Methods related to preparation of a stencil to receive a plurality of IC units

Abstract

A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.

Claims

1. A method of processing IC units, the method comprising the steps of: preparing a stencil by: providing the stencil comprising a metal substrate having an array of stencil apertures; applying an adhesive surface to a top surface of said stencil; and removing portions of said adhesive surface corresponding to the apertures in the stencil, to form adhesive apertures; wherein the adhesive surface is arranged to receive the IC units such that the IC units are positioned above the stencil apertures, so as to be selectively removable; wherein the adhesive apertures are smaller than the stencil apertures, defining an overhang of the adhesive layer; wherein the IC units comprise solder ball connections on the bottom of the units; and wherein the removing step includes laser cutting the adhesive surface, such that the adhesive apertures are larger in size than the solder ball connections; placing the IC units above apertures of the stencil such that the IC units are supported only by the overhang of the adhesive layer; and offloading the stencil.

2. The method according to claim 1, further including the step, after the offloading step, of sputtering the IC units.

3. The method according to claim 1, further including the steps of inspecting the IC units before the placing step.

4. The method according to claim 2, further including the steps of inspecting the IC units after the sputtering step.

5. The method according to claim 1 wherein the applying step includes placing a double sided tape to the substrate.

6. The method according to claim 5, wherein the removing step includes laser cutting the double sided tape and then peeling a backing tape to expose the adhesive surface and remove the cut portions of the double sided tape.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) It will be convenient to further describe the present invention with respect to the accompanying drawings that illustrate possible arrangements of the invention. Other arrangements of the invention are possible and consequently, the particularity of the accompanying drawings is not to be understood as superseding the generality of the preceding description of the invention.

(2) FIG. 1 is a flow chart according to one embodiment of the present invention.

(3) FIG. 2 is a flow chart according to a further embodiment of the present invention.

(4) FIGS. 3A, 3B, and 3C are sequential isometric views of a substrate according to a process of the present invention.

(5) FIG. 4A is a bottom view of the stencil with IC units positioned above the apertures, FIG. 4C is a top view of apertures with an array of apertures in it, and FIG. 4B is a cross-sectional view taken along lines B-B of FIG. 4A, and FIG. 4D is a cross-sectional view taken along lines C-C of FIG. 4A.

(6) FIG. 5 is an isometric view of a ring frame according to one embodiment of the present invention.

(7) FIGS. 6A, 6B, and 6C are sequential isometric views of a ring frame according to a further embodiment of the present invention.

(8) FIGS. 7A and 7B are various views of a recess in the stencil according to a further embodiment of the present invention, and;

(9) FIGS. 8A and 8B are various views of an ejector pin according to one embodiment of the present invention.

DETAILED DESCRIPTION

(10) FIG. 1 shows a flow chart of the overall process. It begins with the units being inspected, flipped, aligned and oriented 10. The units are then placed upon a stencil 20 to which a double sided tape has been applied and laser cut 15. Once the units are engaged with the stencil 20, the stencil is offloaded 25 and sent to sputtering 30. Following the sputtering process, the units are ejected, aligned and further inspected 35 before being offloaded 40.

(11) The inspection, alignment and orientation step 10 includes conducting a top vision inspection then moving the units to a flipper and subsequently a picker for aligning the units. The units are then engaged by a picker to move the units to the stencil and inspecting the underside of the units during delivery by the picker.

(12) FIG. 2 shows the tape application and laser cut step 15 whereby a stencil is provided and a double sided tape applied thereto. The tape is then laser cut through the apertures of the stencil so as to cut the double sided tape. The backing tape of the double sided tape is then removed 60 removing the cut portions of the double sided tape and exposing an adhesive layer for receiving the units.

(13) FIGS. 3A to 3C show the unit application process whereby the provided stencil 65 which in this case is a PCB sized stencil. The double sided tape 75 is applied to the stencil 65 and following the laser cut of the apertures 80, the backing tape 70 is peeled off. This leaves an adhesive layer 85 for receiving the units 90 into the respective apertures.

(14) FIGS. 4A and 4B are detailed views of the units 100 placed on the stencil 115 and in particular, into the apertures 105 so as to allow the solder balls 110 to project through the aperture and thus the unit 100 sitting flushed with the tape 120.

(15) In this particular embodiment using the PCB sized stencil, as shown in FIG. 5, the stencil 130 having the units engaged with the adhesive layer, are then placed on an adhesive layer 135 of a ring frame 125. In this arrangement the ring frame can then be offloaded for sputtering of a smaller batch of units on the PCB sized stencil 130.

