ELECTROMAGNETIC SHIELDING SUBSTRATE AND DISPLAY PANEL
20220118743 · 2022-04-21
Assignee
Inventors
- Yao-Chih Chuang (Tainan City, TW)
- Chia-Yu Liu (Tainan City, TW)
- Chih-Wei Chen (Tainan City, TW)
- Mei-Ling Chou (Tainan City, TW)
- Ming-Liang Chen (Tainan City, TW)
Cpc classification
B32B2307/20
PERFORMING OPERATIONS; TRANSPORTING
B32B2457/20
PERFORMING OPERATIONS; TRANSPORTING
B32B9/005
PERFORMING OPERATIONS; TRANSPORTING
B32B17/06
PERFORMING OPERATIONS; TRANSPORTING
G09G2330/06
PHYSICS
G09G3/20
PHYSICS
International classification
B32B17/06
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The disclosure provides an electromagnetic shielding substrate including a first substrate and an auxiliary layer. The auxiliary layer is disposed on the first substrate and directly contacts the first substrate. The auxiliary layer includes a first sublayer and a second sublayer. The second sublayer is connected between the first sublayer and the first substrate. The chemical ingredient of the first sublayer is M.sub.xO.sub.y, and the chemical ingredient of the second sublayer is M.sub.xO.sub.z, and M is selected from one of Nb, Mo, Ta, Te, Ti, Tl, Y, Yb, Zr, and Zn, where x and y are positive integers, and y−1<z<y. A display panel using the above electromagnetic shielding substrate is also provided.
Claims
1. A display panel, comprising: a first substrate having a first surface and a second surface opposite to each other; a second substrate disposed opposite to the first substrate; an auxiliary layer disposed on the first substrate and directly contacting the first surface or the second surface of the first substrate, and the auxiliary layer comprising: a first sublayer and a second sublayer, wherein the second sublayer is connected between the first sublayer and the first substrate, a chemical ingredient of the first sublayer is M.sub.xO.sub.y, a chemical ingredient of the second sublayer is M.sub.xO.sub.z, and M is selected from one of Nb, Mo, Ta, Te, Ti, Tl, Y, Yb, Zr and Zn, wherein x and y are positive integers, and y−1<z<y; a pixel circuit layer disposed on the second substrate; and a display medium layer disposed between the pixel circuit layer and the first substrate.
2. The display panel as claimed in claim 1, wherein the first substrate is aluminosilicate glass.
3. The display panel as claimed in claim 1, wherein a thickness of the second sublayer is smaller than a thickness of the first sublayer.
4. The display panel as claimed in claim 1, wherein the chemical ingredient of the first sublayer is niobium pentoxide (Nb.sub.2O.sub.5), molybdenum trioxide (MoO.sub.3), tantalum pentoxide (Ta.sub.2O.sub.5), tellurium dioxide (TeO.sub.2), titanium dioxide (TiO.sub.2), thallium oxide (Tl.sub.2O), yttrium oxide (Y.sub.2O.sub.3), ytterbium oxide (Yb.sub.2O.sub.3), zirconium dioxide (ZrO.sub.2) or zinc oxide (ZnO).
5. The display panel as claimed in claim 1, wherein a sheet resistance value of the auxiliary layer is between 10.sup.10 ohms/square and 10.sup.12 ohms/square.
6. The display panel as claimed in claim 5, wherein the auxiliary layer is located between the first substrate and the display medium layer.
7. The display panel as claimed in claim 1, further comprising: an optical auxiliary layer disposed on a side of the auxiliary layer away from the first substrate, wherein a refractive index of the auxiliary layer is greater than a refractive index of the optical auxiliary layer.
8. The display panel as claimed in claim 7, wherein a material of the optical auxiliary layer is silicon dioxide (SiO.sub.2), magnesium fluoride (MgF.sub.2) or sodium hexafluoroaluminate (Na.sub.3AlF.sub.6).
9. The display panel as claimed in claim 7, wherein a thickness of the optical auxiliary layer is between 100 angstroms and 400 angstroms.
10. The display panel as claimed in claim 1, wherein a thickness of the auxiliary layer is between 50 angstroms and 200 angstroms.
11. An electromagnetic shielding substrate, comprising: a first substrate; and an auxiliary layer disposed on the first substrate and directly contacting the first substrate, and the auxiliary layer comprising: a first sublayer and a second sublayer, wherein the second sublayer is connected between the first sublayer and the first substrate, a chemical ingredient of the first sublayer is M.sub.xO.sub.y, a chemical ingredient of the second sublayer is M.sub.xO.sub.z, and M is selected from one of Nb, Mo, Ta, Te, Ti, Tl, Y, Yb, Zr and Zn, wherein x and y are positive integers, and y−1<z<y.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0018]
[0019]
DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS
[0020] The foregoing and other technical content, features and effects of the disclosure will be clearly presented in the following detailed description of exemplary embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are merely the directions with reference to the drawings. Therefore, the directional terms are used to illustrate rather than limit the disclosure. Hereinafter, some embodiments of the disclosure will be described to illustrate the disclosure in detail. Whenever possible, the same reference numerals are used in the drawings and the description to indicate the same or similar parts.
