Encapsulating Composition

Abstract

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method, can provide a thin display and can effectively prevent interference of an electromagnetic field due to a low dielectric constant.

Claims

1. An encapsulating composition comprising an epoxy compound and an oxetane compound, wherein the epoxy compound comprises a linear monofunctional epoxy compound having 7 or more carbon atoms, and the linear monofunctional epoxy compound is included in a range of 25 to 81 parts by weight relative to 100 parts by weight of the total epoxy compound in the encapsulating composition.

2. The encapsulating composition according to claim 1, having a dielectric constant of 3.05 or less at conditions of 100 kHz to 400 kHz and 25° C. after curing it into a thin layer having a thickness of 20 μm or less.

3. The encapsulating composition according to claim 1, wherein the linear monofunctional epoxy compound does not have a branched structure.

4. The encapsulating composition according to claim 1, wherein the linear monofunctional epoxy compound does not have an acyclic ether group.

5. The encapsulating composition according to claim 1, wherein the epoxy compound further comprises an alicyclic epoxy compound and/or a linear or branched polyfunctional aliphatic epoxy compound.

6. (canceled)

7. The encapsulating composition according to claim 5, wherein the linear or branched polyfunctional aliphatic epoxy compound is included in a range of 15 parts by weight or more and less than 205 parts by weight relative to 100 parts by weight of the alicyclic compound.

8. The encapsulating composition according to claim 1, wherein the oxetane compound is included in a range of 40 parts by weight to 155 parts by weight relative to 100 parts by weight of the epoxy compound.

9. The encapsulating composition according to claim 1, wherein the epoxy compound or the oxetane compound has a weight average molecular weight in a range of 150 to 1,000 g/mol.

10. The encapsulating composition according to claim 1, further comprising an ionic photoinitiator comprising a sulfonium salt.

11. (canceled)

12. The encapsulating composition according to claim 10, wherein the photoinitiator is included in an amount of 1 to 15 parts by weight relative to 100 parts by weight of the epoxy compound.

13. The encapsulating composition according to claim 1, further comprising a surfactant.

14. The encapsulating composition according to claim 13, wherein the surfactant comprises a polar functional group.

15. The encapsulating composition according to claim 13, wherein the surfactant is included in an amount of 0.01 parts by weight to 10 parts by weight relative to 100 parts by weight of the epoxy compound.

16. The encapsulating composition according to claim 1, which is an ink composition in a solventless form.

17. The encapsulating composition according to claim 1, wherein the linear monofunctional epoxy compound is included in a range of 28 to 80.5 parts by weight relative to 100 parts by weight of the total epoxy compound in the encapsulating composition.

18. The encapsulating composition according to claim 1, wherein the linear monofunctional epoxy compound has 7 to 30 carbon atoms.

19. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and an organic layer sealing the entire surface of the organic electronic element and containing the encapsulating composition according to claim 1.

20. The organic electronic device according to claim 19, wherein the organic layer has a thickness of 20 μm or less.

21. A method for manufacturing an organic electronic device comprising a step of forming an organic layer on a substrate in which an organic electronic element is formed on its upper part, wherein the organic layer comprises the encapsulating composition of claim 1 and seals the entire surface of the organic electronic element.

22. The method for manufacturing an organic electronic device according to claim 21, wherein the step of forming an organic layer is performed by inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0069] FIGS. 1 and 2 are cross-sectional diagrams showing an organic electronic device according to one example of the present invention.

EXPLANATION OF REFERENCE NUMERALS

[0070] 3: organic electronic device [0071] 31: substrate [0072] 32: organic electronic element [0073] 33: organic layer [0074] 34: inorganic layer [0075] 35: protective layer [0076] 36: sealing structure [0077] 37: sealing film [0078] 38: cover substrate

BEST MODE

[0079] Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not complying with the present invention, but the scope of the present invention is not limited by the following examples.

