ACTIVE IMPLANTABLE MEDICAL DEVICE COMPRISING APPLICATION SPECIFIC INTEGRATED CIRCUIT AND METHOD THEREOF FOR HEATING CONTROL
20230241378 · 2023-08-03
Inventors
Cpc classification
A61N1/086
HUMAN NECESSITIES
International classification
Abstract
The present invention provides an active implantable medical device (AIMD) comprising an implantable lead, an application specific integrated circuit (ASIC) within a hermetic enclosure of the AIMD, and a sensing and cancellation wave output from the ASIC supplying to the lead. The invention also provides a method of reducing heating of an AIMD and a lead thereof.
Claims
1. An active implantable medical device (AIMD) comprising an implantable lead, an application-specific integrated circuit (ASIC) within a hermetic enclosure of the AIMD, wherein the ASIC senses an external signal and generates a cancellation wave output and supplies it to the lead to reduce its heating; and/or the ASIC senses an external signal and adaptively adjusts an impedance of a non-lead portion of the AIMD to minimize an induced heating of the lead.
2. The active implantable medical device according to claim 1, which is an implantable pulse generator (IPG).
3. The active implantable medical device according to claim 1, further comprising a stimulation output 5 supplying to the lead 4.
4. A method of reducing heating of a lead of an active implantable medical device (AIMD), comprising (i) providing an application-specific integrated circuit (ASIC) within a hermetic enclosure of the AIMD; (ii) sensing an external signal by the ASIC; and (iii) generating a cancellation wave output and supplying it to the lead to reduce its heating; and/or adaptively adjusting an impedance of a non-lead portion of the AIMD to minimize an induced heating of the lead.
Description
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0012] The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements. All the figures are schematic and generally only show parts which are necessary in order to elucidate the invention. For simplicity and clarity of illustration, elements shown in the figures and discussed below have not necessarily been drawn to scale. Well-known structures and devices are shown in simplified form, omitted, or merely suggested, in order to avoid unnecessarily obscuring the present invention.
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0018] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent, however, to one skilled in the art that the present invention may be practiced without these specific details or with an equivalent arrangement.
[0019] Where a numerical range is disclosed herein, unless otherwise specified, such range is continuous, inclusive of both the minimum and maximum values of the range as well as every value between such minimum and maximum values. Still further, where a range refers to integers, only the integers from the minimum value to and including the maximum value of such range are included. In addition, where multiple ranges are provided to describe a feature or characteristic, such ranges can be combined.
[0020] It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the invention. For example, when an element is referred to as being “on”, “connected to”, or “coupled to” another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on”, “directly connected to”, or “directly coupled to” another element, there are no intervening elements present.
[0021] With reference to
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[0023] In exemplary embodiments, the ASIC 3 may function as MRI safety sensing ASIC with active reverse voltage injection for the AIMD 10.
[0024] As shown in
[0025]
[0026] In some other embodiments, the ASIC senses (or detects, or measures) an external signal and adaptively adjusts an impedance of a non-lead portion of the AIMD to minimize an induced heating of the lead. For example, the ASIC circuit may be used to (as step 1) detect the input RF signal induced on various electrodes during MR scanner, and to estimate the induced power at each electrode inside the ASIC. Based on the induced voltage level, the ASIC may be used to (as step 2) change the input impedance values between electrode and the ground. Go to step 1 to sense again. Keep on doing step 1 and step 2 until the maximum induced power is reached. Then, use the corresponding value for the rest of the MR imaging. By inducing the maximum power inside the IPG, the induced energy to the tip such as lead tip would be lower. Consequently, this will reduce the device tip heating.
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[0028] In the foregoing specification, embodiments of the present invention have been described with reference to numerous specific details that may vary from implementation to implementation. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. The sole and exclusive indicator of the scope of the invention, and what is intended by the applicant to be the scope of the invention, is the literal and equivalent scope of the set of claims that issue from this application, in the specific form in which such claims issue, including any subsequent correction.