[0021]
[0022] For example, the materials of the first substrate 110 and the second substrate 120 may optionally be aluminosilicate glass, but they are not limited thereto. In other embodiments, the material of the first substrate 110 and the second substrate 120 may be quartz or other suitable glass materials (for example, soda lime glass, borosilicate glass, or the like). It should be noted that, in this embodiment, the materials of the first substrate 110 and the second substrate 120 are optionally the same, but are not limited thereto. In other embodiments, the materials of the first substrate 110 and the second substrate 120 may be different from each other.
[0023] In this embodiment, the display medium layer 130 may be a liquid crystal layer and include a plurality of liquid crystal molecules (not shown). In other words, the display panel 10 of this embodiment may be a liquid crystal display panel, but the disclosure is not limited thereto. In another embodiment, the display medium layer 130 may be a stacked layer of organic light emitting materials. That is, the display panel 10 may be an organic light emitting diode (OLED) panel. In another embodiment, the display medium layer 130 may include a plurality of light emitting components electrically connected to the pixel circuit layer 125, such as micro-light emitting diodes (micro-LEDs) or mini light emitting diodes (mini-LEDs), but is not limited thereto.
[0024] In addition, the pixel circuit layer 125 may include a plurality of active components (not shown), a plurality of pixel electrodes (not shown), and a plurality of signal lines (not shown). These signal lines are respectively disposed in two mutually perpendicular directions, and define a plurality of pixel areas of the display panel 10. The pixel electrodes are respectively disposed in the pixel areas, and each is electrically connected to at least one corresponding active component and at least two corresponding signal lines. However, the disclosure is not limited thereto. When the display panel 10 is a micro light emitting diode display panel or a mini light emitting diode display panel, the pixel circuit layer 125 may optionally include a plurality of bonding pads to electrically contact the above-mentioned light emitting components.
[0025] Furthermore, in this embodiment, the side of the display panel 10 on which the first substrate 110 is provided is the display side. The first substrate 110 has a first surface 110s1 and a second surface 110s2 that are opposite to each other. The auxiliary layer 140 is optionally disposed on the first surface 110s1 of the first substrate 110 away from the display medium layer 130, and the display medium layer 130 is located on the second surface 110s2 of the first substrate 110, but the disclosure is not limited thereto. In particular, the auxiliary layer 140 directly contacts the first surface 110s1 of the first substrate 110, and the auxiliary layer 140 is a stacked layer of a plurality of metal oxides. For example, the thickness of the auxiliary layer 140 may be between 50 angstroms and 200 angstroms. In particular, since the auxiliary layer 140 is disposed on the first substrate 110, the combination of the first substrate 110 and the auxiliary layer 140 may be regarded as an electromagnetic shielding substrate, and the electromagnetic shielding substrate is not limited to the application to the display panel 10. For example, the first substrate 110 provided with the auxiliary layer 140 may be a substrate of a touch panel, but is not limited thereto.
[0026] The auxiliary layer 140 includes a first sublayer 141 and a second sublayer 142. The thickness t2 of the second sublayer 142 is smaller than the thickness t1 of the first sublayer 141, and the oxygen content of the second sublayer 142 is lower than the oxygen content of the first sublayer 141. Specifically, the chemical ingredient of the first sublayer 141 is M.sub.xO.sub.y, and the chemical ingredient of the second sublayer 142 is M.sub.xO.sub.z, and M can be selected from one of Nb, Mo, Ta, Te, Ti, Tl, Y, Yb, Zr and Zn, where x and y are positive integers, and y−1<z<y. For example, the chemical ingredient of the first sublayer 141 is niobium pentoxide (Nb.sub.2O.sub.5), molybdenum trioxide (MoO.sub.3), tantalum pentoxide (Ta.sub.2O.sub.5), tellurium dioxide (TeO.sub.2), titanium dioxide (TiO.sub.2), thallium oxide (Tl.sub.2O), yttrium oxide (Y.sub.2O.sub.3), ytterbium oxide (Yb.sub.2O.sub.3), zirconium dioxide (ZrO.sub.2) or zinc oxide (ZnO).
[0027] In this embodiment, the chemical ingredient of the first sublayer 141 of the auxiliary layer 140 is, for example, niobium pentoxide (Nb.sub.2O.sub.5), and the chemical ingredient of the second sublayer 142 is, for example, Nb.sub.2O.sub.z, wherein 4<z<5. For example, the method of forming the auxiliary layer 140 may include: providing a piece of aluminosilicate glass as the first substrate 110, forming an auxiliary material layer (not shown) on the first substrate 110, performing a heat treatment process, and transforming the auxiliary material layer into the auxiliary layer 140. The material of the auxiliary material layer is Nb.sub.2O.sub.5, and a part of the auxiliary material layer located away from the first substrate 110 and another part of the auxiliary material layer contacting the first substrate 110 respectively form the first sublayer 141 and the second sublayer 142 of the auxiliary layer 140.
