NEGATIVE THERMAL EXPANSION MATERIAL, COMPOSITE MATERIAL, AND METHOD FOR PRODUCING NEGATIVE THERMAL EXPANSION MATERIAL
20210363012 · 2021-11-25
Inventors
- Toshihiro ISOBE (Tokyo, JP)
- Yuko HAYAKAWA (Tokyo, JP)
- Yuri ADACHI (Tokyo, JP)
- Ryosuke Uehara (Tokyo, JP)
Cpc classification
C01B25/45
CHEMISTRY; METALLURGY
International classification
Abstract
A negative thermal expansion material having a negative thermal expansion coefficient according to the present invention is represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ, where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd, and Cr; a is 0≤a<2; x is 0.4≤x≤1; and δ is a value defined as to satisfy a charge neutral condition. The present invention makes it possible to provide a negative thermal expansion material, a composite material and a method for producing a negative thermal expansion material that can realize reduction in cost and density reduction.
Claims
1. A negative thermal expansion material having a negative thermal expansion coefficient and represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd and Cr; a is 0≤a<2; x is 0.4≤x≤1; and δ is a value defined so as to satisfy a charge neutral condition.
2. The negative thermal expansion material according to claim 1, wherein a=0 and the negative thermal expansion material is represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ.
3. The negative thermal expansion material according to claim 1, wherein M is Ti and a is 0<a≤0.7.
4. The negative thermal expansion material according to claim 1, wherein M is Ce and a is 0<a≤0.4.
5. The negative thermal expansion material according to claim 1, wherein M is Sn and a is 0<a≤1.
6. The negative thermal expansion material according to claim 1, wherein M is Mn and a is 0<a≤0.2.
7. The negative thermal expansion material according to claim 1, wherein part of S site is substituted by Mo or W.
8. The negative thermal expansion material according to claim 1, wherein x is 0.48≤x≤0.9.
9. The negative thermal expansion material according to claim 8, wherein an absolute value of volume expansion coefficient of the negative thermal expansion material at a temperature of 100 to 180° C. is larger than an absolute value of volume expansion coefficient of the negative thermal expansion material at a temperature of larger than 180° C.
10. The negative thermal expansion material according to claim 1, wherein x is 0.4≤x<0.48.
11. The negative thermal expansion material according to claim 10, wherein the volume expansion coefficient of the negative thermal expansion material is almost constant at 80° C. or more.
12. A composite material comprising the negative thermal expansion material according to claim 1 and a material having a positive thermal expansion coefficient.
13. A composite material comprising the negative thermal expansion material according to claim 8 and a resin material having a positive thermal expansion coefficient.
14. A composite material comprising the negative thermal expansion material according to claim 10 and a metal material having a positive thermal expansion coefficient.
15. A method for producing a negative thermal expansion material, comprising a step of hydrothermally treating a mixture containing zirconium oxychloride octahydrate, ammonium phosphate and sulfuric acid at a temperature of 130° C. or more, and a step of baking the mixture hydrothermally treated, at a temperature of 450° C. or more to form a material represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ (where 0.4≤x≤1 and δ is a value defined so as to satisfy a charge neutral condition) and having a negative thermal expansion coefficient.
16. A method for producing a negative thermal expansion material, comprising a step of hydrothermally treating a mixture containing zirconium oxychloride octahydrate, ammonium phosphate, sulfuric acid and an additive containing element M at a temperature of 130° C. or more, and a step of baking the mixture hydrothermally treated, at a temperature of 450° C. or more to form a material represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ, (where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd and Cr; a is 0≤a<2; x is 0.4≤x≤1; and δ is a value defined so as to satisfy a charge neutral condition) and having a negative thermal expansion coefficient.
17. The method for producing a negative thermal expansion material according to claim 15, wherein the value of x is controlled by controlling a temperature for baking the mixture hydrothermally treated.
18. The method for producing a negative thermal expansion material according to claim 15, wherein the temperature for the hydrothermal treatment is 180° C. or more.
19. The method for producing a negative thermal expansion material according to claim 15, wherein the temperature for baking the mixture hydrothermally treated is 900° C. or less.
Description
BRIEF DESCRIPTION OF DRAWINGS
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DESCRIPTION OF EMBODIMENTS
[0052] Now, embodiments of the present invention will be described.
[0053] A negative thermal expansion material according to the embodiment is characterized by being represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ, where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd and Cr; a is 0≤a<2; x is 0.4≤x≤1; and δ is a value defined so as to satisfy a charge neutral condition.
[0054] For example, if a=0, the negative thermal expansion material is a material represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ. In contrast, if a≠0, the negative thermal expansion material is a material obtained by substituting part of Zr site with M.
[0055] For example, if M is Ti, the negative thermal expansion material is a material represented by Zr.sub.2-aTi.sub.aS.sub.xP.sub.2O.sub.12+δ, where a is preferably 0<a≤0.7.
[0056] If M is Ce, the negative thermal expansion material is a material represented by Zr.sub.2-aCe.sub.aS.sub.xP.sub.2O.sub.12+δ, where a is preferably 0<a≤0.4.
