Carrier material on the base of a plastic composition and a mineral based solid composition for decorated wall or floor panels
11186709 · 2021-11-30
Assignee
Inventors
Cpc classification
B32B27/42
PERFORMING OPERATIONS; TRANSPORTING
C08L23/16
CHEMISTRY; METALLURGY
B32B27/12
PERFORMING OPERATIONS; TRANSPORTING
C08L2205/03
CHEMISTRY; METALLURGY
B44C5/04
PERFORMING OPERATIONS; TRANSPORTING
C08L2205/025
CHEMISTRY; METALLURGY
B32B7/12
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/718
PERFORMING OPERATIONS; TRANSPORTING
B32B2264/108
PERFORMING OPERATIONS; TRANSPORTING
B29C70/60
PERFORMING OPERATIONS; TRANSPORTING
B29C2043/483
PERFORMING OPERATIONS; TRANSPORTING
B32B5/02
PERFORMING OPERATIONS; TRANSPORTING
B29C70/504
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/546
PERFORMING OPERATIONS; TRANSPORTING
B32B27/20
PERFORMING OPERATIONS; TRANSPORTING
International classification
C08L23/16
CHEMISTRY; METALLURGY
B44C5/04
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A carrier material for producing a decorated wall or floor panel, as well as the corresponding wall or floor panel, may comprise a matrix material and a solid material. The matrix material is present from ≥25 wt.-% to ≤55 wt.-% and the solid material is present from ≥45 wt.-% to ≤75 wt.-% of the carrier material. The matrix material and the solid material together may be present in an amount of ≥95 wt.-% of the carrier material. The solid material is formed to at least 50 wt.-% of a solid composition consisting of at least a first layered silicate powder and a second layered silicate powder. The matrix material is formed to at least 50 wt.-% by a plastic composition consisting of a homopolymer and at least a first copolymer and a second copolymer.
Claims
1. Carrier material for producing a carrier for a decorated wall or floor panel, wherein the carrier material comprises a matrix material and a solid material, wherein the matrix material, based on the carrier material, is present in an amount from ≥25 wt.-% to ≤55 wt.-%, and wherein the solid material, based on the carrier material, is present in an amount from ≥45 wt.-% to ≤75 wt.-%, and wherein the matrix material and the solid material together, based on the carrier material, are present in an amount of ≥95 wt. %, wherein the solid material, based on the solid material, is formed to at least 50 wt.-% of a solid composition comprising at least a first layered silicate powder and a second layered silicate powder, and the matrix material, based on the matrix material, is formed to at least 50 wt.-% by a plastic composition comprising a homopolymer and at least a first copolymer and a second copolymer, wherein the solid composition comprises the first layered silicate powder from ≥35 wt.-% to ≤85 wt.-%, based on the solid composition, in the form of particles having a particle size D.sub.50 in a range from ≥3 μm to ≤6 μm, and/or having a particle size D.sub.98 in a range from ≥10 μm to ≤30 μm, and comprises the second layered silicate powder from ≥15 wt.-% to ≤65 wt.-%, based on the solid composition, in the form of particles having a particle size D.sub.50 in a range from ≥6 μm to ≤10 μm, and/or having a particle size D.sub.98 in a range from ≥20 μm to ≤40 μm.
2. Carrier material according to claim 1, wherein the first layered silicate powder and/or the second layered silicate powder comprise talcum.
3. Carrier material according to claim 1, wherein the homopolymer, the first copolymer and the second copolymer comprise polypropylene.
4. Carrier material according to claim 1, wherein the first copolymer comprises a heterophasic polypropylene and the second copolymer comprises an ethylene-propylene copolymer and an isotactic polypropylene.
5. Carrier material according to claim 1, wherein the second copolymer has an ethylene content from ≥8 wt.-% to ≤22 wt.-%.
6. Carrier material according to claim 1, wherein the melt flow rate of the homopolymer is greater than the melt flow rate of the first copolymer and the second copolymer.
7. Carrier material according to claim 1, wherein the melt flow rate of the second copolymer is greater than the melt flow rate of the first copolymer.
8. Carrier material according to claim 1, wherein the homopolymer, based on the plastic composition, is present in a proportion from ≥10 wt.-% to ≤40 wt.-% and/or that the first copolymer, based on the plastic composition, is present in a proportion from ≥40 wt.-% to ≤70 wt.-% and/or that the second copolymer, based on the plastic composition, is present in a proportion from ≥10 wt.-% to ≤40 wt.-%.
9. Carrier material according to claim 1, wherein the matrix material in addition to the plastic composition comprises at least one coloring additive.
10. Carrier material according to claim 8, wherein the coloring additive is a pigment preparation based on thermoplastic carrier materials, which has a temperature resistance up to at least 230° C. and a melting range from 95° C. to 125° C.
11. Carrier material according to claim 1, wherein the matrix material comprises polyethylene in the form of LDPE.
12. Carrier material according to claim 1, wherein the solid material in addition to the solid composition comprises at least one further solid.
13. Carrier material according to claim 11, wherein the further solid has a bulk density in a range of ≤2000 kg/m.sup.3 and/or that the further solid is selected from the group consisting of wood, expanded clay, volcanic ash, pumice, cellular concrete, inorganic foams and cellulose.
14. Decorated panel, in particular decorated wall or floor panel, comprising a carrier and a decoration applied onto the carrier, wherein in particular a covering layer provided with a structure is applied onto the decoration, wherein the carrier comprises a carrier material according to claim 1.
Description
FIGURES
(1) The invention is further explained below with reference to the Figures and an exemplary embodiment.
