METHOD FOR MANUFACTURING COMMON MODE OR DIFFERENTIAL MODE INDUCTOR AND COMMON MODE OR DIFFERENTIAL MODE INDUCTOR

Abstract

The present disclosure provides a common or differential mode inductor for connection to a printed circuit board. The inductor includes a core, a first coil including a first insulated wire wound with a number of turns around the core, and a supporting device for supporting the core and the first coil. The supporting device includes a base element having a PCB contacting surface, and a first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the PCB contacting surface, wherein the distal end is defining an alignment plane. The core has a first end plane facing the alignment plane and a second end plane, wherein the first end plane is facing the alignment plane. The second end plane is facing the base element.

Claims

1. A common mode or differential mode inductor for connection to a printed circuit board (PCB); wherein the inductor comprises: a core; a first coil comprising a first insulated wire wound with a number of turns around the core; a supporting device for supporting the core and the first coil; wherein the supporting device comprises: a base element having a PCB contacting surface; and an first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the PCB contacting surface, where the distal end is defining an alignment plane; wherein the core has a first end plane and a second end plane, wherein the first end plane is facing the alignment plane; wherein the second end plane is facing the base element; wherein each turn of the first insulated wire has a point furthest from the first end plane a distance in a normal direction towards the alignment plane, wherein the turn having the largest distance from the first end plane is aligned with the alignment plane.

2. The common mode or differential mode inductor according to claim 1, wherein the base element comprises wire guides for guiding ends of the first insulated wire of the first coil with respect to the base element.

3. The common mode or differential mode inductor according to claim 2, wherein the ends of the first insulated wire are slidingly engaged with the wire guides.

4. The common mode or differential mode inductor according to claim 1, wherein the inductor comprises: a second coil comprising a second insulated wire wound with a number of turns around the core; wherein each turn of the second insulated wire has a point furthest from the first end plane a distance in a normal direction towards the alignment plane, wherein the turn having the largest distance from the first end plane is aligned with the alignment plane.

5. The common mode or differential mode inductor according to claim 1, wherein at least one of the core, the first coil and the second coil are fastened to the supporting device by an adhesive.

6. The common mode or differential mode inductor according to claim 1, wherein the supporting device further comprises: a second alignment element having a proximal end connected to the base element and a distal end provided at a second distance from the PCB contacting surface, where the distal end of the first alignment element and the distal end of the second alignment element together are defining the alignment plane.

7. The common mode or differential mode inductor according to claim 1, wherein the supporting device comprises one single alignment element, wherein the distal end of the one single first alignment element comprises an end surface defining the alignment plane.

8. The common mode or differential mode inductor according to claim 6, wherein the supporting device further comprises: a third alignment element having a proximal end connected to the base element and a distal end provided at a third distance from the PCB contacting surface, where the distal end of the first alignment element, the distal end of the second alignment element and the distal end of the third alignment element together are defining the alignment plane.

9. A method for manufacturing a common mode inductor or a differential mode inductor; comprising the steps of: a) providing a supporting device comprising a base element having a printed circuit board (PCB) contacting surface, and a first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the base element, where the distal end is defining an alignment plane; b) providing a core, wherein the core has a first end plane and a second end plane; c) winding a first insulated wire a number of turns around the core, and forming a first coil around the core; d) supporting the core and the first coil on the supporting device by orienting the first end plane facing towards the alignment plane and the second end plane facing towards the base element; e) aligning the alignment plane with a planar surface; f) pushing the core and the first coil towards and abutting the planar surface; g) securing the core and the first coil with respect to the supporting device.

10. The method according to claim 9, wherein the step of supporting the core and the first coil on the supporting device comprises the step of: inserting ends of the first insulated wire of the first coil into wire guides of the supporting device.

11. The method according to claim 9, wherein the step of securing the core and the first coil with respect to the supporting device comprises the step of: adhering the core and the first coil to the supporting device by means of an adhesive.

12. The method according to claim 9, wherein the step of pushing the core and the first coil comprises: pushing the core and the first coil towards the planar surface relative to the supporting device.