[0057] If M is Sn, the negative thermal expansion material is a material represented by Zr.sub.2-aSn.sub.aS.sub.xP.sub.2O.sub.12+δ, where a is preferably 0<a≤1.
[0058] If M is Mn, the negative thermal expansion material is a material represented by Zr.sub.2-aMn.sub.aS.sub.xP.sub.2O.sub.12+δ, where a is preferably 0<a≤0.2.
[0059] Besides there, element M, which substitutes part of Zr site, may be Hf, Ir, Pb, Pd and Cr.
[0060] In the embodiment, part of S site of a negative thermal expansion material represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ, may be substituted by Mo or W.
[0061] In the embodiment, part of P site may be further substituted by an element such as V, Mn, Cr, As and Nb.
[0062] As described above, a negative thermal expansion material according to the embodiment is mainly constituted of cheap and relatively light atoms. Accordingly, reduction in cost and density of a negative thermal expansion material can be realized.
[0063] Now, a negative thermal expansion material according to the embodiment will be more specifically described. In the following embodiments, a material represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ where 0.4≤x≤1; and δ is a value defined so as to satisfy a charge neutral condition, will be described as an example. In the embodiments, other negative thermal expansion materials represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ have the same characteristics as this.
[0064]
[0065]
[0066] As shown in
[0067] As an example, the volume expansion coefficient (100 to 180° C.) of a negative thermal expansion material according to the embodiment is −94 ppm/° C. if x=0.48; −101 ppm/° C. if x=0.54; −101 ppm/° C. if x=0.76; and −108 ppm/° C. if x=0.90. As the value x increases, the volume expansion coefficient (100 to 180° C.) tends to decrease.
[0068] Focusing on the case of x=0.90, the volume expansion coefficient in the range of 30 to 100° C. is −26 ppm/° C.; the volume expansion coefficient in the range of 100 to 180° C. is −108 ppm/° C.; the volume expansion coefficient in the range of 180 to 350° C. is −8.1 ppm/° C.; and the volume expansion coefficient in the range of 350 to 500° C. is −13 ppm/° C.
[0069] If the value x is 0.4≤x<0.48, the volume expansion coefficient of a negative thermal expansion material becomes almost constant at 80° C. or more (see,
[0070] As described above, a negative thermal expansion material according to the embodiment has a negative thermal expansion coefficient in the range of room temperature to 500° C. In particular, if value x is 0.48≤x≤0.9, a large negative thermal expansion coefficient is shown in the range of 100 to 180° C. The magnitude of the thermal expansion coefficient decreases as the content of sulfur atom S decreases. In contrast, if value x is 0.4≤x<0.48, the volume expansion coefficient of the negative thermal expansion material becomes almost constant at 80° C. or more.
[0071] The crystal phase of a negative thermal expansion material according to the embodiment is represented by α-Zr.sub.2SP.sub.2O.sub.12 (ICDD card number: 04-017-0937) and may partly contain another crystal phase. For example, other than a phase (α-Zr.sub.2SP.sub.2O.sub.12), β phase (β-Zr.sub.2SP.sub.2O.sub.12 (ICDD card: 04-007-8019)) may be partly contained.
[0072] The atoms constituting a negative thermal expansion material according to the embodiment (Zr.sub.2S.sub.xP.sub.2O.sub.12+δ) are Zr, S and P. Since these materials are cheap, a negative thermal expansion material can be inexpensively formed compared to conventional negative thermal expansion materials formed of precious metals. Accordingly, cost reduction of a negative thermal expansion material can be realized.
[0073] The atoms constituting a negative thermal expansion material according to the embodiment (Zr.sub.2S.sub.xP.sub.2O.sub.12+δ) are Zr, S and P. Since these atoms (particularly, S and P) are relatively light in weight, the density of the negative thermal expansion material can be reduced compared to conventional negative thermal expansion materials. Accordingly, density reduction of the negative thermal expansion material can be realized.
[0074] For example, the density of a negative thermal expansion material, Mn—Sn—Zn—N (Smartec: registered trademark) is about 7 g/cm.sup.3. The density of the negative thermal expansion material represented by Zr.sub.2WP.sub.2O.sub.12 is 3.86 g/cm.sup.3 and the density of Zr.sub.2MoP.sub.2O.sub.12 is 3.36 g/cm.sup.3. In contrast, the density of a negative thermal expansion material according to the embodiment represented by Zr.sub.2SP.sub.2O.sub.12 is 3.02 g/cm.sup.3, which is lower than the densities of conventional negative thermal expansion materials.
[0075] A composite material controlled in thermal expansion coefficient is formed by mixing a negative thermal expansion material and a material (positive thermal expansion material) having a positive thermal expansion coefficient, in other words, by dispersing a negative thermal expansion material in a positive thermal expansion material. At this time, if the density of the negative thermal expansion material is reduced, the negative thermal expansion material can be homogeneously dispersed in the positive thermal expansion material.
