MASK, USAGE METHOD THEREOF, AND MANUFACTURING METHOD OF ENCAPSULATION LAYER

Abstract

The invention relates to a mask, a usage method thereof, and a manufacturing method of an encapsulation layer. A sum of gravity on a first area and external stress is less than gravity on a second area of the mask, and the sum of the gravity on the first area and external stress is greater than gravity on a third area. The first area of the mask has a lesser deformation amount, or almost no deformation, thereby a bonding area between the first area of the mask and a glass substrate is increased and a width of a deformation area at an edge of the mask is reduced.

Claims

1. A mask, comprising: a first area; a second area surrounding the first area; and a third area surrounding the second area; wherein, a thickness of the second area is greater than a thickness of the first area, and the thickness of the first area is greater than a thickness of the third area.

2. The mask according to claim 1, wherein a ratio of the thickness of the first area to the thickness of the second area is between 0.5 and 0.7.

3. The mask according to claim 1, wherein a ratio of the thickness of the third area to the thickness of the second area is between 0.3 and 0.4.

4. The mask according to claim 1, wherein the second area is ring-shaped.

5. A usage method of a mask, comprising steps of: providing the mask of claim 1 on a substrate; depositing an inorganic layer on the substrate and the mask; and removing the mask; wherein the mask comprises: the first area; the second area surrounding the first area; and the third area surrounding the second area; wherein the thickness of the second area is greater than the thickness of the first area, and the thickness of the first area is greater than the thickness of the third area.

6. The method of using the mask according to claim 5, wherein a ratio of the thickness of the first area to the thickness of the second area is between 0.5 and 0.7.

7. The method of using the mask according to claim 5, wherein a ratio of the thickness of the third area to the thickness of the second area is between 0.3 and 0.4.

8. The method of using the mask according to claim 5, wherein the second area is ring-shaped.

9. The method of using the mask according to claim 5, wherein the substrate comprises a glass base or an organic layer.

10. A method of manufacturing an encapsulation layer, comprising forming a first inorganic layer on an upper surface of a glass substrate, wherein the method specifically comprises steps of: providing the mask of claim 1 on a substrate; and depositing an inorganic layer on the substrate and the mask; and removing the mask; wherein the mask comprises: the first area; the second area surrounding the first area; and the third area surrounding the second area; wherein the thickness of the second area is greater than the thickness of the first area, and the thickness of the first area is greater than the thickness of the third area.

11. The method of manufacturing the encapsulation layer according to claim 10, wherein a ratio of the thickness of the first area to the thickness of the second area is between 0.5 and 0.7.

12. The method of manufacturing the encapsulation layer according to claim 10, wherein a ratio of the thickness of the third area to the thickness of the second area is between 0.3 and 0.4.

13. The method of manufacturing the encapsulation layer according to claim 10, wherein the second area is ring-shaped.

14. The method of manufacturing the encapsulation layer according to claim 10, further comprising: forming an organic layer on an upper surface of the first inorganic layer.

15. The method of manufacturing the encapsulation layer according to claim 14, further comprising: forming a second inorganic layer on an upper surface of the organic layer.

16. The method of manufacturing the encapsulation layer according to claim 15, wherein steps of forming the second inorganic layer specifically comprises: providing the mask of claim 1 on the organic layer; depositing the second inorganic layer on the organic layer and the mask; and removing the mask; wherein the mask comprises: the first area; the second area surrounding the first area; and the third area surrounding the second area; wherein the thickness of the second area is greater than the thickness of the first area, and the thickness of the first area is greater than the thickness of the third area.

17. The method of manufacturing the encapsulation layer according to claim 16, wherein a ratio of the thickness of the first area to the thickness of the second area is between 0.5 and 0.7.

18. The method of manufacturing the encapsulation layer according to claim 16, wherein a ratio of the thickness of the third area to the thickness of the second area is between 0.3 and 0.4.

19. The method of manufacturing the encapsulation layer according to claim 16, wherein the second area is ring-shaped.

Description

DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following figures described in the embodiments will be briefly introduced. It is obvious that the drawings described below are merely some embodiments of the present invention, other drawings can also be obtained by the person ordinary skilled in the field based on these drawings without doing any creative activity.

[0021] FIG. 1 is a schematic diagram of bonding of a mask and a glass substrate under action of gravity in the prior art.

[0022] FIG. 2 is a schematic plan view of a mask of the present invention.

[0023] FIG. 3 is an enlarged view of a first area of the mask of the present invention.

[0024] FIG. 4 is a schematic view of the mask of the present invention attached to a glass substrate under action of gravity.

[0025] FIG. 5 is a flowchart of a method for manufacturing an encapsulation layer of the present invention.