13. The method according to claim 9, wherein each turn of the first insulated wire has a point furthest from the first end plane a distance in a normal direction towards the alignment plane, wherein the step of pushing the core and the first coil comprises: aligning the turn having the largest distance from the first end plane with the alignment plane.

14. The method according to claim 9, wherein the step of pushing the core and the first coil comprises: reducing the distance of at least one of the turns of the first insulated wire.

15. An electric circuit system, comprising: a protective housing; a printed circuit board mounted within the protective housing; a common mode or differential mode inductor according to claim 1; and a thermally conducting material located substantially in the alignment plane between the inductor and the protective housing.

16. An electric circuit system, comprising: a protective housing; a printed circuit board mounted within the protective housing; an inductor manufactured according to claim 9 electrically connected the printed circuit board; and a thermally conducting material located substantially in the alignment plane between the inductor and the protective housing.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0077] Embodiments of the disclosure will now be described in detail with respect to the enclosed drawings, wherein:

[0078] FIG. 1 shows a prior art housing of an outdoor power supply system, the housing being a cabinet;

[0079] FIG. 2a illustrates a converter module used in the power supply system of FIG. 1;

[0080] FIG. 2b illustrates a prior art passively cooled converter module;

[0081] FIG. 2c illustrates a prior art power supply system with two such passively cooled converter modules;

[0082] FIG. 3a shows a front view of a first embodiment of an outdoor power supply system;

[0083] FIG. 3b shows a rear view of the first embodiment;

[0084] FIG. 4a corresponds to FIG. 3, wherein the upper part of the main housing and the upper part of the respective converter module housings have been removed;

[0085] FIG. 4b shows an enlarged view of a converter module located within a converter module housing, where three common mode inductors are shown;

[0086] FIG. 5a shows a perspective view of a first embodiment of a common mode inductor;

[0087] FIG. 5b shows a first side view of the inductor of FIG. 5a;

[0088] FIG. 5c shows a second side view of the inductor of FIG. 5a;

[0089] FIG. 5d illustrates a perspective view of an embodiment of the core;

[0090] FIG. 5e illustrates a perspective view of an alternative embodiment of the core;

[0091] FIG. 6a illustrates an enlarged side view of a first turn of a first winding wound around the core;

[0092] FIG. 6b illustrates an enlarged side view of a second turn of the first winding wound around the core;

[0093] FIG. 6c is a photo of a common mode inductor to illustrate the variations of the different turns of the coil;

[0094] FIG. 6d illustrates an enlarged side view of a first turn of a second winding wound around the core;

[0095] FIG. 6e illustrates an enlarged side view of a second turn of a second winding wound around the core;

[0096] FIG. 7a illustrates a cross sectional top view along line B-B in FIG. 7b of parts of a second embodiment of the inductor;

[0097] FIG. 7b illustrates a cross sectional side view along line A-A in FIG. 7a of parts of a second embodiment of the inductor;

[0098] FIG. 7c corresponds to FIG. 7a, where the coil separation element has been positioned;

[0099] FIG. 7d corresponds to FIG. 7b, where the coil separation element has been positioned;

[0100] FIGS. 8a-8c illustrates the supporting device if the inductor shown in FIGS. 5a-c;

[0101] FIG. 8d is a top view of the supporting device of FIGS. 8a-c;

[0102] FIG. 9a illustrates a side view of a further embodiment of a supporting device;

[0103] FIG. 9b illustrates a cross sectional top view along line A-A of FIG. 9a;

[0104] FIG. 10 illustrates a side view of a further embodiment of a supporting device together with the core;

[0105] FIG. 11 illustrates a cross sectional top view of a further embodiment of a supporting device together with the core;

[0106] FIGS. 12a-e illustrates a method for manufacturing of the common mode inductor of FIGS. 5a-c; and

[0107] FIG. 13 illustrates the common mode inductor and its location within the module housing.