[0076] As described above, a negative thermal expansion material according to the embodiment varies in thermal expansion coefficient depending on the value x, i.e., the content of sulfur atom S. More specifically, if value x is 0.48≤x≤0.9, the material shows a large negative thermal expansion coefficient in the range of 100 to 180° C. The magnitude of the negative thermal expansion coefficient decreases as the content of sulfur atom S decreases. If value x is 0.4≤x<0.48, the volume expansion coefficient of the negative thermal expansion material becomes almost constant at 80° C. or more.
[0077] In the embodiment, depending on the characteristics of the positive thermal expansion material to be used for forming a composite material, the characteristics of the composite material to be formed and the temperature range in which the composite material is to be used, it is preferable to determine value x of the negative thermal expansion material.
[0078] For example, if the positive thermal expansion material is a resin material, in consideration of the operation temperature (heatproof temperature) of the resin material, the value x of a negative thermal expansion material is preferably set at 0.48≤x≤0.9. In other words, in consideration of the heatproof temperature of the resin material, the operation temperature of the resin material is presumed to be from room temperature to 200° C. Also, if value x is 0.48≤x≤0.9, a large negative thermal expansion coefficient is shown in the range of 100 to 180° C. Accordingly, if value x of a negative thermal expansion material is specified as 0.48≤x≤0.9, the operation temperature range of a resin material can be overlapped with the range where a negative thermal expansion material shows a large negative thermal expansion, with the result that the thermal expansion coefficient of the composite material can be efficiently controlled.
[0079] If the positive thermal expansion material is a metal material, in consideration of the operation temperature (heatproof temperature) of the metal material, value x of a negative thermal expansion material is preferably set at 0.4≤x≤0.48. In other words, the composite material containing a metal material is mostly used in a wide range of operation temperature. If value x herein is 0.4≤x<0.48, the volume expansion coefficient of a negative thermal expansion material becomes almost constant at 80° C. or more. Accordingly, if value x of a negative thermal expansion material is set at 0.4≤x<0.48, the operation temperature range of a composite material containing a metal material can be broadly overlapped with the range where the volume expansion coefficient of a negative thermal expansion material becomes almost constant, with the result that the thermal expansion coefficient of the composite material can be efficiently controlled.
[0080] Note that, the above constitution is just an example. In the embodiment, if a positive thermal expansion material is a metal material, a composite material may be formed by use of a negative thermal expansion material in which value x is set at 0.48≤x≤0.9. If a positive thermal expansion material is a resin material, a composite material may be formed by use of a negative thermal expansion material in which value x is set at 0.4≤x<0.48. More specifically, in the embodiment, in consideration of, e.g., the temperature range at which a composite material is used and characteristics of a positive thermal expansion material to be mixed, the value x of a negative thermal expansion material can be determined.
[0081] Now, a method for producing a negative thermal expansion material (Zr.sub.2S.sub.xP.sub.2O.sub.12+δ) according to the embodiment will be described with reference to the flowchart shown in
[0082] After completion of stirring, the resultant aqueous solution (mixture) is hydrothermally treated at a temperature of 130° C. or more, preferably 180° C. or more (step S2). The time for the hydrothermal treatment is specified as 0.5 to 4 days. After the hydrothermal treatment is carried out for predetermined time, the mixture (hydrothermally treated) is dried (step S3). More specifically, after the hydrothermal treatment, a white precipitate is generated in the container. The solution (mixture) containing the white precipitate is poured in an evaporating dish and heated by a heater of about 100° C. to vaporize extra moisture (first drying process). At this time, since the mixture is not completely dried due to the content of excessive sulfuric acid, the evaporating dish is placed in an electric furnace of 300° C. and then second drying process was carried out (step S4).
[0083] After completion of the 2nd drying process, the mixture (dried) is baked at a temperature of 450° C. or more to form a material having a negative thermal expansion coefficient and represented by the above general formula (step S5). The temperature for baking the mixture can be set, for example, at 450° C. or more and 900° C. or less. In the baking process, value x in the above general formula can be controlled by controlling the temperature for baking the dried mixture. More specifically, as the baking temperature increases, sulfur δ is more easily removed and the content ratio of sulfur S in the above formula decreases. At this time, value x (i.e., the content of S) in the above general formula can be controlled by controlling the baking time.
[0084] In the embodiment, since a negative thermal expansion material is produced by a hydrothermal method, the negative thermal expansion material can be produced at low cost. Although the details will be described later, the particle size distribution of a negative thermal expansion material can be narrowed since a hydrothermal method is used. Since the particle size distribution of a negative thermal expansion material is narrow as mentioned above, the negative thermal expansion material can be homogeneously dispersed in a positive thermal expansion material.
