MANUFACTURING METHOD OF SILICON CARBIDE WAFER AND SEMICONDUCTOR STRUCTURE

Abstract

A manufacturing method of a silicon carbide wafer includes the following. A raw material containing carbon and silicon and a seed located above the raw material are provided in a reactor. A nitrogen content in the reactor is reduced, which includes the following. An argon gas is passed into the reactor, where a flow rate of passing the argon gas into the reactor is 1,000 sccm to 5,000 sccm, and a time of passing the argon gas into the reactor is 2 hours to 48 hours. The reactor and the raw material are heated to form a silicon carbide material on the seed. The reactor and the raw material are cooled to obtain a silicon carbide ingot. The silicon carbide ingot is cut to obtain a plurality of silicon carbide wafers. A semiconductor structure is also provided.

Claims

1. A manufacturing method of a silicon carbide wafer, comprising: providing a raw material containing carbon and silicon and a seed located above the raw material in a reactor; reducing a nitrogen content in the reactor, comprising: passing an argon gas into the reactor, wherein a flow rate of passing the argon gas into the reactor is 1,000 sccm to 5,000 sccm, and a time of passing the argon gas into the reactor is 2 hours to 48 hours; heating the reactor and the raw material to form a silicon carbide material on the seed; cooling the reactor and the raw material to obtain a silicon carbide ingot; and cutting the silicon carbide ingot to obtain a plurality of silicon carbide wafers.

2. The manufacturing method as described in claim 1, wherein reducing the nitrogen content in the reactor comprises: before passing the argon gas into the reactor, performing a first vacuum process on the reactor, such that an air pressure in the reactor is 0.1 torr to 100 torr.

3. The manufacturing method as described in claim 1, wherein a resistivity of the silicon carbide ingot is 0.1 ohm/cm to 10 ohms/cm, and a resistivity of each of the silicon carbide wafers is 0.1 ohm/cm to 10 ohms/cm.

4. The manufacturing method as described in claim 1, wherein a visible light transmittance of each of the silicon carbide wafers is greater than 50%.

5. The manufacturing method as described in claim 1, wherein a thickness of the silicon carbide ingot is 5 millimeters to 80 millimeters, and a thickness of each of the silicon carbide wafers is less than 1,000 micrometers.

6. The manufacturing method as described in claim 1, wherein reducing the nitrogen content in the reactor comprises: after passing the argon gas into the reactor, performing a second vacuum process on the reactor, such that an air pressure in the reactor is less than 5×10.sup.−5 torr.

7. The manufacturing method as described in claim 1, wherein a nitrogen content of the silicon carbide ingot is 10.sup.16 atoms/cm.sup.3 to 10.sup.17 atoms/cm.sup.3.

8. The manufacturing method as described in claim 1, wherein a nitrogen content of each of the silicon carbide wafers is 10.sup.16 atoms/cm.sup.3 to 10.sup.17 atoms/cm.sup.3.

9. A semiconductor structure, comprising: a silicon carbide wafer, wherein a resistivity of the silicon carbide wafer is 0.1 ohm/cm to 10 ohms/cm, and a visible light transmittance of the silicon carbide wafer is greater than 50%.

10. The semiconductor structure as described in claim 9, wherein a nitrogen content of the silicon carbide wafer is 10.sup.16 atoms/cm.sup.3 to 10.sup.17 atoms/cm.sup.3.

11. The semiconductor structure as described in claim 9, wherein silicon carbide in the silicon carbide wafer has a c-axis with a deflection angle of less than 0.5 degrees.

12. The semiconductor structure as described in claim 9, wherein a diameter of the silicon carbide wafer is greater than 75 millimeters.

13. The semiconductor structure as described in claim 9, wherein a thickness of the silicon carbide wafer is less than 1,000 micrometers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0010] FIG. 1A to FIG. 1G are schematic cross-sectional views of a manufacturing method of a silicon carbide wafer according to an embodiment of the disclosure.