DESCRIPTION OF EMBODIMENTS

[0108] An introduction of the embodiments of the present disclosure will now be described with reference to 3a, 3b, 4a and 4b. In FIG. 3a and FIG. 3b, the front side FS and rear side RS of a power supply system 1 are shown. In one embodiment of the present disclosure, the power supply system 1 includes a main unit 10 including a protective main housing 11 and a distribution circuit 20 disposed in the protective main housing 11. The power supply system 1 further includes a converter module unit 30 including a protective module housing 31 and a converter module 40 disposed in the protective module housing 31. In the drawings, the system includes four such converter module units 30a, 30b, 30c, and 30d each including respective module housings 31a, 31b, 31c, 31d and converter modules 40a, 40b. However, the system may include only one, two, three or four such units 30, depending on the expected load connected to the power supply system 1.

[0109] The distribution circuit 20 includes cable connectors, circuit breakers/relays, a controller for controlling power through the converter(s), for controlling the output voltage, for battery management etc., while the converter module 40 includes an AC/DC converter, a DC/DC converter, and/or a DC/AC converter, depending on the input power and load requirement. UPS functionality may also be provided by connecting a rechargeable battery to the distribution circuit 20.

[0110] In FIG. 4b, the printed circuit board PCB of the converter module 40 is shown. It is also shown that the printed circuit board PCB includes three inductors 100 according to one embodiment of the present disclosure, which will be described in detail below. In one embodiment, the three inductors 100 are common mode inductors.

[0111] When supplied with electric power, the electric components of the converter module 40, including the inductors 100, produce heat, which must be removed from the inside of the housing 31 to prevent overheating.

[0112] The system 1 therefore includes a passive cooling system 70, where the housing 31 is a part of the cooling system, where heat is dissipated from the housing 31 to the environment. The housing 31 is therefore made of a thermally conducting material, such as a metal. In one aspect, the cooling system includes cooling fins 71 provided on the outer surface of the housing 31.

[0113] Preferably, the system 1 is designed for outdoor use. In such a case, the housing 31 is a protective housing 31 protecting the inside (i.e. the PCB and the electric components) of the housing 31 from an outdoor environment. The system 1 may for example have an IP65 classification.

[0114] Preferably, the housing 31 is made of aluminum or an aluminum alloy. The cooling fins 71 of the passive cooling system 70 may be manufactured together with the converter module housing in a die casting process or a machining process.

[0115] Embodiments of the common mode inductor 100 will now be described in detail below.

First Embodiment

[0116] It is now referred to FIGS. 5a-d. The inductor 100 has three main parts: a core 102, a coil 104, and a supporting device 110. These parts will be described in detail below.

[0117] The core 102 is shown in FIG. 5d and is cylindrical, with a first end plane 102a and a second, opposite end plane 102b and a longitudinal center axis I1 defined through the opening 102d through the core 102. An outer side surface between the first and second end planes is referred to as 102c.

[0118] An alternative core 102 is shown in FIG. 5e and is toroidal, with an oval cross section. The end planes 102a, 102b, the opening 102d, and the outer side surface 102c are also indicated in FIG. 5e.

[0119] Alternatively, the core 102 may be a cylinder with chamfered edges, or it may even be torus-shaped.

[0120] The coil 104 includes an insulated wire 105 wound with a number of turns a1, a2,. . . , aN around the core 102. The insulated wire 105 has two ends 105a intended to be conductively mounted to the printed circuit board PCB.

[0121] In the embodiment, the inductor 100 is a common mode inductor with two coils. Hence, the coil 104 is referred to as a first coil 104, and a second coil is referred to as 106. The second coil 106 includes a second insulated wire 107 wound with a number of turns b1, b2, . . . , bN around the core 102. Also two ends 107a of the second wire 107 are intended to be conductively mounted to the printed circuit board PCB.

[0122] The present embodiment of the supporting device 110 is shown in FIGS. 8a and 8b. The supporting device 110 includes a base element 112 having a PCB contacting surface 113. In FIGS. 8b and 8c, it is shown that the PCB contacting surface 113 includes four legs protruding from the base element 112 towards the dashed line indicating the printed circuit board PCB.

[0123] The base element 112 further includes wire guides 114 for guiding ends 105a of the first insulated wire 105 of the first coil 104 with respect to the base element 112 and for guiding ends 107a of the second insulated wire 107 of the second coil 106. The wire guides 114 may be provided as openings in the base element 112 or as U- or V-shaped notches in the base element 112. The ends 105a, 107a of the wires 105, 107 are slidingly engaged with the wire guides 114.

