Scrubbing fluid and methods for using same
11229875 · 2022-01-25
Assignee
Inventors
- Eric Matthew Teletzke (Iowa Colony, TX, US)
- Flavia Mariana Dos Santos Bates (Denver, CO, US)
- Brett Christopher Roberts (Little Elm, TX, US)
- Erik John Stewart (Pearland, TX, US)
- Kathleen Yvonne Turk (Livermore, CA, US)
Cpc classification
B01D53/1493
PERFORMING OPERATIONS; TRANSPORTING
B01D53/485
PERFORMING OPERATIONS; TRANSPORTING
B01D53/507
PERFORMING OPERATIONS; TRANSPORTING
B01D2252/504
PERFORMING OPERATIONS; TRANSPORTING
B01D2252/20489
PERFORMING OPERATIONS; TRANSPORTING
B01D53/526
PERFORMING OPERATIONS; TRANSPORTING
B01D2252/602
PERFORMING OPERATIONS; TRANSPORTING
Y02C20/40
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B01D2257/306
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A scrubbing solution for removing contaminants, including particularly hydrogen sulfide, from a fluid. The scrubbing solution includes at least one scrubbing reagent which has a primary or secondary amine and an acid, which may be phosphoric acid. The fluid being scrubbed is passed through the scrubbing solution. The contaminants react with the scrubbing reagent securing them in the scrubbing solution. The fluid being scrubbed and the scrubbing solution are then separated. The scrubbing solution is heated and, if the scrubbing solution is under pressure, the pressure is reduced. The acid facilitates thorough removal of the contaminants, and especially the hydrogen sulfide, from the scrubbing solution. The scrubbing solution is then ready for reuse. Because the scrubbing solution is rendered substantially free of hydrogen sulfides, it can absorb other sulfide contaminants that might not otherwise be absorbed.
Claims
1. A scrubbing solution comprising at least one scrubbing reagent, an acid, and water, wherein said scrubbing reagent has at least one primary or secondary amine and wherein the acid is selected from the group consisting of phosphoric acids, sulfuric acids, and combinations thereof, wherein the solution has a ratio of moles of acid to moles of amine, wherein the ratio of moles of acid to moles of amine is between about 0.018 and about 0.036, wherein the scrubbing reagent is selected from the group consisting of methyl diethanolamine and piperazine and combinations thereof, wherein the methyl diethanolamine comprises between about 20 and about 60 percent by weight of the scrubbing solution, and wherein the piperazine comprises between about 0.1 and about 10 percent by weight of the scrubbing solution.
2. A scrubbing solution according to claim 1 wherein the acid is polyprotic.
3. A scrubbing solution according to claim 1, wherein the acid consists essentially of phosphoric acids.
4. A scrubbing solution according to claim 1 wherein the scrubbing reagent comprises a sterically hindered amine.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DISCLOSURE OF THE BEST MODE
(8) A scrubbing fluid is disclosed. In one embodiment, the scrubbing fluid is an aqueous solution. One or more reagents are added to the aqueous solution. The reagents are selected to react with the contaminants in the target fluid. In one embodiment, the reagents are amines. In one embodiment, one of the reagents is methyl diethanolamine (“MDEA”). In another embodiment, one of the reagents is a primary or secondary amine. In another embodiment, one of the reagents is piperazine. In another embodiment, MDEA and piperazine are used together.
(9) Other suitable scrubbing reagents include dimethylethanolamine, triethanolamine, monoethanolamine, monomethylethanolamine, diethanolamine, methylpiperazine, morpholine, 2-amino-1-butanol, 2-amino-propanol, 2-amino-3-methyl-1-butanol, 2-amino-1-pentanol, 2-amino-1-hexanol, 2-amino-1-octanol, aminoethoxyethanol, 2-amino-2-methyl-1-propanol, 1-(2-hydroxyethyl)piperazine, diisopropanolamine, and sterically hindered amines such as 2-(N-methylamino)-2-methylpropan-1-ol, 2-(N-sec-butylamino)-2-methylpropan-1-ol (SBAE), and (2-(N-t-butylamino)-2-methylpropan-1-ol, and Flexsorb SE™, a sterically hindered alkanolamine (C.sub.8H.sub.19NO.sub.2) available from the Monument Chemical Company of Pasadena, Tex. The scrubbing solution may be comprised of one or more of any of the foregoing scrubbing agents or similar amine containing scrubbing agents used alone or in combination with other, non-amine scrubbing agents.
(10) In one embodiment, MDEA comprises between about 20 and about 60 percent by weight of the scrubbing fluid and piperazine comprises between about 0.1 and about 10 percent by weight of the scrubbing fluid (unless otherwise indicated, when used herein the term “about” means plus or minus 10 percent). In one embodiment, MDEA comprises about 42.0 percent by weight of the scrubbing fluid and the piperazine comprises about 8.0 percent by weight of the scrubbing fluid, with the balance being water and acid as discussed below. In another embodiment MDEA comprises about 35.0 percent by weight of the scrubbing fluid and the piperazine comprises about 5.0 percent by weight of the scrubbing fluid, with the balance being water and acid.
