PACKAGING UNIT FOR A SUBSTRATE

Abstract

The present invention relates to a packaging unit for a substrate, a package stack with such packaging units and a process for packaging a substrate. The packaging unit for a substrate comprises a first shell, a substrate and a second shell. The substrate is inserted into the first shell, and the second shell is mounted on the first shell so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell. A metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit. The second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point.

Claims

1. A packaging unit for a substrate, comprising: a first shell, a substrate, and a second shell, wherein the substrate is placed in the first shell, and the second shell is mounted on the first shell so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell, wherein a metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit, and wherein the second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point.

2. Packaging The packaging unit according to claim 1, wherein the substrate is a metal-ceramic substrate.

3. The packaging unit according to claim 2, wherein the metal-ceramic substrate comprises a ceramic layer and at least one metallisation layer and the metal deposit is applied to the metallisation layer.

4. The packaging unit according to claim 1, wherein the metal deposit can be a solderable or sinterable metal or a solderable or sinterable alloy.

5. The packaging unit according to claim 1, wherein the first shell and/or the second shell has/have at least one spacer for support on the respective other shell and/or on the substrate.

6. The packaging unit according to claim 1, wherein the first shell comprises a base and a circumferential wall, and wherein the circumferential wall extends from the base up to a wall height that is between the height of the substrate and double the height of the substrate.

7. The packaging unit according to claim 6, wherein the circumferential wall has a smaller outer dimension in the direction of the base than at its free end.

8. The packaging unit according to claim 1, wherein the first shell and the second shell are identical in construction.

9. The packaging unit according to claim 1, wherein the adhesive point is designed for fastening an electronic component on the substrate.

10. The packaging unit according to claim 1, wherein the substrate comprises a plurality of individual substrates arranged next to each other.

11. The packaging unit according to claim 1, wherein the first shell and the second shell are made of plastic or cardboard.

12. The packaging unit according to claim 1, also comprising a further substrate which is inserted into the second shell.

13. A package stack comprising a plurality of packaging units according to claim 1 stacked on top of each other.

14. The package stack according to claim 13, further comprising a stabilising element which forms the conclusion of the package stack.

15. A process for packaging a substrate comprising the following steps: providing a first shell, inserting a substrate into the first shell, and mounting a second shell on the first shell, so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell, wherein a metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit, and wherein the second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0040] FIG. 1 shows a packaging unit according to one form of embodiment.

[0041] FIG. 2 shows a packaging unit according to one form of embodiment.

[0042] FIG. 3 shows a metal-ceramic substrate according to one form of embodiment.

[0043] FIG. 4 shows a package stack according to one form of embodiment.

DETAILED DESCRIPTION OF THE EXAMPLES OF EMBODIMENT

[0044] FIG. 1 and FIG. 2 show a packaging unit 10 for a metal-ceramic substrate 1. The packaging unit 10 comprises a first shell 4, a second shell 4′ (in FIG. 4) and a substrate 1. The substrate 1 can be produced by a direct copper bonding (DCB) process or direct aluminium bonding (DAB) process and can comprise a plurality of individual substrates arranged next to each other. The substrate 1 is inserted into the first shell 4, and the second shell 4′ (in FIG. 4) is mounted on the first shell 4 so that an underside of the substrate 1 is surrounded by the first shell 4 and an opposite, upper side of the substrate 1 is covered by the second shell 4′.

[0045] The substrate 1 comprises a ceramic layer 11 and at least one metallising layer 12. The substrate 1 preferably comprises a total of two metallising layers, namely the metallising layer 12 and a further metallising layer, which is not shown, on the other side of the ceramic layer 11. As also shown in FIG. 3, a metal deposit 2 is applied to the upper side of the metallising layer 12 of the substrate 1 and an adhesive point 3 is arranged on the metal deposit 2. The metal deposit 2 comprises a solderable or sinterable metal or a solderable or sinterable alloy. At room temperature and/or in air, the adhesive point 3 is sticky and smearable. An electronic component, for example a chip, lamp, resistor, capacitor etc. can be applied to the adhesive point.

[0046] The first shell and the second shell 4, 4′ can be designed identically and be made of plastic or cardboard. The first and the second shell 4, 4′ comprise a base 7 and a circumferential wall 6. The circumferential wall 6 extends from the base 7 to a wall height at which only a substrate 1 plus a safety margin are surrounded. The circumferential wall 6 has a smaller outer dimension in the direction of the base 7 than at its free end. The first shell 4 and/or the second shell 4′ has/have at least one spacer 5 for support on the respective other shell and/or on the substrate 1. Furthermore, the first and the second shell 4, 4′ can comprise a fastening element (not shown) for the lateral fastening of the substrate 1 relative to the first shell 4 and/or to the second shell 4′. The fastening element can, for example, be an extended spacer or arranged separately on the ceramic layer 11 or metallising layer 12. When the second shell 4′ is placed on the first shell 4, the second shell 4′ should be supported on the first shell 4 in such a way that the second shell 4′ only contacts the substrate 1 outside the adhesive point 3.

[0047] As shown in FIG. 4, the packaging unit 10 can also comprise a further substrate 1′ which is placed on the second shell 4′. In this way a package stack can be produced which comprises a plurality of packaging units 10 stacked on top of each other and can store and/or transport them in a space-saving manner without contacting the adhesive points of the substrate. The package stack can also comprise a stabilising element (not shown) which forms the conclusion of the package stack.

[0048] It is additionally pointed out that “comprising” and “having” do not rule out other elements or steps, and “a” or “an” do not rule out a plurality. It is also pointed out that features or steps which have been described with reference to the above examples of embodiment can also be used in combination with other features or steps of other examples of embodiment described above. Reference numbers in the claims should not be considered as restrictions.