METHOD OF FABRICATION OF COMPOUND LIGHT-GUIDE OPTICAL ELEMENTS
20230251415 · 2023-08-10
Inventors
Cpc classification
B29D11/00721
PERFORMING OPERATIONS; TRANSPORTING
G02B6/0035
PHYSICS
G02B27/0081
PHYSICS
International classification
Abstract
A method of fabricating a compound light-guide optical element (LOE) is provided. A bonded stack of a plurality of LOE precursors and a plurality of transparent spacer plates alternating therebetween is bonded to a first optical block having a plurality of mutually parallel obliquely angled internal surfaces. The block is joined to the stack such that first plurality of partially reflective internal surfaces of the block is non-parallel to the internal surfaces of the LOE precursor. After bonding, a second optical is thereby formed. At least one compound LOE is sliced-out of the second optical block by cutting the second block through at least two consecutive spacer plates having a LOE precursor sandwiched therebetween.
Claims
1. A method of fabricating a compound light-guide optical element (LOE), comprising: obtaining a stack of a plurality of LOE precursors, the stack having a first pair of parallel faces including first and second faces, each LOE precursor comprising a pair of major parallel surfaces and a first plurality of mutually parallel partially reflective internal surfaces angled obliquely relative to the pair of major parallel surfaces; obtaining a first block having: a second pair of parallel faces including third and fourth faces, a second plurality of mutually parallel partially reflective internal surfaces, and a transparent plate bonded to the third or fourth face; bonding together the first block and the stack such that an external surface of the transparent plate is joined to one of the first or second faces of the stack and the first plurality of partially reflective internal surfaces is non-parallel to the second plurality of partially reflective internal surfaces, thereby forming a second block; and slicing out at least one compound LOE from the second block by cutting the second block through at least two cutting planes substantially parallel to the major parallel surfaces of the LOE precursors.
2. The method of claim 1, wherein the transparent plate is an optically inert area that is free of any reflective or semi-reflective surfaces.
3. The method of claim 1, wherein the transparent plate includes at least one optical element embedded therein.
4. The method of claim 3, wherein the at least one optical element includes a partially reflective surface.
5. The method of claim 3, wherein the at least one optical element includes a polarization element.
6. The method of claim 1, wherein the transparent plate includes any combination of: an optically inert area that is free of any reflective or semi-reflective surfaces, an area that includes a partially reflective surface, and an area that includes a polarization element.
7. The method of claim 1, further comprising: polishing the external surface of the transparent plate prior to bonding together the first block and the stack.
8. The method of claim 1, further comprising: polishing the first face or the second face of the stack prior to bonding together the first block and the stack.
9. The method of claim 1, further comprising: prior to bonding together the first block and the stack, aligning the first block and the stack such that first plurality of partially reflective internal surfaces and the second plurality of partially reflective internal surfaces are orthogonal.
10. The method of claim 1, further comprising: polishing the external surfaces of the sliced-out at least one compound LOE that are parallel to the major parallel surfaces of the LOE precursor.
11. The method of claim 1, wherein the stack is a bonded stack that includes a plurality of transparent spacer plates, wherein the LOE precursors and the transparent spacer plates are arranged in the bonded stack so as to alternate along a length of the bonded stack perpendicular to the first pair of parallel faces.
12. The method of claim 11, wherein the at least two cutting planes are in at least two consecutive spacer plates having a LOE precursor sandwiched therebetween.
13. An optical structure that is an intermediate work product of a compound light-guide optical element (LOE) fabrication process, the optical structure comprising: a first region comprising a plurality of LOE precursors, each LOE precursor comprising a pair of major parallel surfaces and a first plurality of mutually parallel partially reflective internal surfaces angled obliquely relative to the pair of major parallel surfaces; a second region comprising a second plurality of mutually parallel partially reflective internal surfaces being non-parallel to the first plurality of partially reflective internal surfaces; and a third region separating the first and second regions, the third region being formed from a transparent plate having major external surfaces that are perpendicular to the pairs of major parallel surfaces.
14. The optical structure of claim 13, wherein the transparent plate is an optically inert area that is free of any reflective or semi-reflective surfaces.
15. The optical structure of claim 13, wherein the transparent plate includes at least one optical element embedded therein.
