number of connections between semiconductor layers per pixel. In one embodiment and with reference to
[0122] In conclusion, the linear integration mode is used for high sensitivity at low light levels and frame mode operation, as in a classical 4T pixel. The dynamic range can be extended for frame mode operation using the alternative logarithmic mode at no extra cost (area) or using the first logarithmic mode for improved performance at additional cost (area).
[0123] The first logarithmic mode provides a high quality continuous output signal for pixel local processing suitable for generating event responses.
[0124] The operating modes are obtained by electrical reconfiguration with a small overhead to the foundry standard 3T or 4T circuit providing both high quality frame image data and a continuous pixel-local high quality logarithmic response for event processing from the same pixel array.
[0125] The use of the same array for the linear and logarithmic operating modes is advantageous as: [0126] the geographical correlation of the frame image data and the event data is simple as the same pixels are used. Precise and time-stable and vibration-stable alignment or calibration of multiple image systems (optics) or compensation of optical aberrations and distortions or chromatic responses is not required. [0127] the requirement for a second image sensor is removed in some embodiments, reducing camera volume, power consumption and cost and improving reliability.
[0128] The plurality of pixels is typically organised in a two dimensional grid with “rows” and “columns”. It should be noted that the definition of “rows” and “columns” can be interchanged without affecting the invention. It should also be noted that other geometrical configurations are possible which map to a two dimensional grid, without impacting the applicability of the invention.
[0129] The configurations according to the embodiments described above may be electrically reconfigured from time to time in operation and may optionally depend on the operating mode or on the illumination conditions.
[0130] Other aspects, features, and advantages will be apparent from the summary above, as well as from the description, including the figures and the claims.
[0131] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. It will be understood that changes and modifications may be made by those of ordinary skill within the scope of the following claims. In particular, the present invention covers further embodiments with any combination of features from different embodiments described above and below.
[0132] Furthermore, in the claims the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single unit may fulfil the functions of several features recited in the claims. The terms “essentially”, “about”, “approximately” and the like in connection with an attribute or a value particularly also define exactly the attribute or exactly the value, respectively. Any reference signs in the claims should not be construed as limiting the scope.