[0085] When a method for producing a negative thermal expansion material according to the embodiment is used, the negative thermal expansion material can be formed into cubic particles of 200 to 300 nm on a side (see,
[0086] Note that, the production method mentioned above is for producing a material represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ (i.e., a=0). A material represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ (0<a<2) can be produced as follows: in mixing raw materials in step S1, a material (additive) containing element M is added other than zirconium oxychloride octahydrate, ammonium phosphate and sulfuric acid. For example, if M is Ti, a titanium (IV) sulfate solution (Ti(SO.sub.4).sub.2) is added. If M is Ce, cerium sulfate tetrahydrate (Ce(SO.sub.4).sub.2.4H.sub.2O) is added. If M is Sn, tin oxide (SnO.sub.2) is added. If M is Mn, manganese dioxide (MnO.sub.2) is added. Note that, these additives are just as examples. Materials (additives) other than these may be used as long as they can add element M to a negative thermal expansion material.
[0087] As described above, in the embodiment, part of S site of a negative thermal expansion material represented by Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ, may be substituted by Mo or W. In this case, a material (additive) containing an element Mo or an element W is added during production. In this manner, part of S site can be substituted by Mo or W.
EXAMPLES
[0088] Now, Examples of the present invention will be described.
[0089] In the following, Examples of the following negative thermal expansion materials will be described.
(1) Zr.sub.2S.sub.xP.sub.2O.sub.12+δ
(2) Zr.sub.2-aTi.sub.aS.sub.xP.sub.2O.sub.12+δ (part of Zr site is substituted by Ti)
(3) Zr.sub.2-aCe.sub.aS.sub.xP.sub.2O.sub.12+δ (part of Zr site is substituted by Ce)
(4) Zr.sub.2-aSn.sub.aS.sub.xP.sub.2O.sub.12+δ (part of Zr site is substituted by Sn)
(5) Zr.sub.2-aMn.sub.aS.sub.xP.sub.2O.sub.12+δ (part of Zr site is substituted by Mn)
(6) Zr.sub.2S.sub.1-bMo.sub.bP.sub.2O.sub.12+δ (part of S site is substituted by Mo)
(7) Zr.sub.2S.sub.1-bW.sub.bP.sub.2O.sub.12+δ (part of S site is substituted by W)
(1) Zr.sub.2S.sub.xP.sub.2O.sub.12+δ
Preparation and Evaluation of Negative Thermal Expansion Material
[0090] First, in order to examine the relationship between a composition of a negative thermal expansion material according to the present invention represented by Zr.sub.2S.sub.xP.sub.2O.sub.12+δ (0.4≤x≤1 and δ is a value defined so as to satisfy a charge neutral condition) and a thermal expansion coefficient thereof, samples 1 to 9 were prepared. Samples 1 to 9 were prepared in accordance with the flowchart shown in
[0091] More specifically, first, raw materials, ZrCl.sub.2O.sub.8.8H.sub.2O (Wako special grade, Wako Pure Chemical Industries Ltd. (current name: FUJIFILM Corporation, the same applies in the following), NH.sub.4H.sub.2PO.sub.4 (reagent special grade, Wako Pure Chemical Industries Ltd.) and H.sub.2SO.sub.4 (reagent special grade, Wako Pure Chemical Industries Ltd.) were prepared. Then, ZrCl.sub.2O.8H.sub.2O and NH.sub.4H.sub.2PO.sub.4 were each dissolved in distilled water so as to be 0.8 M. Subsequently, these aqueous solutions (10 ml for each) and 3 ml of H.sub.2SO.sub.4 were mixed. The mixture was stirred for 90 minutes by a stirrer (step S1).
[0092] After completion of stirring, the aqueous solution (mixture) was poured in a container (HUT-100, SAN-AI Kagaku Co. Ltd.) made of Teflon (registered trademark) and the container was set in an outer cylinder made of pressure-resistant stainless steel (HUS-100, SAN-AI Kagaku Co. Ltd.). The cylinder was placed in a hot air circulation oven (KLO-45M, Koyo Thermo Systems Co., Ltd.) and heated. In this manner, a hydrothermal treatment was carried out (step S2). The hydrothermal treatment was carried out at a temperature of 180° C. for 4 days.
[0093] After the hydrothermal treatment, the Teflon container taken out had a white precipitate yield therein, in which a white precipitate was generated. A solution containing the precipitate was poured in an evaporating dish and heated on a heater of about 100° C. to vaporize extra moisture (step S3: first drying process). At this time, the sample was not completely dried due to the content of excessive H.sub.2SO.sub.4 and moisture remained. Thus, the evaporating dish containing the sample was placed in an electric furnace (KDF-S80, DENKEN-HIGHDENTAL Co., Ltd.) of 300° C. and dried for further 12 hours (step S4: second drying process). Thereafter, the sample (dried at 300° C.) was placed in an electric furnace (KDF-S80, DENKEN-HIGHDENTAL Co., Ltd.) and baked at 400 to 900° C. for 4 hours or 12 hours. In this manner, white powder samples 1 to 9 were obtained (step S5).
[0094] The compositions (atomic ratio) of samples 1 to 9 thus prepared were analyzed by ICP-OES (Inductivity Coupled Plasma Optical Emission Spectrometry).