[0124] The ends 105a, 107a of the insulated wire 105, 107 are protruding from the base element 112 in a direction away from the alignment plane AP. The ends 105a are sufficiently long to penetrate openings of the printed circuit board PCB and to be soldered to the side of the printed circuit board PCB being opposite of the supporting device 110.

[0125] The supporting device 110 further includes a first alignment element 120 having a proximal end 120b connected to the base element 112 and a distal end 120a provided at a distance D (FIG. 8b) from the PCB contacting surface 113.

[0126] The supporting device 110 further includes a second alignment element 125 having a proximal end 125b connected to the base element 112 and a distal end 125a provided at a second distance from the PCB contacting surface 113.

[0127] In FIG. 8b, it is shown that the first and second alignment elements 120, 125 are oriented substantially in parallel with each other. A dashed line La is drawn between the distal ends 120a, 125a. This dashed line La is provided in parallel with the PCB plane. It is also shown that the distal end 120a of the first aligning element 120 is extending (indicated by a dashed line L120a) in a direction substantially perpendicular to the dashed line La and similarly, that the distal end 125a of the second aligning element 125 is extending (indicated by a dashed line L125a) in a direction substantially perpendicular to the dashed line La.

[0128] Hence, the distal end 120a of the first alignment element 120 and the distal end 125a of the second alignment element 125 are defining parallel lines L120a, L125a. The distal end 120a of the first alignment element 120 and the distal end 125a of the second alignment element 125 together are defining an alignment plane AP as indicated in FIGS. 8b and 8c. This alignment plane AP is parallel to the printed circuit board PCB.

[0129] As shown in FIGS. 5a, 5b and 5c, the core 102 and the coils 104, 106 are located between the first and second aligning elements 120, 125.

[0130] It is also shown that the longitudinal center axis I1 of the core 102 is oriented in parallel with the printed circuit board PCB.

[0131] In FIG. 5a, it is further shown that the inductor 100 includes a coil separation element 140 for separating the first coil 104 from the second coil 106. The coil separation element 140 sets a separation distance between turns al, aN of the first coil 104 from turns b1, b2, . . . , bN of the second coil 106, to avoid an electric short-circuit between the first and second coils.

[0132] In this embodiment, the coil separation element 140 is provided at least partially inside the opening of the core 102.

[0133] In addition, the core 102, the first coil 104 and the second coil 106 may be fastened to the supporting device 110 by an adhesive (illustrated by an adhesive container in FIG. 12e). It should be noted that the adhesive may be in direct contact with the coils and the supporting device 110 only. As the coils 104, 106 are wound around the core 102, the adhesive will indirectly also fasten the core 102 to the supporting device 110. The adhesive 200 may also be used fasten the coil separation element 140 to the coil or coils and/or to the supporting device 110.

First Embodiment—Manufacturing

[0134] The manufacturing of the first embodiment of the inductor 100 will now be described.

[0135] In a first step, the first insulated wire 105 is wound a number of turns a1, a2, . . . , aN around the core 102, and forming a first coil 104 around the core 102.

[0136] In the same way, the second insulated wire 107 is wound a number of turns b1, b2, . . . , bN around the core 102, and forming a second coil 104 around the core 102.

[0137] It should be noted that the coils 104, 106 shown in FIG. 5a are illustrated by means of a three dimensions (3D) computer program, in which each turn are perfectly aligned with the other turns. In reality, there will be variations between each turn, one reason being the relatively rigid wire 105, 107 of the coils 104, 106. In FIG. 6c an image of an inductor 100 is shown, where it is apparent that the two adjacent turns a1, a2 are not perfectly aligned with each other.

[0138] It is now referred to FIG. 12a. Here the supporting device 110 and the core 102 with its two coils 104, 106 are shown adjacent to each other (only coil 106 shown). It should be noted that the ends 107a of the wire 107 are shown to be rather long.