(11) In many of the embodiments discussed, the only ingredients in the scrubbing solution were water, acid, and scrubbing reagents. However, if the fluid being treated has foaming issues, an anti-foam agent may be added. Polyglycol and silicone based anti-foam agents will be suitable in most instances. Other potential additives include physical solvents, corrosion inhibitors, and oxygen scavengers.
(12) Some of the common target contaminants are sulfide containing compounds such as hydrogen sulfide, mercaptans, and carbonyl sulfide (COS). Another common contaminant is carbon dioxide. Several other target contaminants are listed in the figures as discussed in the examples.
(13) Hydrogen sulfide and carbon dioxide are the most common target contaminants. However, their presence can make the removal of other target contaminants very difficult. For example, the pKa of H.sub.2S is much, much lower than the pKa of most mercaptans at ambient temperatures. As long as there is any H.sub.2S in the fluid being scrubbed, the amine scrubbing reagents will react with the H.sub.2S over the mercaptans. Essentially all of the H.sub.2S has to be removed before the amine scrubbing reagents will capture mercaptan contaminants.
(14) Piperazine and MDEA each contain amine functional groups. MDEA is a tertiary amine. Piperazine includes two secondary amines. The amines in these reagents are believed to react well with most, if not all of the above listed contaminants. In any event, MDEA and piperazines are good scrubbing reagents for the targeted contaminants, and they work particularly well in tandem.
(15) In one embodiment of the invention, pressure varies significantly between the absorption and desorption sides of the scrubbing process. On the absorption side of the process, the pressure may be elevated while the temperature ranges from ambient to as high as 180 to 190 degrees F. These conditions facilitate absorption of the contaminants by the scrubbing solution. Specifically, the elevated pressure—typically, at least about 50 to about 150 psig and often about 1000 psig or higher-forces the contaminants into solution in the scrubbing solution. The solubility of most gases is inversely related to temperature, so more gas may be dissolved in the scrubbing solution at lower temperatures. Once in solution, the contaminants may react with and become bound to the reagents.
(16) On the desorption side, the pressure will be much lower—typically 10-12 psig while the scrubbing solution will be heated above about 190 degrees F. and to as high as about 325 degrees F. and, in one embodiment, to about 260 degrees F. This tends to cause the scrubbing solution to release the contaminants absorbed on the absorption side of the process. Many of the contaminants simply dissolved in the scrubbing solution will degas because of the drop in pressure. Likewise, heating the scrubbing solution will have a similar effect on gasses dissolved in the scrubbing solution as the solubility of most relevant gasses goes down as temperature goes up.
(17) Removing dissolved gasses from the scrubbing solution will effect the equilibrium of gasses bound to the scrubbing reagents. The quantity of contaminants that will react with the scrubbing reagents depends, in part, on the amount of contaminants dissolved in the solution. More contaminants dissolved in the solution means more contaminants will react with the reagents. As the quantity of contaminants dissolved in the scrubbing solution falls, the equilibrium shifts and fewer contaminants will remain bound to the reagents.
(18) The invention involves the addition of an acid to the scrubbing fluid. In one embodiment the acid is phosphoric acid. In another embodiment, the acid is sulphuric acid. The amount of acid used will depend upon the amount of scrubbing reagent present. Where the scrubbing reagents are amines or include amine functional groups, between about 0.004 moles to about 0.80 moles acid will be provided per mole of amine containing reagent. Where the scrubbing reagents are MDEA and piperazine and the acid, the preferred range of phosphoric acid is between 0.004 to about 0.16 moles acid per mole of amine. Where the scrubbing reagents are MDEA and piperazine, the preferred range of sulfuric acid is between about 0.004 to about 0.49 moles acid per mole amine. In one embodiment where the scrubbing reagents are MDEA and piperazine and the acid is phosphoric acid, between about 0.018 moles to about 0.036 moles of acid are provided per mole of amine containing reagent.
(19) The addition of phosphoric acid to solutions containing tertiary amines, such as MDEA, in order to reduce H.sub.2S levels in the scrubbing solution is known. However, it is contraindicated in scrubbing solutions that contain CO.sub.2 and more than trivial amounts of primary or secondary amines. Secondary amines, such as piperazines, react with CO.sub.2 to form carbamates and protonated amines. The prior art teaches that the presence of CO.sub.2 in the fluid being scrubbed and a primary or secondary amine in the scrubbing solution nullifies the ability of acid to remove H.sub.2S from the scrubbing solution.
(20) The present invention achieves substantial elimination of H.sub.2S from the scrubbing solution via the addition of an acid, despite the presence of high CO.sub.2 levels and the use of a secondary amine to react with the CO.sub.2. The invention achieves the elimination of H.sub.2S and CO.sub.2 from the scrubbing solution. The inventors believe that the very low H.sub.2S levels in the scrubbing solution upon its return to the absorption side of the process, allows the scrubbing solution to capture substantially all of the H.sub.2S from the fluid being scrubbed. This is believed to allow the scrubbing reagents to capture other sulfide containing contaminants, including especially mercaptans, as illustrated in the examples.