[0011] FIG. 2 is a flowchart of a manufacturing method of a silicon carbide wafer according to an embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

[0012] FIG. 1A to FIG. 1G are schematic cross-sectional views of a manufacturing method of a silicon carbide wafer according to an embodiment of the disclosure.

[0013] With reference to FIG. 1A, a reactor 100 includes an induction coil 102, a furnace body 104, a pipeline 105, a graphite crucible 106, and a seed support member 108. The graphite crucible 106 and the seed support member 108 are disposed in the furnace body 104. The induction coil 102 is disposed outside the graphite crucible 106.

[0014] A raw material 300 and a seed 200 located above the raw material 300 are provided in the reactor 100. The raw material 300 and the seed 200 are spaced apart by a vertical distance V1.

[0015] The raw material 300 is disposed in the graphite crucible 106. The raw material 300 contains carbon and silicon, and the raw material 300 is, for example, silicon carbide powder. The seed 200 is disposed on the seed support member 108. In some embodiments, the seed 200 is fixed on the seed support member 108 by an adhesive layer (not shown). The material of the seed 200 includes silicon carbide. For example, the seed 200 is 6H-silicon carbide or 4H-silicon carbide.

[0016] In some embodiment, a first surface 202 of the seed 200 has a surface roughness (Ra) less than 2 nm, preferably a surface roughness (Ra) less than 0.5 nm, and more preferably a surface roughness (Ra) less than 0.3 nm. In some embodiment, the seed 200 has a total thickness variation (TTV) of less than 2 μm, a warp less than 30 μm, and a bow less than ±20 μm. In some embodiments, the first surface 202 of the seed 200 is the basal plane (0001) of silicon carbide.

[0017] In this embodiment, when the raw material 300 and the seed 200 are disposed in the reactor 100, air from the outside will enter the reactor 100 together, such that oxygen, nitrogen, and other gases are contained in the reactor 100.

[0018] With reference to FIG. 1B to FIG. 1D, a nitrogen content in the reactor 100 is reduced. In some embodiments, the reducing of the nitrogen content in the reactor 100 includes a first vacuum process F1, a gas transport process F2, and a second vacuum process F3.

[0019] With reference to FIG. 1B, the first vacuum process F1 is performed on the reactor 100 through the pipeline 105, such that an air pressure in the reactor is 0.1 torr to 100 torr (preferably 0.1 torr to 20 torr). Oxygen, nitrogen, and other gases may be discharged from the reactor 100 by the first vacuum process F1. However, a small amount of nitrogen may still be contained in the reactor 100.

[0020] With reference to FIG. 1C, the gas transport process F2 is performed on the reactor 100 through the pipeline 105. The gas transport process F2 includes passing an argon gas into the reactor 100, where a flow rate of passing the argon gas into the reactor 100 is 1,000 sccm to 5,000 sccm, and a time of passing the argon gas into the reactor 100 is 2 hours to 48 hours. The argon gas passed into the reactor 100 may dilute the residual nitrogen in the reactor 100, helping to squeeze out the nitrogen in the gaps of the raw material 300 or the nitrogen adsorbed on the surface of the raw material 300.

[0021] With reference to FIG. 1D, after the argon gas is passed into the reactor 100 through the pipeline 105, the second vacuum process F3 is optionally performed on the reactor 100, such that the air pressure in the reactor 100 is less than 5×10.sup.−5 torr, and more preferably, the air pressure in the reactor 100 is less than 1×10.sup.−5 torr.

[0022] In FIG. 1B to FIG. 1D, the first vacuum process F1, the gas transport process F2, and the second vacuum process F3 are each performed through the same pipeline 105, but the disclosure is not limited thereto. In other embodiments, the first vacuum process F1, the gas transport process F2, and the second vacuum process F3 may be performed through different pipelines.

[0023] With reference to FIG. 1E, a silicon carbide material 210 is formed on the seed 200 by physical vapor transport (PVT). In this embodiment, the reactor 100 and the raw material 300 are heated by the induction coil 102, such that the silicon carbide material 210 is formed on the first surface 202 of the seed 200.