16. The optical structure of claim 15, wherein the at least one optical element includes a partially reflective surface.
17. The optical structure of claim 15, wherein the at least one optical element includes a polarization element.
18. The optical structure of claim 13, wherein the transparent plate includes any combination of: an optically inert area that is free of any reflective or semi-reflective surfaces, an area that includes a partially reflective surface, and an area that includes a polarization element.
19. The optical structure of claim 13, wherein the plurality of LOE precursors are separated by transparent spacer plates.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The invention is herein described, by way of example only, with reference to the accompanying drawings, wherein:
[0013]
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DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0030]
[0031] LOE 2 also include a pair of major parallel surfaces 201 that are perpendicular to surfaces 101, 102 of LOE 1, and a plurality of mutually parallel partially reflective facets 5 that are obliquely angled relative to surfaces 201. In some embodiments, as shown in
[0032] Compound LOE 100 further includes transparent cover plates 3 on the surfaces of LOE in the XZ plane. The surfaces covered by plates 3 include surfaces 103 of LOE 1 and surfaces 201 of LOE 2. Accordingly, these surfaces need to be accurately aligned in order to apply plates 3.
[0033]
[0034] In order to overcome the difficulties described above, the present invention discloses a new method of fabricating a compound LOE. In addition to overcoming the problems of precise alignment during bonding of LOE 1 to LOE 2, the presently disclosed process allows for fabrication of a new embodiment of compound LOE 100 in which transparent cover plates 3′ exist only on surfaces 201 of LOE 2, as shown in
[0035]
[0036] Referring now to
[0037] Referring now to
[0038] Known methods exist for forming optical block 16. For example, as shown in
[0039] Referring now to
[0040] The aligned and bonded structure is denoted herein as optical block 18, which in fact is an optical structure that is an intermediate work product of a compound LOE fabrication process. As shown, block 18 includes a first region with a plurality of LOE precursors separated by transparent spacer plates between the LOE precursors, a second region with a plurality of mutually parallel partially reflective internal surfaces, and an internal surface separating the first and second region. In other embodiments, as will be further detailed below, intermediate block 18 can also include one or more additional sub-regions in the first and/or second regions. These sub-regions can include non-faceted areas as well as areas comprising one or more optically active or optically inert elements. These sub-regions can be added to block 18 by adding one or more plates, some of which may include optically active elements, to block 16 prior to bonding with stack 15, as will be detailed below with reference to
[0041] Block 18 is sliced using a cutting apparatus (not shown) at predetermined intervals along the length of stack 15 (y-dimension) and through spacer plates 7 to form a plurality of compound LOE structures sliced-out of block 18. The planes of slicing are shown in
[0042] Optionally, additional transparent cover plates can be bonded to the final compound LOE over plates 17 and 17 and those cover plates polished (in which case LOE 1 will have a single cover plate and LOE 2 will have a double cover plate).
[0043] As detailed above with reference to
d2=2t+2p+s
[0044] where t denotes the desired difference between the thickness of the first LOE cover plate and second LOE cover plate, p denotes the thickness of the material removed during polishing, and s denotes the thickness of the cut including tolerances for cut positioning in a sawing machine. It should be noted that in the case that cover plates are desired only for LOE and not LOE 1, t simply denotes the thickness of the LOE 2 cover plate. The typical values of t may range from 50 microns to 500 microns.
[0045]
d4=d1+d2−d3
[0046] where d1 and d2 have been defined previously above.
[0047]
[0048] It should be appreciated that the bonded block 16′ and stack 15 represents another embodiment of the intermediate optical structure block 18. In fact, various other embodiments of block 16 (and therefore block 18) are also possible for yielding a variety compound LOEs having a different structures in regards to LOE 1, some of which are described below.
[0049] For example, in some embodiments, it may be desirable for some of facets 4 of LOE 1 to not extend all the way across LOE 1, thereby providing one or more un-faceted regions (i.e. without partially reflective internal surfaces) within LOE 1, as will be illustrated in the following examples.
[0050]
[0051] Block 19 and stack 15 are aligned and bonded together as shown in
[0052]
[0053] In other embodiments (not shown) the LOE precursors of stack 15 can be modified to include one or more facet-free regions within the LOE precursor, thereby yielding compound LOEs in which LOE 2 includes one or more un-faceted sub-regions (i.e. free of partially reflective internal surfaces).
[0054] It will be appreciated that the above descriptions are intended only to serve as examples, and that many other embodiments are possible within the scope of the present invention as defined in the appended claims.