CONNECTION MODULE AND THINNING METHOD THEREOF
20230246363 ยท 2023-08-03
Inventors
Cpc classification
H01R12/91
ELECTRICITY
H01R12/722
ELECTRICITY
International classification
Abstract
A connection module is disposed in a main circuit board and includes a card edge connector, a hard circuit board and two connectors. The card edge connector is fixedly disposed on the main circuit board. The hard circuit board has a board body and a connecting tongue for correspondingly plugging with the card edge connector. The board body is configured with a disconnecting notch, and the board body is separated by the disconnecting notch into two floating plates arranged side by side at an interval and floatable using the disconnecting notch. The connectors are respectively fixed to the floating plates. Thus, without needing an additional guide frame, the connectors are enabled to float in any desired direction, thereby achieving effects of reducing an overall height and satisfying current thinning requirements.
Claims
1. A connection module, disposed on a main circuit board, comprising: a card edge connector, disposed stationarily on the main circuit board; a hard circuit board, having a board body and a connecting tongue correspondingly plugged with the card edge connector, the board body provided with at least one disconnecting notch, the board body separated by the disconnecting notch into two floating plates arranged side by side at an interval and floatable using the disconnecting notch; and at least two connectors, respectively fixed to the floating plates.
2. The connection module according to claim 1, wherein the hard circuit board is fixed to the main circuit board.
3. The connection module according to claim 1, wherein the hard circuit board is provided with a through hole, and the hard circuit board is fixed to the main circuit board by a fixing element via the through hole.
4. The connection module according to claim 3, wherein the through hole is provided at the board body and is in communication with the disconnecting notch.
5. The connection module according to claim 3, further comprising: a fixing column, arranged on the main circuit board and having a fixing hole; wherein, the fixing element is fixedly connected to the fixing hole via the through hole, and the hard circuit board is fixed between the fixing element and the fixing column.
6. The connection module according to claim 5, wherein the fixing column has a small diameter portion, the small diameter portion is correspondingly inserted in the through hole and has an outer periphery, the through hole has an inner periphery and is in communication with the disconnecting notch, a gap is present between the inner periphery and the outer periphery, and the floating plates are floatable via the disconnecting notch and the gap.
7. The connection module according to claim 5, wherein the fixing column is correspondingly inserted in the through hole and has a flange formed thereon, and the fixing column supports the hard circuit board by the flange.
8. The connection module according to claim 1, wherein the hard circuit board is defined with a side-by-side direction and a top-down direction perpendicular to each other, and the floating plates are floatable in the side-by-side direction, the top-down direction, or the side-by-side direction and the top-down direction via the disconnecting notch.
9. The connection module according to claim 1, wherein the hard circuit board has two concave portions respectively formed between two short sides of the connecting tongue and a long side of the board body, and a distance between a notch bottom of the disconnecting notch and a concave portion inner corner of each of the concave portions is reduced for the floating plates with the use of the concave portions.
10. The connection module according to claim 1, wherein a length of the connecting tongue is less than a length of the board body.
11. The connection module according to claim 1, wherein the card edge connector is an M.2 connector.
12. The connection module according to claim 1, wherein each of the floating plates is provided with a sunken plate opening, and each of the connectors is embedded into each of the sunken plate opening by a sunken plate means.
13. The connection module according to claim 1, wherein each of the connectors is a USB Type-C connector.
14. The connection module according to claim 1, wherein the card edge connector is disposed flat on the main circuit board, the card edge connector is defined with a first plugging direction, the first plugging direction is parallel to a mounting surface of the main circuit board, and the hard circuit board is pluggably plugged with the card edge connector in the first plugging direction.
15. The connection module according to claim 14, wherein each of the connectors is defined with a second plugging direction, and each of the second plugging direction is parallel to the first plugging direction.
16. A thinning method for a connection module, the connection module arranged on a main circuit board, the thinning method comprising: providing a card edge connector, the card edge connector disposed stationarily on the main circuit board; providing a hard circuit board, the hard circuit board having a board body and a connecting tongue; configuring a disconnecting notch, the disconnecting notch configured at the board body such that the board body is separated by the disconnecting notch into two floating plates arranged side by side at an interval and floatable using the disconnecting notch; and providing at least two connectors, the connectors respectively fixed to the floating plates; wherein, the hard circuit board is correspondingly plugged with the card edge connector by the connecting tongue.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Details and technical contents of the present invention are described with the accompanying drawings below. It should be noted that the accompanying drawings are only for reference and illustration purposes and are not to be construed as limitations to the present invention.