ICP-OES
[0095] ICP-OES apparatus used: 5100 VDV ICP-OES (Agilent Technologies) [0096] ICP ionization unit: Ar plasma
[0097] Using standard solutions for Zr, P and S of samples 1 to 9 (all are manufactured by Wako Pure Chemical Industries Ltd.), calibration curves of concentrations of atoms contained in the solutions were prepared. The concentrations of atoms completely dissolved in mixed acid (0.5% HF+5% HNO.sub.3) were measured.
[0098]
[0099] To describe more specifically, in sample 1 (dried only once at 300° C.), the atomic ratio of S was 1.6. In sample 2 (baking conditions: 400° C., 4 hours), the atomic ratio of S was 1.2. In sample 3 (baking conditions: 450° C., 4 hours), the atomic ratio of S was 1. In sample 4 (baking conditions: 500° C., 4 hours), the atomic ratio of S was 0.90. In sample 5 (baking conditions: 500° C., 12 hours), the atomic ratio of S was 0.76. In sample 6 (baking conditions: 600° C., 4 hours), the atomic ratio of S was 0.54. In sample 7 (baking conditions: 700° C., 4 hours), the atomic ratio of S was 0.48. In sample 8 (baking conditions: 800° C., 4 hours), the atomic ratio of S was 0.44. In sample 9 (baking conditions: 900° C., 4 hours), the atomic ratio of S was 0.43.
[0100]
[0101] When sample 4 and sample 5 were compared, the atomic ratio of S was 0.90 in sample 4 (baking conditions: 500° C., 4 hours) and the atomic ratio of S was 0.76 in sample 5 (baking conditions: 500° C., 12 hours). From the result, it is suggested that as the baking time is increased, the content of S decreases. Accordingly, it was found that the content of S in samples can be controlled by controlling baking time.
[0102] For determining the crystal structures of samples 1 to 9, X ray diffraction measurement was carried out (XRD: X-ray diffraction).
XRD
[0103] Apparatus used: XRD-6100 (Shimadzu Corporation) [0104] Atmosphere: Air [0105] Tube current/tube voltage: 30 mA/40 kV [0106] Target: Cu [0107] Step width: 0.02° [0108] Range of measurement (scanning speed): 10 to 70° (1°/min)
[0109] The XRD measurement results of samples 1 to 9 are shown in
[0110] Using the XRD measurement results, the correlation between the content of S and lattice constant was examined.
[0111] The thermal expansion coefficients of samples 1 to 9 were measured by the following method.
[0112] The following powder X ray diffractometer was equipped with a bench-top heating stage (BTS 500, AntonPaar) and X ray diffraction patterns at an arbitrary temperature were obtained. Note that, a high speed one-dimensional detector (D/teX Ultra2, company: Rigaku) was used as a detector and measurement was carried out in the following conditions. As the internal standard, Si (NIST SRM 640c) was used.
High Temperature XRD
[0113] Apparatus used: Mini Flex 600 (company: Rigaku) [0114] Atmosphere: Air [0115] Tube current/tube voltage: 15 mA/40 kV [0116] Target: Cu [0117] Step width: 0.02° [0118] Range of measurement (scanning speed): 10 to 80° (4°/min) [0119] Measurement temperature: 30 to 500° C. (at intervals of 20° C. in the range of 80 to 220° C. and at intervals of 50° C. in the range of 250° C. or more)
[0120] Using the X ray diffraction patterns thus obtained and analysis software (HighScore Plus, PANalytical), crystal structures were refined in accordance with the Rietveld method and lattice constants were calculated. Plots of lattice constant versus temperature are drawn in a graph. In the temperature range where linear approximation was successfully applied, linear thermal expansion coefficients α.sub.1 for individual crystal axes and volume thermal expansion coefficients α.sub.v of were calculated in accordance with the following expressions.
[0121]
[0122] When sample 6 (x=0.54) and sample 7 (x=0.48) were compared to sample 4 (x=0.90), the tendency that as the baking temperature increases and the content of S decreases, a volume change decreases, was observed. The volume thermal expansion coefficient (100 to 180° C.) in sample 6 (x=0.54) was −101 ppm/° C.; whereas, the coefficient of sample 7 (x=0.48) was −94 ppm/° C. The volume thermal expansion coefficient (the temperature range is the same as above) of sample 5 (x=0.76) baked for a long time was −101 ppm/° C. When this value was compared to that of sample 4 (x=0.90), the volume change was found to be small.
[0123] In the measurement, when sample 9 (x=0.43) was compared to other samples, the degree of volume shrinkage in the range of 100° C. to 180° C. was low. In sample 9 (x=0.43), the linear thermal expansion coefficient (100 to 180° C.) of a axis was +8.3 ppm/° C.; whereas, the linear thermal expansion coefficient (in the same temperature range) of c axis was −44 ppm/° C. From these, the volume thermal expansion coefficient (in the same temperature range) was calculated as −27 ppm/° C. The content of S in sample 9 (x=0.43) was the smallest and cell volume at room temperature was small compared to other samples.
