X-RAY HIGH-VOLTAGE GENERATOR WITH AN OSCILLATING HEAT PIPE

Abstract

A two-phase cooling system for an X-ray high-voltage generator comprises a heat sink block and a heat sink. The heat sink block spatially surrounds a cooling duct loop, wherein the cooling duct loop is at least partially filled with a working medium and is configured to act as an oscillating heat pipe. The heat sink is configured to dissipate heat from a heat source. The heat sink block includes a material including a polymer.

Claims

1. A two-phase cooling system for an X-ray high-voltage generator, the two-phase cooling system comprising: a heat sink block including a material containing a polymer, wherein the heat sink block spatially surrounds a cooling duct loop, and wherein the cooling duct loop is at least partially filled with a working medium, and wherein the cooling duct loop is configured to act as an oscillating heat pipe; and a heat sink configured to dissipate heat from a heat source.

2. The two-phase cooling system as claimed in claim 1, wherein the material exclusively contains the polymer.

3. The two-phase cooling system as claimed in claim 1, wherein the material contains the polymer and at least one of a metal or a ceramic, and wherein the material is homogenized by commingling.

4. The two-phase cooling system as claimed in claim 1, wherein at least one of a retaining device or a fastening element for mechanical stabilization of the heat sink block on the X-ray high-voltage generator is introduced into the heat sink block.

5. The two-phase cooling system as claimed in claim 1, wherein a printed circuit board is introduced into the heat sink block and is configured for electrical supply of the heat source.

6. The two-phase cooling system as claimed in claim 5, wherein the printed circuit board is multi-layered, wherein at least two conductor path planes of the printed circuit board are conductive and a diffusion duct in a permeable conductor path plane between the at least two conductive conductor path planes is between the at least two conductive conductor path planes, and wherein opposing permeable ends of the diffusion duct are spaced apart from one another such that the diffusion duct is fluid-tight as a result of a length of the diffusion duct.

7. The two-phase cooling system as claimed in claim 1, wherein the heat sink block is dimensioned such that because of a length of the heat sink block, a shortest diffusion route between the cooling duct loop and a permeable surface of the heat sink block is fluid-tight.

8. The two-phase cooling system as claimed in claim 1, wherein the heat source is introduced into the heat sink block as part of a duct wall of the heat sink block, the duct wall enclosing the working medium in the cooling duct loop, and wherein the working medium is electrically insulating.

9. The two-phase cooling system as claimed in claim 1, wherein the heat sink block is at least partially coated with a fluid-tight layer.

10. The two-phase cooling system as claimed in claim 1, further comprising: an intermediate heat accumulator thermally directly coupled to the heat source via a heat-distributing element, wherein the heat-distributing element adjoins the cooling duct loop in a planar manner.

11. The two-phase cooling system as claimed in claim 1, wherein the heat sink block contains an inlay, wherein a material of the inlay has a higher thermal conductivity than the material of the heat sink block.

12. The two-phase cooling system as claimed in claim 1, wherein the cooling duct loop is configured to be angular, such that at least two partial planes of the cooling duct loop stand at an angle of greater than 0° to one another.

13. An X-ray high-voltage generator for provision of a high voltage, the X-ray high-voltage generator comprising: the two-phase cooling system as claimed in claim 1; and a circuit arrangement with at least one power-electronic circuitry part, the at least one power-electronic circuitry part configured to form the heat source in operation, wherein the at least one power-electronic circuitry part is directly thermally coupled to the two-phase cooling system to dissipate heat from the heat source at the heat sink.

14. An X-ray tube assembly, comprising: the X-ray high-voltage generator as claimed in claim 13; and an X-ray tube configured to generate X-rays using the high voltage.

15. A computed tomography device, comprising: the X-ray high-voltage generator as claimed in claim 13; and a gantry having a rotating part and a stationary part, wherein the two-phase cooling system is arranged on the gantry.

16. The two-phase cooling system as claimed in claim 10, wherein the intermediate heat accumulator is composed of at least one of copper or aluminum and the heat-distributing element is composed of at least one of diamond or a graphite material.

17. The two-phase cooling system as claimed in claim 11, wherein the inlay is composed of at least one of copper or aluminum.