[0021] The present invention provides a connection module and a thinning method thereof. As shown in
[0022] As shown in
[0023] As shown in
[0024] As shown in
[0025] At least one disconnecting notch 210 shaped as a breach is provided on any side of the board body 21, and the number of the disconnecting notch 210 may be one or two or more. In this embodiment, one disconnecting notch 210 provided on the other long side 21a of the board body 21 is used as an example for illustration. Thus, the board body 21 is separated by the disconnecting notch 210 into two floating plates 211 arranged side by side at an interval, and the two floating plates 211 are floatable in any desired direction using the disconnecting notch 210. As shown in
[0026] The number of the connectors 3 is not limited by the present invention, and may be two or three or more; a corresponding number of the connectors 3 is needed according to the number of floating plates 211 of the board body 21. In this embodiment, two connectors 3 are respectively fixed to the two floating plates 211 as an example for illustration.
[0027] A structure for fixing the connector 3 to the floating plate 211 may be any fixing structure as desired, and in this embodiment, a sunken plate structure is taken as an example for illustration. That is, each floating plate 211 is provided with a sunken plate opening 2110, so as to embed each connector 3 by a sunken plate means into each sunken plate opening 2110 and fix each connector 3 to each floating plate 211, thereby providing an effect of reducing the overall height. The position for providing each sunken plate opening 2110 may also be on the other long side 21a of the board body 21. As shown in
[0028] Accordingly, as shown in
[0029] In addition to fixing the hard circuit board 2 to the main circuit board 91 by plugging in the card edge connector 1, a through hole 213 may be further provided so that the hard circuit board 2 may be fixed to the main circuit board 91 by a fixing element F via the through hole 213. The through hole 213 may be provided at the board body 21 or the connecting tongue 22, and is provided at the board body 21 in this embodiment as an example for illustration. The through hole 213 may be in communication with the disconnecting notch 210 as shown in the drawings, or may not be in communication therewith (not shown). In this embodiment, the through hole 213 is connected to and is in communication with the disconnecting notch 210 as an example for illustration, so as to reduce the distance between the through hole 213 and the disconnecting notch 210 and to minimize the area of the board body 21 (or reduce the area of the hard circuit board 2).
[0030] The hard circuit board 2 may be fixed to the main circuit board 91 by the fixing element F via the through hole 213 only, preferably, the fixing element F is further fixed via the fixing column 4, as shown in
[0031] More specifically, as shown in
[0032] Referring to
[0033] The through hole 213 above may be in communication with any portion of the disconnecting notch 210, and is in communication with an inner end of the disconnecting notch 210 in this embodiment as an example for illustration, such that the through hole 213 becomes a notch bottom of the disconnecting notch 210. In other embodiments not shown in the drawings, if the through hole 213 is not in communication with the disconnecting notch 210, the inner end of the disconnecting notch 210 is the notch bottom.
[0034] To enhance the floating ability of each of the floating plates 211 in the top-down direction D4, as shown in
[0035] Moreover, as described above, in other embodiments not shown in the drawings, the hard circuit board 2 may be provided with two or more disconnecting notches 210, and each of the through hole 213 and the fixing column 4 is provided in singular form, for the reason that only one additional second fixing portion is needed in addition to fixing the hard circuit board 2 to the card edge connector 1 (a first fixing portion). The second fixing portion may be fixed by the fixing element F only, or the fixing element F may be fixed to the fixing column 4.
[0036] As shown in
[0037] In step S1101 of providing a card edge connector 1, the card edge connector 1 is disposed stationarily on the first mounting surface 911 of the main circuit board 91. In step S1103 of providing a hard circuit board 2, the hard circuit board 2 has a board body 21 and a connecting tongue 22 protruding integrally from one of the long sides 21a of the board body 21. In step S1105 of configuring a disconnecting notch 210, the disconnecting notch 210 is configured at the board body 21, so that the board body 21 is separated by the disconnecting notch 210 into two floating plates 211 arranged side by side at an interval and the two floating plates 211 are floatable in any desired direction using the disconnecting notch 210. In step S1107 of providing two connectors 3, the connectors 3 are respectively fixed to the floating plates 211, such that the connectors 3 are floatable in any desired direction along with the floating plates 211. The hard circuit board 2 is correspondingly plugged with the card edge connector 1 by the connecting tongue 22 thereof.
[0038] Thus, using the connection module 100 having a special design of the present invention, without needing an additional guide frame, the connectors 3 are enabled to float in any desired direction along with the floating plates 211 and the two counterpart connectors 8 are allowed to be simultaneously precisely plugged, thereby achieving effects of reducing the overall height and satisfying current thinning requirements.
[0039] In conclusion, the connection module and the thinning method thereof of present invention are capable of achieving expected utilization objects and resolving drawbacks of the prior art, and thus the present invention completely meets the requirements of a patent application. Therefore, a patent application is filed accordingly, and granting the application with patent rights is respectfully requested to ensure rights of the Inventor.
[0040] The description above provides merely preferred feasible embodiments of the present invention and is not to be construed as limitations to the claim scope of the present invention. All equivalent structural variations made on the basis of the description and drawings of the present invention are to be encompassed within the scope of claims of the present invention.