[0024] In this embodiment, when the raw material 300 at the bottom of the graphite crucible 106 is heated to a high temperature (higher than 1900° C., for example) by the induction coil 102, the raw material 300 is sublimated, and, under the drive of a temperature gradient, is transmitted to the first surface 202 of the seed 200 and form the silicon carbide material 210 on the seed 200, to form a growth body GB containing the seed 200 and the silicon carbide material 210. The growth body GB grows along a growth direction GD perpendicular to the first surface 202 of the seed 200.

[0025] In some embodiments, the silicon carbide material 210 is not only formed on the first surface 202 of the seed 200, but also formed on the sidewall of the seed 200. In other words, the growth body GB may also grow along the radial direction of the seed 200.

[0026] With reference to FIG. 1F, after the growth body GB grows to an expected size, the reactor 100 and the raw material 300 are cooled to obtain a silicon carbide ingot GB′.

[0027] The silicon carbide ingot GB′ is taken out of the reactor 100. In some embodiments, a nitrogen content of the silicon carbide ingot GB′ is 10.sup.16 atoms/cm.sup.3 to 10.sup.17 atoms/cm.sup.3. In some embodiments, a resistivity of the silicon carbide ingot is 0.1 ohm/cm to 10 ohms/cm. In some embodiments, a thickness of the silicon carbide ingot is 5 millimeters (mm) to 80 mm, for example, 5 mm to 50 mm or 5 mm to 30 mm.

[0028] With reference to FIG. 1G, the silicon carbide ingot GB′ is cut to obtain a plurality of silicon carbide wafers W. A thickness of each silicon carbide wafer W is less than 1,000 micrometers. A diameter of each silicon carbide wafer W is greater than 75 mm.

[0029] In some embodiments, a nitrogen content of each silicon carbide wafer W is 10.sup.16 atoms/cm.sup.3 to 10.sup.17 atoms/cm.sup.3. A resistivity of each silicon carbide wafer W is 0.1 ohm/cm to 10 ohms/cm. Since the resistivity of the silicon carbide wafer W is lower than 10 ohms/cm, in the subsequent semiconductor manufacturing process, the silicon carbide wafer W may be moved by electrostatic adsorption.

[0030] In this embodiment, a visible light transmittance of the silicon wafer carbide W obtained based on the above manufacturing process is greater than 50%, preferably greater than 70%, and more preferably greater than 80%. The visible light is defined as light with a wavelength of 380 nanometers to 750 nanometers. In some embodiments, the silicon carbide wafer W is approximately transparent. In this embodiment, silicon carbide in the silicon carbide wafer W has a c-axis with a deflection angle of less than 0.5 degrees. Accordingly, polarization caused by the silicon carbide wafer W may be improved.

[0031] In some embodiments, after the silicon carbide wafer W is completed, an alignment mark (not shown) is formed on the silicon carbide wafer W. The alignment mark may be adapted for confirming a position of the silicon carbide wafer W. Since the silicon carbide wafer W has a great visible light transmittance, the position of the silicon carbide wafer W may be more accurately confirmed by the alignment mark, thereby improving the manufacturing yield in the subsequent semiconductor manufacturing process. For example, in some embodiments, when a back side via process is performed on the silicon carbide wafer W, the alignment mark may be configured to confirm the position of the silicon carbide wafer W, thereby preventing a position of the obtained via from deviation.

[0032] FIG. 2 is a flowchart of a manufacturing method of a silicon carbide wafer according to an embodiment of the disclosure.

[0033] With reference to FIG. 2, in step S201, a raw material containing carbon and silicon and a seed located above the raw material are provided in a reactor.

[0034] In step S202, a first vacuum process is performed on the reactor.

[0035] In step S203, an argon gas is passed into the reactor.

[0036] In step S204, the reactor and the raw material are heated to form a silicon carbide material on the seed.

[0037] In step S205, the reactor and the raw material are cooled to obtain a silicon carbide ingot.

[0038] In step S206, the silicon carbide ingot is cut to obtain a plurality of silicon carbide wafers.