18. A computed tomography device, comprising: the X-ray tube assembly as claimed in claim 14; and a gantry having a rotating part and a stationary part, wherein the two-phase cooling system is arranged on the gantry.

19. The two-phase cooling system as claimed in claim 6, wherein the heat sink block is dimensioned such that because of a length of the heat sink block, a shortest diffusion route between the cooling duct loop and a permeable surface of the heat sink block is fluid-tight.

20. The two-phase cooling system as claimed in claim 19, wherein the heat source is part of a duct wall of the heat sink block, the duct wall enclosing the working medium in the cooling duct loop, and wherein the working medium is electrically insulating.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0078] In the drawings:

[0079] FIG. 1 shows a conventional X-ray high-voltage generator in accordance with the prior art,

[0080] FIG. 2 shows an inventive two-phase cooling system,

[0081] FIG. 3 shows a first exemplary embodiment of the two-phase cooling system,

[0082] FIG. 4 shows a second exemplary embodiment of the two-phase cooling system,

[0083] FIG. 5 shows a third exemplary embodiment of the two-phase cooling system,

[0084] FIG. 6 shows a fourth exemplary embodiment of the two-phase cooling system,

[0085] FIG. 7 shows a fifth exemplary embodiment of the two-phase cooling system,

[0086] FIG. 8 shows a sixth exemplary embodiment of the two-phase cooling system,

[0087] FIG. 9 shows an inventive X-ray high-voltage generator,

[0088] FIG. 10 shows a first exemplary embodiment of the X-ray high-voltage generator,

[0089] FIG. 11 shows a second exemplary embodiment of the X-ray high-voltage generator,

[0090] FIG. 12 shows an inventive X-ray tube assembly and

[0091] FIG. 13 shows an inventive computed tomography device.

DETAILED DESCRIPTION

[0092] FIG. 1 shows a conventional X-ray high-voltage generator 10 in accordance with the prior art.

[0093] The X-ray high-voltage generator 10 has, as part of a circuit arrangement for the provision of a high voltage, two power-electronic circuitry parts 11 as heat sources. Both the power-electronic circuitry parts 11 are in each case arranged on a heat sink pad 12, which for example consists of copper. A support plate 13 carries both the heat sink pads 12 and connects them to a heat sink 14. The support plate 13 can be designed to be electrically insulating. Alternatively or additionally an insulation layer for the electrical insulation of the power-electronic circuitry parts 11 can be provided as part of the conventional X-ray high-voltage generator 10. The arrows indicate the heat flow from the heat sources to the heat sink 14.

[0094] FIG. 2 shows a section of an inventive two-phase cooling system 22 for an X-ray high-voltage generator.

[0095] The two-phase cooling system 22 contains a heat sink 23 or itself acts as a heat sink 23 on the sides facing away from a heat source. For dissipation of heat from the heat source the two-phase cooling system 22 contains a heat sink block 24. The heat sink block 24 spatially surrounds a cooling duct loop 25. The cooling duct loop 25 is part of the two-phase cooling system 22. The cooling duct loop 25 is at least partially filled with a working medium 26 and acts as an oscillating heat pipe. The heat sink block 24 consists of a material which contains a polymer. The polymer can be polypropylene, polycarbonate, polyetheretherketone, polyamide or acrylnitrile-butadiene-styrole copolymer.

[0096] Purely for illustrative purposes the cooling duct loop 25 has duct sections arranged in a meander shape. For example, 10 parallel duct sections are shown. The number of parallel duct sections can be over 50, in particular over 500, for example between 2 and 1000. A spacing, i.e. a web width, between the duct sections is typically between 0.01 and 5 mm, for example between 0.1 and 1 mm. If the heat sink block 24 consists of polymer, the web width is for example at least 0.3 mm, preferably 0.5 mm.

[0097] In this exemplary embodiment the material exclusively contains the polymer. Alternatively, the material can additionally contain a metal and/or a ceramic, wherein the material is homogenized by commingling.

[0098] FIG. 2 shows a cross-section along a plane of the cooling duct loop 25. The section plane A-A is indicated in FIG. 4. In the following FIGS. 3 to 11 this plane of the cooling duct loop 25 stands substantially perpendicular on the plane of the drawing sheet in comparison with FIG. 2.