(2)
(3)
DESCRIPTION
(4) The device 10 of
(5) a) providing a pourable carrier material 20, in particular a granulate,
(6) b) placing the carrier material 20 between two belt-like conveying means 12, 14,
(7) c) molding the carrier material 20 under the action of temperature to form a web-shaped carrier 36,
(8) d) compressing the carrier 36,
(9) e) treating the carrier 36 under the action of temperature and pressure, in particular by use of a twin belt press,
(10) f) optionally cooling the carrier 36,
(11) Following these process steps, the process can comprise further process steps in order to obtain the finished wall or floor panel.
(12) The device 10 according to
(13) In particular, the carrier material 20 may further be provided by use of a kneader mixer, in which the starting materials are mixed and conveyed by means of a worm and thus are pressed through a perforated plate and cut in small particles, for example, by means of an angled cutter, so as to obtain a granulate material.
(14) The conveying means 12, 14 may be at least partially constructed of polytetrafluoroethylene, for example, be coated therewith. Furthermore, the conveying means 12, 14 may at least partially be roughened or structured in particular on their side facing the receiving space 18. Moreover, the conveying means 12, 14 may have a width in a range of about 1.5 m.
(15) In order to apply the carrier material 20 between the belt-like conveying means 12, 14 or in the receiving space 18, a discharge unit 22 with one or a plurality of discharge heads 24 is provided, by means of which the carrier material 20 can be placed on the lower conveying means 14. The discharge heads 24 can comprise a funnel 25 which applies the carrier material 20 onto corresponding scattering rollers 26, whereupon the carrier material 20 can be scattered onto the lower conveying means 14.
(16) In order to ensure a homogeneous application of the carrier material 20 onto the lower conveying means 14 a sensor for checking the placement of the carrier material 20 between the two belt-like conveying means 12, 14 may be provided. The sensor can in particular be coupled with the discharge unit 22 in order to immediately correct a potentially inaccurate filling of the receiving space 18.
(17) In order to enable a homogeneous distribution of the carrier material 20, moreover, vibrators may be provided. These may, for example, act on the lower conveying means 14 and may be arranged, for example, below the lower conveying means 14, such that the carrier material 20 is finely distributed.
(18) In order to prevent an unwanted contamination and a damage of downstream processing stations, moreover a sensor for detecting metals can be provided, which is able to detect inadvertently introduced metal.
(19) Furthermore, a molding unit 28 is provided in the conveying direction of the conveying means 12, 14, which is indicated by the arrow 13, wherein the molding unit is adapted to mold the carrier material 20 under the action of temperature or heat to fuse the carrier material 20 while forming a web-shaped carrier 36. For this purpose, the molding unit 28 may have two plate-like molding means 30, 32 which can be heated by one or a plurality of heating means 34, for example by means of a thermal oil. As a result, the carrier material 20 can be heated until, for example depending on the melting point of the carrier material 20 or a portion thereof, it has reached a temperature, for example and depending on the material used, from ≥180° to ≤200° C. To this end, the molding unit 28 or the molding means 30, 32 can be heated, for example, to a temperature of up to 250° C. To this end, for example, one or for setting a temperature gradient a plurality of independently adjustable heating sections can be provided. For example, the entire molding means 30, 32 which may have a length of several meters, can be heatable, or only a part thereof can be heatable.
(20) Furthermore, the molding unit 28 can in particular comprise a parallel gap which can be formed by the plate-like molding means 30, 32. In this case, however, at the inlet an inlet mouth can be provided by a conical form in order to allow an improved inflow of the carrier material 20. The force acting on the carrier material 20 may here be in a range of >0 kg/m2 up to ≤1 kg/m2. In this manner, in particular a uniform pressurization can be provided without the provision of a pressure profile or a pressure gradient.
(21) In
(22) In the further course in the conveying direction of the conveying units 12, 14 the web-shaped carrier 36 is fed through a pressing means 38. The pressing means 38 can, for example, include an S-roller, which is shown in detail in
(23) From the pressing means 38 the carrier 36 is subsequently fed to a further pressing means 40. In order to compensate any heat loss of the carrier 36 or to intentionally heat the carrier 36 further or to cool the carrier 36 one or a plurality of further tempering means 42 can be provided between the pressing means 38, 40.
(24) Returning to the pressing means 40, this can advantageously be a twin belt press which in particular may comprise steel belts 44, 46, wherein the belts 44, 46 of the twin belt press may be guided by deflection rollers 48, 50. The deflection rollers 48, 50 can, for example, be heated, for example by means of a thermal oil heating and/or the rollers on the same side of the gap may be disposed at a distance in a range from ≥1 m to ≤2 m, for example 1.5 m, from each other, wherein the belts 44, 46 may have a width in a range of about 1.5 m. According to
(25) Here, the pressing means 40 may have a varying pressure profile, for example starting with 6 mm and ending with 4.1 mm, or advantageously be configured as an isochoric press.
(26) In the conveying direction downstream of the pressing means 40 according to
(27) After these process steps the carrier 36 which may have a final thickness in a range from ≥3 mm to ≤5 mm, for example 4.1 mm, may be directly further processed or stored, such as a web-shaped carrier 36 or as an already separated plate-shaped carrier 36.
(28) At this point, the further steps may follow:
(29) g) optionally applying a decorative subsurface onto at least a portion of the carrier 36,
(30) h) applying a decoration replicating a decoration template onto at least a portion of the carrier 36,
(31) i) applying a protective layer onto at least a portion of the decoration.
(32) j) optionally structuring the protective layer, and
(33) k) optionally treating the carrier 36 for electrostatic discharge prior to one of the aforementioned steps.