[0039] Several experiments are provided as follows to verify the effects of the disclosure, but the content of the experiments are not intended to limit the scope of the disclosure.

Preparation Example 1

[0040] A silicon carbide wafer was manufactured by utilizing physical vapor transport. For the manufacturing method thereof, reference may be made to FIG. 1A to FIG. 1G.

[0041] In <Preparation example 1>, a flow rate of the argon gas in the gas transport process F2 (shown in FIG. 1C) was 1,000 sccm to 2,000 sccm, and a time of passing the argon gas into the reactor 100 was 2 hours.

[0042] A nitrogen content of the silicon carbide wafer obtained from <Preparation example 1> was 1×10.sup.16 atoms/cm.sup.3 to 9×10.sup.17 atoms/cm.sup.3, and a resistivity of the silicon carbide wafer was 0.03 ohm/cm to 50 ohms/cm.

Preparation Example 2

[0043] A silicon carbide wafer was manufactured by utilizing physical vapor transport. For the manufacturing method thereof, reference may be made to FIG. 1A to FIG. 1G.

[0044] In <Preparation example 2>, a flow rate of the argon gas in the gas transport process F2 (shown in FIG. 1C) was 2,000 sccm to 3,000 sccm, and a time of passing the argon gas into the reactor 100 was 3 hours.

[0045] A nitrogen content of the silicon carbide wafer obtained from <Preparation example 2> was 2×10.sup.16 atoms/cm.sup.3 to 7×10.sup.17 atoms/cm.sup.3, and a resistivity of the silicon carbide wafer was 0.05 ohm/cm to 30 ohms/cm.

Preparation Example 3

[0046] A silicon carbide wafer was manufactured by utilizing physical vapor transport. For the manufacturing method thereof, reference may be made to FIG. 1A to FIG. 1G.

[0047] In <Preparation example 3>, a flow rate of the argon gas in the gas transport process F2 (shown in FIG. 1C) was 3,000 sccm to 4,000 sccm, and a time of passing the argon gas into the reactor 100 was 4 hours.

[0048] A nitrogen content of the silicon carbide wafer obtained from <Preparation example 3> was 3×10.sup.16 atoms/cm.sup.3 to 6×10.sup.17 atoms/cm.sup.3, and a resistivity of the silicon carbide wafer was 0.1 ohm/cm to 10 ohms/cm.

Preparation Example 4

[0049] A silicon carbide wafer was manufactured by utilizing physical vapor transport. For the manufacturing method thereof, reference may be made to FIG. 1A to FIG. 1G.

[0050] In <Preparation example 4>, a flow rate of the argon gas in the gas transport process F2 (shown in FIG. 1C) was 4,000 sccm to 5,000 sccm, and a time of passing the argon gas into the reactor 100 was 5 hours.

[0051] A nitrogen content of the silicon carbide wafer obtained from <Preparation example 4> was 4×10.sup.16 atoms/cm.sup.3 to 5×10.sup.17 atoms/cm.sup.3, and a resistivity of the silicon carbide wafer was 1 ohm/cm to 5 ohms/cm.

[0052] For the relevant parameters in <Preparation example 1> to <Preparation example 4>, see Table 1 below.

TABLE-US-00001 TABLE 1 Flow rate Time Resis- (sccm) of (hour) of Nitrogen tivity of Prep- argon gas passing content of silicon aration in gas argon gas in silicon carbide carbide ex- transport gas transport wafer wafer ample process F2 process F2 (atom/cm.sup.3) (ohm/cm) 1 1,000 to 2,000 2 1 × 10.sup.16 to 9 × 10.sup.17 0.03 to 50 2 2,000 to 3,000 3 2 × 10.sup.16 to 7 × 10.sup.17 0.05 to 30 3 3,000 to 4,000 4 3 × 10.sup.16 to 6 × 10.sup.17  0.1 to 10 4 4,000 to 5,000 5 4 × 10.sup.16 to 5 × 10.sup.17   1 to 5

[0053] It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure covers modifications and variations provided that they fall within the scope of the following claims and their equivalents.