[0139] It is now referred to FIG. 12b. Here the core 102 and the coils 104, 106 are supported on the supporting device 110 by orienting the first end plane 102a of the core 102 facing towards the alignment plane AP and the second end plane 102b facing towards the base element 112. The coils 104, 106 are located between the two alignment elements 120, 125. The ends 105a, 107a of the first insulated wire 105 and the second insulated wire 107 have been inserted into the wire guides 114 of the supporting device 110.

[0140] It is now referred to FIG. 12c. Here, the inductor 100 corresponds to the inductor shown in FIG. 12b, but turned upside down. The alignment plane AP is aligned with a planar surface PS, for example the surface of a table T etc. It is shown in FIG. 12c that there is a distance Dt1 between the turns of the coils and the aligning plane AP being larger than zero.

[0141] It is now referred to FIG. 12d. Here it is shown that the core 102 together with the coils 104, 106 has been pushed towards the planar surface PS until at least one of the turns of one of the coils is abutting the planar surface PS. The distance Td1 is now zero. It should be noted that the—pushing the core 102 together with the coils 104, 106 have been pushed relative to the supporting device 110, as the distal ends 120a, 125a defining the aligning plane AP is held stationary with respect to the planar surface. This relative movement is allowed as the wires 105, 107 are slidingly engaged with the wire guides 114.

[0142] In a final step shown in FIG. 12e, the core 102 together with the coils 104, 106 are secured with respect to the supporting device 110. As described above, this may be achieved by adhering the core 102 and/or the coils 104, 106 to the supporting device 110 by means of an adhesive 200. The adhesive will be allowed to cure when the inductor 100 is in the position shown in FIG. 12e.

[0143] Optionally, the ends 105a, 107a may be cut off to a suitable length as illustrated in FIG. 12e. Alternatively, this can be done after the inductor 100 has been soldered to the printed circuit board PCB.

[0144] It is now referred to FIGS. 6a and 6b. Here, two different turns a1, a2 of the core 104 are shown. Each turn a1, a2, aN of the first insulated wire 105 has a point furthest from the first end plane 102a at a distance Da1, Da2, , DaN in a normal direction towards the alignment plane AP. When comparing FIG. 6a with FIG. 6b, it is apparent that the turn a1 has the largest distance from the first end plane 102a, as the distance Da1 is larger than the distance Da2.

[0145] As described above with reference to FIG. 12d, the coils 104, 106 (together with the core 102) are pushed towards the planar surface PS until at least one of the turns of one of the coils is abutting the planar surface PS. In the case of FIGS. 6a and 6b, the first turn a1 will be abutting the planar surface PS and hence be aligned with the aligning plane AP, while the second turn a2 will not be abutting the planar surface PS. Hence, if the inductor has one coil 104 only, it is the turn having the largest distance Da1, Da2, DaN from the first end plane 102a which will be aligned with the alignment plane AP.

[0146] It is now referred to FIGS. 6d and 6e. Here, two different turns b1, b2 of the core 104 are shown. Similar to FIGS. 6a and 6b described above, it is apparent that the turn bl has the largest distance from the first end plane 102a, as the distance Db1 is larger than the distance Db2.

[0147] Hence, in case the inductor 100 has two coils 104, 106, it is the turn having the largest distance Da1, Da2, DaN, Db1, Db2, , DbN from the first end plane 102a which will be aligned with the alignment plane AP.

[0148] In practice, some of the turns may have the same distance from the planar surface 102 and hence more than one of the turns of the same coil or of different coils may be aligned with the aligning plane AP.

[0149] It may also be the case that the step of pushing the core 102 and the first coil 104 will cause a reduction in the distance Da1, Da2, , DaN, Db1, Db2, , DbN of at least one of the turns a1, a2, . . . , aN, b1, b2, bN of the first insulated wires 105, 107. This will typically require a deformation of the wires 105, 107.

Second Embodiment

[0150] It is now referred to FIG. 7a-d. Here, only the supporting device 110 and the core 102 is shown, the coil or coils are not shown.

[0151] Also here, the supporting device 110 includes a base element 112 and a PCB contacting surface 113. However, the supporting device 110 here only includes one single alignment element 120. This one single alignment element 120 must here have a distal end 120a extending in two different directions, i.e. the distal end 120a must itself define the alignment plane AP.