[0124] In the temperature ranges from room temperature to 100° C. and from 180 to 500° C., continuous volume shrinkage was observed. When the thermal expansion coefficient of sample 4 (x=0.90) was calculated, the volume thermal expansion coefficient (30 to 100° C.) was −26 ppm/° C.; the volume thermal expansion coefficient (180 to 350° C.) was −8.1 ppm/° C.; and the volume thermal expansion coefficient (350 to 500° C.) was −13 ppm/° C.
[0125] From the above results, it was demonstrated that the material represented by α-Zr.sub.2SP.sub.2O.sub.12 has a negative thermal expansion coefficient in the range from room temperature to 500° C., and an extremely large negative thermal expansion coefficient particularly in the range of 100 to 180° C.; and that the negative thermal expansion coefficient decreases as the content of S decreases. Since α-Zr.sub.2SP.sub.2O.sub.12 causes a phase transition from 100° C. to 180° C., it is considered that such an extremely large negative thermal expansion coefficient is exhibited.
[0126] Sample 4 was observed by an electron microscope (FE-SEM). The results are shown in
FE-SEM
[0127] Apparatus used: JSM-7500F (JEOL) [0128] Acceleration voltage: 7 to 10 kV
Study on Hydrothermal Treatment Conditions
[0129] Optimal conditions for a hydrothermal treatment were examined. More specifically, samples 10 to 25 shown below were prepared and evaluated by using ICP-OES, XRD and FE-SEM. In this manner, optimal conditions for a hydrothermal treatment were examined.
[0130] A method for producing samples 10 to 25 are the same as the method for producing samples 1 to 9 except conditions for a hydrothermal treatment. The apparatus used in evaluation for samples are the same as those used for evaluation of samples 1 to 9. In the following tables, hydrothermal treatment conditions, baking conditions and constituent atomic ratios of samples 10 to 25 are shown. Note that, “300° C. (dry)” means that a sample was dried at 300° C. (
TABLE-US-00001 TABLE 1 Hydrothermal treatment Atomic ratio Temp Time Baking condition by ICO-OES (° C.) (days) Temp (° C.) Time (h) Zr P S Sample 10 110 2 300 (dry) 12 2 1.9 1.7 Sample 11 110 2 500 4 2 1.9 1.1 Sample 12 110 2 700 4 2 2 0.8 Sample 13 110 2 900 4 2 1.9 0.7
TABLE-US-00002 TABLE 2 Hydrothermal treatment Atomic ratio Temp Time Baking condition by ICO-OES (° C.) (days) Temp (° C.) Time (h) Zr P S Sample 14 130 2 300 (dry) 12 2 1.9 2 Sample 15 130 2 500 12 2 1.9 0.8 Sample 16 130 2 700 4 2 2 0.4 Sample 17 130 2 900 4 2 1.9 0.4
TABLE-US-00003 TABLE 3 Hydrothermal treatment Atomic ratio Temp Time Baking condition by ICO-OES (° C.) (days) Temp (° C.) Time (h) Zr P S Sample 18 180 2 300 (dry) 12 2 2 2 Sample 19 180 2 500 4 2 2 0.9 Sample 20 180 2 700 4 2 2 0.5 Sample 21 180 2 900 4 2 2 0.4
TABLE-US-00004 TABLE 4 Hydrothermal treatment Atomic ratio Temp Time Baking condition by ICO-OES (° C.) (days) Temp (° C.) Time (h) Zr P S Sample 22 230 4 300 (dry) 12 2 1.7 1.8 Sample 23 230 4 500 4 2 1.8 0.8 Sample 24 230 4 700 4 2 1.8 0.5 Sample 25 230 4 900 4 2 1.9 0.4
[0131]
[0132]
[0133]
[0134] In the case where the hydrothermal treatment temperature was 180° C., samples were prepared by applying a hydrothermal treatment for 0.5 days and 7 days. As a result, in the case where the hydrothermal treatment temperature was 180° C., in all samples prepared by applying a hydrothermal treatment for 0.5 days to 7 days, single-phase α-Zr.sub.2SP.sub.2O.sub.12 was produced by baking at 500° C. for 4 hours after the hydrothermal treatment. Thus, at a hydrothermal treatment temperature of 180° C., a hydrothermal treatment was carried out for at least 0.5 days and then baking was carried out. In this manner, single-phase α-Zr.sub.2SP.sub.2O.sub.12 can be produced.
[0135]
[0136]
[0137]
[0138] In consideration of the above results, the hydrothermal treatment temperature is preferably 130° C. or more in order to control the composition of Zr.sub.2SP.sub.2O.sub.12. As shown in the XRD measurement results of
(2) Zr.sub.2-aTi.sub.aS.sub.xP.sub.2O.sub.12+δ
[0139] A material (Zr.sub.2-aTi.sub.aS.sub.xP.sub.2O.sub.12+δ) obtained by substituting part of Zr site with Ti, will be described herein.