[0028] In particular, since the electrochemical potential of aluminum in the chemical ingredient of the first substrate 110 is greater than the electrochemical potential of niobium in the auxiliary material layer, the driving force of the reaction between aluminum and oxygen is higher than the driving force of the reaction between niobium and oxygen. Therefore, during the heat treatment process of the auxiliary material layer, part of the oxygen element in the auxiliary material layer contacting the first substrate 110 tends to bond with aluminum element, and as a result, the oxygen content of the part of the auxiliary material layer contacting the first substrate 110 is reduced, and the second sublayer 142 is formed with the chemical ingredient of Nb.sub.2O.sub.z, where 4<z<5.
[0029] It is worth mentioning that the sheet resistance of the auxiliary material layer before the heat treatment process is greater than 10.sup.12 ohms/square. After the heat treatment process is completed, the sheet resistance is between 10.sup.10 ohms/square and 10.sup.12 ohms/square. More specifically, in this embodiment, through the heat treatment process, the auxiliary material layer directly contacting the first substrate 110 can be converted into the auxiliary layer 140 with a specific conductivity (for example, a conductivity greater than 10.sup.4 Siemens/cm), and the conductivity of the auxiliary layer 140 increases with the increase of the heat treatment temperature. In other words, the auxiliary layer 140 which has undergone the heat treatment process can be used as the electromagnetic shielding layer of the display panel 10, thereby achieving the effect of electromagnetic protection. Furthermore, since the auxiliary layer 140 is made of inorganic metal oxides, the hardness and service life can be significantly increased.
[0030] However, the disclosure does not limit the method of forming the auxiliary layer 140. In another embodiment, during the thermal evaporation process of the auxiliary material layer, the second sublayer 142 with a lower oxygen content may be formed by controlling the oxygen flow rate in the reaction chamber.
[0031] Furthermore, the display panel 10 may optionally include an optical auxiliary layer 150. The optical auxiliary layer 150 is disposed on a side of the auxiliary layer 140 away from the first substrate 110, and the refractive index of the auxiliary layer 140 is greater than the refractive index of the optical auxiliary layer 150. For example, the refractive index of the optical auxiliary layer 150 at the wavelength of visible light may be less than 1.5, and the refractive index of the auxiliary layer 140 at the wavelength of visible light may be greater than 2, but it is not limited thereto. In this embodiment, the material of the optical auxiliary layer 150 is, for example, silicon dioxide (SiO.sub.2), but it is not limited thereto. In other embodiments, the material of the optical auxiliary layer 150 may be magnesium fluoride (MgF.sub.2), sodium hexafluoroaluminate (Na.sub.3AlF.sub.6), or other materials with a low refractive index (for example, materials whose refractive index at the wavelength of visible light is less than 1.5). In addition, the thickness of the optical auxiliary layer 150 may be between 100 angstroms and 400 angstroms.
[0032] The auxiliary layer 140 with high refractive index and the optical auxiliary layer 150 with low refractive index are sequentially stacked on the first surface 110s1 of the first substrate 110, which effectively helps the first surface 110s1 of the first substrate 110 to reflect less external ambient light, thereby improving the display quality of the display panel 10 (for example, the contrast in dark state).
[0033]
[0034] Since the method of forming the auxiliary layer 140A of this embodiment is similar to the method of forming the auxiliary layer 140 of the foregoing embodiment, for detailed description, please refer to the relevant paragraphs of the foregoing embodiment, and the description will not be repeated here. It is worth mentioning that, compared with the conventional case of using a transparent conductive film (such as an indium tin oxide film) as an electromagnetic shielding layer, the auxiliary layer 140A of this embodiment has a larger sheet resistance value (for example, 10.sup.10 to 10.sup.12 ohms/square), which is more suitable for the electromagnetic shielding layer when it needs to have a high sheet resistance value, and its sheet resistance value (or conductivity) may be adjusted by the reaction temperature of the heat treatment process. In other words, unlike the conventional transparent conductive film that requires a thinner film thickness in order to obtain a higher sheet resistance value, which makes the process control difficult, the auxiliary layer 140A of this embodiment may allow for a larger process tolerance. In addition, the display panel 11 can maintain the optical performance of low reflectivity while achieving the electromagnetic protection effect.
[0035] As mentioned above, in the display panel of an embodiment of the disclosure, the auxiliary layer is provided on the surface of the substrate of the display panel, so as to reduce the reflectivity of the external ambient light. In the auxiliary layer, the oxygen content of the metal oxides of the second sublayer contacting the substrate is lower than the oxygen content of the metal oxides of the first sublayer not contacting the substrate, which thus results in a specific conductivity of the auxiliary layer to achieve the effect of electromagnetic protection. In addition, using inorganic metal oxides can also increase the hardness and service life of the auxiliary layer.
[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the disclosure, but not to limit them; although the disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; however, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the disclosure.