(16) FIGS. 6A to 6C show a conventional view where large volumes of units may be sputtered whereby the stencil 145 is entirely coated by the double sided tape 150. As with the PCB embodiment of FIGS. 3A to 3C, the tape 150 is laser cut with the cut portions removed on peeling the backing tape 140 leading to the ring frame 155 having an adhesive layer 165 for receiving the units 160. As with the embodiment of FIG. 5, the ring frame 155 having the units 160 engaged thereon, can then be offloaded for sputtering.

(17) In a particular embodiment, the laser cutting of the double sided tape may not cut the tape flush with the stencil. FIGS. 7A and 7B show a particular example whereby the stencil 170 following the laser cut of the tape leaves an overhang 185 passed the stencil frame 175 leaving a reduced sized aperture 180. By accounting for this overhang 185, the stencil 170 may be sized to have apertures larger than normal whereby the aperture in the tape including the overhang 185 is sufficient to receive the unit 195 and sit on the overhang with the solder balls projecting into the aperture 180. Thus, the embodiment of FIGS. 7A and 7B fall within the scope of the present invention and accommodate practical limitations of the laser cutting practice.

(18) FIGS. 8A and 8B show the BGA chip 200 positioned on an adhesive surface 205 within a stencil 210. The BGA chip 200 includes solder ball connections 235 around the chip 200 with an electrode 240 within the array of solder balls and a vacant space, being a different area 245 adjacent to electrode 240.

(19) To remove the BGA chip from the stencil requires an ejector pin, however, conventional ejector pins risk damaging the electrode 240 by applying a localized force which may scratch, damage or dislodge the electrode. To this end the present invention includes a new ejector pin 215 having a specialized head 220. The specialized head includes a first contact surface, larger than a cross sectional area of the shaft of the ejector in and a second surface. The first region 225 is arranged to contact the electrode so as to distribute the ejection force uniformly about the electrode. The second surface 230 is offset from the first portion 225 so as to contact the vacant area 245 of the BGA chip. Thus, the head 220 is arranged to apply a uniform pressure to the solder ball face of the BGA unit 200 and thus minimize the force applied to the electrode which may prevent damage.

(20) Having described various systems and methods herein, some embodiments can include, but are not limited to:

(21) In a first embodiment, a method for preparing a stencil to receive a plurality of IC units comprises the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; and removing portions of said adhesive surface corresponding to the apertures in the metal substrate.

(22) A second embodiment can include the method of the first embodiment, wherein the applying step includes placing a double sided tape to the substrate.

(23) A third embodiment can include the method of the second embodiment, wherein the removing step includes laser cutting the double sided tape and then peeling a backing tape to expose the adhesive surface and remove the cut portions of the double sided tape.

(24) A fourth embodiment can include the method of the first embodiment, wherein the applying step includes placing the metal substrate on a surface, applying a fluid adhesive to the substrate, and the removing step includes lifting the substrate from the surface to separate excess adhesive that has passed through the apertures.

(25) In a fifth embodiment a method of processing IC units comprises comprising the steps of: preparing a stencil according to any one of the previously described methods; placing a plurality of the IC units in apertures of the stencil; and offloading the stencil.

(26) A sixth embodiment can include the method of the fifth embodiment, further including the step, after the offloading step, of sputtering the IC units.

(27) A seventh embodiment can include the method of the fifth or sixth embodiment, further including the steps of inspecting the IC units before the placing step.

(28) An eighth embodiment can include the method of the sixth or seventh embodiment, further including the steps of inspecting the IC units after the sputtering step.

(29) In a ninth embodiment, a stencil for receiving a plurality of IC units comprises: a metal substrate having an array of apertures; an adhesive surface on said substrate; and said apertures arranged to receive said plurality of IC units.

(30) A tenth embodiment can include the stencil of the ninth embodiment, wherein the IC units are BGA chips, said apertures sized to allow solder ball connections of the BGA chips to pass through the aperture but retain the IC portion of the BGA chip.

(31) An eleventh embodiment can include the stencil of the ninth or tenth embodiment, wherein the adhesive surface includes an opposed side of a double sided tape layer applied to the substrate.

(32) In a twelfth embodiment, an ejector pin for an ejecting IC unit from an aperture comprises: a shaft and a head at the end of said shaft, the head having a first contact surface larger than a cross section of the shaft; and said first contact surface arranged to contact a surface of the IC unit and apply a force there to disengage the IC unit from the aperture.

(33) A thirteenth embodiment can include the ejector pin of the twelfth embodiment, wherein the head includes a second contact surface offset from the first contact surface, said second contact surface arranged to simultaneous contact a different area on the IC unit.

(34) A fourteenth embodiment can include the ejector pin of the thirteenth embodiment, wherein said ejector pin is arranged to eject a BGA chip, such that the first contact surface is arranged to contact an electrode on the BGA chip and the second surface is arranged to contact a different area on the BGA chip.