Abstract
The disclosure relates to a method for producing a welded assembly including a plurality of welded connections between first contact partners of a contact substrate and second contact partners of a placement unit. The contact partners are arranged in an overlapping position and a sonotrode is moved into a position overlapping with the second contact partner using a positioning device, is lowered onto the second contact partner in a welding contact position, and is subjected to ultrasonic vibrations to produce a welded connection. The sonotrode is positioned relative to the second contact partner with a camera and the sonotrode is positioned relative to the second contact partner based on a determination of a position deviation of a sonotrode imprint of a sonotrode working surface produced on a reference imprint carrier by the welding process.
Claims
1. A method for producing a welded assembly comprising a plurality of welded connections between first contact partners of a contact substrate and second contact partners of a placement unit, which is a semiconductor assembly, arranging the contact partners in an overlapping position to position the first and second contact partners relative to each other in a welding position and moving a sonotrode into a position overlapping with the second contact partner using a positioning device to position the sonotrode in individual welding positions and lowering the sonotrode onto the second contact partner in a welding contact position and subjecting the sonotrode to ultrasonic vibrations to produce a welded connection, the sonotrode being positioned relative to the second contact partner with a camera device, which is provided with an image processing device, in such a manner that the sonotrode is positioned relative to the second contact partner based on a determination of a position deviation Δx.sub.SA, Δy.sub.SA of a sonotrode imprint of a sonotrode working surface of the sonotrode produced on a reference imprint carrier by the welding process.
2. The method according to claim 1, wherein the sonotrode is positioned relative to the second contact partner both based on a position deviation Δx.sub.KP, Δy.sub.KP of the sonotrode relative to the second contact partner and based on the position deviation Δx.sub.SA, Δy.sub.SA of the sonotrode imprint of the sonotrode working surface of the sonotrode produced on the reference imprint carrier by the welding process, both position deviations Δx.sub.KP, Δy.sub.KP; Δx.sub.SA, Δy.sub.SA being determined using the camera device provided with an image processing device.
3. The method according to claim 1, wherein a total position deviation which consists of position deviations Δx.sub.KP, Δy.sub.KP; Δx.sub.SA, Δy.sub.SA is superimposed on a feed path of the positioning device which corresponds to a distance t between first contact partners of the contact substrate.
4. The method according to claim 1, wherein the position deviation Δx.sub.SA, Δy.sub.SA of the sonotrode imprint is determined after a change in the position of the sonotrode relative to the positioning device.
Description
(1) Hereinafter, a preferred embodiment of the disclosure will be explained in more detail with reference to the drawings.
(2) FIG. 1 shows a contact substrate disposed on a contact substrate holder and having two sonotrodes displaceable relative to the contact substrate by means of a positioning device;
(3) FIG. 2 shows a side view of a sonotrode disposed in a sonotrode holder;
(4) FIG. 3 shows the sonotrode of FIG. 2 in the initial position;
(5) FIG. 4 shows the sonotrode of FIG. 2 in the welding contact position;
(6) FIG. 5 shows a sonotrode imprint in the case of a properly aligned welded connection;
(7) FIG. 6 shows a sonotrode imprint in the case of a misaligned contact partner;
(8) FIG. 7 shows a sonotrode imprint after adjustment of the sonotrode position to the misaligned contact partner;
(9) FIG. 8 shows a sonotrode imprint of a misaligned sonotrode;
(10) FIG. 9 shows a sonotrode imprint of a misaligned sonotrode.
(11) FIG. 1 is a schematic illustration showing a top view of a contact substrate 10 comprising a plurality of first contact partners 11 disposed in contact rows 20 and realized as contact surfaces and a semiconductor assembly 12 provided with a plurality of terminals 13 forming second contact partners 13. To produce a welded assembly 14 from contact substrate 10 and semiconductor assembly 12, starting from the relative position of second contact partners 13 of semiconductor assembly 12 on first contact partners 11 of contact substrate 10 as illustrated in FIG. 1, ultrasonic welding units 16 each provided with a sonotrode 15 and disposed on a longitudinal side of contact substrate 10 are successively moved into an initial position above second contact partners 13 as illustrated in FIGS. 1 and 3 and then lowered into the welding contact position illustrated in FIG. 4 by means of positioning devices 17. To this end, positioning devices 17 allow sonotrodes 15 to be moved in the x, y, and z directions along the three spatial axes.