[0026] FIG. 6 is a schematic structural view of manufacturing an encapsulation layer by vapor deposition method.

REFERENCE NUMERALS

[0027] 100 prior art mask, 200 glass substrate, 101 effective area, 1 mask of the present invention, 2 glass substrate, 3 carrier, 11 first area, 12 second area, 13 third area, 111 effective area

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0028] The following describes the preferred embodiments of the present invention in detail with reference to the accompanying drawings of the specification to fully introduce the technical content of the present invention to those skilled in the art, so as to prove that the present invention can be implemented. The technical content disclosed in the present invention is made clearer, and it is easier for those skilled in the art to understand how to implement the present invention. However, the present invention can be achieved by various forms of embodiments. The protection scope of the present invention is not limited to the embodiments mentioned in this article. The description of the embodiments below is not intended to limit the scope of the present invention.

[0029] Directional terminology mentioned in the application, such as “above”, “under”, “front”, “back”, “left”, “right”, “inside”, “outside”, “side”, etc., are only refer to the directions of the accompanying drawings. The directional terminology used herein is used to explain the present invention, rather than to limit the protection scope of the present invention.

[0030] In the drawings, components with the same structure are denoted by the same numerals, and components with similar structures or functions are denoted by similar numerals. In addition, for ease of understanding and description, the size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component.

[0031] When one component is described as “on” another component, the component can be directly placed on another component. There can also be an intermediate component, the component is placed on the intermediate component, and the intermediate component is placed on another component. When a component is described as “installed to” or “connected to” another component, it can be understood as “installed to” or “connecting to” directly, or one component is “installed to” or “connected” to another component through an intermediate component.

EMBODIMENT

[0032] As shown in FIG. 2, this embodiment provides a mask 1 including: a first area 11, a second area 12, and a third area 13.

[0033] As shown in FIGS. 2 and 3, the first area 11 includes an effective area 111. The effective area means a coating safety area.

[0034] As shown in FIG. 2, the second area 12 surrounds the first area 11, wherein the second area 12 has a ring shape.

[0035] As shown in FIG. 2, the third area 13 surrounds the second area 12.

[0036] As shown in FIGS. 2 and 4, a thickness of the second area 12 is greater than a thickness of the first area 11, and the thickness of the first area 11 is greater than a thickness of the third area 13.

[0037] A ratio of the thickness of the first area 11 to the thickness of the second area 12 is between 0.5 and 0.7. In this embodiment, a ratio of the thickness of the first area 11 to the thickness of the second area 12 is preferably 0.6.

[0038] A ratio of the thickness of the third area to the thickness of the second area is between 0.3 and 0.4. In this embodiment, a ratio of the thickness of the third area 13 to the thickness of the second area 12 is preferably 0.4.

[0039] As described above, by changing thicknesses of the first area 11, the second area 12, and the third area 13 of the mask 1, the gravity on each corresponding area of the mask 1 is changed. As a result, a sum of the gravity on the first area 11 and external stress is less than the gravity on the second area 12 of the mask 1, and a sum of the gravity on the first area 11 and external stress is greater than the gravity on the third area 13 so that the mask in the second area 12 bears the greatest force. The first area 11 of the mask 1 has a lesser deformation amount, or almost no deformation, thereby the bonding area between the first area 11 of the mask 1 and the glass substrate 2 is increased and the width of the deformation area at the edge of the mask 1 is reduced.

[0040] The second area 12 and the third area 13 of the mask are warped upward, and the deformation amount of the third area 13 is greater than that of the second area 12, thereby the distance between the deformation area at the edge of the mask 1 and the glass substrate is reduced.

[0041] Since the width of the deformation area at the edge of the mask 1 is reduced, the distance between the deformation area and the glass substrate is reduced. Therefore, a gap between the edge of the mask 1 and the glass substrate becomes smaller, less material enters the gap when coating so that the shadow area generated during coating is reduced, the uniformity of the film thickness is improved, and the reliability of the encapsulation layer is enhanced.

[0042] This embodiment also provides a method of using a mask 1, including following steps: providing the mask 1 on a substrate; depositing an inorganic layer on the substrate and the mask; and removing the mask 1.

[0043] The substrate includes a glass base or an organic layer.

[0044] Since the thicknesses of the first area 11, the second area 12, and the third area 13 of mask 1 are changed, the gravity on each corresponding area of the mask changes. As a result, a sum of the gravity on the first area 11 and external stress is less than the gravity on the second area of the mask, and a sum of the gravity on the first area 11 and external stress is greater than the gravity on the third area 13 so that the mask 1 in the second area 12 bears the greatest force. As a result, the first area 11 of the mask 1 has a lesser deformation amount, or almost no deformation, thereby the bonding area between the first area 11 of the mask 1 and the glass substrate 2 is increased and the width of the deformation area at the edge of the mask 1 is reduced.