[0140] A negative thermal expansion material represented by Zr.sub.2-aTi.sub.aS.sub.xP.sub.2O.sub.12+δ was produced in accordance with the flowchart shown in
[0141] After completion of stirring, the resultant aqueous solution (mixture) was poured in a container (HUT-100, SAN-AI Kagaku Co. Ltd.) made of Teflon (registered trademark) and the container was set in an outer cylinder made of pressure-resistant stainless steel (HUS-100, SAN-AI Kagaku Co. Ltd.). The cylinder was placed in a hot air circulation oven (KLO-45M, Koyo Thermo Systems Co., Ltd.) and heated. In this manner, a hydrothermal treatment was carried out (step S2). The hydrothermal treatment was carried out at a temperature of 180° C. for 12 hours
[0142] After the hydrothermal treatment, the Teflon container taken out had a white precipitate yield therein. A solution containing the precipitate was poured in an evaporating dish and heated by a heater of about 100° C. for 5 hours to vaporize extra moisture (step S3: first drying process). At this time, since the sample was not completely dried because of the content of excessive H.sub.2SO.sub.4 and moisture remained. Thus, the evaporating dish containing the sample was placed in an electric furnace (KDF-S80, DENKEN-HIGHDENTAL Co., Ltd.) of 300° C. and dried for further 12 hours (step S4: second drying process). Thereafter, the sample dried at 300° C. was placed in an electric furnace (KDF-S80, DENKEN-HIGHDENTAL Co., Ltd.) and baked at 500° C. for 4 hours. In this manner, a white powder sample was obtained (step S5).
[0143] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0144] In the XRD measurement results shown in
[0145] The atomic ratios of the samples obtained by substituting part of Zr site with Ti (a=0.1 to 0.7) were determined by an ICP-OES apparatus.
[0146] As shown in
[0147] The cell volume (thermal expansion coefficient) of the sample obtained by substituting part of Zr site with Ti was obtained by a high-temperature XRD apparatus.
[0148] As shown in
[0149] It was found that the samples where a=0.1 to 0.4 exhibit three-step thermal expansion behavior, similarly to Zr.sub.2SP.sub.2O.sub.12 (a=0). Accordingly, it is considered that every time the slope of cell volume changes, a negative thermal expansion coefficient due to framework-phase transition-framework is shown. As shown in
[0150] In contrast, in the samples where a=0.5 to 0.7, the volume shrinkage of a portion causing a phase transition significantly decreased. Compared to the samples where a=0.1 to 0.4, cell volumes in the beginning of the measurement (low temperature side) significantly decreased. In the sample where a=0.7, as long as a change in cell volume is concerned, volume shrinkage due to phase transition was not substantially confirmed. Because of this, it is deemed that the conditions of the samples where a=0.1 to 0.4 may significantly differ from those of the samples where a=0.5 to 0.7.
[0151] The lattice constant at room temperature varies depending on the content of Ti. However, in all samples at 773K, it was confirmed that as the content of Ti increases, the cell volume decreases at regular intervals. The relationship between the content of Ti and cell volume is shown in
[0152] With respect to samples of Zr.sub.2-aTi.sub.aSP.sub.2O.sub.12+δ (a=0.1 to 0.7), temperature dependency of lattice constant of a axis are c axis were examined. As a result, in all samples, variation in lattice constant of c axis was larger than that of a axis. The results were the same as in the above results of α-Zr.sub.2SP.sub.2O.sub.12 (see,
[0153]
(3) Zr.sub.2-aCe.sub.aS.sub.xP.sub.2O.sub.12+δ
[0154] A material (Zr.sub.2-aCe.sub.aS.sub.xP.sub.2O.sub.12+δ) obtained by substituting part of Zr site with Ce, will be described herein.
[0155] A negative thermal expansion material represented by Zr.sub.2-aCe.sub.aS.sub.xP.sub.2O.sub.12+δ was produced also in accordance with the flowchart shown in
[0156] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0157] In the XRD measurement results shown in
[0158] The cell volumes (thermal expansion coefficient) of the samples obtained by substituting part of Zr site with Ce were obtained by a high-temperature XRD apparatus.
[0159] As shown in
(4) Zr.sub.2-aMn.sub.aS.sub.xP.sub.2O.sub.12+δ
[0160] A material (Zr.sub.2-aMn.sub.aS.sub.xP.sub.2O.sub.12+δ) obtained by substituting part of Zr site with Mn, will be described herein.
[0161] A negative thermal expansion material represented by Zr.sub.2-aMn.sub.aS.sub.xP.sub.2O.sub.12+δ was produced also in accordance with the flowchart shown in
[0162] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0163] In the XRD measurement results shown in
[0164] The cell volume (thermal expansion coefficient) of the sample obtained by substituting part of Zr site with Mn was obtained by a high-temperature XRD apparatus.
[0165] As shown in
(5) Zr.sub.2-aSn.sub.aS.sub.xP.sub.2O.sub.12+δ
[0166] A material (Zr.sub.2-aSn.sub.aS.sub.xP.sub.2O.sub.12+δ) obtained by substituting part of Zr site with Sn, will be described herein.