(12) FIG. 1 shows a sonotrode 15 disposed on each longitudinal side of contact substrate 10, said sonotrode 15 being moved into the subsequent welding positions, which are illustrated by dashed lines, after completion of a first welded connection.
(13) The illustration in FIG. 1 shows that the initial position of sonotrode 15 is defined by a corresponding position of a sonotrode working surface 22 (FIGS. 2 to 4) in the x/y plane. As apparent from a combined view of FIGS. 3 and 4, starting from the initial position, sonotrode working surface 22 of sonotrode 15 is lowered onto upper second contact partner 13 into the welding position at a defined contact pressure, and sonotrode 15 is subjected to ultrasonic vibrations so as to execute the welding process.
(14) As shown in FIG. 5, in particular, once the welding process is complete, a sonotrode imprint 24 has been formed on second contact partner 13 as a result of second contact partner 13 having been subjected to ultrasonic vibrations with sonotrode working surface 22, sonotrode imprint 24 being caused by a profiled surface of sonotrode working surface 22 imprinting on a contact surface 23 of second contact partner 13, leading to a negative of the profiled sonotrode working surface being visible on contact surface 23.
(15) In FIG. 5, a properly aligned welded connection is illustrated, in which a full overlap has been established between first contact partner 11 and second contact partner 13 and full sonotrode imprint 24 has been imprinted on contact surface 23 of second contact partner 13.
(16) In contrast to FIG. 5, FIG. 6 shows a misaligned welded connection bearing an incomplete sonotrode imprint 27 on contact surface 23 of second contact partner 13, which is due to second contact partner 13 not being located in its target position relative to first contact partner 11 as illustrated in FIG. 5. This may be because second contact partner 13 is bent, for example.
(17) When sonotrodes 15 are successively transferred into the respective initial positions along contact rows 20, sonotrode holders 25 equipped with sonotrodes 15 undergo an indexed forward motion corresponding to distances t of first contact partners 11. Distances t of second contact partners 13 of semiconductor assembly 12, which are also disposed in rows 20, are typically identical to the distances of first contact partners 11, the overlap between second contact partners 13 and first contact partners 11 required for the execution of a properly aligned ultrasonic welding process thus typically happening automatically.
(18) In practice, however, it was found that occasional misaligned positions of second contact partners 13 do very well occur, such as shown in FIG. 1 with middle contract pair 21 in upper contact row 20 as an example, where second contact partner 13 exhibits an offset Δx.sub.KP (illustrated in FIG. 6) relative to the target position (illustrated in FIG. 5) of a reference edge 26 of second contact partner 13, said offset Δx.sub.KP being present in direction x only in the present example and causing a sonotrode 15 moved forward in direction x along contact row 20 by distance t of first contact partners 11 to now be located in an initial position in which sonotrode 15 is not located in a position relative to second contact partner 13 that would allow a welding contact for producing sonotrode imprint 24 illustrated in FIG. 5. Instead, a welding contact starting from the relative position of sonotrode working surface 22 relative to second contact partner 13 as illustrated in FIG. 1 would lead to the formation of a sonotrode imprint 27 as illustrated by way of example in FIG. 6 in such a manner that, corresponding to sonotrode imprint 27, a welded connection between first contact partner 11 and second contact partner 13 would merely be formed in a narrow edge portion 28 of contact partner 13.