(21) During absorption—when the scrubbing fluid is interacting with the fluid to be scrubbed—the temperature will typically be below about 190 degrees Fahrenheit, and commonly between about 70 degrees and 185 degrees F. During absorption, the fluids typically move in opposite directions in a column, See, e.g., U.S. Pat. No. 10,646,818 which is hereby incorporated by reference in its entirety. The scrubbing solution typically enters at the top of the absorption column and moves down while the fluid being scrubbed enters at the bottom and moves up. The absorption process is exothermic, so the scrubbing fluid heats up as it absorbs contaminants. That means that the scrubbing solution is usually coolest when it enters the absorption column and hottest near the bottom of the column. Additionally, the contaminants in the fluid are progressively removed as the fluid moves up the column. The net result of this process is that the fluid being scrubbed will be cleanest at the top of the column where it will also encounter the cleanest and coolest scrubbing solution. Where the fluid being scrubbed is a gas, the partial pressure of the contaminants in the gas will be lowest at the top of the column.
(22) At the top of the absorption side of the process, the temperature will commonly be about 120 to 130 degrees Fahrenheit, and warms as it proceeds through the absorption side of the process. During desorption—when the contaminants are being removed—the temperature is raised to above about 190 degrees Fahrenheit. When MDEA, piperazines, and other amines are used as the scrubbing reagents, temperature increases above about 325 degrees F. are undesirable because they can result in thermal degradation of the amines. The hottest place on the desorption side of the process will be where the scrubbing solution exits the desorption side. This will usually be the boiling point of the amine scrubbing reagents at the pressure being applied to the desorption side. The pressure will vary depending on the scrubbing reagents and the contaminants, but temperatures of about 250 to 260 degrees Fahrenheit are typical.
(23) While the pressure drop and temperature increase discussed above will remove many of the contaminants from the scrubbing fluid, the acid facilitates polishing, allowing for the removal the residual contaminants from the amines. Once released by the amines, the contaminants may be removed from the scrubbing solution. Upon return of the scrubbing solution to the absorption phase of the process, the temperature is lowered.
(24) While the process has been described in the context of a significant pressure variation, it will be appreciated that the effect of the acid is not dependant on the pressure change. Many scrubbing processes involve treatment of low pressure fluid streams in which there is no high pressure to release. Contaminants in such low pressure fluid may be treated with a scrubbing solution in which amine containing scrubbing reagents react with and capture the contaminants. Heating the solution will have the same effect on dissolved gasses in the solution discussed above, and the acid will have the same polishing effect. Once the contaminants have been removed, the temperature may be lowered and the scrubbing solution is ready for reuse.
EXAMPLES
Example 1
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(26) The results for H.sub.2S and CO.sub.2 scrubbing were outstanding. The acidified scrubbing solution removed an order of magnitude more H.sub.2S: 0.07 ppm H.sub.2S remaining in the gas scrubbed with the acid vs. 0.321 H.sub.2S remaining in the gas scrubbed without the acid. This is believed to be attributable to the removal of more of the H.sub.2S contaminants from the scrubbing fluid during desorption, the cleaner scrubbing fluid ultimately being able to remove more contaminants on reuse.
Example 2
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(28) The CO.sub.2 results reveal an order of magnitude improvement in the acid treated scrubbing fluid compared to the non-acid treated scrubbing fluid. The H.sub.2S results were even better. Two full orders of magnitude improvement were observed. These results indicate that after desorption, the scrubbing fluid treated with the acid contains substantially fewer contaminants compared to scrubbing fluid containing no acid.
Example 3
(29) In example 3, one embodiment of the scrubbing fluid comprising 39.1% by weight MDEA, 7.7% by weight piperazine, 0.47% by weight H.sub.3PO.sub.4, and the balance water was used to treat a 33 MMSCFD gas stream. The gas stream entered the absorption side of the treatment at about 935 psig and about 78 degrees F. The scrubbing fluid was added to the absorption side at a rate of about 400-450 gallons per minute. On the desorption side, pressure was dropped to about 10.5 psig and the temperature was raised to about 230 degrees F. at the “top” of the desorption process. At the “bottom” the inventors believe the temperature was closer to 250-255 degrees F. The contaminants in the gas stream were measured before and after scrubbing. The results are provided in
Example 4
(30) In example 4, the same embodiment of the scrubbing solution described in example 3 was used to treat a similar gas stream at the same location as in example 3. However, in example 4, there were two inlets to the absorption side of the process which could be independently sampled. Otherwise, the treatment conditions were the generally the same as recited example 3. The contaminants in the gas stream were measured before and after scrubbing. The results are provide in
Example 5
(31) In example 5, relatively similar gas streams were treated with different scrubbing fluids. As shown in
(32) These and other modifications for the formulation of a scrubbing fluid and for the methods of using the same will be apparent to those of skill in the art from the foregoing disclosure and figures and are intended to be encompassed by the scope and spirit of the following claims.