Example 1

[0080] An alicyclic epoxy compound (Celloxide 2021P from Daicel), an aliphatic polyfunctional epoxy compound (HAJIN CHEM TECH, DE203) and a monofunctional epoxy compound (1,2-epoxydecane) as epoxy compounds, an oxetane compound (OXT-101 from TOAGOSEI), a photoinitiator (CPI-310B from San-Apro) and a fluorine-based surfactant (F552 from DIC) were each introduced into a mixing vessel at a weight ratio of 20:7.5:15:50:1.5:1.0 (Celloxide2021P:DE203:1,2-epoxydecane:OXT-101:CPI-310B:F552) at room temperature.

[0081] In the mixing vessel, a uniform encapsulating composition was prepared using a planetary mixer (Kurabo, KK-250s).

Example 2

[0082] An encapsulating composition was prepared in the same method as in Example 1, except that the alicyclic epoxy compound, the aliphatic polyfunctional epoxy compound, the monofunctional epoxy compound, the oxetane compound, the photoinitiator and the surfactant were each introduced in the mixing vessel at a weight ratio of 20:5:25:42.5:1.5:1.0 (Celloxide2021P:DE203:1,2-epoxydecane:OXT-101:CPI-310B:F552).

Example 3

[0083] An encapsulating composition was prepared in the same method as in Example 1, except that the alicyclic epoxy compound was changed to Celloxide 3000 from Daicel and the oxetane compound was changed to OXT-212 from TOAGOSEI, and

[0084] The alicyclic epoxy compound, the aliphatic polyfunctional epoxy compound, the monofunctional epoxy compound, the oxetane compound, the photoinitiator and the surfactant were each introduced into the mixing vessel at a weight ratio of 9:1.5:43:39:1.5:1.0 (Celloxide3000:DE203:1,2-epoxydecane:OXT-212:CPI-310B:F552).

Comparative Example 1

[0085] An encapsulating composition was prepared in the same method as in Example 1, except that the alicyclic epoxy compound, the aliphatic polyfunctional epoxy compound, the monofunctional epoxy compound, the oxetane compound, the photoinitiator and the surfactant were each introduced in the mixing vessel at a weight ratio of 10:1.5:50:31:1.5:1.0 (Celloxide2021P:DE203:1,2-epoxydecane:OXT-101:CPI-310B:F552).

Comparative Example 2

[0086] An encapsulating composition was prepared in the same method as in Example 1, except that the alicyclic epoxy compound, the aliphatic polyfunctional epoxy compound, the monofunctional epoxy compound, the oxetane compound, the photoinitiator and the surfactant were each introduced in the mixing vessel at a weight ratio of 25:7.5:10:50:1.5:1.0 (Celloxide2021P:DE203:1,2-epoxydecane:OXT-101:CPI-310B:F552).

Comparative Example 3

[0087] An encapsulating composition was prepared in the same method as in Example 1, except that the alicyclic epoxy compound, the aliphatic polyfunctional epoxy compound, the monofunctional epoxy compound, the oxetane compound, the photoinitiator and the surfactant were each introduced in the mixing vessel at a weight ratio of 25:18:0:49.5:1.5:1.0 (Celloxide2021P:DE203:1,2-epoxydecane:OXT-101:CPI-310B:F552).

Comparative Example 4

[0088] An encapsulating composition was prepared in the same method as in Example 1, except that the monofunctional epoxy compound was changed to 1,2-epoxybutane.

Comparative Example 5

[0089] An encapsulating composition was prepared in the same method as in Example 1, except that the monofunctional epoxy compound was changed to o-cresyl glycidyl ether.

Comparative Example 6

[0090] An encapsulating composition was prepared in the same method as in Example 1, except that the monofunctional epoxy compound was changed to 2-ethylhexyl glycidyl ether.

[0091] Physical properties in Examples and Comparative Examples were evaluated in the following manner.