[0167] A negative thermal expansion material represented by Zr.sub.2-aSn.sub.aS.sub.xP.sub.2O.sub.12+δ was produced also in accordance with the flowchart shown in
[0168] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0169] In the XRD measurement results shown in
[0170] The cell volume (thermal expansion coefficient) of the sample obtained by substituting part of Zr site with Sn was obtained by a high-temperature XRD apparatus.
[0171] As shown in
[0172]
(6) Zr.sub.2S.sub.1-bMo.sub.bP.sub.2O.sub.12+δ
[0173] A material (Zr.sub.2S.sub.1-bMo.sub.bP.sub.2O.sub.12+δ) obtained by substituting part of S site with Mo, will be described herein. A negative thermal expansion material represented by Zr.sub.2S.sub.1-bMo.sub.bP.sub.2O.sub.12+δ was produced by two processes, i.e., process A shown in the flowchart of
Process A
[0174] First, process A will be described. As shown in
Process B
[0175] Process B will be described. Note that, in the flowchart shown in
[0176] As shown in
[0177] Thereafter, (NH.sub.4).sub.6Mo.sub.7O.sub.24.4H.sub.2O aq. (Wako special grade, Wako Pure Chemical Industries Ltd.) was impregnated with the Zr.sub.2SP.sub.2O.sub.12+δ powder prepared in step S5 (step S6). Then, the solution containing Zr.sub.2SP.sub.2O.sub.12+δ powder and (NH.sub.4).sub.6Mo.sub.7O.sub.24.4H.sub.2O aq. was filtered (step S7). Thereafter, the filtrate (powder) was baked at 500° C. for 4 hours to prepare a sample (step S8).
[0178] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0179]
[0180] In XRD measurement results shown in
[0181] In contrast, in the sample (b=0.2-800) where the content of Mo: b=0.2 and baking temperature of step S5: 800° C. and the sample (b=0.6-800) where the content of Mo: b=0.6 and baking temperature of step S5: 800° C., a ZrO.sub.2 peak was confirmed other than peaks of α-ZSP crystal phase. Accordingly, if the baking temperature of step S5 is high (800° C.), it was confirmed that ZrO.sub.2 emerges.
[0182]
[0183] In XRD measurement results shown in the upper graph of
[0184] The cell volume (thermal expansion coefficient) of a sample obtained by substituting part of S site with Mo was obtained by use of a high temperature XRD apparatus.
[0185]
[0186] As shown in
(7) Zr.sub.2S.sub.1-bW.sub.bP.sub.2O.sub.12+δ
[0187] A material (Zr.sub.2S.sub.1-bW.sub.bP.sub.2O.sub.12+δ), obtained by substituting part of S site by W, will be described herein. A negative thermal expansion material represented by Zr.sub.2S.sub.1-bW.sub.bP.sub.2O.sub.12+δ was produced by two processes, i.e., process A shown in the flowchart of
Process A
[0188] First, process A will be described. As shown in
Process B
[0189] Process B will be described. Note that, in the flowchart shown in
[0190] As shown in
[0191] Thereafter, (NH.sub.4).sub.10W.sub.12O.sub.41.5H.sub.2O aq. (Wako special grade, Wako Pure Chemical Industries Ltd.) was impregnated with the Zr.sub.2SP.sub.2O.sub.12+δ powder prepared in step S5 (step S6). Then, the solution containing Zr.sub.2SP.sub.2O.sub.12+δ powder and (NH.sub.4).sub.10W.sub.12O.sub.41.5H.sub.2O was filtered (step S7). Thereafter, the filtrate (powder was baked at 500° C. for 4 hours to prepare a sample (step S8)
[0192] For determining the crystal structures of the samples thus prepared, X ray diffraction measurement was carried out.
[0193]
[0194] In XRD measurement results shown in
[0195] In contrast, in the sample (b=0.2-800) where the content of W: b=0.2 and baking temperature of step S5: 800° C., the sample (b=0.6-800) where the content of W: b=0.6 and baking temperature of step S5: 500° C. and the sample (b=0.6-800) where the content of W: b=0.6 and baking temperature of step S5: 800° C., peaks of impurity phases (indicated by arrows) were confirmed other than peaks of α-ZSP crystal phase.
[0196]
[0197] In XRD measurement results shown in the upper graph of
[0198] The cell volume (thermal expansion coefficient) of a sample obtained by substituting part of S site with W was obtained by use of a high temperature XRD apparatus.
[0199]
[0200] As shown in
[0201] In the above, Examples of Zr.sub.2-aM.sub.aS.sub.xP.sub.2O.sub.12+δ obtained by substituting part of Zr site and Examples obtained by substituting part of S site were separately described. However, in the present invention, both part of Zr site and S site may be substituted.
[0202] In the foregoing, the present invention has been described along with the embodiments. The present invention is not limited to the constitutions of the above embodiments and, needless to say, the present invention includes various modification, corrections and combinations which can be carried out by those skilled in the art within the range of claims of the present application.