[0152] Here, the one single alignment element 120 is provided through the opening 102d of the core 102. The end surface 121 defining the alignment plane AP is substantially circular.

[0153] It is also shown that the alignment element 120 includes a slit 122 in its distal end, the slit 122 being adapted to receive the separation element 140.

[0154] The coil separation element 140 includes an aligning surface 142, which will be aligned with the alignment plane AP during the manufacturing step of pushing the coil (together with the core) against the planar surface PS.

Third Embodiment

[0155] It is now referred to FIGS. 9a and 9b. Here, the supporting device 110 further includes a third alignment element 128 having a proximal end 128b connected to the base element 112 and a distal end 128a provided at a third distance from the PCB contacting surface 113, where the distal end 120a of the first alignment element 120, the distal end 125a of the second alignment element 125 and the distal end 128a of the third alignment element 128 together are defining the alignment plane AP.

[0156] The third alignment element 128 is here provided through the opening 102d of the core 102, similar to the second embodiment above. Hence, this third embodiment may be seen as a combination of the first and second embodiment above.

Fourth Embodiment

[0157] It is now referred to FIG. 10. Here, the supporting device 110 includes two alignment elements 120, 125, where one of the two alignment elements is provided through the opening 102d of the core 102, similar to the second embodiment above.

[0158] The distal end 120a of the first alignment element 120 and the distal end 125a of the second alignment element 125 together are defining the alignment plane AP.

Fifth Embodiment

[0159] It is now referred to FIG. 11. Here, the supporting device 110 includes three alignment elements 120, 125, 128, all of then provided radially outside of the core 102 as shown in FIG. 11.

[0160] The distal end 120a of the first alignment element 120, the distal end 125a of the second alignment element 125 and the distal end 128a of the third alignment element 128 together are defining the alignment plane AP.

[0161] As is apparent from the above embodiments, there are several ways that such an alignment plane AP can be defined by means of one or more distal ends of one or more supporting elements.

[0162] In the above embodiments, the supporting device 110 is made as one, single body. It may be made of a non-conducting material, such as a plastic material. Alternatively, the base element 112 and the alignment element(s) may be made as separate bodies fixed to, or secured to, each other.

[0163] According to the above, the purpose of the supporting device 110 is to support the core 102 and the coil(s) with respect to the printed circuit board PCB. A further purpose is to support the core 102 and the coils in a preferred position with respect to the printed circuit board PCB and also with respect to a cooling surface, the cooling surface being located at a distance from the printed circuit board PCB.

[0164] One embodiment of the present disclosure provides an electric circuit system achieved by using the inductor 100 shown in FIG. 13, where the cooling system provided by means of the housing 31 is illustrated below and above the inductor 100. The inductor 100 here has been conductively mounted to a printed circuit board PCB. As shown, the electric circuit system includes a thermally conducting material 48 located substantially in the alignment plane

[0165] AP between the inductor 100 and the protective housing 31. In one embodiment, the thermally conducting material 48 is a thermally conductive pad. The thermally conductive pad 48 has been provided between the inductor 100 and the inside of the upper housing 31, to improve heat transfer from the inductor 100 to the upper housing 31.

[0166] According to the above inductor and method for manufacturing of such an inductor, it is achieved that none of the turns a1, a2, . . . , aN, b1, b2, . . . , bN is protruding further away from the first end plane 102a than the alignment plane AP. Hence, all inductors 100 will fit in its assigned position between the printed circuit board and an outer housing and none of the inductors will prevent the assembly of the electric circuit system.

[0167] Due to the alignment of the coil(s) with the alignment plane AP, it is achieved that fewer or thinner pads may be used. Moreover, it is achieved that the variation between different inductors is reduced.

Alternative Embodiments

[0168] It should be noted that if the inside of the housing is inclined, i.e. not parallel with, the printed circuit board PCB, then the alignment plane AP may also be inclined with respect to the PCB plane.

[0169] It would be possible to integrate the coil separation element 140 with the supporting device 110, i.e. that the coil separation element 140 is provided as part of the supporting device 110.

[0170] It should be noted that the inductor 100 may have one, two or more than two coils wound around the core 102.