[0099] FIG. 3 shows a first exemplary embodiment of the two-phase cooling system 22.

[0100] The two-phase cooling system 22 contains an intermediate heat accumulator 29, in particular made of copper and/or aluminum. The intermediate heat accumulator 29 can be thermally directly coupled to at least one power-electronic circuitry part 21 e.g. of an X-ray high-voltage generator via a heat-distributing element 30, in particular made of diamond and/or a graphite material and in this exemplary embodiment is directly thermally coupled as a heat source. The heat-distributing element 30 adjoins the cooling duct loop 25 in a planar manner.

[0101] In this exemplary embodiment the heat sink block 24 contains an inlay 27, in particular made of copper and/or aluminum, wherein the material of the inlay 27 has a higher thermal conductivity than the material of the heat sink block 24. An inlay element can in principle be provided between the heat-distributing element 30 and the intermediate heat accumulator 29 and/or the at least one power-electronic circuitry part 21 and/or the heat sink 23. The three inlay elements of the inlay 27 in FIG. 3 in each case thermally directly couple the intermediate heat accumulator 29, at least one power-electronic circuitry part 21 as a heat source and the heat sink 23 to the cooling duct loop 25. The heat sink 23 in this exemplary embodiment is provided with a shape that increases the surface, in particular cooling ribs.

[0102] The intermediate heat accumulator 29 in this figure is arranged such that the at least one power-electronic circuitry part 21 is arranged between the intermediate heat accumulator 29 and the heat sink 23. Alternatively it is conceivable for the intermediate heat accumulator 29 to be arranged between the at least one power-electronic circuitry part 21 and the heat sink 23. Between in this connection means on the shortest route along the cooling duct loop 25.

[0103] FIG. 4 shows a second exemplary embodiment of the two-phase cooling system 22.

[0104] The heat source, here the at least one power-electronic circuitry part 21, is introduced into the heat sink block 24 as part of a duct wall of the heat sink block 24 enclosing the working medium 26 in the cooling duct loop 25. The working medium 26 is dielectrically or electrically insulating.

[0105] FIG. 5 shows a third exemplary embodiment of the two-phase cooling system 22.

[0106] The heat sink block 24 is at least partially coated with a metal element 34 as a fluid-tight layer. In this exemplary embodiment the heat sink block 24 is thus completely enveloped.

[0107] The heat source, for example the at least one power-electronic circuitry part 21, is introduced into the heat sink block 24 as part of a duct wall of the heat sink block 24 enclosing the working medium 26 in the cooling duct loop 25. The working medium 26 is in this case dielectrically or electrically insulating.

[0108] A printed circuit board, comprising a power supply 35 which is designed for the electrical supply of the X-ray high-voltage generator 20, e.g. of the at least one power-electronic circuitry part 21, is introduced into the heat sink block 24. In principle it is conceivable for the power supply 35 to be designed as a busbar. The printed circuit board forms the metal element 34.

[0109] FIG. 6 shows a fourth exemplary embodiment of the two-phase cooling system 22.

[0110] In this exemplary embodiment the heat sink block 24 contains the inlay 27. The material of the inlay 27 has a higher thermal conductivity than the material of the heat sink block 24. The cooling duct loop 25 is designed as angular, such that at least two, in this exemplary embodiment four, part planes 25.T of the cooling duct loop 25 stand at an angle of greater than 0° to one another.

[0111] FIG. 10 additionally shows that a fastening element 37, such as e.g. a type of spring element, for fastening the at least one power-electronic circuitry part 21 is introduced into the heat sink block 24 for the mechanical stabilization of the heat sink block 24 at the high-voltage generator 20. The metal element 34, in this case a printed circuit board, is fastened to the heat sink block 24 with a retaining device 36. The retaining device 36 is for example a screw and/or a bracket.

[0112] The heat sink block 24 offers the advantage that thanks to the angular alignment geometrically complex structures of the two-phase cooling system 22 can be realized, e.g. through a recess in the metal element 34.

[0113] FIG. 7 shows a fifth exemplary embodiment of the two-phase cooling system 22.

