MANUFACTURING METHOD OF THERMAL MODULE

Abstract

A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.

Claims

1. A manufacturing method of thermal module, comprising steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component.

2. The manufacturing method of thermal module as claimed in claim 1, wherein the copper embedding layer has an embedding face and a contact face respectively positioned on two opposite faces of the copper embedding layer, the embedding face being deep engaged and inlaid in a section of the aluminum heat conduction component, which section is securely assembled with the copper heat conduction component, the contact face serving as an exposed surface of the copper embedding layer and being connected with a welding material layer.

3. The manufacturing method of thermal module as claimed in claim 1, wherein the copper heat conduction component is a copper heat pipe, while the aluminum heat conduction component is an aluminum base seat.

4. The manufacturing method of thermal module as claimed in claim 3, wherein the copper heat conduction component has a heat absorption section and a condensation section, the aluminum heat conduction component having a connection section, the heat absorption section being correspondingly assembled with the connection section, the copper embedding layer being disposed on an outer surface of the connection section, the condensation section being correspondingly passed through multiple radiating fins made of aluminum material, whereby by means of the copper embedding layer, the heat absorption section is securely welded and connected with the connection section.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

[0012] FIG. 1 is a flow chart of the manufacturing method of thermal module of the present invention; and

[0013] FIG. 2 is a sectional assembled view showing the manufacturing method of thermal module of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Please refer to FIG. 1, which is a flow chart of the manufacturing method of thermal module of the present invention. As shown in the drawing, the manufacturing method of thermal module of the present invention includes steps of;

[0015] S1. providing at least one aluminum heat conduction component and at least one copper heat conduction component, a copper heat conduction component or an aluminum heat conduction component being provided, the copper heat conduction component being a copper-made base seat, a copper-made substrate, a copper-made heat pipe, a copper-made vapor chamber or a copper-made water block, the aluminum heat conduction component being an aluminum-made base seat or an aluminum-made radiating fin;

[0016] S2. disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component, the face or the section to be processed being physically or chemically processed so as to dispose a copper embedding layer thereon, that is, by means of physical or chemical processing, the copper embedding layer being formed on a surface of the aluminum heat conduction component, which surface is to be securely assembled with the copper heat conduction component, the physical processing being a mechanical processing for deforming or cutting the surface, for example, by means of high-speed spraying, accumulating metal particles on a surface of the aluminum heat conduction component, which surface is to be securely assembled with the copper heat conduction component, to form the copper embedding layer or by means of hammering, inlaying a copper foil into a surface of the aluminum heat conduction component, which surface is to be securely assembled with the copper heat conduction component, to form the copper embedding layer, the chemical processing being selected from a group consisting of printing, electroplating, electrolysis and electroforming for disposed the copper embedding layer on the surface of the aluminum heat conduction component, by means of the copper embedding layer disposed on the surface of the aluminum heat conduction component, the shortcoming that the conventional aluminum heat conduction component can be hardly welded with the copper heat conduction component being improved; and

[0017] S3. welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component.

[0018] In this step, the aluminum heat conduction component is connected with the copper heat conduction component by means of welding. In the welding operation, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, is welded with the copper heat conduction component. Due to the copper embedding layer, the surface of the aluminum heat conduction component to be welded with the copper heat conduction component has the same metal element as the copper heat conduction component. Therefore, the aluminum heat conduction component can be successfully welded and connected with the copper heat conduction component.

[0019] Please refer to FIG. 2, which shows that the aluminum heat conduction component 2 is correspondingly connected with the copper heat conduction component 1. The copper embedding layer 3 is disposed on a section of the aluminum heat conduction component 2, which section is in contact and connection with the copper heat conduction component 1. In addition, a welding material layer 4 is disposed between the copper embedding layer 3 and the copper heat conduction component 1, whereby the aluminum heat conduction component 2 is securely connected with the copper heat conduction component 1.

[0020] The copper heat conduction component 1 has a heat absorption section and a condensation section. The aluminum heat conduction component 2 has a connection section. The heat absorption section is correspondingly assembled with the connection section. The copper embedding layer is disposed on an outer surface of the connection section. The condensation section is correspondingly passed through multiple radiating fins made of aluminum material. By means of the copper embedding layer, the heat absorption section can be securely welded and connected with the connection section.

[0021] The copper embedding layer 3 has an embedding face and a contact face respectively positioned on two opposite faces of the copper embedding layer. The embedding face is deep engaged and inlaid in a section of the aluminum heat conduction component 2, which section is securely assembled with the copper heat conduction component 1. The contact face serves as an exposed surface of the copper embedding layer 3 and is connected with a welding material layer 4.

[0022] It can be known from the content of the specification of the present invention that after the copper embedding layer is formed on the section of the aluminum heat conduction component, which section is to be connected with the copper heat conduction component, the aluminum heat conduction component can be easily welded and connected with the copper heat conduction component by means of welding.

[0023] In the conventional manufacturing method of the thermal module, the aluminum heat conduction component (such as base seat and radiating fin assembly) must be connected with the copper heat conduction component by means of welding. However, the copper material and the aluminum material cannot be directly welded with each other. Also, the aluminum material and the aluminum material cannot be directly welded with each other. Therefore, in the conventional technique, it is necessary to first deposit a nickel coating on a section of the aluminum radiating fin, which section is connected with the aluminum base seat, or on a section of the aluminum base seat, which section is connected with the copper heat pipe by means of chemical nickel plating. In this case, the aluminum base seat, the aluminum radiating fin and the copper heat pipe can be successfully welded and connected with each other. The environmental pollution caused by the process of chemical nickel deposition has been gradually stressed and required to improve. Therefore, the present invention provides a manufacturing method of thermal module to improve the problem of environmental pollution of the conventional manufacturing method of thermal module. In the manufacturing method of thermal module of the present invention, a copper embedding layer is disposed on an outer surface of a section of the aluminum heat conduction component, which section is to be welded and connected with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component and the copper heat conduction component can be successfully directly welded and connected with each other.

[0024] The present invention employs the copper embedding layer instead of the chemical electroplated nickel used in the conventional manufacturing method of thermal module so that the cost is saved and the problem of environmental pollution caused by the chemical nickel plating is improved.

[0025] The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.