[0092] 1. Contact Angle Measurement (Spreadability)

[0093] For the encapsulating compositions prepared in Examples and Comparative Examples, each contact angle to glass at 25° C. was measured. It is measured by injecting the encapsulating composition into a syringe, dropping one droplet to a volume of 5 μl and then photographing it with CCD camera. The mean value of 5 times was used and the used equipment was DSA100 from KRUSS. It was classified as O in the case where the contact angle was less than 10° because the spreadability was excellent, as Δ in the case where the contact angle was 10° to 30°, and as X in the case where the contact angle was more than 30°.

[0094] 2. Organic Layer Thickness

[0095] When the encapsulating compositions prepared in Examples and Comparative Examples have been each ink-jetted, it can be judged that it is good (O) when the organic layer is formed to a thickness of 20 μm or less, and it is classified as normal (Δ) when the organic layer is formed to a thickness of 40 μm or less and as defective (X) when the organic layer is formed to a thickness of 60 μm or less. In the case of Comparative Example 2 as in Table 1 below, it was substantially impossible to form the thin film organic layer below 20 μm or less.

[0096] 3. Curing Sensitivity Measurement

[0097] The encapsulating compositions prepared in Examples and Comparative Examples were each irradiated with UV of 1 J/cm.sup.2 at an intensity of 1000 mW/cm.sup.2 and then the tack free time of each adhesive was measured. First, the encapsulating composition is applied by spin coating to a thickness of 10 μm and cured. A time until a tacky feeling disappears and there is no leakage of the sealing material when the surface of the sealing material has been touched immediately after curing, is defined as a tack free time and measured. It was classified as ⊚ in the case where the tack free time was less than 1 second, as O in the case where it was less than 1 minute, as Δ in the case where it was 5 minutes or more and as X in the case where it was 30 minutes or more.

[0098] 4. Surface Hardness Measurement

[0099] The encapsulating compositions prepared in Examples and Comparative Examples were each applied on an LCD glass base material of 50 mm×50 mm to a thickness of 5 μm through spin coating. The applied composition was cured at a light quantity of 1000 mJ/cm.sup.2 through an LED UV lamp. The cured product was subjected to a surface hardness test at a speed of 273 mm/min under a weight of 500 g using a pencil hardness tester from H to 5H.

[0100] 5. Measurement of Dielectric Constant

[0101] An Al plate (conductive plate) was deposited to 500 Å on the cleaned bare glass. The encapsulating compositions prepared in Examples and Comparative Examples were each inkjet-coated on the deposited Al plate surface, and the coated composition was cured with a light quantity of 1000 mJ/cm.sup.2 through an LED UV lamp to form an organic layer having a thickness of 8 μm. The Al plate (conductive plate) was deposited again to 500 Å on the organic layer.

[0102] Then, the capacitance value of the Al plate was measured at conditions of 100 kHz and 25° C. using an impedance measuring instrument, Agilent 4194A. Through the measured value, the dielectric constant of the organic layer was calculated using the following equation.

C=εr.Math.εo.Math.A/D

(C: capacitance of Al plate, εr: dielectric constant of organic layer, εo: vacuum dielectric constant, A: area of Al plate, D: distance between two Al plates)

[0103] In the present application, the dielectric constant is a relative value (ratio) with respect to the dielectric constant in the vacuum when the dielectric constant in the vacuum has been set as 1.

TABLE-US-00001 TABLE 1 Curing Surface Dielectric Spreadability Thickness sensitivity hardness constant Example 1 ◯ ◯ 5 H 2.94 2 ◯ ◯ 4 H 2.84 3 ◯ ◯ ◯ 3 H 2.67 Comparative 1 ◯ ◯ Δ 1 H 2.56 Example 2 Δ Δ ◯ 4 H 3.09 3 ◯ ◯ ◯ 5 H 3.46 4 ◯ ◯ 4 H 3.43 5 ◯ ◯ 4 H 3.08 6 ◯ ◯ 4 H 3.12