[0114] A printed circuit board is introduced into the heat sink block 24, and is designed for the electrical supply of the heat source. The heat source in this exemplary embodiment forms a power-electronic circuitry part 21. The heat source is supplied with electrical power via non-continuous vias 35 as a power supply in the printed circuit board.

[0115] The printed circuit board is multi-layered and thus has multiple, in this exemplary embodiment five, conductor path planes 46. The printed circuit board, in particular the multiple conductor path planes 46, is/are sealed laterally fluid-tight with a fluid-tight layer 48.

[0116] At least two of the conductor path planes 46 of the printed circuit board are conductive 46.L. A diffusion duct 47 in a permeable conductor path plane 46 arranged between the two conductive conductor path planes 46.L is formed between the two conductive conductor path planes 46.L. The diffusion duct 47 is indicated by a dashed double arrow. The opposing permeable ends of the diffusion duct 47 are spaced apart from one another such that because of its length the diffusion duct 47 is fluid-tight.

[0117] The heat source is introduced into the heat sink block 24 as part of a duct wall of the heat sink block 24 enclosing the working medium 26 in the cooling duct loop 25. The working medium 26 is electrically insulating. The two-phase cooling system 22 is fastened to a support plate 39. The latter couples the two-phase cooling system 22 and the heat sink 23. At least one inlay 27 improves the transfer of heat from the cooling duct loop 25 to the heat sink 23.

[0118] FIG. 8 shows a sixth exemplary embodiment of the two-phase cooling system 22.

[0119] The two-phase cooling system 22 is designed to dissipate heat from two heat sources. Two power-electronic circuitry parts 21 form the heat sources, wherein one is connected to a power supply 35 in accordance with SMD assembly and the other in accordance with THT assembly.

[0120] The power supply 35 in this exemplary embodiment is a busbar. Alternatively it is conceivable for a conductive conductor path plane of a printed circuit board to be used as a power supply.

[0121] The heat sink block 24 is dimensioned such that because of its length the shortest diffusion route between the cooling duct loop 25 and a permeable surface of the heat sink block 24 is fluid-tight. The permeable surface of the heat sink block 24 is represented by a dashed line.

[0122] The heat sink block 24 in this exemplary embodiment is designed as multi-part. An upper part is arranged above the heat sources as a type of cover and a lower part is arranged underneath the heat sources.

[0123] FIG. 9 shows an X-ray high-voltage generator 20.

[0124] The X-ray high-voltage generator 20 is designed for the provision of a high voltage and contains the two-phase cooling system 22 and a circuit arrangement with at least one power-electronic circuitry part 21. The at least one power-electronic circuitry part 21 forms the heat source in operation. The at least one power-electronic circuitry part 21 is directly thermally coupled to the two-phase cooling system 22 to dissipate heat from the heat source at the heat sink 23.

[0125] A support plate 39 is connected and thermally directly coupled to the heat sink block 24 in order to further improve the cooling power. As a result, in particular the support plate 39 forms the heat sink 23 of the two-phase cooling system 22. The support plate 39 can for example be a housing of the X-ray high-voltage generator 20 or a gantry of a computed tomography device 50 (not shown) or a frame of an X-ray tube assembly 40 (not shown).

[0126] FIG. 10 shows a first exemplary embodiment of the X-ray high-voltage generator 20.

[0127] For a better heat splay an inlay element of the inlay 27 adjoins a support plate 39 in a planar manner in order to improve the thermal input into the support plate 39. The heat sink 23 is directly thermally coupled to the support plate 39. The latter can for example be the gantry of a computed tomography device 40 (not shown), in particular the rotating part 52.

[0128] In comparison to FIG. 9 the support plate 39 in FIG. 10 is not arranged laterally to the heat sink block 24, but below it.

[0129] FIG. 11 shows a second exemplary embodiment of the X-ray high-voltage generator 20.

[0130] The heat source, in other words the at least one power-electronic circuitry part 21, is introduced into the heat sink block 24 as part of a duct wall of the heat sink block 24 enclosing the working medium 26 in the cooling duct loop 25. As a result, the at least one power-electronic circuitry part 21 is cooled directly by the working medium 26. The working medium 26 is in this case dielectrically or electrically insulating.