(19) As explained above with reference to FIG. 1, sonotrodes 15 are held in sonotrode holders 25 which are displaceable in the direction of the x axis, i.e. along contact rows 20 of contact substrate 10, by means of sonotrode positioning device 17. Sonotrode positioning device 17 preferably also allows sonotrodes 15 to be displaced relative to sonotrode holders 25, thus allowing sonotrode 15 and sonotrode working surface 22 to be displaced in direction y from a retracted position, which is illustrated in FIG. 2, into the initial position above contact pair 21, which is illustrated in FIG. 3, and then to be displaced, also by means of sonotrode positioning device 17, into a welding contact position by a movement in the direction of the z axis to execute the welded connection.
(20) A camera device 29 is located on sonotrode holder 25, preferably above sonotrode 15, optical axis 30 of camera device 29 being directed at contact pair 21 in such a manner that an image processing device associated with camera device 29 can determine position deviation Δx.sub.KP, Δy.sub.KP based on the known target position of reference edge 26 of second contact partner 13 and position deviation Δx.sub.KP, Δy.sub.KP can be converted into a corresponding positioning signal and be transmitted to positioning device 17, which transmits said positioning parameter to sonotrode holder 25 for making sonotrode 15 travel a positioning path x.sub.SK, y.sub.SK. For simplification, FIGS. 6 and 7 merely show position deviations in direction x. Thus, sonotrode 15 is then located in a corrected initial position which allows sonotrode working surface 22 to come into a welding contact with second contact partner 13 that produces sonotrode imprint 24 illustrated in FIG. 7.
(21) FIG. 5 shows an ideal welding contact formation with a substantially central sonotrode imprint 24 on second contact partner 13. Such a relative positioning of sonotrode imprint 24 depends on a suitable relative positioning of sonotrode 15 and, in particular, of sonotrode working surface 22, which produces sonotrode imprint 24, relative to first contact partners 11 formed by the contact surfaces of contact substrate 10.
(22) Hence, after sonotrode replacement, in particular, the positioning of sonotrode 15 in sonotrode holder 25 has required adjustment so far in order to compensate any tolerances in the arrangement of sonotrode working surface 22 in a contact surface 31 formed on a sonotrode head 33. In particular, sonotrode working surface 22 can exhibit position tolerances such as sonotrode working surface 22 not being parallel to contact surface 31 but inclined by a misalignment angle α relative to contact surface 31. This position deviation has the effect that, as illustrated in FIG. 8, for example, sonotrode imprint 27—and thus the welding contact—is incomplete after a welding contact between sonotrode working surface 22 and a reference imprint carrier 32 or a second contact partner 13 even if sonotrode 15 is positioned correctly relative to first contact partner 11 and reference imprint carriers 32 or second contact partner 13 is positioned correctly relative to first contact partner 11.
(23) An incomplete welding contact is also the result if, as illustrated in FIG. 9, sonotrode working surface 22 is not positioned in the middle of contact surface 31 of sonotrode head 33 but at an offset v, causing to an incomplete sonotrode imprint 27 to be formed in this case, too.
(24) In the case of incomplete sonotrode imprint 27 illustrated in FIG. 8, which points at sonotrode working surface 22 and the contact surface not being parallel if sonotrode 15 is correctly aligned in sonotrode holder 25, sonotrode 15 will typically have to be replaced because this is a sonotrode misalignment that cannot be compensated by means of positioning device 17.
(25) In the case of the lateral offset v illustrated in FIG. 9, offset v can be compensated by means of sonotrode positioning device 17. To do so, camera device 29 described above and provided with image processing device 30 can be used to determine position deviation Δx.sub.SA, which is present in direction x only in the case at hand, and position deviation Δx.sub.SA can be transmitted to sonotrode 15 for correction through positioning device 17 travelling a corresponding positioning path x.sub.SA.
(26) When subsequent welding processes are executed, positioning device 17 travels positioning path x.sub.SA, which serves to compensate the tolerance misalignment of sonotrode 15, in addition to positioning path x.sub.KP, which is individually determined for each second contact partner 13, when approaching each initial position.