[0045] The second area 12 and the third area 13 of the mask are warped upward, and the deformation amount of the third area 13 is greater than that of the second area 12, thereby the distance between the deformation area at the edge of the mask 1 and the glass substrate is reduced.

[0046] Since the width of the deformation area at the edge of the mask 1 is reduced, the distance between the deformation area and the glass substrate is reduced. Therefore, a gap between the edge of the mask 1 and the glass substrate becomes smaller, less material enters the gap when coating so that the shadow area generated during coating is reduced, the uniformity of the film thickness is improved, and the reliability of the encapsulation layer is enhanced.

[0047] As shown in FIG. 5, this embodiment also provides a method of manufacturing an encapsulation layer, including: S1, forming a first inorganic layer on an upper surface of a glass substrate 2; S2, forming an organic layer on the first inorganic layer; and S3, forming a second inorganic layer on the organic layer.

[0048] As shown in FIG. 6, wherein S1 includes: providing a carrier 3, providing a glass substrate 2 on the carrier 3, providing a mask 1 on the glass substrate 2, depositing a first inorganic layer on the glass substrate 2 and the mask 1, and removing the mask 1.

[0049] Since the thicknesses of the first area 11, the second area 12, and the third area 13 of the mask 1 are changed, the gravity on each corresponding area of the mask changes. As a result, a sum of the gravity on the first area 11 and external stress is less than the gravity on the second area 12 of the mask, and a sum of the gravity on the first area 11 and external stress is greater than the gravity on the third area 13 so that the mask 1 in the second area 12 bears the greatest force. The first area 11 of the mask 1 has a lesser deformation amount, or almost no deformation, thereby the bonding area between the first area 11 of the mask 1 and the glass substrate 2 is increased and the width of the deformation area at the edge of the mask 1 is reduced.

[0050] The second area 12 and the third area 13 of the mask are warped upward, and the deformation amount of the third area 13 is greater than that of the second area 12, thereby the distance between the deformation area at the edge of the mask 1 and the glass substrate is reduced.

[0051] Since the width of the deformation area at the edge of the mask 1 is reduced, the distance between the deformation area and the glass substrate is reduced. Therefore, a gap between the edge of the mask 1 and the glass substrate becomes smaller, less material enters the gap when coating so that the shadow area generated during coating is reduced. This embodiment uses the mask 1 to form a first inorganic layer, which can improve the uniformity of film thickness of the first inorganic layer and finally improve the encapsulation performance of the encapsulation layer.

[0052] In S2, an inkjet printing technology is used to form an organic layer on the first inorganic layer. In S3, a second inorganic layer is formed on the organic layer by a vapor deposition method. S3 specifically includes the following steps: providing the mask 1 on the organic layer, depositing a second inorganic layer on the organic layer and the mask 1, and removing the mask 1.

[0053] Since the thicknesses of the first area 11, the second area 12, and the third area 13 of the mask 1 are changed, the gravity on each corresponding area of the mask changes. As a result, a sum of the gravity on the first area 11 and external stress is less than the gravity on the second area 12 of the mask 1, and a sum of the gravity on the first area 11 and external stress is greater than the gravity on the third area 13 so that the mask 1 in the second area 12 bears the greatest force. The first area 11 of the mask 1 has a lesser deformation amount, or almost no deformation, thereby the bonding area between the first area 11 of the mask 1 and the glass substrate 2 is increased and the width of the deformation area at the edge of the mask 1 is reduced.

[0054] The second area 12 and the third area 13 of the mask are warped upward, and the deformation amount of the third area 13 is greater than that of the second area 12, thereby the distance between the deformation area at the edge of the mask 1 and the glass substrate is reduced.

[0055] Since the width of the deformation area at the edge of the mask 1 is reduced, the distance between the deformation area and the glass substrate is reduced. Therefore, a gap between the edge of the mask 1 and the glass substrate becomes smaller, less material enters the gap when coating so that the shadow area generated during coating is reduced. This embodiment uses the mask 1 to form a second inorganic layer, which can improve the uniformity of film thickness of the second inorganic layer and finally improve the encapsulation performance of the encapsulation layer.

[0056] A mask, a usage method thereof, and a manufacturing method of an encapsulation layer provided by this application have been described in detail above. This article uses specific examples to explain the principles and implementation of this application. The descriptions of the above embodiments are only used to help understand the technical solutions and core ideas of the present application. Those of ordinary skill in the art should understand that they can modify the technical solutions described in the embodiments, or equivalently substitute some of the technical features. However, these modifications or substitutions do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the present application.