[0131] The heat sink block 24 is sealed on the side with the at least one power-electronic circuitry part 21 via the metal element 34 as a fluid-tight layer. The metal element 34 is a printed circuit board with multiple conductor path planes. The printed circuit board is a multi-layered board, wherein its conductor path planes are provided with so-called “buried vias” as a power supply 35.

[0132] FIG. 12 shows an inventive X-ray tube assembly 40.

[0133] The X-ray tube assembly 40 contains an X-ray high-voltage generator 20 for the provision of a high voltage and an X-ray tube 41. The X-ray high-voltage generator 20 and the X-ray tube 41 are connected to a high-voltage cable 42 for the transmission of the high voltage.

[0134] The X-ray tube 42 contains an X-ray tube housing 43, an electron emitter 44 arranged therein as a cathode, and an anode 45. The high voltage is present between the electron emitter 44 and the anode 45.

[0135] FIG. 13 shows a computed tomography device 50.

[0136] The computed tomography device 50 contains a circular gantry with a rotating part 52 and a stationary part 51 as well as the X-ray high-voltage generator 20 as part of the X-ray tube assembly 40. The two-phase cooling system 22 is arranged on the gantry. In this exemplary embodiment the rotating part 52 and the stationary part 51 are arranged in a disk-shaped manner. Alternatively a drum-shaped embodiment can be considered.

[0137] The X-ray tube assembly 40 is arranged on the rotating part 52. A patient 53 is mounted on a patient couch 54.

[0138] The drawings are to be regarded as being schematic representations and elements illustrated in the drawings are not necessarily shown to scale. Rather, the various elements are represented such that their function and general purpose become apparent to a person skilled in the art. Any connection or coupling between functional blocks, devices, components, or other physical or functional units shown in the drawings or described herein may also be implemented by an indirect connection or coupling. A coupling between components may also be established over a wireless connection. Functional blocks may be implemented in hardware, firmware, software, or a combination thereof.

[0139] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections, should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of embodiments. As used herein, the term “and/or,” includes any and all combinations of one or more of the associated listed items. The phrase “at least one of” has the same meaning as “and/or”.

[0140] Spatially relative terms, such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below,” “beneath,” or “under,” other elements or features would then be oriented “above” the other elements or features. Thus, the example terms “below” and “under” may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. In addition, when an element is referred to as being “between” two elements, the element may be the only element between the two elements, or one or more other intervening elements may be present.

[0141] Spatial and functional relationships between elements (for example, between modules) are described using various terms, including “on,” “connected,” “engaged,” “interfaced,” and “coupled.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the disclosure, that relationship encompasses a direct relationship where no other intervening elements are present between the first and second elements, and also an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. In contrast, when an element is referred to as being “directly” connected, engaged, interfaced, or coupled to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between,” versus “directly between,” “adjacent,” versus “directly adjacent,” etc.).

[0142] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments. As used herein, the singular forms “a,” “an,” and “the,” are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the terms “and/or” and “at least one of” include any and all combinations of one or more of the associated listed items. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. Also, the term “example” is intended to refer to an example or illustration.

[0143] It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.

[0144] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0145] It is noted that some embodiments may be described with reference to acts and symbolic representations of operations (e.g., in the form of flow charts, flow diagrams, data flow diagrams, structure diagrams, block diagrams, etc.) that may be implemented in conjunction with units and/or devices discussed above. Although discussed in a particularly manner, a function or operation specified in a specific block may be performed differently from the flow specified in a flowchart, flow diagram, etc. For example, functions or operations illustrated as being performed serially in two consecutive blocks may actually be performed simultaneously, or in some cases be performed in reverse order. Although the flowcharts describe the operations as sequential processes, many of the operations may be performed in parallel, concurrently or simultaneously. In addition, the order of operations may be re-arranged. The processes may be terminated when their operations are completed, but may also have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, subprograms, etc.

[0146] Specific structural and functional details disclosed herein are merely representative for purposes of describing embodiments. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

[0147] Although the present invention has been illustrated and described in greater detail by the preferred exemplary embodiments, the present invention is nevertheless not restricted by the disclosed examples and other variations can be derived therefrom by the person skilled in the art, without departing from the scope of protection of the present invention.